Abstract: A display panel is provided, including a flat display region, and a fixed region and a sliding-scrolling region on two sides of the flat display region in a first direction, the fixed region is adhered with a middle frame, the flat display region is configured to display images, the sliding-scrolling region is configured to form a rolled-up state and an extended state by sliding-scrolling, the sliding-scrolling region displays the image together with the flat display region in the extended state, on a plane perpendicular to the display panel, the display panel at least includes a display substrate, an adhesive layer disposed on the display substrate, and a cover plate layer on a side of the adhesive layer away from the display substrate, the cover plate layer at least includes a glass layer, the glass layer of at least one of the fixed region and the sliding-scrolling region has a structural hole.

Abstract: This application discloses a peak clipping method. The method includes: performing 1-out-of-N sampling on a first signal; then selecting, from a second signal obtained through the sampling, a noise point set of the second signal based on a second threshold; determining a candidate noise point set of the first signal based on the noise point set of the second signal; selecting a noise point set of the first signal from the candidate noise point set of the first signal based on a first threshold; determining a peak clipping coefficient based on the noise point set of the first signal; clipping the first signal based on the peak clipping coefficient; and finally outputting a clipped first signal. In this method, fewer sample points are used for peak clipping, reducing storage space. This application further discloses a signal processing apparatus and a network device that can implement the foregoing method.

Abstract: A silicon carbide-based micro-electro-mechanical system (MEMS) combined temperature-pressure sensor chip and a preparation thereof. The chip includes a peripheric pressure-measuring unit and a center temperature-measuring unit. The pressure-measuring unit includes a silicon carbide substrate with a raised island and a pressure sensitive diaphragm formed by etching the back of the substrate. The raised island and the pressure-sensitive diaphragm constitute a membrane-island structure. Four piezoresistive strips are arranged symmetrically along a circumferential direction of a root of the pressure-sensitive diaphragm and between the raised island and the pressure-sensitive diaphragm. The temperature-measuring unit includes the raised island and a thin-film thermocouple arranged thereon.

Abstract: A silicon carbide-based micro-electro-mechanical system (MEMS) combined temperature-pressure sensor chip and a preparation thereof. The chip includes a peripheric pressure-measuring unit and a center temperature-measuring unit. The pressure-measuring unit includes a silicon carbide substrate with a raised island and a pressure sensitive diaphragm formed by etching the back of the substrate. The raised island and the pressure-sensitive diaphragm constitute a membrane-island structure. Four piezoresistive strips are arranged symmetrically along a circumferential direction of a root of the pressure-sensitive diaphragm and between the raised island and the pressure-sensitive diaphragm. The temperature-measuring unit includes the raised island and a thin-film thermocouple arranged thereon.