Patents Issued in May 14, 2013
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Patent number: 8441124Abstract: A sidewall protection structure is provided for covering at least a portion of a sidewall surface of a bump structure, in which a protection structure on the sidewalls of a Cu pillar and a surface region of an under-bump-metallurgy (UBM) layer is formed of at least one non-metal material layers, for example a dielectric material layer, a polymer material layer, or combinations thereof.Type: GrantFiled: April 29, 2010Date of Patent: May 14, 2013Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Wen Wu, Cheng-Chung Lin, Chien Ling Hwang, Chung-Shi Liu
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Patent number: 8441125Abstract: A semiconductor device, including: a semiconductor layer having an active region; a first conductive layer formed above the semiconductor layer and having a first width; a second conductive layer connected to the first conductive layer and having a second width smaller than the first width; an interlayer dielectric formed above the semiconductor layer; an electrode pad formed above the interlayer dielectric and covering the active region when viewed from a top side; and a forbidden region provided in the semiconductor layer in a specific range positioned outward from a line extending vertically downward from an edge of at least part of the electrode pad. A connection section at which the first conductive layer and the second conductive layer are connected is not provided in the forbidden region.Type: GrantFiled: March 28, 2011Date of Patent: May 14, 2013Assignee: Seiko Epson CorporationInventors: Takeshi Yuzawa, Masatoshi Tagaki
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Patent number: 8441126Abstract: A semiconductor apparatus includes a semiconductor chip in which a plurality of electrode pads are provided on a main surface, and a plurality of bump electrodes are provided on the electrode pads of the semiconductor chip. The semiconductor apparatus also includes a wired board which is allocated in a side of the main surface of the semiconductor chip, and is positioned in a central area of the main surface of the semiconductor chip so as to be separated from an edge part of the semiconductor chip by at least 50 ?m or more. The semiconductor apparatus also includes a plurality of external terminals which are provided on the wired board, and which are electrically connected to a plurality of bump electrodes through wirings of the wired board, and sealing part which is provided between the semiconductor chip and the wired board, is made of underfill material that covers a connection part between the bump electrode and the wiring.Type: GrantFiled: May 12, 2011Date of Patent: May 14, 2013Assignee: Elpida Memory, Inc.Inventors: Mitsuhisa Watanabe, Ichiro Anjoh
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Patent number: 8441127Abstract: A device includes a package component, and a metal trace on a surface of the package component. A first and a second dielectric mask cover a top surface and sidewalls of the metal trace, wherein a landing portion of the metal trace is located between the first and the second dielectric masks. The landing portion includes a first portion having a first width, and a second portion connected to an end of the first portion. The second portion has a second width greater than the first width, wherein the first and the second widths are measured in a direction perpendicular to a lengthwise direction of the metal trace.Type: GrantFiled: June 29, 2011Date of Patent: May 14, 2013Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Fu-Tsai Hou, Liang-Chen Lin
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Patent number: 8441128Abstract: A semiconductor arrangement includes a circuit carrier, bonding wire and at least N half bridge circuits. The circuit carrier includes a first metallization layer, a second metallization layer, an intermediate metallization layer arranged between the first metallization layer and the second metallization layer, a first insulation layer arranged between the intermediate metallization layer and the second metallization layer, and a second insulation layer arranged between the first metallization layer and the intermediate metallization layer. Each half bridge circuit includes a controllable first semiconductor switch and a controllable second semiconductor switch. The first semiconductor switch and the second semiconductor switch of each half bridge circuit are arranged on that side of the first metallization layer of the circuit carrier facing away from the second insulation layer. The bonding wire is directly bonded to the intermediate metallization layer of the circuit carrier at a first bonding location.Type: GrantFiled: August 16, 2011Date of Patent: May 14, 2013Assignee: Infineon Technologies AGInventor: Daniel Domes
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Patent number: 8441129Abstract: A semiconductor device includes a first structural body having first electrode pads; a second structural body disposed in a face-up type over the first structural body in such a way as to expose the first electrode pads, and having first connection members with at least two protrusions; and a third structural body disposed in a face-down type over the second structural body, and having second connection members with at least two protrusions, on a surface thereof facing the second structural body, wherein some of the protrusions of the second connection members are electrically connected with the exposed first electrode pads, and at least one of remaining protrusions of the second connection members is electrically connected with the first connection members.Type: GrantFiled: March 5, 2012Date of Patent: May 14, 2013Assignee: SK Hynix Inc.Inventor: Ki Young Kim
