Abstract: The invention relates to a method and an arrangement for the surge protection of inverters for photovoltaic systems, comprising at least one surge protection device which is physically integrated in the inverter or can be found in the vicinity of the inverter. The at least one surge protection device is connected to the DC side of the inverter. According to the invention, the inverter supplies a signal for setting or tracking the operating point at an operating level in the maximum power point (MPP) range, the response voltage of the surge protection device being predetermined, set, or selected on the basis of said signal.

Abstract: In accordance with an embodiment, an electronic device includes a controller configured to apply slope compensation to a reference signal in a power factor corrector. The device also configured to adjust the slope compensation based on an input voltage of the power factor corrector.

Abstract: A micro inverter is provided. The micro inverter includes an inverter efficiency threshold detector configured to determine whether an efficiency of the micro inverter is below a threshold efficiency, wherein the micro inverter is configured to convert direct current power into alternating current power, and a microcontroller coupled to the inverter efficiency threshold detector and configured to operate the micro inverter in a continuous power mode, operate the micro inverter in a discontinuous power mode, and switch the micro inverter between the continuous power mode and the discontinuous power mode based on whether the efficiency of the micro inverter is below the threshold efficiency.

Abstract: A power conversion apparatus including a three-phase transformer having at least four three-phase windings, and three converter arms each configured by connecting one or plural unit converters each including a switching device and an energy storage element in series. A power source or a load is connected to a first three-phase winding of the transformer, three series circuits which connects second and third three-phase windings of the transformer, and the converter arms in series with each other are connected in parallel, the parallel connection point is a DC terminal, and a magnitude relationship between a coupling coefficient of the first and second three-phase windings, and a coupling coefficient of the first three- and third three-phase windings is equal to a magnitude relationship between a coupling coefficient of the fourth and second three-phase windings, and a coupling coefficient of the fourth and the third three-phase windings.

Abstract: A micro inverter includes a synchronous bi-directional power converter and a controller communicatively coupled to the synchronous bi-directional power converter. The controller is configured to operate the micro inverter in a forward conduction mode when photovoltaic (PV) power is available and operate the micro inverter in at least one of a reverse conduction mode and a reactive power compensation mode when PV power is unavailable.

Abstract: A photovoltaic (PV) system is disclosed that provides dynamic regulation of the output of a PV array such that the inverter can safely operate without entering a voltage protection mode. The PV system includes a PV array that generates a direct current (DC) output from received solar radiation and a DC link coupled to the PV array to receive the DC output therefrom. The PV system also includes a DC-to-AC power inverter electrically coupled to the DC link to receive the DC output therefrom and invert the DC output to an AC output and a damping circuit electrically coupled to the DC link and positioned between the PV array and the DC-to-AC power inverter. The damping circuit includes a damping resistor and a damping switch.

Abstract: According to one embodiment, a liquid cooling type power conversion apparatus is provided. The liquid cooling type power conversion apparatus has a power conversion apparatus and a cooling apparatus which are provided in an engine room of a railway vehicle, an electric component and a plurality of semiconductor devices which are provided in the power conversion apparatus, a third heat exchanger located between the electric component and an electric blower, a cooling body on which the plurality of the semiconductor devices are mounted, a first heat exchanger provided in the cooling apparatus, a second heat exchanger provided in the cooling apparatus having a size smaller than the first heat exchanger 111b, a piping to connect the third heat exchanger 5 and the second heat exchanger, and a piping to connect the cooling body and the first heat exchanger.

Abstract: A system on chip (SoC) provides a memory array of nonvolatile bitcells. Each bit cell includes two ferroelectric capacitors connected in series between a first plate line and a second plate line, such that a node Q is formed between the two ferroelectric capacitors. The first plate line and the second plate line are configured to provide a voltage approximately equal to first voltage while the bit cell is not being accessed. A clamping circuit is coupled to the node Q and is operable to clamp the node Q to a voltage approximately equal to first voltage while the bit cell is not being accessed.

Abstract: A system on chip (SoC) provides a memory array of self referencing nonvolatile bitcells. Each bit cell includes two ferroelectric capacitors connected in series between a first plate line and a second plate line, such that a node Q is formed between the two ferroelectric capacitors. The first plate line and the second plate line are configured to provide a voltage approximately equal to first voltage while the bit cell is not being accessed. A clamping circuit coupled to the node Q. A first read capacitor is coupled to the bit line via a transfer device controlled by a first control signal. A second read capacitor coupled to the bit line via another transfer device controlled by a second control signal. A sense amp is coupled between the first read capacitor and the second read capacitor.

