Abstract: The present invention discloses an electric device, which comprises at least one transparent/semi-transparent substrate; a plurality of electric conduction elements arranged on at least one of two opposite surfaces and a lateral surface of the transparent/semi-transparent substrate; and at least one module arranged on the transparent/semi-transparent substrate and electrically connected with the electric connection units. The present invention also discloses an electric device, which comprises a plurality of transparent/semi-transparent substrates; a plurality of electric conduction elements selectively arranged on the transparent/semi-transparent substrates; and a plurality of modules arranged on outer surfaces of the transparent/semi-transparent substrates or interposed between the transparent/semi-transparent substrates, and electrically connected with the electric conduction elements. The electric device has electric functions and features transparency esthetics.

Abstract: A motherboard includes a resistor, a display card controller, first and second display connectors, and a signal switch chip. A display device is connected to either the first or second display connector. A detecting pin of the first display connector is connected to a power source through the resistor. The signal switch chip is connected between the display card controller and each of the first display connector and the second display connector.

Abstract: Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device having a bonded-wire coil which is formed and maintained within the device without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost, and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.

Abstract: In one embodiment, an electrical device includes a first substrate with a first side and a second side, a second substrate opposed to the first side of the first substrate, and a functional element arranged between the first side of the first substrate and the second substrate. The electrical device includes a first electrode arranged to a first substrate side of the functional element and overlaps with the functional element in planar view, and a second electrode arranged to a second substrate side of the functional element and overlaps with the functional element in planar view. The electrical device includes an electronic component arranged between the functional element and the first electrode, overlapping the first electrode and the second electrode in planar view, and driving the functional element. The electrical device includes a connecting section electrically connecting the first electrode to the second electrode.

Abstract: An electrical device includes a first substrate, a second substrate opposed to a first side of the first substrate, and a functional element between the first side of the first substrate and the second substrate. A first electrode is arranged to a first substrate side of the functional element and overlaps with the functional element. A second electrode is arranged to a second substrate side of the functional element and overlaps with the functional element. An electronic component is arranged between the functional element and the first electrode, overlaps the first and second electrodes, and drives the functional element. A connecting section includes a first wiring, a second wiring, a first contact hole connecting the first electrode to the first wiring, and a second contact hole connecting the first wiring to the second wiring. The first contact hole has a portion that does not overlap with the second contact hole.

Abstract: In one embodiment, an electrical device includes a first substrate with a first side and a second side, a second substrate opposed to the first side of the first substrate, and a functional element between the first side of the first substrate and the second substrate. A first electrode arranged to a first substrate side of the functional element and overlaps with the functional element in planar view. A second electrode is arranged to a second substrate side of the functional element and overlaps with the functional element in planar view. An electronic component is arranged between the functional element and the first electrode, overlaps with the first electrode and the second electrode in planar view, and drives the functional element. A connecting section electrically connects the first electrode to the second electrode and a protection circuit between an output terminal of the electronic circuit and the first electrode.

Abstract: An organic light emitting diode (OLED) display device includes: a display panel including a display area and a non-display area provided in an external side of the display area; a set frame disposed on a rear surface of the display panel and supporting the display panel; a side frame surrounding a side surface of the display panel and covering the non-display area; and a cover window covering the display area disposed in an inner space surrounded by the side frame.

Abstract: This application relates generally to a multipurpose fastener for an electronic device. More specifically, the multipurpose fastener is configured to both mechanically restrain at least one circuit board within a housing of an electronic device and to electrically couple at least one circuit board to the housing. In some embodiments, the fastener is configured to constrain two printed circuit boards such that they are disposed substantially parallel to one another. A conductive sleeve can be utilized to establish a predefined distance between the two circuit boards and to provide a conduit through which power can be transferred.

Abstract: A circuit board mounting assembly includes a chassis with a securing hole, a circuit board attached to the chassis, a drive bracket mounted in the chassis, and a latch member configured to latch the circuit board. The drive bracket comprises at least one clamp engaged with the circuit board for preventing the circuit board from moving along a first direction. The latch member comprises a retractable post movable between a latched position and an unlatched position along the first direction. When the retractable post is in the latched position, the retractable post is received through the securing hole for preventing the circuit board from moving along a second direction perpendicular to the first direction, thereby locking the circuit board to the chassis. When the retractable post is in the unlatched position, the retractable post is removed from the securing hole for unlocking the circuit board.

