Patents by Inventor Zigmund Ramirez Camacho

Zigmund Ramirez Camacho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210151359
    Abstract: A semiconductor device has a substrate panel with a substrate having a first substrate area and a second substrate area outside a footprint of the first substrate area. A plurality of semiconductor die or discrete IPDs is disposed over the first substrate area. Substrate area 102a has electrical interconnect for the semiconductor die. A molding compound is disposed over the semiconductor die and first substrate area using a transfer mold process, which leaves mold culls and mold gates disposed over the second substrate area. A substrate edge is formed in the second substrate area under the mold gates. The substrate edge extends into the first substrate area under the molding compound to reinforce the mold gates and reduce cracking during mold degating. The substrate edge can have a variety of forms such as parallel bars, diagonal bars, orthogonal bars, and combinations thereof.
    Type: Application
    Filed: October 9, 2020
    Publication date: May 20, 2021
    Applicant: Semtech Corporation
    Inventors: Henry Descalzo Bathan, Zigmund Ramirez Camacho
  • Patent number: 9865554
    Abstract: An integrated circuit packaging system and method of manufacture thereof including: providing a substrate; forming contact pads on top of the substrate; forming a protection layer on top of the contact pads and the substrate; exposing the contact pads from the protection layer; printing under bump metallization (UBM) layers over the exposed contact pads extended over the protection layer with conductive inks; and forming bumps on top of the under bump metallization layers. It also including: printing an adhesion layer using conductive ink, wherein the adhesion layer comprises interconnected adhesion layer pads; forming additional under bump metallization (UBM) layers and bumps on top of the adhesion layer pads utilizing an electro-deposition process; and removing connections among the interconnected adhesion layer pads.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: January 9, 2018
    Assignee: STATS ChipPAC Ptc. Ltd.
    Inventors: Il Kwon Shim, Kyung Moon Kim, HeeJo Chi, JunMo Koo, Bartholomew Liao Chung Foh, Zigmund Ramirez Camacho
  • Patent number: 9679769
    Abstract: A system and method of manufacture of an integrated circuit packaging system includes: a photoimagable dielectric layer having a trace opening for exposing the carrier; a trace within the trace opening; an inner solder resist layer directly on the photoimagable dielectric layer and the trace, the inner solder resist layer having a bond pad opening for exposing the trace; an integrated circuit over the inner solder resist layer, the integrated circuit electrically connected to the trace through the bond pad opening; an encapsulation directly on the integrated circuit and the inner solder resist layer; and an external interconnect electrically coupled to the trace and the integrated circuit.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: June 13, 2017
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi
  • Patent number: 9659897
    Abstract: A system and a method of manufacture thereof of integrated circuit packaging system, including: a pillar; a conductive buildup attached to the pillar; and a molded body encapsulating the conductive buildup, the pillar extending out of the molded body.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: May 23, 2017
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Zigmund Ramirez Camacho, Emmanuel Espiritu, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, Jeffrey David Punzalan
  • Patent number: 9502267
    Abstract: An integrated circuit packaging system, and a method of manufacture thereof, includes: a support structure having: an internal insulation layer having a hole, a device connection side, and a removal mark characteristic of a conductive seed layer removed at the device connection side, a first conductive pad in the hole at the device connection side, and an exterior insulation layer over the first conductive pad at the device connection side; an integrated circuit over the exterior insulation layer; and an encapsulation over the integrated circuit.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: November 22, 2016
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: HeeJo Chi, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Zigmund Ramirez Camacho, Dao Nguyen Phu Cuong
  • Patent number: 9406642
    Abstract: An integrated circuit packaging system and method of manufacture thereof includes: a substrate; a plain trace on the substrate; an insulated trace on the substrate; an insulation layer on the insulated trace, the insulation layer at least partially covers the insulated trace; and a semiconductor device over the substrate, the semiconductor device has a plain bump attached on the plain trace and an inner bump attached on the insulated trace, and the plain bump is mounted adjacent to the insulation layer.
    Type: Grant
    Filed: March 9, 2015
    Date of Patent: August 2, 2016
    Assignee: STATS ChipPAC Ltd.