Abstract: A method to operate an integrated circuit includes operating a locally active memristive device in a locally reactive region of an operating domain where the device exhibits inductor-like behavior, such as a phase shift where a voltage across the device leads a current through the device.

Abstract: A programmable crossbar array includes a layer of row conductors and a layer of column conductors with the row conductors crossing over the column conductors to form junctions. Programmable crosspoint devices are sandwiched between a row conductor and a column conductor at a junction. Each programmable crosspoint device includes a data element with a first programming threshold and a control element with a second programming threshold, in which the second programming threshold is greater than the first programming threshold. A method for mitigating shorts in a programmable crossbar array is also provided.

Abstract: A programmable crossbar array with inline fuses includes a layer of row lines and a layer of column lines with the row lines crossing over the column lines to form junctions and resistive memory elements sandwiched between row lines and a column lines at the junctions. Inline fuses are located in either the row lines, column lines or both. The inline fuses are interposed between the support circuitry and the resistive memory elements. A method for mitigating shorts in a crossbar array is also provided.

Abstract: A resistance-based random access memory circuit includes a first data line, a second data line, a plurality of memory cells, a first driving unit, and a second driving unit. The memory cells are arranged one following another in parallel with the first and second data lines. Each of the memory cells are coupled between the first data line and the second data line. The first driving unit is coupled with first ends of the first and second data lines. The first driving unit is configured to electrically couple one of the first data line and the second data line to a first voltage node. The second driving unit is coupled with second ends of the first and second data lines. The second driving unit is configured to electrically couple the other one of the first data line and the second data line to a second voltage node.

Abstract: A nonvolatile memory device comprises a resistive memory cell, a write driver configured to write data to the resistive memory cell during a write period comprising a plurality of loops, and a sense amplifier configured to verify whether the data is correctly written to the resistive memory cell in each of the loops. Where the sense amplifier verifies that the data is correctly written in a k-th loop among the loops, the write driver is disabled from a (k+1)-th loop to an end of the write period.

Abstract: A control circuit is configured to perform, when a plurality of variable resistance elements connected to a selected first wiring line are selected, a read operation to sense a voltage of the selected first wiring line. The control circuit is configured to adjust, according to the voltage of the selected first wiring line sensed in the read operation, a voltage to be applied to the selected first wiring line in a reset operation or a set operation. The reset operation is an operation to increase resistance of a variable resistance element. The set operation is an operation to decrease resistance of a variable resistance element.

Abstract: A method for read measurement of a plurality N of resistive memory cells having a plurality K of programmable levels. The method includes a step of applying a first read voltage to each of the plurality N of resistive memory cells and, at each of the plurality N of resistive memory cells, measuring a first read current due to the applied first read voltage, determining a respective second read voltage based on the first read current measured at the plurality N of resistive memory cells and a target read current determined for the plurality N of resistive memory cells for each of the plurality N of resistive memory cells, and applying the respective determined second read voltage to the plurality N of resistive memory cells for obtaining a second read current for each of the plurality N of resistive memory cells.

Abstract: A method for read measurement of a plurality N of resistive memory cells having a plurality M of programmable levels is suggested. The method includes a step of reading back from a number of reference cells to obtain a reading back parameter, a step of determining an actual read voltage for the N memory cells based on the obtained reading back parameter for obtaining a target read current at a following read measurement, and, a step of applying the determined actual read voltage to the N memory cells at the following read measurement.

Abstract: A memory cell including conductive oxide electrodes is disclosed. The memory cell includes a memory element operative to store data as a plurality of resistive states. The memory element includes a layer of a conductive metal oxide (CMO) (e.g., a perovskite) in contact with an electrode that may comprise one or more layers of material. At least one of those layers of material can be a conductive oxide (e.g., a perovskite such as LaSrCoO3-LSCoO or LaNiO3-LNO) that is in contact with the CMO. The conductive oxide layer can be selected as a seed layer operative to provide a good lattice match with and/or a lower crystallization temperature for the CMO. The conductive oxide layer may also be in contact with a metal layer (e.g., Pt). The memory cell additionally exhibits non-linear IV characteristics, which can be favorable in certain arrays, such as non-volatile two-terminal cross-point memory arrays.