Abstract: A communication module adaptor adapted for mating with a device connector of a smart electronic device includes an adaptor circuit having a communication module and an adaptor connector coupled to the adaptor circuit. The communication module has a mating interface differing from a mating interface of the device connector such that the communication module is unable to directly connect to the device connector. The adaptor connector has a mating interface complementary to the mating interface of the device connector for mating with the device connector to electrically connect the communication module adaptor to the smart electronic device. The adaptor circuit electrically connects the adaptor connector and the communication module and control signals are transmitted from a controller of the communication module to the device connector of the smart electronic device via the adaptor connector.

Abstract: A conductive member connection structure includes a connection structure to electrically connect first and second conductive members that are positioned with a gap in between, a first metal member that is melted by heating and is welded to a connecting surface of the first conductive member and to a connecting surface of the second conductive member, and a second metal member that has a higher melting point than the first metal member and is covered with the first metal member without being melted by the heating. The second metal member is configured so as to prevent the first metal member from flowing out in a molten state thereof.

Abstract: A circuit board for an optoelectronic semiconductor chip includes an electrically conductive first metal foil, a first electrically insulating foil, an electrically conductive second metal foil, wherein the first electrically insulating foil is applied to the first metal foil at a top side of the first metal foil and mechanically connects thereto, the first electrically insulating foil has a recess in which the first metal foil is exposed, the recess electrically conductively fixes the optoelectronic semiconductor chip to the first metal foil within the recess, the second metal foil is applied at a top side of the first electrically insulating foil, the top side facing away from the first metal foil, and mechanically connects to the electrically insulating foil, the first electrically insulating foil is free of the second metal foil at least in the region of the recess, and the second metal foil electrically contacts the optoelectronic semiconductor chip.

Abstract: A component built-in board mounting body has a component built-in board mounted on a mounting board, the component built-in board being configured having stacked therein a plurality of printed wiring bases that each have a wiring pattern and a via formed on/in a resin base thereof, and having an electronic component built in thereto, wherein the component built-in board has at least a portion of the plurality of printed wiring bases including thermal wiring in the wiring pattern and including a thermal via in the via, and is mounted on the mounting board via a bump formed on a surface layer of the component built-in board, and a surface on an opposite side to an electrode formation surface of the built in electronic component is connected to the bump via the thermal via and the thermal wiring, and is thermally connected to the mounting board via the bump.

Abstract: Methods and apparatus for forming a semiconductor device package with a transmission line using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top device and a bottom device. A signal transmission line may be formed using a micro-bump line above a bottom device. A ground plane may be formed using a redistribution layer (RDL) within the bottom device, or using additional micro-bump lines. The RDL formed ground plane may comprise open slots. There may be RDLs at the bottom device and the top device above and below the micro-bump lines to form parts of the ground planes.

Abstract: A circuit assembly includes a substrate having a substrate electrical circuit, opposite top and bottom substrate surfaces, and a substrate hole extending through the substrate. The circuit assembly also includes a discrete component assembly electrically connected to the substrate electrical circuit and a support member attached to the discrete component. At least a portion of the discrete component is physically mounted in the substrate hole.

Abstract: Provided is technology that stably fixes a plurality of harnesses all at once, without using a wire holder. A line-shaping section 30 for routing harnesses 99 is created in a front cabinet forming section 20. The line-shaping section 30 comprises two ribs 40 separated by a prescribed distance and a hook 50 positioned in the center thereof and created so as to cover from the top, when viewed from the side surface. The harnesses 99 held by the ribs 40 and the hook are prevented from being displaced outside, by a hook locking section 54. In addition, routing work for the harnesses 99 is able to be performed smoothly since a sloping surface (a guide section 56) is created in a tip part of the hook locking section 54.

Abstract: A wireless apparatus has a board, a power amplifier high-frequency IC chip, and a process variations detector. The process variations detector monitors a circuit characteristic variation amount due to process variations. An underfill having a parameter value calculated using the monitored circuit characteristic variation amount is applied between the board and the high-frequency IC chip and the mounting board. As a result, the wireless apparatus exhibits a desired circuit characteristic even with process variations and influence of the underfill.

