Abstract: A multi-monitor display system is described having an arm adapted for supporting a plurality of monitors containing display screens. The system also includes a column for supporting the arm, a monitor controller assembly for electronically controlling images displayed on the screens, and a graphics assembly for sending signals to the monitor controller assembly to produce the images. The system is used in conjunction with a central processor located in a computer housing. The monitor controller assembly is disposed outside of the monitors and/or the graphics assembly is disposed outside the computer housing.

Abstract: An information processing apparatus includes: a housing; a main circuit board housed inside the housing and having a notch portion; and a storage device disposed inside the housing and having at least a part of a body of the storage device being disposed within the notch portion, the storage device having an installation surface being set to have a predetermined angle with respect to a board surface of the main circuit board.

Abstract: A HDD assembly comprises a HDD defining a plurality of mounting holes therein and a bracket for fixing the HDD. The bracket comprises a fixing plate and a holding frame connected with the fixing plate. The holding frame defines a receiving space for receiving the HDD therein. The holding frame comprises a resilient clip. The resilient clip forms a plurality of poles engaging in the mounting holes of the HDD, to firmly fix the HDD in the receiving space of the bracket.

Abstract: A mounting apparatus is used to secure a disk drive, which has a positioning post, and includes a bracket and a locking component. The bracket is configured for receiving the disk drive, and includes a first sidewall, the first sidewall defining a guiding slot. The locking component includes a main body secured to an outer surface of the first sidewall. A convex structure is located on the main body, and includes a first portion, a second portion and a third portion. A distance is defined between the second portion and the first sidewall and great enough to allow the positioning post pass underneath. A resiliently deformable locking piece extends from the convex structure and substantially adjacent the guiding slot. The locking piece engages with the positioning post.

Abstract: A notebook computer docking station including a body and a first connecting port is provided. The body has a first recess and a second recess, wherein the first recess is for accommodating a notebook computer and the second recess is for accommodating peripheral devices. The first connecting port is located in the second recess and electrically connected to the peripheral devices.

Abstract: A stand for supporting an object. The stand includes a base, a support member coupled to the base, and a movement mechanism adapted to allow the object to move along a range of travel relative to the base. The base includes a planar surface for resting on a support surface. The planar surface includes a first portion and a second portion. The first portion includes a pad for providing frictional resistance between the base and the support surface on which the base is placed. The second portion includes at least first and second wheels, for rotating the base about the pad such that the object is rotated about the pad when the base is rotated about the pad.

Abstract: A computer docking station is provided for supporting and electrically coupling to a portable computer that includes a docking connector and an aperture at least partly defining a carrying handle for the computer. The docking station includes a body with a cradle portion configured to support a portion of the computer and having a connector operable to electrically couple with the docking connector of the computer. The body further includes an arm portion sized and configured to be received in the aperture in the computer. A latching member is coupled with the arm portion and is movable between a first position relative to the arm portion, in which the arm portion can be inserted into or removed from the aperture in the portable computer, and a second position relative to the arm portion, in which the arm portion cannot be removed from the aperture in the portable computer.

Abstract: An electronic device includes a body portion such as, for example, a laptop chassis, and a deployable support coupled to the bottom surface of the body portion. The deployable support can be moved between a stowed position relative the bottom surface of the body portion and a deployed position in which support is positioned in spaced relationship to the bottom to create an airflow path beneath the body portion.

Abstract: A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling; heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electronic device includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid, and a pump for pumping the liquid into and out of the space, to and from a heat exchanger that is fixed to the housing outside the interior space. The heat exchanger includes a cooling liquid inlet, a cooling liquid outlet, and a flow path for cooling liquid therethrough from the cooling liquid inlet to the cooling liquid outlet. An air-moving device, such as a fan can be used to blow air across the heat exchanger to increase heat transfer.

Abstract: A fan delay controlling apparatus includes a connector connected to a fan of an electronic device, a power supplying module connected to the connector, and a power controlling module connected to the power supplying module. The power supplying module is connected to a fan power source and a stand-by power source. The power controlling module controls the power supplying module supply power to the fan when the electronic device including the fan powers off until an ambient temperature is lower than a predetermined value.