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Patent number: 8441130Abstract: A power supply interconnect structure of a semiconductor integrated circuit includes a single borderless stack via electrically connecting power supply interconnects of two different interconnect layers to form a connecting portion of the interconnects, and a multi-stack via functioning as another connecting portion of the interconnects, which electrically connect the power supply interconnects, and having a wide pad portion. The single borderless stack via is located in an interconnect region with high signal interconnect density. The multi-stack via is located in an interconnect region with low signal interconnect density. This increases interconnection efficiency in the region with the high signal interconnect density to improve interconnection characteristics. This enables reduction in an area of a chip and increases compatibility to an EDA tool, thereby improving IR-DROP characteristics.Type: GrantFiled: July 6, 2011Date of Patent: May 14, 2013Assignee: Panasonic CorporationInventor: Hideaki Takeshima
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Patent number: 8441131Abstract: Generally, the subject matter disclosed herein relates to sophisticated semiconductor chips that may be less susceptible to the occurrence of white bumps during semiconductor chip packaging operations, such as flip-chip or 3D-chip assembly, and the like. One illustrative semiconductor chip disclosed herein includes, among other things, a bond pad and a metallization layer below the bond pad, wherein the metallization layer is made up of a bond pad area below the bond pad and a field area surrounding the bond pad area. Additionally, the semiconductor device also includes a plurality of device features in the metallization layer, wherein the plurality of device features has a first feature density in the bond pad area and a second feature density in the field area that is less than the first feature density.Type: GrantFiled: September 12, 2011Date of Patent: May 14, 2013Assignee: GLOBALFOUNDRIES Inc.Inventor: Vivian W. Ryan
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Patent number: 8441132Abstract: Packaged microelectronic devices recessed in support member cavities, and associated methods, are disclosed. Method in accordance with one embodiment includes positioning a microelectronic device in a cavity of a support member, with the cavity having a closed end with a conductive layer, and an opening through which the cavity is assessable. The microelectronic device can have bond sites, a first surface, and a second surface facing opposite from the first surface. The microelectronic device can be positioned in the cavity so that the second surface faces toward and is carried by the conductive layer. The method can further include electrically coupling the bond sites of the microelectronic device to the conductive layer. In particular embodiments, the microelectronic device can be encapsulated in the cavity without the need for a releasable tape layer to temporarily support the microelectronic device.Type: GrantFiled: February 17, 2012Date of Patent: May 14, 2013Assignee: Micron Technology, Inc.Inventors: David J. Corisis, Chin Hui Chong, Choon Kuan Lee
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Patent number: 8441133Abstract: A semiconductor device including a first substrate having first and second surfaces, multiple first mounting pads formed on the first surface of the first substrate and for mounting a first semiconductor element on the first surface of the first substrate, multiple first connection pads formed on the first surface of the first substrate and positioned on the periphery of the multiple first mounting pads, a second substrate formed on the first substrate and having first and second surfaces, the second substrate having a second penetrating electrode which penetrates through the first and second surfaces of the second substrate, multiple second mounting pads formed on the first surface of the second substrate and for mounting a second semiconductor element, and a conductive member formed on one of the first connection pads and electrically connecting an end portion of the second penetrating electrode and the one of the first connection pads.Type: GrantFiled: January 28, 2010Date of Patent: May 14, 2013Assignee: Ibiden Co., Ltd.Inventors: Daiki Komatsu, Kazuhiro Yoshikawa
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Patent number: 8441134Abstract: A chip stacking structure includes a first chip and a second chip. The first chip includes a surface having a first group of pads formed thereon, and the second chip includes a surface having a second group of pads formed thereon. The second group of pads is bonded onto the first group of pads to define a plurality of capillary passages extending in a same direction. The chip stacking structure further includes an underfill filling up interspaces between the first chip and the second chip. The chip stacking structure is capable of avoiding chip deformation and cracking during a bonding process.Type: GrantFiled: September 9, 2011Date of Patent: May 14, 2013Assignee: United Microelectronics CorporationInventors: Chien-Li Kuo, Yung-Chang Lin, Ming-Tse Lin