Abstract: Consistent with an example embodiment, a semiconductor device comprises a patterned conductive layer defining contact pads for being connected to terminals of a semiconductor chip. The semiconductor chip comprises the terminals at a first side and an adhesive layer at a second side opposite to the first side; wherein, the semiconductor chip is mounted with an adhesive layer on a patterned conductive layer such that the semiconductor chip part of each respective contact pad leaves part thereof uncovered by the chip for wire bonding. Wire bonds connect respective terminals of the semiconductor chip and respective contact pads at the first side thereof. A molding compound covers the semiconductor chip, the wire bonds and the contact pads; wherein, the molding compound is also located on the second side of the semiconductor device, separating the contact regions that are located directly on a backside of the contact pads.

Abstract: The arc-resistant MCC is provided with either the expansion chamber or the plenum. Arc flashes create pressure. Different arc-resistant MCC bases are used depending on whether the expansion chamber or the plenum is to be attached, as the expansion chamber and the plenum deal with the created pressure in different ways and are accordingly attached to the MCC base in different ways.

Abstract: A discrete component assembly includes a discrete component having a central longitudinal axis and having an outer surface with a laterally outermost point positioned at a first radial distance from the central longitudinal axis. The assembly includes a support structure mounted on the discrete component. The assembly also includes a plurality of contact pads electrically connected to the discrete component and mounted on the support structure at radial distances from the central longitudinal axis greater than the first radial distance.

Abstract: According to one embodiment, an electronic apparatus includes a first unit, a second unit, first magnets, and second magnets. The first magnets are at the first unit and include south poles and north poles configured to face in a direction from the first unit toward the second unit or in an opposite direction to the direction. The south pole and the north pole of one of any adjacent two of the first magnets face in opposite directions to facing directions of the south pole and the north pole of the other. The second magnets are at the second unit and configured to face the first magnets. The second magnets include a south pole which faces one of the north poles of the first magnets and a north pole which faces one of the south poles of the first magnets.

Abstract: The illumination apparatus includes a light source, a first reflective portion provided inside further than the light source in a radial direction so as to extend in a circumferential direction and reflecting light from the light source toward a light projecting direction. The apparatus further includes a second reflective portion provided inside further than the light source in the radial direction so as to extend in the radial direction and reflecting the light from the light source toward an area extending to a side away from the light source in the circumferential direction.

Abstract: Described herein are devices, compositions, and methods for improving color discernment.

Abstract: The present invention provides a backlight module and liquid crystal display device. The backlight module includes diffuser plate, substrate, fluorescent layer and light-emitting chip. The fluorescent layer is disposed on a light-entering surface of diffuser plate, and the fluorescent layer includes quantum dot (QD). The light-emitting chip is disposed on the substrate and the light-emitting chip is between substrate and fluorescent layer for irradiating on the fluorescent layer to excite the quantum dots to emit light to form white backlight source. The present invention uses quantum dots to effectively increase luminance, color saturation and avoid chroma offset. The quantum dots can emit uniform light and reduce thickness of the backlight module.

Abstract: The light emitting module includes a plurality of light emitting elements; a fluorescent substance resin layer containing a fluorescent substance which is excited by light emitted from the plurality of light emitting elements to emit visible light; a reflective surface configured to reflect light emitted from the plurality of light emitting elements and the fluorescent substance resin layer; and a light guiding body layer provided between the reflective surface and the fluorescent substance resin layer, and configured to guide light emitted from the plurality of light emitting elements or the fluorescent substance.

Abstract: A lighting device, comprising a glow material; a light source, positioned to illuminate the glow material when the light source is activated; and a light source controller, for sequencing sufficient on and off activation of the light source to maintain activate the glow material over a period of time.