Abstract: A portable computing device includes a base including a first surface, and a lid that is pivotably connected to the base and includes a second surface. One of the first surface and the second surface defines a through opening. A latching mechanism for locking the lid onto the base includes a protruding tab that protrudes from the other one of the first surface and the second surface and defines a through hole. The latching mechanism also includes a hook arranged within and rotatably connected to one of the base and the lid. The hook is configured for engaging the through hole of the protruding tab extending through the through opening, to lock the lid onto the base. An elastic member is provided to apply a spring force to the hook to cause the hook to rotate back to an original position after the hook disengages from the protruding tab.

Abstract: There is provided a laptop personal computer comprising: a first chassis 11 accommodating a display section and having a basic shape of substantially rectangle in a planar view; a second chassis 31 accommodating an operation control section and having a basic shape of substantially rectangle in a planar view; and a hinge mechanism 20 for coupling one side 31r of the second chassis and one side 11r of the first chassis and supporting both chassis in a relatively openable and closable manner, wherein the first chassis is provided with a projection part 19 at an edge portion of an other side 11f opposing to the one side 11r, the projection part is formed along the other side and projects to the second chassis side in a state where the first chassis is closed together with the second chassis.

Abstract: A filter 101 of the present application has flexibility. The filter 101 includes a left protruding portion 102, a right protruding portion 103, a lower protruding portion 104a, a lower protruding portion 104b, and an upper protruding portion 105. The electronic equipment of the present application includes a main portion 2 and a display portion 3. The display portion 3 includes a left groove 11a, a right groove 11b, a lower groove 12a, and a lower groove 12b. The left protruding portion 102 can be inserted in the left groove 11a. The right protruding portion 103 can be inserted in the right groove 11b. The lower protruding portion 104a can be inserted in the lower groove 12a. The lower protruding portion 104b can be inserted in the lower groove 12b. When the filter 101 is mounted on the display portion 3, the upper protruding portion 105 is positioned on the display frame 9.

Abstract: A data processing system with at least one mainboard is arranged in a computer housing and at least one daughter card that can be electrically connected to the mainboard by at least one riser card. A metal carrier sheet accommodates and supports the riser card and the daughter card and can be arranged together with the riser card and the daughter card in the computer housing. A metal carrier sheet includes a retaining bracket constructed to fix the riser card on the metal carrier sheet without screws.

Abstract: An audio sound system has a printed circuit board disposed within a compact case. The PCB has a power conversion circuit for generating an operating potential, audio amplifier circuit coupled for receiving the operating potential to amplify an audio signal, and peak voltage and current limiting circuit coupled to the audio amplifier circuit to avoid hard clipping of the audio signal. The power conversion circuit has heat-generating components. A cooling tunnel is mounted over the printed circuit board. A cooling fan is mounted in the compact case adjacent a first opening of the cooling tunnel for directing air flow through a second opening of the cooling tunnel over the PCB. The cooling tunnel has a notch formed in a side of the cooling tunnel for directing air flow over the PCB. The audio amplifier circuit can generate greater than 500 watts into a 4-ohm load.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a heat dissipating member disposed inside the housing, a first heat generating element mounted on the circuit board, a second heat generating element mounted on the circuit board, a first heat pipe, and a second heat pipe. The first heat pipe includes a first heat receiving portion thermally connected to the first heat generating element, and a first heat releasing portion thermally connected to the heat dissipating member. The second heat pipe includes a second heat receiving portion thermally connected to the second heat generating element, a second heat releasing portion thermally connected to the heat dissipating member, and a fluid capturing structure configured to temporarily hold a working fluid enclosed inside the second heat pipe.

Abstract: A display apparatus includes a liquid crystal display having a display panel, a housing, and a plurality of heat pipes. The housing has a sealing part and has aeration paths. The sealing part seals the display panel to box the display panel therein, while making a display screen of the display panel viewable from outside. The aeration paths are arranged outside the sealing part and communicate with the outside of the housing. The heat pipes extend from a rear surface of the display panel to the aeration paths.