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Patent number: 8441135Abstract: A semiconductor device includes a first semiconductor chip that includes a driver circuit, a second semiconductor chip that includes a receiver circuit and an external terminal, and a plurality of through silicon vias that connect the first semiconductor chip and the second semiconductor chip. The first semiconductor chip further includes an output switching circuit that selectively connects the driver circuit to any one of the through silicon vias, the second semiconductor chip further includes an input switching circuit that selectively connects the receiver circuit to any one of the through silicon vias and the external terminal, the input switching circuit includes tri-state inverters each inserted between the receiver circuit and an associated one of the through silicon vias and the external terminal, and the input switching circuit activates any one of the tri-state inverters.Type: GrantFiled: July 31, 2012Date of Patent: May 14, 2013Assignee: Elpida Memory, Inc.Inventors: Hideyuki Yoko, Kayoko Shibata
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Patent number: 8441136Abstract: This description relates to a semiconductor device including a wafer having a first surface and a second surface opposite to the first surface and a carrier attached to the first surface of the wafer by an adhesive layer, a portion of the adhesive layer adjacent to an edge of the wafer is exposed. The semiconductor device further includes a protection layer to cover the exposed portion of the adhesive layer. The semiconductor device further includes a plurality of dies attached to the second surface and a molding compound encapsulating the plurality of dies.Type: GrantFiled: July 27, 2012Date of Patent: May 14, 2013Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wen-Chih Chiou, Weng-Jin Wu, Shau-Lin Shue
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Patent number: 8441138Abstract: For optimising annual energy production in a wind turbine, the invention provides a method by which operation of the turbine in accordance with different pre-specified modes depending on the wind direction towards the turbine is enabled. The modes may include pitch and/or power control strategies. The invention further provides a control system for a wind turbine adapted to operate in accordance with the method, and a wind turbine with such a control system.Type: GrantFiled: April 30, 2010Date of Patent: May 14, 2013Assignee: Vestas Wind Systems A/SInventors: Christian Gjerløv, Jesper Graugaard, Aleks Kvartborg Jakobsen, Martin Jørgensen, Kenneth Simonsen, Leo Thesbjerg, Kasper Zinck Østergaard
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Patent number: 8441139Abstract: The various embodiments herein provide an apparatus for harnessing a wave energy, solar energy and wind energy. The apparatus comprises a floating frame, a base portion connected to the floating frame and at least two linkage units. The two linkage units are a basic linkage unit and a medium linkage unit. The apparatus includes a plurality of floating flaps and at least one power extraction means. A connecting pivot is provided in the linkage units and the base portion. The floating flaps are pivoted vertically on the basic linkage unit and the base portion. The flaps associated with the floating flaps are placed under water against prevailing waves and floats associated with the floating flaps are placed on surface of the water, for absorbing the wave energy from projected portions present at edges and middle portion of the flaps.Type: GrantFiled: October 10, 2010Date of Patent: May 14, 2013Inventor: Reza Karimi
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Patent number: 8441140Abstract: A new and useful concept is provided for utilizing an air flow in connection with a primary function, that is not a waste function and uses the flow of air for a useful purpose to produce electricity. A fluid driven turbine is located in the path of the flow of air, the turbine having turbine blades rotatable about an axis of rotation, the turbine blades located in the path of the air flow, and the axis of rotation of the turbine oriented transverse to the flow of air, to rotate the turbine from the flow of air in the primary system, and generating electricity from the rotation of the turbine.Type: GrantFiled: November 23, 2009Date of Patent: May 14, 2013Inventor: Pierre M. Abou-Zeid
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Patent number: 8441141Abstract: A wind power system including a first pulley, a second pulley spaced from the first pulley, a continuous loop structure engaged with the first and second pulleys, a plurality of airfoils fixedly connected to the continuous loop structure, wherein the airfoils extend outward from the continuous loop structure, and a fairing positioned to direct airflow to the airfoils.Type: GrantFiled: March 11, 2010Date of Patent: May 14, 2013Assignee: The Boeing CompanyInventors: Richard P. Ouellette, Benjamin A. Harber
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Patent number: 8441142Abstract: The present invention relates to a wind turbine nacelle. This nacelle comprises a body, and a head. The body comprises a base which is designed to be fastened to the upper end of a wind turbine tower, and a tubular chamber which upwardly extends said base along a vertical axis. The head comprises a cavity which is designed for rotationally mounting blades and for accommodating a generator, and by a shroud which is secured to the cavity and arranged along a vertical axis so as to be pivotally mounted on the tubular chamber. Furthermore, the nacelle comprises pivot connection means which are arranged between the shroud and the tubular chamber and allow the head to be pivotally mounted on the body. Another aspect of the present invention concerns a wind turbine equipped with such a wind turbine nacelle.Type: GrantFiled: March 24, 2009Date of Patent: May 14, 2013Assignee: DDIS, S.A.S.Inventors: Jean Marc Canini, Bernard Claude Lhenry
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Patent number: 8441143Abstract: A rail vehicle system and a method for managing distribution of power in the rail vehicle system are provided.Type: GrantFiled: July 21, 2010Date of Patent: May 14, 2013Assignee: General Electric CompanyInventors: Todd William Goodermuth, Wolfgang Daum, Mark Kraeling, Jared Klineman Cooper, Ning Zhang
