Polishes Patents (Class 106/3)
  • Patent number: 6918938
    Abstract: A polishing composition comprising an abrasive, an acid and/or a salt thereof, and water, wherein copper (Cu) is contained in an amount of 1 mg or less per kg of the polishing composition; a process for reducing a surface defect of a substrate comprising applying to a substrate or a polishing pad a polishing composition comprising an abrasive, an acid and/or a salt thereof, and water, wherein copper (Cu) is contained in an amount of 1 mg or less per kg of the polishing composition fed to the substrate or the polishing pad; and a process for manufacturing a substrate comprising a polishing step comprising applying to a substrate or a polishing pad the above polishing composition.
    Type: Grant
    Filed: October 21, 2003
    Date of Patent: July 19, 2005
    Assignee: Kao Corporation
    Inventors: Toshiya Hagihara, Shigeo Fujii
  • Patent number: 6913634
    Abstract: An aqueous chemical mechanical polishing slurry is provided that comprises precipitated amorphous silica abrasive particles treated with acidic aluminum. Also provided is a method of polishing an electronic component substrate comprising the steps of: a) obtaining an electronic component substrate, the electronic component substrate having an insulating film deposited over it, an interconnection pattern formed in the insulating film, and interconnection material deposited on the insulated film and in the interconnection pattern; and b) polishing the interconnection material until a surface of said insulating film is exposed by using an aqueous chemical mechanical polishing slurry comprising: precipitated amorphous silica abrasive particles treated with acidic aluminum.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: July 5, 2005
    Assignee: J. M. Huber Corporation
    Inventors: Duen-Wu Hua, Frands Nielsen
  • Patent number: 6911069
    Abstract: Iodine or iodophor stain resistance is imparted to a surface by applying a hardenable coating composition containing an effective amount of a reducing agent having a redox potential sufficient to decolorize an iodine or iodophor stain. The reducing agent reacts with triiodide anion in the stain to change the stain coloration from a yellowish hue (e.g., yellow-white, yellow or brown) towards a lighter hue (e.g., pale yellow, white or transparent). This decolorization reaction takes place over a period of minutes, hours or days, and preferably can eventually cause the stain to disappear.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: June 28, 2005
    Assignee: Ecolab Inc.
    Inventors: Kim R. Smith, Scott I. DeFields, Keith E. Olson
  • Patent number: 6902590
    Abstract: A method for chemical mechanical polishing of semiconductor substrates containing a metal layer requiring removal and metal interconnects utilizing a composition containing engineered copolymer molecules comprising hydrophilic functional groups and relatively less hydrophilic functional groups; the engineered copolymer molecules enabling contact-mediated reactions between the polishing pad surface and the substrate surface during CMP resulting in minimal dishing of the metal interconnects in the substrate.
    Type: Grant
    Filed: September 17, 2003
    Date of Patent: June 7, 2005
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc
    Inventors: Barry Weinstein, Tirthankar Ghosh
  • Patent number: 6902591
    Abstract: A polishing composition comprising an abrasive, water and an organic acid or a salt thereof, wherein the composition has a specified viscosity of from 1.0 to 2.0 mPa·s at a shearing rate of 1500 s?1 and 25° C.; a roll-off reducing agent comprising a Brönsted acid or a salt thereof, having an action of lowering viscosity so that the amount of viscosity lowered is 0.01 mPa·s or more, wherein the amount of viscosity lowered is expressed by the following equation: (Amount of Viscosity Lowered)=(Viscosity of Standard Polishing Composition)?(Viscosity of Roll-Off Reducing Agent-Containing Polishing Composition), wherein the standard polishing composition is prepared which comprises 20 parts by weight of an abrasive, said abrasive being high-purity alumina having Al2O3 purity of 98.
    Type: Grant
    Filed: July 24, 2003
    Date of Patent: June 7, 2005
    Assignee: Kao Corporation
    Inventors: Hiroaki Kitayama, Shigeo Fujii, Yoshiaki Oshima, Toshiya Hagihara
  • Patent number: 6896710
    Abstract: The present invention provides a novel, structurally improved, abrasive agent, with improved surface properties resulting, inter alia, in enhanced wettability, dispersability and bonding. More specifically, the present invention provides according to an aspect thereof, an abrasive agent comprising abrasive particles, said particles being in the form of a composite material comprising more than one metal oxide material. In another aspect, the present invention provides an abrasive agent comprising metal oxide abrasive particles, said particles being coated at least partially with an extraneous metal or metal bearing layer.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: May 24, 2005
    Assignee: J.G. Systems, Inc.