Abstract: According to one embodiment, the electronic device includes a housing, the first to third printed circuit boards, and a fan unit. The first printed circuit board includes the first heat-generating part secured to the first wiring board. The second printed circuit board includes the second and third heat-generating parts, has an amount of heat generation larger than that of the first printed circuit board, and is located between the first printed circuit board and the second wall. The third printed circuit board includes the fourth heat-generating part, has an amount of heat generation smaller than that of the first printed circuit board, and is located between the first printed circuit board and the first wall.

Abstract: A display apparatus has a liquid crystal display having a display panel, a housing, a circulating fan, and an air conditioner. The housing has a sealing part. The sealing part seals around the display panel and accommodates the display panel therein, while making the display screen viewable from outside. The circulating fan circulates air along a circulation path surrounding the display panel wherein the path includes a space between the display screen and the sealing part. The air conditioner collects heat from the air circulating the circulation path and releases the heat to outside of the housing.

Abstract: An electronic device including a case, a fan module and a transparent cover is provided. The fan module including a fan and a fin set is disposed in the case. The fin set is disposed aside the fan, and a space is formed there between. The transparent cover is connected to the case, and is located above the space formed between the fin set and the fan.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a partition, a first cooling fan, and a second cooling fan. The partition partitions an inside of the housing into a first chamber and a second chamber. The first chamber communicates with a first inlet, a third inlet, and a first outlet. The second chamber communicates with a second inlet and a second outlet. The first cooling fan locates above the third inlet in the first chamber, and includes a first intake configured to draw air in the first chamber, and a second intake configured to draw air outside the housing through the third inlet, the first cooling fan being configured to discharge the air to a heat sink. The second cooling fan locates in the second chamber and is configured to draw air in the second chamber, and to discharge the air to the second outlet.

Abstract: According to one embodiment, an electronic apparatus includes a housing provided with air intake holes, a circuit board contained in the housing, with a heat producing component mounted on the circuit board, a heat sink contained in the housing, and a fan which sends cooling air to the heat sink in the housing, and includes a fan casing and an impeller contained in the fan casing. The fan casing includes a first suction port and a second suction port which face each other with the impeller inserted therebetween, and an exhaust port which faces the heat sink. The first suction port communicates with the air intake holes of the housing. The second suction port comprises an open area which faces the heat producing component in the housing, and another open area which is open to inside of the housing at a position deviated from the circuit board.

Abstract: Compliant conduction rail assembly and method are provided for facilitating cooling of an electronics structure. The rail assembly includes a first thermally conductive rail mounted to a surface of the electronics structure, a second thermally conductive rail thermally conductively interfaced to the first rail, and a biasing mechanism biasing the second rail away from the first rail. The first and second rails and the biasing mechanism are configured for slidable insertion into a housing with the electronics structure, the housing containing a liquid-cooled cold plate(s). With insertion of the electronics structure into the housing, the second rail engages the liquid-cooled cold plate and is forced by the biasing mechanism into thermal contact with the cold plate, and is forced by the cold plate towards the first rail, which results in a compliant thermal interface between the electronics structure and the liquid-cooled cold plate of the housing.

Abstract: A liquid-cooled electromagnetic component (reactor, transformer) including a plurality of disc-shaped coils with one or more turns and flat radiators located between them, wherein at least two disc coils are assigned to a flat radiator, and in which all the winding elements (turns of the coil) are in direct thermal contact with the surfaces of the flat radiators. This component is used in power converter installations and in midfrequency installations.

Abstract: An electronic device including a heat generation element, a heat dissipation plate, and a heat pipe is provided. The heat dissipation plate includes a top surface, a bottom surface, a pair of longitudinal side surfaces, and a pair of lateral side surfaces including a third side surface and a fourth side surface. The longitudinal side surfaces include first and second side surfaces. The lateral side surfaces include third and fourth side surfaces. The first, second, third and fourth side surfaces are connected to both the top surface and the bottom surface. The heat pipe is disposed in contact with the heat dissipation plate, and the heat pipe and the heat generation element are disposed on the bottom surface of the heat dissipation plate. The heat pipe is disposed on the heat dissipation plate and extension of the heat pipe is not beyond the first, second, third and fourth side surfaces.