Abstract: Some embodiments include apparatuses and methods having first conductive lines, second conductive lines, a memory array including memory cells, each of the memory cells coupled between one of the first conductive lines and one of the second conductive lines. At least one of such apparatuses and methods can include a module configured to cause a first current from a first current source and a second current from a second current source to flow through a selected memory cell among the memory cells during an operation of storing information in the selected memory cell. Other embodiments including additional apparatuses and methods are described.

Abstract: Apparatus to store data and methods to read memory cells are disclosed. A disclosed example method involves, during a read cycle of a memory cell, applying a current across the memory cell to read a content of the memory cell. During a subsequent read cycle of the memory cell, a subsequent current is applied across the memory cell in the opposite direction to read the content of the memory cell.

Abstract: A semiconductor device includes an equalizing circuit and a control circuit. The equalizing circuit executes an operation of pre-charging the signal input/output line pair used for data inputting/outputting and an operation of equalizing it independently of each other. In case a plurality of data write operations occur in succession, the control circuit halts pre-charge control in the equalizing circuit in the course of consecutive write operations.

Abstract: Static random access memories (SRAM) with read-preferred cell structures and write drivers are disclosed. In one embodiment, the SRAM has a six transistor bit cell. The read-preferred bit cell is implemented by providing two inverters, each having a pull up transistor, a pull down transistor and a pass gate transistor. Each pull up transistor is associated with a feedback loop. The feedback loop improves random static noise margin. Each transistor has a width and a length. The lengths of the pass gate transistors are increased. The widths of the pull down transistors are equal to one another and also equal to the widths of the pass gate transistors. The widths of the pass gate and pull down transistors may also be increased relative to prior designs. A write assist circuit may also be used to improve performance.

Abstract: A memory including current-limiting devices and methods of operating the same to prevent a spread of soft errors along rows in an array of memory cells in the memory are provided. In one embodiment, the method begins with providing a memory comprising an array of a plurality of memory cells arranged in rows and columns, wherein each of the columns is coupled to a supply voltage through one of a plurality of current-limiting devices, Next, each of the plurality of current-limiting devices are configured to limit current through each of the columns so that current through a memory cell in a row of the column due to a soft error rate event does not result in a lateral spread of soft errors to memory cells in the row in an adjacent column. Other embodiments are also provided.

Abstract: A bit line driver for a static random access memory (SRAM) cell including: a first voltage supply for supplying a first voltage; a second voltage supply for supplying a second voltage that is less than the first voltage; a write circuit to drive a bit line and an inverse bit line when writing to the SRAM cell; and a pre-charge circuit to pre-charge the bit line and the inverse bit line before reading the content of the SRAM cell. The bit line driver supplies a voltage less than the first voltage by a threshold voltage of one transistor to the bit line or the inverse bit line when the bit line driver drives the bit line or the inverse bit line to a high state.

Abstract: A memory has magnetic tunnel junction elements with different resistances in different logic states, for bit positions in memory words accessed by a word line signal coupling each bit cell in the addressed word between a bit line and source line for that bit position. The bit lines and source lines are longer and shorter at different word line locations, causing a resistance body effect. A clamping transistor couples the bit line to a sensing circuit when reading, applying a current through the bit cell and producing a read voltage compared by the sensing circuit to a reference such as a comparable voltage from a reference bit cell circuit having a similar structure. A drive control varies an input to the switching transistor as a function of the word line location, e.g., by word line address, to offset the different bit and source line resistances.

Abstract: Embodiments are directed to detecting a state of a memory element in a memory device, comprising: applying a pulse of a predetermined magnitude and duration to the memory element to induce a transition in the state of the memory element when a polarity of the pulse is opposite to the state, monitoring, by a device, a signal associated with the memory element to detect a presence or absence of a transition in the signal in an amount greater than a threshold, and determining the state of the memory element based on said monitoring.