    Inventors: HeeJo Chi, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Zigmund Ramirez Camacho, Dao Nguyen Phu Cuong
  • Patent number: 9406531
    Abstract: A system and method of manufacture of an integrated circuit packaging system includes: a photoimagable dielectric layer having a trace opening for exposing the carrier; a trace within the trace opening; an inner solder resist layer directly on the photoimagable dielectric layer and the trace, the inner solder resist layer having a bond pad opening for exposing the trace; an integrated circuit over the inner solder resist layer, the integrated circuit electrically connected to the trace through the bond pad opening; an encapsulation directly on the integrated circuit and the inner solder resist layer; and an external interconnect electrically coupled to the trace and the integrated circuit.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: August 2, 2016
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi
  • Patent number: 9355983
    Abstract: A system and a method of manufacture thereof of integrated circuit packaging system, including: a pillar; a conductive buildup attached to the pillar; and a molded body encapsulating the conductive buildup, the pillar extending out of the molded body.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: May 31, 2016
    Assignee: STATS ChipPAC Ltd.
    Inventors: Zigmund Ramirez Camacho, Emmanuel Espiritu, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, Jeffrey David Punzalan
  • Patent number: 9331003
    Abstract: An integrated circuit packaging system, and method of manufacture thereof, includes: lead islands; a pre-molded material surrounding a bottom of the lead islands; a device over a portion of the lead islands and having electrical connections to another portion of the lead islands, the electrical connections over areas of the another portion of the lead islands over areas covered by the pre-molded material; and an encapsulation over the device and the lead islands.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: May 3, 2016
    Assignee: STATS ChipPac Ltd.
    Inventors: Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi
  • Patent number: 9324673
    Abstract: A method of manufacture of an integrated circuit packaging system includes: removing a portion of a leadframe to form a partially removed region and an upper portion of a peripheral lead on the leadframe first side; mounting a first integrated circuit over the partially removed region with a first adhesive; forming a first molding layer directly on the first integrated circuit and the peripheral lead; removing a portion of a leadframe second side exposing the first adhesive; mounting a second integrated circuit on the first adhesive of the first integrated circuit; forming a first interconnection layer directly on the first integrated circuit with the first integrated circuit and the peripheral lead electrically connected; and forming a second interconnection layer directly on the second integrated circuit with the second integrated circuit and the peripheral lead electrically connected.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: April 26, 2016
    Assignee: STATS ChipPAC Ltd.
    Inventor: Zigmund Ramirez Camacho
  • Publication number: 20160099222
    Abstract: An integrated circuit packaging system and method of manufacture thereof including: providing a substrate; forming contact pads on top of the substrate; forming a protection layer on top of the contact pads and the substrate; exposing the contact pads from the protection layer; printing under bump metallization (UBM) layers over the exposed contact pads extended over the protection layer with conductive inks; and forming bumps on top of the under bump metallization layers. It also including: printing an adhesion layer using conductive ink, wherein the adhesion layer comprises interconnected adhesion layer pads; forming additional under bump metallization (UBM) layers and bumps on top of the adhesion layer pads utilizing an electro-deposition process; and removing connections among the interconnected adhesion layer pads.
    Type: Application
    Filed: November 30, 2015
    Publication date: April 7, 2016
    Inventors: Il Kwon Shim, Kyung Moon Kim, HeeJo Chi, JunMo Koo, Bartholomew Liao Chung Foh, Zigmund Ramirez Camacho
  • Patent number: 9299644
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a terminal having a top with a depression; applying a dielectric material in the depression, the dielectric material having a gap formed therein and exposing a portion of the top therefrom; forming a trace within the gap and in direct contact with the top, the trace extending laterally over an upper surface of the dielectric material; and connecting an integrated circuit to the terminal through the trace.
    Type: Grant
    Filed: May 22, 2014
    Date of Patent: March 29, 2016
    Assignee: STATS ChipPAC Ltd.