Abstract: The present invention discloses a display device, a backlight module, and a first emitting light source. The light emitting light source includes first and second substrates arranged relatively with each other. A first electrode layer is formed on an internal side of the first substrate; and a second electrode layer is formed on an internal side of the second substrate. An light-emitting layer is arranged between the first and second transparent conductive layers, and formed over the first transparent conductive layer, wherein the light-emitting layer includes a quantum dot material. And wherein the second transparent conductive layer is used to emit electrons toward the light emitting layer so as to create illumination for being used in is backlight module. A quantum dot material is incorporated so as to increase the light emitting performance of the light emitting light source.

Abstract: The embodiments of present invention disclose a direct type backlight module, comprising a backplate and a plurality of strip lamps provided on the backplate, each of the strip lamps is provided with a lamp set composed of a plurality of light-emitting diodes. The direct type backlight module further comprises a plurality of wires, the lamp set of at least one strip lamp of the plurality of strip lamps is electrically connected to the power supply via the plurality of wires. The lamp set of the at least one strip lamp has two terminals, i.e., positive/negative terminals, the positive/negative terminals of the lamp set of the at least one strip lamp are electrically connected to the corresponding wires via a pair of mated connectors.

Abstract: A display device includes a display component, a light source, a light source substrate, a heat dissipation member and a holding member. The light source is disposed on a rear side of the display device with respect to the display component. The light source is mounted to the light source substrate. The light source substrate is attached to the heat dissipation member. The heat dissipation member is made of sheet metal and configured to dissipate heat from the light source. The heat dissipation member is attached to the holding member. The holding member is made of sheet metal and holds the display component from the rear side. The holding member integrally includes a positioning component and a fixing component. The positioning component positions the heat dissipation member. The fixing component fixes the heat dissipation member positioned by the positioning component.

Abstract: Exemplary embodiments provide a lighting system for a transparent LCD having opposing vertical edges, the system having a mullion lighting assembly positioned adjacent to each vertical edge of the transparent LCD, each mullion lighting assembly having sidewalls defining a center channel. A plurality of LEDs are positioned along the sidewall of each mullion assembly and on a side of the sidewall that opposes the center channel. The LEDs are preferably placed in conductive thermal communication with the sidewall and preferably have a quantum dot film positioned over each LED. A fan is preferably positioned to draw cooling air through the center channel.

Abstract: An image display device with organic light-emitting diodes (OLEDs) includes a first cover and an organic light-emitting diode (OLED) module. The first cover has a first light transparent zone and a first mask zone. The first light transparent zone forms a first image. The first mask zone is complementary with the first light transparent zone. The OLED module is positioned against the first cover and includes a plurality of juxtaposed organic light emitting diode (OLED) pixels emitting light to project to the first cover. The light includes transmission light and reflective light. The transmission light passes through the first light transparent zone to display the first image. The reflective light is blocked by the first mask zone. Thus the first image can be displayed with a continuous and smooth border on the curvature contour to improve resolution and visual appeal.

Abstract: An improvement to a lighted drinking container is provided. A problem exists with prior art illuminated drinking containers wherein glare hits the users' eyes upon use of the container (or upon tilting the glass towards the face to drink the liquid therein). The improvement disclosed herein provides an opaque or translucent barrier to allow for light to scatter away from the eye of the user, thus making the use of the container more comfortable while maintaining the illumination features thereof.

Abstract: A luminaire having a waveguide suspended beneath a mounting element, the waveguide has a first surface proximal to the mounting element, a second surface distal to the mounting element, and an edge between the first and the second surfaces. At least one cavity extends into the waveguide from the first surface to the second surface. A LED component is coupled to the waveguide so as to emit light into the cavity. LED support structures are also disclosed.

Abstract: A candle stand with faux flame is disclosed, including a lamp stand, power supply, support frame, holder, flame decorative element, light-emitting body, motor, driving element, first resistive magnet body, and at least a second resistive magnet body. The support frame is fixedly standing upon lamp stand; the flame decorative element is suspended at top of holder; the light-emitting body emits light towards flame decorative element. The power supply and motor are inside lamp stand for driving the driving element. The first resistive magnet body is disposed at lower end of flame decorative element. The second resistive magnet body is disposed on the driving element. When the motor drives the driving element, the second resistive magnet body moves close to or away from first resistive magnet body so as to sway flame decorative element. With projected light, the swaying flame decorative element emulates a flame.