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Patent number: 8441144Abstract: A system for selectively regulating current flow to a plurality of electrical devices, being at least partially operative by wireless remote control and including a control assembly connected to at least a first power input and a second power input. The control assembly includes a plurality of outlet sections, each including at least one outlet structured to electrically connect an electrical device to either the first or second power inputs. A timing assembly is operatively structured for time based regulation of current flow from one of the power inputs to one of the outlet sections, wherein another outlet section includes switching capabilities structured to selectively establish a current flow connection with either the first or second power input. A receiver assembly is operatively connected to at least the timing assembly and structured for wireless, operative activation with a remote transmitting unit.Type: GrantFiled: July 26, 2010Date of Patent: May 14, 2013Inventor: Maurilio G. Hernandez
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Patent number: 8441145Abstract: A modular power distribution system configured to drive DC and AC electrical loads comprises logical units in different locations receiving DC and AC power lines for distribution to respectively DC and AC electrical loads in all of these locations. In each of the logical units, the system comprises one or more physical units, and in each of the physical units one or more power modules for the distribution of DC or AC power to one of the DC or AC electrical loads. Finally, the system comprises at least one master control unit for each of the logical units placed in one of physical units to control the functions of the pertaining logical unit.Type: GrantFiled: October 22, 2008Date of Patent: May 14, 2013Assignee: Mahtechs S.r.L.Inventor: Marco Gestri
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Patent number: 8441146Abstract: A current supply arrangement for, e.g., producing polysilicon, with a first current supply device and a second power supply device, including two AC current regulators and a voltage sequence controller for controlling the AC current regulators, with a terminal group having two terminals for connecting a load. A terminals is connected directly, i.e., without an interconnected switch, with an output terminal of the second current supply device, and with a first switching group associated with the terminal group, with switches for connecting and disconnecting the terminals of the terminal group with or from output terminals of the first current supply device. The current supply arrangement also includes an additional current supply device having two AC current regulators and a voltage sequence controller for controlling the AC current regulators, additional terminal groups comprising two terminals for connecting one load.Type: GrantFiled: June 24, 2010Date of Patent: May 14, 2013Assignee: AEG Power Solutions B.V.Inventors: Peter Wallmeier, Christian Ferber
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Patent number: 8441147Abstract: A bypass device for bypassing a power cell of a multi-cell device. The bypass device includes a stationary portion of a first set of contacts connected to at least first and second output terminals of a power cell, a magnetically latching solenoid that, when energized, moves a moving portion of the first set of contacts from a first position to a second position or from the second position to the first position, and at least one added insulating material positioned between the solenoid and the first set of contacts, and configured to allow a voltage between the magnetically latching solenoid and the first and second output terminals of the power cell to exceed a voltage between said output terminals.Type: GrantFiled: August 17, 2010Date of Patent: May 14, 2013Assignee: Siemens Industry, Inc.Inventor: Peter Willard Hammond
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Patent number: 8441148Abstract: A DC to DC converter comprises voltage regulation circuitry for generating at least two output voltages responsive to an input voltage. The voltage regulation circuitry further includes a plurality of main switches connected to receive the input voltage. A plurality of auxiliary switches is connected to provide the at least two output voltages. A single inductor is connected between the plurality of main switches and the plurality of auxiliary switches. A dual-output PWM controller provides a first PWM control signal for controlling the operation of the plurality of main switches responsive to a first feedback voltage from a first output voltage using a first control loop and provides a second PWM control signal for controlling the operation of the plurality of auxiliary switches responsive to a second feedback voltage from a second output voltage using a second control loop. Current mode control can be used for each control loop to reduce the cross regulation problem.Type: GrantFiled: June 8, 2010Date of Patent: May 14, 2013Assignee: Intersil Americas LLCInventors: Zaki Moussaoui, Jifeng Qin
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Patent number: 8441149Abstract: A high-speed low dropout (HS-LDO) voltage regulation circuit suitable to enable a power gate unit to produce a variable voltage signal based on the load of a processor is disclosed herein. In various embodiments, selection logic may dynamically enable or disable the HS-LDO circuit to allow the power gate unit to operate under a fully-on or fully-off mode. Other embodiments may be disclosed or claimed.Type: GrantFiled: June 25, 2010Date of Patent: May 14, 2013Assignee: Intel CorporationInventors: Malay Trivedi, Tong H. Kim