Abstract: Memory self-repair circuitry includes a memory cell array on a chip, and built-in self test (BIST) circuitry on the chip coupled to the memory cell array. The BIST circuitry is configured to perform a magnetic random access memory (MRAM) write operation to write addresses of failed memory cells in the memory cell array to a failed address sector also in the memory cell array. The memory self-repair circuitry also includes first select circuitry coupled between the BIST circuitry and the memory cell array. The first select circuitry is configured to selectively couple an output of the BIST circuitry and an input to the memory cell array.

Abstract: A memory device using a spin hall effect, and methods of manufacturing and operating the memory device, include applying a first operational current to a bit line of the memory device such that a spin current is applied to a magnetic tunnel junction (MTJ) cell coupled to the bit line due to a material in the bit line, wherein the bit line is electrically connected to a word line via the MTJ cell, and the word line intersects the bit line.

Abstract: Methods for monitoring one or more load currents corresponding with one or more voltage regulators used during operation of a semiconductor memory are described. The one or more load currents may be due to the biasing of memory cells within a memory array or due to the presence of shorts between lines in the memory array. In some embodiments, a plurality of load currents corresponding with a plurality of voltage regulators may be monitored in real-time before and during biasing of one or more memory arrays. The plurality of load currents may be monitored using a configurable load current monitoring circuit that uses a current summation technique. The ability to monitor the plurality of load currents before performing a programming operation on a memory array allows for remapping of defective portions of the memory array and modification of programming bandwidth prior to the programming operation.

Abstract: Methods and systems for phase change memories and arrays with improved write characteristics. If a data word can be more efficiently written by e.g. exchanging SETs and RESETs, it is written as such on the fly, and e.g. a bit of overhead is written to indicate the transformation. This has a surprising synergy with phase change memory as SET operations usually take longer and consume more power than do RESET operations. In one sample embodiment of multilevel phase change memory, states intermediate between SET and RESET can be even less desirable to write than SETs, as they take more precision than do the extreme states of SET and RESET, so that a desirable transformation can be to exchange intermediate states for extreme states.

Abstract: Methods and systems for phase change memories and arrays with improved write characteristics. If a data word can be more efficiently written by e.g. exchanging SETs and RESETs, it is written as such on the fly, and e.g. a bit of overhead is written to indicate the transformation. This has a surprising synergy with phase change memory as SET operations usually take longer and consume more power than do RESET operations. In one sample embodiment of multilevel phase change memory, states intermediate between SET and RESET can be even less desirable to write than SETs, as they take more precision than do the extreme states of SET and RESET, so that a desirable transformation can be to exchange intermediate states for extreme states.

Abstract: Methods and systems for phase change memories and arrays with improved write characteristics. If a data word can be more efficiently written by e.g. exchanging SETs and RESETs, it is written as such on the fly, and e.g. a bit of overhead is written to indicate the transformation. This has a surprising synergy with phase change memory as SET operations usually take longer and consume more power than do RESET operations. In one sample embodiment of multilevel phase change memory, states intermediate between SET and RESET can be even less desirable to write than SETs, as they take more precision than do the extreme states of SET and RESET, so that a desirable transformation can be to exchange intermediate states for extreme states.

Abstract: An embodiment includes a three terminal magnetic element for a semiconductor memory device. The magnetic element includes a reference layer; a free layer; a barrier layer disposed between the reference layer and the free layer; a first electrode; an insulating layer disposed between the electrode and the free layer; and a second electrode coupled to sidewalls of the free layer.

Abstract: It is an object to provide a signal processing circuit for which a complex manufacturing process is not necessary and whose power consumption can be suppressed. In particular, it is an object to provide a signal processing circuit whose power consumption can be suppressed by stopping the power supply for a short time. The signal processing circuit includes a control circuit, an arithmetic unit, and a buffer memory device. The buffer memory device stores data sent from the main memory device or the arithmetic unit in accordance with an instruction from the control unit; the buffer memory device comprises a plurality of memory cells; and the memory cells each include a transistor including an oxide semiconductor in a channel formation region and a memory element to which charge whose amount depends on a value of the data is supplied via the transistor.

Abstract: A method of programming a split gate memory applies voltages differently to the terminals of the selected cells and the deselected cells. For cells being programming by being coupled to a selected row and a selected column, coupling the control gate to a first voltage, coupling the select gate to a second voltage, programming is achieved by coupling the drain terminal to a current sink that causes the split gate memory cell to be conductive, and coupling the source terminal to a third voltage. For cells not being programmed by not being coupled to a selected row, non-programming is maintained by coupling the control gate to the first voltage, coupling the select gate to a fourth voltage which is greater than a voltage applied to the select gate during a read in which the split gate memory cells are deselected but sufficiently low to prevent programming.