Abstract: An illumination device having a pole mount, a light support that extends from the pole mount, a lighting unit is connected to the pole mount, and a solar panel assembly is mounted to the lighting unit. In another embodiment an illumination apparatus is provided having a pole mount and a lighting assembly, and the pole mount has hinged first clamp half and second clamp halves. When in the closed clamp position the pole mount clamp defines a pole opening. A first light support extends from the first clamp half and a light emitting assembly is supported by the first light support. In another preferred embodiment there is a band illumination device that is secured to a pole with a band, and in another preferred embodiment there is and adjustable band illumination assembly secured to a pole with bands.

Abstract: In one example embodiment, the present invention is a joining member configured to join at least two portable lighting devices such as flashlights. The joining member comprises means of attachment with each of the at least two portable lighting devices. And, the joining member is configured such that each of the at least two portable lighting devices is independently operational while attached with said joining member. In another example embodiment, the present invention is a primary portable lighting device that comprises a joining member configured to join at least two secondary portable lighting devices such as flashlights.

Abstract: A light source module includes a first triangular prism, a second triangular prism, a second laser source, and a third laser source. A first laser beam emitted from the first laser source and a second laser beam emitted from the second laser source are mixed to a first mixed laser beam by the first triangular prism. The third laser beam emitted from the third laser source and the first mixed laser beam emitted from the first triangular prism are mixed with a second mixed laser beam by the second triangular prism.

Abstract: According to one aspect, a luminaire includes a waveguide body having an interior coupling cavity extending into a portion of the waveguide body remote from an edge thereof. The luminaire further includes an LED element extending into the interior coupling cavity having first and second sets of LEDs wherein each LED of the first set comprises a blue-shifted yellow LED and each LED of the second set comprises a red LED wherein the red LEDs are disposed between the blue-shifted yellow LEDs and wherein the blue-shifted yellow LEDs have a first height and the red LEDs have a second height less than the first height. The LED element further includes a lens disposed over the first and second sets of LEDs.

Abstract: An object of the present invention is to provide a light-emitting device having a temperature compensation function implemented with simple circuitry, and a method of temperature compensation in such a light-emitting device. More specifically, the invention provides a light-emitting device and a method of temperature compensation using a light-emitting device, wherein the light-emitting device includes a substrate, a first LED chip which is arranged on the substrate, and which has a characteristic such that ?x and ?y, each representing an amount of displacement on an xy chromaticity diagram, both are negative as temperature rises, and a second LED chip which is arranged on the substrate, and which has a characteristic such that ?x and ?y, each representing an amount of displacement on an xy chromaticity diagram, both are positive as temperature rises.

Abstract: A multi-color light emitting diode device includes a plurality of light sources and a control module. The light sources are a Ultraviolet A light source, a Ultraviolet B light source, and a Ultraviolet C light source, a red light source, a green light source, and a blue light source, an infrared light source, and a YVA light source. The control circuit is configured with a plurality of control channels. Each of the control channels controls he respective light source to emit a light to generate a desired light combination.

Abstract: A lighting module may be provided that comprises: an optical plate; a base frame including a central frame disposed on the optical plate, a first frame coupled to the central frame, and a second frame coupled to the first frame; a side frame coupled between the optical plate and the second frame of the base frame; and a light source including a substrate disposed on the side frame and a light emitter disposed on the substrate, wherein the second frame is disposed on the light source, and wherein the second frame has an inner surface reflecting light from the light source to at least one of the first frame and the central frame.

Abstract: An apparatus for directing laser light has an illumination source having one or more lasers that are each energizable to emit laser light. A first faceted array in the path of the emitted laser light from the illumination source has at least a first light-redirecting facet and an adjacent second light-redirecting facet. A second faceted array, spaced apart from the first faceted array by a light propagation distance has at least a first light-collimating facet and a second light-collimating facet, wherein the first and second collimating facets define an output axis and wherein the emitted light that is redirected from the first light-redirecting facet is incident to the first light-collimating facet and directed along the output axis and wherein the emitted light that is redirected from the second light-redirecting facet is incident to the second light-collimating facet and directed along the output axis.