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Patent number: 8441150Abstract: A device for connection to an impedance having a mainly inductive character. The device comprises a reactive element. Furthermore, the device is provided with inputs for inputting output signals of electric inverters for parallel supply and at least one output for connection to a supply terminal for a phase of the impedance, such that the device is composed to substantially filter out a high-frequency differential component of at least two output signals during use.Type: GrantFiled: November 20, 2006Date of Patent: May 14, 2013Assignee: Atlas Copco Airpower N.V.Inventor: Gerd Terörde
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Patent number: 8441151Abstract: A power supply with arc flash protection mechanism for providing power to a load is disclosed. The power supply comprises a first power connector including a plurality of power terminals and a first detecting terminal, a power conversion circuit, a control unit and a connection status detection circuit. The power terminals of the first power connector are configured to couple with a plurality of power terminals of a second power connector, and the first detecting terminal is configured to couple with a second detecting terminal of the second power connector and provide a detecting signal indicative of whether the second power connector is being disconnected with the first power connector. When the first detecting terminal is disconnected with the second detecting terminal, a power connection status signal of the connection status detection circuit is under disable status and the control unit controls the power conversion circuit not to generate or output the output voltage to the load.Type: GrantFiled: February 26, 2010Date of Patent: May 14, 2013Assignee: Delta Electronics, Inc.Inventor: Yu-Hung Huang
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Patent number: 8441152Abstract: The power generation and transmission device and method is able to be used to harness power such as solar and/or wind power and then transmit the power to a device on the other side of a physical structure such as a house, a car, a umbrella, a tent, and an awning.Type: GrantFiled: May 5, 2010Date of Patent: May 14, 2013Inventors: Chih-Cheng Tai, Lucas J. Myslinski, Chyh-Yih Chang, Shih Ming Tseng, Shih Hsiang Tseng
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Patent number: 8441153Abstract: A system comprising a contactless power transfer system is presented. The system includes a primary element, a secondary element, and at least one field-focusing element interposed between the primary element and the secondary element and configured to focus a magnetic field. A partition is disposed between the primary element and the secondary element. The contactless power transfer system is disposed within pressure isolation cavities of a sub-sea assembly and configured to transfer power between a power source and a load.Type: GrantFiled: June 22, 2010Date of Patent: May 14, 2013Assignee: General Electric CompanyInventors: Adnan Kutubuddin Bohori, Somakumar Ramachandrapanicker, Christof Martin Sihler, Arvind Kumar Tiwari, Suma Memana Narayana Bhat
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Patent number: 8441154Abstract: A mobile wireless receiver for use with a first electromagnetic resonator coupled to a power supply and a second electromagnetic resonator coupled to at least one of a power supply and the first electromagnetic resonator. The mobile wireless receiver includes a load associated with an outdoor lighting unit that draws energy from the load to power a light source associated with the outdoor lighting unit, and a third electromagnetic resonator configured to be coupled to the load and movable relative to at least one of the first electromagnetic resonator and the second electromagnetic resonator, wherein the third resonator is configured to be wirelessly coupled to at least one of the first electromagnetic resonator and the second electromagnetic resonator to provide resonant, non-radiative wireless power to the third electromagnetic resonator from at least one of the first electromagnetic resonator and the second electromagnetic resonator.Type: GrantFiled: October 28, 2011Date of Patent: May 14, 2013Assignee: WiTricity CorporationInventors: Aristeidis Karalis, Andre B. Kurs, Andrew J. Campanella, David A. Schatz, Herbert Toby Lou, Morris P. Kesler, Katherine L. Hall, Konrad Kulikowski, Eric R. Giler, Ron Fiorello, Marin Soljacic
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Patent number: 8441155Abstract: A fan controller that is capable of switching power to a fan between an “on” state and an “off” state in accordance with one or more programmable schedule. In some cases, fan controller may be programmed to display one or more screens for setting one or more parameters of the fan controller by interacting with a first button and/or a second button. In some cases, when the controller is in an operating mode, depressing a first button, second button, and/or a third button may temporarily override the programmable schedule and, in some cases, override the programmable schedule for a programmable period of time.Type: GrantFiled: October 29, 2009Date of Patent: May 14, 2013Assignee: Honeywell International Inc.Inventors: Pierre Simard, Patrick Langevin, Benoit Meilleur, Dominic Boisvert