Abstract: According to one embodiment, a pressing member includes: a band-like pressing portion placed on a heat receiving block arranged on an element mounted on a substrate, the pressing portion configured to press the heat receiving block against the element; a first arm, one end of the first arm being connected to one longitudinal end of the pressing portion, other end of the first arm being connected to the substrate; and a second arm, one end of the second arm being connected to other longitudinal end of the pressing portion, other end of the second arm being connected to the substrate, wherein the first arm and the second arm are connected to the pressing portion in a bent shape as seen in a planar view from above a surface of the substrate.

Abstract: According to one embodiment, an electronic device includes a housing, a circuit board, a thermally radiative section, a first heat generator, a second heat generator, a first heat receiving block, a second heat receiving block, at least one heat pipe including a first end and a second end, a second heat pipe including a third end, a fourth end, and an intermediate portion, and a cutout section provided on the first heat receiving block. The second heat generator is mounted on the circuit board at a position farther from the thermally radiative section than the first heat generator is. The first heat receiving block is provided with a cutout section and is thermally connected to the first heat generator. The second heat receiving block is thermally connected to the second heat generator. The intermediate portion of the second heat pipe passes through the cutout section.

Abstract: An evaporator includes a liquid barrier wall made of a ceramic material, a vapor barrier wall made of a ceramic material, and a wick made of a ceramic material and being positioned between the liquid barrier wall and the vapor barrier wall.

Abstract: System and method are provided for cooling an electronics rack. A modular cooling unit (MCU) is associated with the rack to provide system coolant to an electronics subsystem and a bulk power assembly. The MCU includes a liquid-to-liquid heat exchanger, and defines portions of facility and system coolant loops. Chilled coolant from a facility source is passed through the liquid-to-liquid heat exchanger to cool system coolant flowing through the system coolant loop. The system also includes an air-to-liquid heat exchanger in fluid communication with the system coolant loop, a pump in fluid communication with the system coolant loop, and a controller. The controller controls operation of the pump to adjust flow of system coolant through the system coolant loop dependent upon a mode of operation. In a standby mode, system coolant flows through the air-to-liquid heat exchanger at a lower flow rate, and expels heat to ambient air.

Abstract: Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.

Abstract: A tuner module includes a circuit board, an electronic component, mounted on the circuit board, for demodulating a high frequency reception signal received from an antenna unit to produce a speech signal, a metal case accommodating the circuit board and the electronic component therein, and a heat conductive sheet, disposed between the electronic component and the metal case, made of an elastic body. The heat conductive sheet has dimensions which are substantially equal to or slightly lower than outer dimensions of the electronic component. The metal case has at least one slit-shaped hole which is formed along an outer shape of the electronic component.

Abstract: A module substrate having a heat-generative electronic component mounted thereon includes first and second dielectric substrates and an intermediate heat transfer film. The heat-generative electronic component is flip-chip bonded on a wiring layer formed on the main surface of the first dielectric substrate through a solder bump. The second dielectric substrate is attached to the upper surface of the electronic component through an insulating layer. The intermediate heat transfer film for transferring heat generated by the electronic component to the second dielectric substrate is attached between the insulating layer and the second dielectric substrate so as to make the intermediate heat transfer film in close contact with the lower surface of the second dielectric substrate, thereby suppressing the temperature of the heat-generative electronic component in operation from increasing.

Abstract: A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.