Abstract: An inventive LED-based lamp, lamp cover component, and methods for manufacturing thereof are disclosed which provides a light diffusive lamp cover having a diffusivity (transmittance) that is different for different areas (zones or regions) of the cover. The diffusivity and location of those areas are configured so that the emission pattern of the whole lamp meets desired emissions characteristics and optical efficiency levels. The diffusive cover may have any number of specifically delineated diffusivity areas. Alternatively, the cover may provide a gradient of increasing/decreasing diffusivity portions over the cover.

Abstract: A LED light source, comprising a heat-dissipation base, a circuit base is fixed on the heat-dissipation base, and luminous LED(s) is fixed on the circuit base, a light-distribution lens is sealed connected outside the heat-dissipation base, a housing is fixed outside the light-distribution lens, and front ends of the housing and the light-distribution lens are separately fixed jointed to a light-transmitting cover, the light-transmitting cover is sealed connection with the heat-dissipation base, the circuit base and LEDs are located within a sealed first chamber formed by the heat-dissipation base, light-distribution lens and light-transmitting cover, at least a channel is further arranged on the heat-dissipation base, each channel is disconnected to the first chamber, and two opposite openings of each channel are connected to the exterior. The LED light source has a good heat-dissipation performance, particularly to be used for high-power LED illumination.

Abstract: A diffusing lens includes a first surface and a second surface facing away from the first surface. The first surface has a first negative Fresnel structure for diffusing light from a point light source. The second surface has a second negative Fresnel structure aligning with the first negative Fresnel structure and for further diffusing the light of the point light source.

Abstract: An LED light fixture including a frame defining a forward open region and a rearward region with a rearmost portion adapted for securement to a support member. An LED assembly is secured with respect to the frame and positioned within the open forward region with open spaces remaining therebetween. The LED assembly includes an LED illuminator secured with respect to the LED-supporting region of a heat sink with an LED-supporting region and heat-dissipating surfaces extending therefrom. Another aspect of the invention is a non-metallic frame defining a forward open region and having a rearward region having a rearmost portion adapted for securement to a support member. An LED assembly is secured with respect to the frame and positioned within the open forward region with open spaces remaining therebetween.

Abstract: An electric candle has a candle body and at least two lighting devices which are arranged in the candle body. In order to develop the electric candle further in such a way that the user perceives it in a more aesthetically pleasing fashion, the candle wick is made of a transparent or translucent material and the candle body constitutes a casing. The interior of the candle is embodied as a cavity in which the lighting devices are arranged.

Abstract: A semiconductor optical device includes a stem; a semiconductor optical element mounted on the stem; a resin cap including a cylindrical body portion, a plate portion, and an edge portion; and a lens attached integrally to the plate portion of the cap. The edge portion of the cap is bonded to the stem so that the cap covers the semiconductor optical element. The cylindrical body portion of the cap has at least one first portion and second portions which are spaced apart from each other in the circumferential direction of the cylindrical body portion and which project inwardly relative to the at least one first portion. The stem has projections, and each projection vertically underlies and engages or contacts a surface of a respective one of the second portions of the cap.

Abstract: Each of an optical component, a laser apparatus that includes the optical component and a method for operating the laser apparatus uses a particular reflective material layer located and formed over a substrate at a particular thickness for providing the optical component, the laser apparatus and the method for operating the laser apparatus with sufficient imperviousness to laser filaments under particular energy density fluence considerations. A particular reflective material layer comprises gold or a gold alloy. Other reflective materials may include silver, copper, aluminum and palladium reflective materials and related alloys.

Abstract: An energy-saving and explosion-proof LED lamp comprises a lamp socket, an LED element, a lamp shade and a ring cap. The lamp socket includes a housing chamber, a jutting coupling portion with a housing compartment at the bottom thereof to hold a washer assembly inside to seal the bottom of the lamp socket. The LED element is fixedly held in the housing chamber. The lamp shade is made of tempered glass and wedged in the housing chamber, and has a jutting lens in the center and an annular end extended outwards from the perimeter of the lens. The ring cap has a coupling opening mating the lens and a press portion at the rim thereof. The ring cap is coupled on the lamp socket with the press portion covering the annular end, thus forms a flame propagation distance complying with explosion-proof certification.