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Patent number: 8441156Abstract: An electrically conductive module is provided. The module includes a panel configured to engage with one or more conductive structural elements. The module further includes conductive layers formed on or in the panel. Each conductive layer has a terminal configured to be in electrical communication with at least one of the conductive structural elements. In one embodiment of the present invention, a first terminal is configured to be in electrical communication with a first conductive structural element and a second terminal is configured to be in electrical communication with a second conductive structural element. In another embodiment of the present invention, both a first terminal and a second terminal are configured to be in electrical communication with a first conductive structural element. In this embodiment, the first and second terminals are respectively configured to be in electrical communication with first and second conductive portions of the first conductive structural element.Type: GrantFiled: September 2, 2009Date of Patent: May 14, 2013Assignee: T-Ink, Inc.Inventors: Daniel Boss, Scott Qualls, Terrance Z. Kaiserman, Keith J. Margolin, Michael Wassief, Liang Chai
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Patent number: 8441157Abstract: A power supply system includes a transformer for converting an external AC power into an external DC power, a battery for providing a battery power, a selection module for outputting the external DC power or the battery power, a first-stage DC conversion module for converting power provided by the selection module into a first DC power, a plurality of second-stage DC conversion module, each for converting an input power into a second DC power, and a switching module for switching to output the battery power or the first DC power of the first-stage DC conversion module as the input power of each of the plurality of second-stage DC conversion module according to the external DC power.Type: GrantFiled: September 30, 2010Date of Patent: May 14, 2013Assignee: Wistron CorporationInventor: Te-Lung Wu
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Patent number: 8441158Abstract: To further reduce force ripple of a linear motor, a primary part has a plurality of windings sequentially arranged in an axial direction and subdivided in the axial direction into groups having an identical number of windings. The sequence of the association of the windings with the phases of a multi-phase system is not repeated at least in a group of windings within the primary part as long as the winding sense of the corresponding windings in the group is maintained.Type: GrantFiled: February 15, 2011Date of Patent: May 14, 2013Assignee: Siemens AktiengesellschaftInventor: Rolf Vollmer
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Patent number: 8441159Abstract: A self-latching sector motor for producing a net torque from two integral independent sources where one can serve as a spare backup or paralleled for double net torque or used alternately for extended life operation. The self-latching sector motor includes a housing, a magnet-shaft assembly, and two pair of electromagnetic poles. The magnet-shaft assembly rotates within the housing. The two pair of electromagnetic poles extend fixedly and radially inwardly from the housing, towards the magnet-shaft assembly. The electromagnetic poles of an associated pair of electromagnetic poles are diametrically and magnetically opposed to each other, and each pair of electromagnetic poles are similarly poled to each other for North and South poles so as to provide the net torque to the magnet-shaft assembly that can be backed-up or doubled. The self-latching torque at the stops is achieved by restraining the magnet-shaft assembly from seeking a position of maximum flux.Type: GrantFiled: July 9, 2010Date of Patent: May 14, 2013Inventor: Victor Nelson
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Patent number: 8441160Abstract: Provided is an inverter-integrated electric compressor which is compact, has excellent ease of mounting, can ensure heat resistance reliability, and can reduce vibration and noise. In an inverter-integrated electric compressor where an inverter device having a noise removing filter circuit and an inverter circuit is incorporated in an inverter accommodating section provided on an outer periphery of a housing, the inverter accommodating section consists of an inverter box provided on the outer periphery of the housing and in which the inverter circuit is accommodated and installed, and a junction box integrally coupled to the inverter box and in which a constituent component of the noise removing filter circuit is accommodated and installed, the junction box is coupled to the inverter box with internal spaces opposing each other, and functions as a cover of the inverter box, and the noise removing filter circuit is electrically wire-connected to the inverter circuit.Type: GrantFiled: February 4, 2011Date of Patent: May 14, 2013Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Takayuki Watanabe, Hiroyuki Kamitani, Takeshi Hirano, Takayuki Takashige
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Patent number: 8441161Abstract: An electric motor drive device (1) includes a motor (11), a speed reducing part (31) to reduce speed of a rotation outputted from the motor (11) and transmit it to the side of a wheel, and a connection/disconnection part (21) to disconnect or connect rotation transmission of the speed reducing part, a motor side rotation member (18) serving as an input shaft to input the rotation from the motor (11), an output shaft (34) to output the rotation to the side of the wheel, a double shaft (33) arranged coaxially with the input shaft and including a tube-shaped outer side rotation shaft (33o) and an inner side rotation shaft (33i) inserted into the outer side rotation shaft.Type: GrantFiled: September 7, 2009Date of Patent: May 14, 2013Assignee: NTN CorporationInventors: Tomoaki Makino, Fumihiro Isobe, Ken Yamamoto