Abstract: There is provided a laptop personal computer comprising: a first chassis 11 accommodating a display section and having a basic shape of substantially rectangle in a planar view; a second chassis 31 accommodating an operation control section and having a basic shape of substantially rectangle in a planar view; and a hinge mechanism 20 for coupling one side 31r of the second chassis and one side 11r of the first chassis and supporting both chassis in a relatively openable and closable manner, wherein the hinge mechanism includes a hinge bracket 22 of which a base end 22b side is coupled with a hinge axle 21, the hinge bracket, being disposed inside an escutcheon part 14 of the first chassis and supports the first chassis: an extension part 14a which extends at a slant from a flat portion 14f of the escutcheon part is provided to a side edge portion of the escutcheon part from a side corresponding to a tip 22a of the hinge bracket to a side corresponding to the base end of the hinge bracket, and a slanted part 3

Abstract: An electronic device includes a main body, an expansion card holder, and a protective cover assembly. The main body defines an opening. The expansion card holder is located in the main body adjacent to the opening. The expansion card holder defines a bay facing the opening to receive an expansion card. The protective cover assembly includes a rotary shaft unit, and a metallic cover rotatably connected to the main body via the rotary shaft unit. The metallic cover includes a cover portion covering the opening, and a resisting portion extending from the cover portion and resisting the main body. The resisting portion provides resilient force impelling the cover portion to cover the opening automatically.

Abstract: A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features may mate and self-lock with each other. For example, the positive features on one of the surfaces may include pairs of counterposed micro-springs, and the negative features may include pits or grooves on the other surface. When the substrates are mechanically coupled, a given pair of positive features may provide a force in a plane of the other surface. Furthermore, by compressing the MCM so that the surfaces of the substrates are pushed toward each other, the mechanical coupling may be released.

Abstract: A fixing structure for a battery positions the battery in a casing of an electronic device. The fixing structure includes at least a connecting portion, at least a locking portion, and a receiving portion. The connecting portion is on one side of the battery and with a waterproof element. The locking portion is on the other side of the battery and is opposite to the connecting portion. The receiving portion is on the casing and with a first inserting portion and a plurality of second inserting portions. The first inserting portion and the second inserting portions correspond in position to the connecting portion and the locking portion respectively. Hence, the fixing structure protects the electronic device against permeation of water and ensures secure positioning of the battery.

Abstract: A flexible circuit assembly. The flexible circuit assembly includes a flexible circuit, a substrate of a capacitive-sensing device and an electronic component that are coupled to the flexible circuit. The flexible circuit includes a first portion having a first conductive contact pad, a second portion having a second conductive contact pad, and a third portion disposed between the first portion and the second portion. The flexible circuit is configured to fold at the third portion between the first portion and the second portion so that the first conductive contact pad couples to a first conductor disposed along a first edge of the substrate and the second conductive contact pad couples to a second conductor disposed along a second edge of the substrate of the capacitive-sensing device. The first edge of the substrate of the capacitive-sensing device is non-parallel to the second edge of the substrate of the capacitive-sensing device.

Abstract: A fixing structure is adapted for an electronic device. The electronic device has a circuit board. The fixing structure includes a base plate and a position limiting element. The base plate has a first side and a second side. The position limiting element has a first limiting portion and a second limiting portion. The first limiting portion connects the first side of the base plate, and the second limiting portion connects the second side of the base plate, such that the position limiting element and the base plate together form a receiving space. The circuit board is adapted for passing through the receiving space, so as to be assembled onto the base plate.

Abstract: Sensitive electronic components can be mounted on a printed circuit board within an electronic device. To isolate a sensitive component from stresses that may arise during an unintended impact event, the electronic component can be isolated using a groove in the printed circuit board. The electronic component may be mounted to a component mounting region using solder balls. The component mounting region may be surrounded on some or all sides by the groove. Flex circuit structures that bridge the groove or a portion of the rigid printed circuit board may be used to hold the component mounting region in place. The flex circuit structures may be provided in the form of separate structures or may be provided as an integral portion of the printed circuit board.

Abstract: A portable electronic device includes a housing, a circuit board received in the housing, and a memory card retaining mechanism received in the housing. The memory card retaining mechanism includes a plurality of conductive parts. The plurality of conductive parts cooperatively form an antenna integrated with the memory card retaining mechanism and connected to the circuit board.

Abstract: An electronic component includes: an electronic component body; and a lead secured to the electric component and including a projection portion defined by first and second inclined portions facing each other. The solder wettability of the first inclined portion is smaller than the solder wettability of the second inclined portion.