    Inventors: Byung Tai Do, Arnel Trasporto, Zigmund Ramirez Camacho
  • Patent number: 9202793
    Abstract: An integrated circuit packaging system and method of manufacture thereof including: providing a substrate; forming contact pads on top of the substrate; forming a protection layer on top of the contact pads and the substrate; exposing the contact pads from the protection layer; printing under bump metallization (UBM) layers over the exposed contact pads extended over the protection layer with conductive inks; and forming bumps on top of the under bump metallization layers. It also including: printing an adhesion layer using conductive ink, wherein the adhesion layer comprises interconnected adhesion layer pads; forming additional under bump metallization (UBM) layers and bumps on top of the adhesion layer pads utilizing an electro-deposition process; and removing connections among the interconnected adhesion layer pads.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: December 1, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventors: Il Kwon Shim, Kyung Moon Kim, HeeJo Chi, JunMo Koo, Bartholomew Liao, Zigmund Ramirez Camacho
  • Patent number: 9202777
    Abstract: A semiconductor package system includes: providing a leadframe having inner frame bars, outer frame bars, a die pad, tiebars, and rows of leads, the inner frame bars being coplanar with outer frame bars; attaching a semiconductor chip to the die pad; attaching bond wires between the semiconductor chip and the rows of leads; encapsulating the semiconductor chip, the bond wires, the inner frame bars, the outer frame bars, the die pad, the tiebars, and the rows of leads in an encapsulant; cutting a groove to remove the inner frame bars; and singulating the leadframe and the encapsulant to remove the outer frame bars.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: December 1, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventors: Lionel Chien Hui Tay, Seng Guan Chow, Zigmund Ramirez Camacho
  • Patent number: 9142531
    Abstract: An integrated circuit packaging system and method of manufacture thereof includes: an L-plated lead; a die conductively connected to the L-plated lead; and an encapsulant encapsulating the L-plated lead and the die.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: September 22, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventors: Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay
  • Patent number: 9076737
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a base strip having a base top side; forming a terminal body with a substantially spherical shape partially in the base strip; attaching a device adjacent the terminal body and over the base top side, a device mount side of the device below a top portion of the terminal body; attaching a device connector to the device and the top portion of the terminal body; applying an encapsulant over the device connector, the device, and the top portion of the terminal body; and removing the base strip providing the terminal body partially exposed from the encapsulant.
    Type: Grant
    Filed: June 19, 2009
    Date of Patent: July 7, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventors: Zigmund Ramirez Camacho, Emmanuel Espiritu, Jose Alvin Caparas, Lionel Chien Hui Tay
  • Publication number: 20150179602
    Abstract: An integrated circuit packaging system and method of manufacture thereof including: an integrated circuit die having a contact pad; a redistribution layer on the contact pad, the redistribution layer having a chip contact, a trace, and a bump pad, the redistribution layer having a curved top surface and sidewalls which are planar; an upper passivation layer on the sidewalls of the redistribution layer with the area above the bump pad of the redistribution layer exposed from the upper passivation layer; and an external interconnect attached over the bump pad.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 25, 2015
    Inventors: Zigmund Ramirez Camacho, Bartholomew Liao, Sheila Marie L. Alvarez, Kelvin Dao
  • Patent number: 9059151
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having an upper structure, upper protrusions, and a base side facing away from the upper structure and the upper protrusions; forming tie bars in the leadframe with an opening surrounding the upper structure, the tie bars connected to the upper structure and exposed on the base side; connecting an integrated circuit to the upper protrusions; applying an encapsulant over the integrated circuit, over the upper structure, and in the opening with the base side exposed; removing the tie bars exposing a first surface and a second surface of the encapsulant below the first surface, and forming a die paddle from the upper structure and exposed from the second surface; and removing the leadframe from the base side forming island terminals from the upper protrusions exposed from the second surface and isolated from the die paddle.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: June 16, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventors: Zigmund Ramirez Camacho, Henry Descalzo Bathan, Emmanuel Espiritu
  • Patent number: 9059074
    Abstract: An integrated circuit package system includes: mounting an integrated circuit die adjacent to a lead; forming a first encapsulation around and exposing the integrated circuit die and the lead; and forming a planar interconnect between the integrated circuit die and the lead with the planar interconnect on the first encapsulation.
    Type: Grant
    Filed: March 26, 2008
    Date of Patent: June 16, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventors: Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan, Abelardo Jr. Hadap Advincula
  • Patent number: 9034692
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a lead; placing an integrated circuit device, having an external connector, adjacent to and electrically isolated from the lead; mounting an integrated circuit over the lead and the integrated circuit device with the integrated circuit electrically isolated from the integrated circuit device; and forming a package encapsulation, having an encapsulation base, over the lead, the integrated circuit, and the integrated circuit device with the lead and the external connector exposed from the encapsulation base.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: May 19, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventors: Henry Descalzo Bathan, Zigmund Ramirez Camacho, Jairus Legaspi Pisigan