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Patent number: 8441162Abstract: Disclosed is a stator device adapted to be arranged in an electrical machine, where the electrical machine further comprises a moving device, where the stator device is a multi-phase stator device, where the phases are arranged side-by-side in a direction perpendicular to direction of motion of the moving device, and where each phase comprises a first stator core section having a set of teeth, a second stator core section having a set of teeth, and a coil, and where the teeth are arranged to protrude towards the moving device; and wherein at least two neighboring phases share a stator core section, so that the first stator core section of a first phase and a second stator core section of a second phase is formed as a single unit.Type: GrantFiled: September 20, 2010Date of Patent: May 14, 2013Assignee: Hoganas AB (Publ)Inventors: Glynn James Atkinson, Alan G. Jack, Barrie Mecrow
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Patent number: 8441163Abstract: The present invention essentially relates to an electric machine (1.1) with homopolar double excitation, comprising a rotor particularly consisting of a central portion (51) made of a solid magnetic material and a laminated annular portion (53) located at the periphery of the solid portion. In addition, the rotor comprises permanent magnets (54), the magnetization thereof being radially oriented relative to the axis (33) of the rotor (31), and separated from one another such that the double excitation flow generated by the field coils (38, 39) can enter the rotor (31, 67) via the flanges (48, 49) of the rotor, and come back out via the spaces between the magnets (54), or vice-versa.Type: GrantFiled: November 9, 2009Date of Patent: May 14, 2013Assignee: Peugeot Citroen Automobiles SAInventors: Victor Moynot, Franck Chabot, Michel Lecrivain, Mohamed Gabsi, Sami Hlioui
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Patent number: 8441164Abstract: An outer rotor motor includes a stator and a rotor. The stator includes a stator core having a plurality of teeth, coils and insulators retaining the coils. The insulators are connected to each other in an annular configuration such that the teeth are inserted into the insulators. Each of the insulators includes a body portion and an outer peripheral flange. Each of the insulators further includes an auxiliary tooth portion on at least one of two axial ridge portions. The axial ridge portions include bonding portions between the body portion and the outer peripheral flange. The auxiliary tooth portion includes a rotor-facing surface facing the rotor and a tooth-contacting surface contacting one of the side surfaces in the circumferential direction.Type: GrantFiled: July 28, 2011Date of Patent: May 14, 2013Assignee: Honda Motor Co., Ltd.Inventors: Tadanobu Takahashi, Kentaro Fukui
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Patent number: 8441165Abstract: Disclosed are a motor for a compressor and a hermetic compressor having the same. An aluminum coil cheaper than a copper coil is used in the motor for the compressor, a ratio between the aluminum coil and a stator core is set, and sectional areas of main and sub slot portions of the stator core and the numbers thereof are adjusted to be suitable for usage conditions, whereby fabricating costs of the motor for the compressor and the hermetic compressor can drastically be reduced and efficiencies thereof can be improved.Type: GrantFiled: October 20, 2008Date of Patent: May 14, 2013Assignee: LG Electronics Inc.Inventors: Hae-Ok Jung, Dong-In Park, Ki-Seok Sung, Jae-Hun Lee, Cheol Kim, Seong-Hun Seo
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Patent number: 8441166Abstract: A device (10) for connecting together end winding parts (1) of stator bars (2) of an electric generator includes a first and a second element (11, 12) having sloped facing surfaces (13) defining two trapezoidal seats each housing a trapezoidal cursor (14), and one or two screws (15), axially fixed and rotatably movable with respect to the first and second element (11, 12) and having a threaded portion inserted in a threaded through hole (17) of the cursor (14).Type: GrantFiled: February 24, 2011Date of Patent: May 14, 2013Assignee: ALSTOM Technology Ltd.Inventors: Hossein Safari Zadeh, Damir Novosel
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Patent number: 8441167Abstract: A capacitive generator has a generator circuit (G) and a charge priming circuit (P) that includes variable capacitors (1, 2, 101, 102) all coupled to a mechanical transmission which acts to vary the capacitance of the capacitors and to actuate an array of switches (K). A small residual charge on the priming circuit (P) can thus be amplified and conveyed to the generating circuit (G) where it is used to generate an alternating current between the variable capacitors (1, 2) of the generating circuit. The capacitance of the generating capacitors (1, 2) is varied in antiphase in response to the movement of the transmission. An electrical energy extraction device (8) in circuit with the generator capacitors (1, 2) extracts electrical energy from the circuit in reaction to the alternating current which can then be used to power or recharge a small portable device.Type: GrantFiled: July 11, 2008Date of Patent: May 14, 2013Inventors: Alexander Grigorievich Verkoglyad, Alexander Gueroguievich Kvashnin, Sergey Nikolaevich Makarov, Sergey Kuzmich Golushko, Vladimir Ivanovich Merkulov