Abstract: A strain measurement chip including a body, a strain gauge provided within the body, and electrical contacts with which the strain measurement chip can be mounted to a circuit board, at least one of the electrical contacts being in electrical communication with the strain gauge to enable communication of strain data measured by the strain gauge to the circuit board.

Abstract: Electronic assemblies with solder containment brackets are provided. A solder containment bracket may have a planar base and a vertically extending wall. The wall may protrude upwards from the base to form an enclosed region. The base may have a hole that corresponds to the shape of the enclosed region. The wall may have an opening. A wire may be inserted into the opening. The wire may be soldered to the solder containment bracket to form a solder joint that electrically connects the wire to the bracket. The solder joint formed within the enclosed region may have a size that is defined by the bracket wall. The solder containment bracket may be soldered to a solder pad on a printed circuit board by reflowing a layer of solder paste.

Abstract: A semiconductor device comprising a flat wiring board, a first LSI disposed on one surface of the wiring board, a sealing resin for covering the one surface and a side face of the first semiconductor element, and a second LSI disposed on another surface of the wiring board. The wiring board has conductive wiring as a wiring layer, an insulation resin as a support layer for the wiring layer, and a conductive through-hole that passes through the wiring layer and the support layer. Connection points between lands disposed in positions in which the external peripheral edges of the semiconductor elements transverse the interior of the lands as viewed vertically from above, which lands are selected from land portions on which the external connection terminals are formed, and the wiring board formed in the same plane as the lands, are unevenly distributed toward one side of the wiring board.

Abstract: A pad layout structure of a driver IC chip of a liquid crystal display device includes dummy power pads and dummy ground pads, which are disposed in corners of the driver IC chip and are connected to main power pads and main ground pads by metal lines in a chip-on-film (COF) package. Accordingly, it is possible to reduce the resistance of power supply lines and ground lines, to minimize a power dip of a block located far away from the main power pads and main ground pads, and to prevent a failure in power application, which may occur due to a decrease of adhesive strength at a specific position, by dispersing the adhesion positions of the power pads and ground pads.

Abstract: According to one embodiment, an electronic apparatus has a circuit module. The circuit module includes a first circuit board having a first side end face on which a first circuit pattern is formed, a second circuit board having a second side end face on which a second circuit pattern is formed, and a flexible wiring board which is in contact with the first side end face and the second side end face to electrically connect the first circuit pattern and the second circuit pattern.

Abstract: An integrated circuit assembly includes a first electrically conductive sheet, a second electrically conductive sheet electrically isolated from the first electrically conductive sheet, a non-conductive material disposed between the first and second electrically conductive sheets, an electrical trace disposed on the non-conductive material and electrically isolated from the first and second electrically conductive sheets, and an integrated circuit having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the electrical trace. Other integrated circuit assemblies and method for making integrated circuit assemblies are also disclosed.

Abstract: An electronic system includes a system board and a packaging substrate mounted on the system board. One or more semiconductor dies are mounted on the packaging substrate and coupled to the system board. The system also includes one or more semiconductor die-based packaging interconnects between the system board and the packaging substrate. The semiconductor die-based packaging interconnect has a first face coupled to the system board and a second face coupled to the packaging substrate. Through silicon vias located in the semiconductor die-based packaging interconnect enable communication between the system board and the one or more semiconductor dies. The semiconductor die-based packaging interconnects may include passive devices, active devices, and/or circuitry. For example, the semiconductor die-based packaging interconnect may provide impedance matching, decoupling capacitance, and/or amplifiers for minimizing insertion loss.

Abstract: A shielding structure is provided for shielding a signal path extending between a first layer and a second layer in an electronic device at a transition region with a transition that extends in a first direction and a second direction orthogonal to the first direction. The shielding structure includes a shielding structure portion, which includes a first shielding via in proximity to a first area of the signal path at the transition; a second shielding via in proximity to a second area of the signal path at the transition; and an area metallization electrically coupled to the first shielding via.