Fluid apparatus for semiconductor manufacturing equipment

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Description

The file of this patent contains at least one drawing/photograph executed in color. Copies of this patent with color drawing(s)/photograh(s) will be provided by the Office upon request and payment of the necessary fee.

FIG. 1 is a front view of a fluid apparatus for semiconductor manufacturing equipment showing my new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof; and,

FIG. 7 is an enlarged view of encircled portion labeled FIG. 7 in FIG. 1.

The drawings are lined for the color black.

Figures indicated in broken lines in the drawings represent environmental structure, which forms no part of the claimed design. Dash-dot lines in the drawings represent the boundary of the claimed design. In FIGS. 1-4, the solid-color portion at the center of the claimed design represents a black-colored portion.

Claims

The ornamental design for a fluid apparatus for semiconductor manufacturing equipment, as shown and described.

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Other references
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Patent History
Patent number: D845803
Type: Grant
Filed: Apr 20, 2016
Date of Patent: Apr 16, 2019
Assignee: Surpass Industry Co., Ltd. (Gyoda-shi, Saitama)
Inventor: Takashi Imai (Saitama)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/561,806
Classifications
Current U.S. Class: Volume, Flow Or Rate (D10/96)