Patents by Inventor Zuruzi Bin Abu Samah

Zuruzi Bin Abu Samah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8643463
    Abstract: A method of forming a film is described. The method begins by forming a mixture including a polymer and a plurality of unordered nanomaterial. The film is dried and a plurality of pores is formed within the film. A sensitive film transducer capable of detecting changes in pressure and applied force can be made using this method.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: February 4, 2014
    Assignee: Nanyang Polytechnic
    Inventor: Zuruzi Bin Abu Samah
  • Publication number: 20120235781
    Abstract: A method of forming a film is described. The method begins by forming a mixture including a polymer and a plurality of unordered nanomaterial. The film is dried and a plurality of pores is formed within the film. A sensitive film transducer capable of detecting changes in pressure and applied force can be made using this method.
    Type: Application
    Filed: November 30, 2009
    Publication date: September 20, 2012
    Inventor: Zuruzi Bin Abu Samah
  • Publication number: 20120237424
    Abstract: A method of producing a titanium dioxide film with dopant uniformly dispersed throughout the entirety of the film The method involves deposition of dopant, concurrently or sequentially, with titanium before oxidation of the titanium. No separate doping step is required in this invention since the doping step occurs in-situ during oxidation process. The amount of dopant incorporated into a titanium dioxide film is controllable by varying the thickness and/or number of dopant layers deposited. Furthermore, dispersion of dopant throughout the titanium dioxide film is more uniform in this invention as multiple layers of dopant may be employed.
    Type: Application
    Filed: December 7, 2009
    Publication date: September 20, 2012
    Inventor: Zuruzi Bin Abu Samah
  • Patent number: 7015132
    Abstract: A method of constructing an electrical contact on an electronic component comprises first forming a protruding electrically conducting stud at a contact location by wire bonding a metal wire to a contact pad of the component. The stud is then contacted with solder, without using a mask, so that a solder bump is deposited on and adheres to the metal stud to form a composite solder contact which is able to form with a contact of another component a solder joint which has good electrical and mechanical properties and which may be reliable fabricated at high density by a low cost method. An electronic component provided with such solder contacts and an electronics component package including such a component are also disclosed.
    Type: Grant
    Filed: January 2, 2002
    Date of Patent: March 21, 2006
    Assignee: Agency for Science, Technology and Research
    Inventors: Syamal Kumar Lahiri, Rinus Tek Po Lee, Zuruzi Bin Abu Samah
  • Publication number: 20020102765
    Abstract: A method of constructing an electrical contact on an electronic component comprises first forming a protruding electrically conducting stud at a contact location by wire bonding a metal wire to a contact pad of the component. The stud is then contacted with solder, without using a mask, so that a solder bump is deposited on and adheres to the metal stud to form a composite solder contact which is able to form with a contact of another component a solder joint which has good electrical and mechanical properties and which may be reliable fabricated at high density by a low cost method. An electronic component provided with such solder contacts and an electronics component package including such a component are also disclosed.
    Type: Application
    Filed: January 2, 2002
    Publication date: August 1, 2002
    Inventors: Syamal Kumar Lahiri, Rinus Tek Po Lee, Zuruzi Bin Abu Samah