Abstract: A semiconductor integrated circuit according to an embodiment includes an oscillator that generates and outputs an oscillation signal in an active state and generates no oscillation signal in an inactive state. The semiconductor integrated circuit includes a negative charge pump that generates an output voltage that is a negative voltage in response to the oscillation signal and outputs the output voltage to an output pad. The semiconductor integrated circuit includes a negative voltage detecting circuit that detects the output voltage and controls the oscillator to be in the active state or inactive state so as to bring the output voltage close to a target voltage.

Abstract: A system and methods for programming a set of data onto non-volatile memory elements, maintaining copies of the data pages to be programmed, as well as surrounding data pages, internally or externally to the memory circuit, verifying programming correctness after programming, and upon discovering programming error, recovering the safe copies of the corrupted data to be reprogrammed in alternative non-volatile memory elements. Additionally, a system and methods for programming one or more sets of data across multiple die of a non-volatile memory system, combining data pages across the multiple die by means such as the XOR operation prior to programming the one or more sets of data, employing various methods to determine the correctness of programming, and upon identifying data corruption, recovering safe copies of data pages by means such as XOR operation to reprogram the pages in an alternate location on the non-volatile memory system.

Abstract: A flash memory includes a program voltage generator, plural memory units, a current limiter, and a multi-bit program control unit. The program voltage generator is used for providing a constant program voltage during a detecting cycle and providing a dynamically-adjustable program voltage during a program cycle. The plural memory units output plural drain currents and plural data line voltages to plural data lines. The current limiter is used for receiving a reference current and a reference voltage, thereby controlling the plural drain currents. During the detecting cycle, a specified data line voltage of the plural data line voltages with the minimum voltage level is detected by the multi-bit program control unit. During the program cycle, the specified data line voltage is used as a feedback voltage, and the dynamically-adjustable program voltage is generated by the program voltage generator according to the feedback voltage.

Abstract: A memory device is described that includes a three-dimensional array of memory cells having a plurality of levels of memory cells accessed by a plurality of word lines, and a plurality of bit lines. Control circuitry is coupled to the plurality of word lines and the plurality of bit lines. The control circuitry is adapted for programming a selected memory cell in a selected level of the array and on a selected word line, by hot carrier generation assisted FN tunneling, while inhibiting disturb in unselected memory cells in unselected levels and in the selected level and on unselected word lines by self-boosting.

Abstract: The memory cells storing a group of codewords are read to obtain respective read signals each comprising N signal components corresponding to respective symbols of a codeword. The components of each read signal are ordered according to signal level to produce an ordered read signal. Correspondingly-positioned components of the ordered read signals are then ordered according to signal level to produce ordered component sets for respective component positions in a said ordered read signal. Each ordered component set is partitioned into subsets corresponding to respective memory cell levels, wherein the subsets of the ordered component sets contain respective numbers of components dependent on predefined probabilities of occurrence of different symbol values at different positions in a said codeword whose symbols are ordered according to symbol value. The reference signal level is determined in dependence on the signal components in the subsets corresponding to that memory cell level.

Abstract: To program in a nonvolatile memory device include a plurality of memory cells that are programmed into multiple states through at least two program steps, a primary program is performed from an erase level to a first target level with respect to the memory cells coupled to a selected word line A preprogram is performed from the erase level to a preprogram level in association with the primary program with respect to the memory cells coupled to the selected word line, where the preprogram level is larger than the erase level and smaller than the first target level A secondary program is performed from the preprogram level to a second target level with respect to the preprogrammed memory cells coupled to the selected word line.

Abstract: According to one embodiment, a semiconductor memory device includes a first sense amplifier that is located in a first region and amplifies signals from a memory cell in the first region. A second sense amplifier is located in a second region and amplifies signals from a memory cell in the second region. A bus is connected to the first and second sense amplifiers and passes through the first and second regions. A first latch is located in the second region and is connected to the bus. A second latch is located in the second region and is connected to the bus.