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Patent number: 8441168Abstract: The subject of the present invention is a set of SAW (surface acoustic wave) based sensor tag device embodiments system for remotely sensing and/or providing identification information. These sensor/tag devices would operate in a system which consists of one or more uniquely identifiable sensor/tag devices and a wireless interrogator. The sensor device incorporates an antenna for receiving incident RF energy and re-radiating the tag identification number and the sensor measured parameter(s). Since there is no power source in or connected to the sensor, it is a passive sensor. As such the device is elegantly simple, low-cost, and rugged. The device is wirelessly interrogated by the interrogator which is described elsewhere.Type: GrantFiled: August 6, 2009Date of Patent: May 14, 2013Assignee: Applied Sensor Research & DevelopmentInventors: Jacqueline H. Hines, Leland P. Solie
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Patent number: 8441169Abstract: A voltage converter is provided for receiving a low input DC voltage and driving a piezoelectric actuator of a fluid transportation device. The voltage converter includes plural capacitors, a resistor and a boost chip. The boost chip is connected with the plural capacitors and the resistor, has a switch element and a polar switching circuit, and receives the low input DC voltage. The low input DC voltage is increased and multiplied to a high DC voltage by a switching operation of the switch element. The high DC voltage is converted into an output AC voltage by the polar switching circuit so as to drive the piezoelectric actuator. An operating frequency of the boost chip is controlled by the plural capacitors and the resistor.Type: GrantFiled: May 18, 2010Date of Patent: May 14, 2013Assignee: Microjet Technology Co., Ltd.Inventors: Shih Chang Chen, Ying Lun Chang, Rong Ho Yu, Daw Ping Chang, Kuei Liang Chiang
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Patent number: 8441170Abstract: An ultrasonic motor includes a stator. The stator includes a seat and a driving unit. The driving unit includes a generally semi-elliptical driving mechanism formed integrally with the seat, and two spaced-apart piezoelectric actuators disposed between the seat and the driving mechanism. Each of the piezoelectric actuators has a first end abutting against the driving mechanism, and a second end opposite to the first end and abutting against the seat.Type: GrantFiled: April 21, 2011Date of Patent: May 14, 2013Assignee: National Kaohsiung University of Applied SciencesInventors: Shine-Tzong Ho, Fu-Jie Hu
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Patent number: 8441171Abstract: A motor device comprises a transmission substrate formed with a transmission portion that is wound around at least part of the outer periphery of a rotator; and a driving substrate that has a driving portion which moves the transmission portion by a certain distance in a state in which a rotational force is transmitted between the rotator and the transmission portion returns the transmission portion to a predetermined position in a state in which the rotation force transmission state is released, and is connected to the transmission substrate so that the driving force due to the driving portion acts on the transmission portion.Type: GrantFiled: March 30, 2011Date of Patent: May 14, 2013Assignee: Nikon CorporationInventors: Masashi Okada, Akimitsu Ebihara
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Patent number: 8441172Abstract: An oscillator apparatus and method for vibration energy harvesting includes a nonlinear oscillator (e.g. piezoelectric, magnetic or liquid oscillator) configured in association with a potential energy profile to enhance a desirable nonlinear effect with a larger displacement and a wider spectrum response. A cantilever beam associated with a vibrating structure generates a mechanical energy in response to vibration forces. A mechanical-to-electrical power converter can be coupled to the nonlinear oscillator to convert the mechanical power into an electrical power. The frequency response of the nonlinear oscillator adapts to varying ambient vibrations and auto-tunes with respect to the ambient vibration change for wireless and MEMS applications.Type: GrantFiled: October 25, 2010Date of Patent: May 14, 2013Assignee: Honeywell International Inc.Inventor: Chunbo Zhang
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Patent number: 8441173Abstract: A wake-up unit for waking up an electronic device is provided. The wake-up unit comprises a resonating unit (C) for resonating at least one specific frequency, at least one first electrode (TE), at least one piezoelectric material (PM) and at least one second electrode (BE). The piezoelectric material (PM) is sandwiched between the at least one first and the at least one second electrode (TE, BE) such that an electronic current is provided to the at least one first and at least one second electrode (TE, BE) when the resonating unit (C) resonates at the at least one specific frequency.Type: GrantFiled: April 16, 2009Date of Patent: May 14, 2013Assignee: NXP B.V.Inventor: Aly Aamer Syed
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Patent number: 8441174Abstract: In a multilayer piezoelectric element in which a plurality of piezoelectric layers and a plurality of metal layers are stacked alternately, the plurality of metal layers include a plurality of low-filled metal layers having a lower filling rate of metal composing the metal layers than oppositely disposed metal layers adjacent to each other in a stacking direction. In a multilayer piezoelectric element in which a plurality of piezoelectric layers and a plurality of metal layers are stacked alternately, the plurality of metal layers include a plurality of thin metal layers having a smaller thickness than oppositely disposed metal layers adjacent to each other in a stacking direction.Type: GrantFiled: June 15, 2006Date of Patent: May 14, 2013Assignee: Kyocera CorporationInventors: Takeshi Okamura, Masaki Terazono, Tomohiro Kawamoto, Takafumi Tsurumaru, Shigenobu Nakamura, Ken Yamamoto