Abstract: A low-pin-count non-volatile memory (NVM) embedded an integrated circuit can be accessed without any additional pins. The NVM has one or more memory cells and at least one of the NVM cells can have at least one NVM element coupled to at least one selector and to a first supply voltage line. The selector can be coupled to a second supply voltage line and has a selecting signal. The integrated circuit can include at least one test mode detection circuit to activate a test mode upon detecting an abnormal (or out of normal) operation condition(s). Once a test mode is activated, at least one I/O or supply voltage of the integrated circuit can be used as the I/O or supply voltage of the NVM to select at least one NVM cell for read, program into nonvolatile, or volatile state. At least one NVM cell can be read during ramping of at least one supply voltage line.

Abstract: Upon selecting non-volatile storage elements to be sensed, the system obtains information about the position of these non-volatile storage elements, determines sensing parameters based at least in part on this information, pre-charges a charge storage device and, while maintaining the voltage level of the bit lines of these memory cells at a constant value, applies a reference signal to these non-volatile storage elements for a certain duration of time, afterwards determining whether, for the certain duration of time, the current conducted by these non-volatile storage elements exceeds a predetermined value.

Abstract: Techniques and devices relating to adjusting one or more operational parameters for memory cells are provided. One such device may include a detection unit configured to perform one or more reading operations on a set of memory cells to determine an upper bound of the threshold voltages of the set of memory cells. The device may further include a parameter adjustment unit configured to adjust one or more operational parameters for the set of memory cells based, at least in part, on the determined upper bound of the threshold voltages. Other techniques and devices are also provided.

Abstract: Some embodiments relate to a sense amplifier output buffer configured to buffer an output of a sense amplifier. The sense amplifier output buffer includes a first pull-up element having a source coupled to a first DC supply terminal and having a drain coupled to an output terminal of the sense amplifier output buffer. A first pull-down element is in series with the first pull-up element and has a source coupled to a second DC supply terminal and has a drain coupled to the output terminal. A miller capacitance decoupling circuit is coupled between the drain of the first pull-up element and the drain of the first pull-down element. The miller capacitance decoupling circuit is configured to decouple miller capacitance associated with the drains of the pull-up and pull-down elements from the output terminal. Other embodiments are also disclosed.

Abstract: A method and system are provided for adjusting a write timing in a memory device. For instance, the method can include receiving a data signal, a write clock signal, and a reference signal. The method can also include detecting a phase shift in the reference signal over time. The phase shift of the reference signal can be used to adjust a phase difference between the data signal and the write clock signal, where the memory device recovers data from the data signal based on an adjusted write timing of the data signal and the write clock signal.

Abstract: A system on chip (SoC) provides a nonvolatile memory array that is configured as n rows by m columns of bit cells. Each of the bit cells is configured to store a bit of data. There are m bit lines each coupled to a corresponding one of the m columns of bit cells. There are m write drivers each coupled to a corresponding one of the m bit lines. An AND gate is coupled to the m bit lines and has an output line coupled to an input of a test controller on the SoC. An OR gate is coupled to the m bit lines and has an output line coupled to an input of the test controller.

Abstract: A supply voltage generation circuit includes a comparison unit, a voltage level control unit and a voltage regulator circuit. Comparison unit is configured to compare input data and output data of a memory array to each other and thereby generating a comparison result, wherein output data are storage data stored in a plurality of memory units of the memory array processed by a program operation according to the input data, and comparison result indicates the number of different bits existing between the output data and the input data. Voltage level control unit is configured to generate a control signal according to the comparison result. Voltage regulator circuit is configured to provide a supply voltage for the memory array and adjust value of the supply voltage according to the control signal. A memory and an operation method of a supply generation circuit used for a memory array are also provided.

Abstract: One or more techniques or systems for controlling a voltage divider are provided herein. In some embodiments, a control circuit is configured to bias a pull up unit of a voltage divider using an analog signal, thus enabling the voltage divider to be level tunable. In other words, the control circuit enables the voltage divider to output multiple voltage levels. Additionally, the control circuit is configured to bias the pull up unit based on a bias timing associated with a pull down unit of the voltage divider. For example, the pull up unit is activated after the pull down unit is activated. In this manner, the control circuit provides a timing boost, thus enabling the voltage divider to stabilize more quickly.