    Inventor: John Grunwald
  • Patent number: 6893476
    Abstract: A composition and associated methods for chemical mechanical planarization (or other polishing) are described. The composition may comprise an abrasive and a dispersed hybrid organic/inorganic particle. The composition may further comprise an alkyne compound. Two different methods for chemical mechanical planarization are disclosed. In one method (Method A), the CMP slurry composition employed in the method comprises comprise an abrasive and a dispersed hybrid organic/inorganic particle. In another method (Method B), the CMP slurry composition employed in the method comprises comprise an abrasive and an alkyne compound. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated methods (A and B) for metal CMP applications (e.g., tungsten CMP).
    Type: Grant
    Filed: December 9, 2002
    Date of Patent: May 17, 2005
    Assignee: DuPont Air Products Nanomaterials LLC
    Inventors: Junaid Ahmed Siddiqui, Timothy Frederick Compton
  • Patent number: 6893477
    Abstract: The present invention provides a cerium-based abrasive slurry particles including a cerium-based abrasive particle of no less than 95% by weight of total rare earth oxides (TREO), in which the cerium-based abrasive particle has less than 3% by weight of fluorine content of TREO, and a particle size distribution determined by a laser diffraction method is within a predetermined range. And adhesion property is further improved by setting this fluorine content in 0.005 to 0.5% by weight of TREO.
    Type: Grant
    Filed: September 12, 2002
    Date of Patent: May 17, 2005
    Assignee: Mitsui Mining & Smelting Co, Ltd.
    Inventors: Yoshitsugu Uchino, Kazuya Ushiyama
  • Patent number: 6887289
    Abstract: There is provided an abrasive used for polishing a substrate which comprises silica as a main component, for example a rock crystal, a quartz glass for photomask, for CMP of an organic film, Inter Layer Dielectric (ILD) and shallow trench isolation of a semiconductor device, or for polishing a hard disk made of glass. A sol which particles are dispersed in a medium, wherein the particles have a particle size of 0.005 to 1 ?m and comprise as a main component crystalline cerium oxide of the cubic system and as an additional component a lanthanum compound, a neodymium compound or a combination thereof, wherein the additional component is contained in X/(Ce+X) molar ratio of 0.001 to 0.5 in which X is lanthanum atoms, neodymium atoms or a combination thereof.
    Type: Grant
    Filed: February 19, 2004
    Date of Patent: May 3, 2005
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Isao Ota, Kenji Tanimoto, Tohru Nishimura
  • Patent number: 6881757
    Abstract: Pressurized mixtures of propellant gasses and liquid surface or air treating materials are disclosed. The liquid materials are in the form of a dispersion which is a biliquid foam with a thickener, where the foam is structured as an oil-in-water complex. The dispersion has an oil portion having a polysiloxane and/or a hydrocarbon oil. There is also surfactant such as one nonionic surfactant and one polar surfactant. Water is also provided.
    Type: Grant
    Filed: November 8, 2002
    Date of Patent: April 19, 2005
    Assignee: S.C. Johnson & Son, Inc.
    Inventors: Timothy I. Moodycliffe, Ralph W. Oakeson, Lynn M. Werkowski
  • Patent number: 6863700
    Abstract: A cerium oxide abrasive slurry having, dispersed in a medium, cerium oxide particles whose primary particles have a median diameter of from 30 nm to 250 nm, a maximum particle diameter of 600 nm or smaller, and a specific surface area of from 7 to 45 m2/g, and slurry particles have a median diameter of from 150 nm to 600 nm. The cerium oxide particles have structural parameter Y, representing an isotropic microstrain obtained by an X-ray Rietvelt method (with RIETAN-94), of from 0.01 to 0.70, and structural parameter X, representing a primary particle diameter obtained by an X-ray Rietvelt method (with RIETAN-94), of from 0.08 to 0.3. The cerium oxide abrasive slurry is made by a method of obtaining particles by firing at a temperature of from 600° C. to 900° C. and then pulverizing, then dispersing the resulting cerium oxide particles in a medium.
    Type: Grant
    Filed: February 13, 2001
    Date of Patent: March 8, 2005
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Masato Yoshida, Toranosuke Ashizawa, Hiroki Terazaki, Yasushi Kurata, Jun Matsuzawa, Kiyohito Tanno, Yuuto Ootuki
  • Patent number: 6852009
    Abstract: A polishing composition which comprises the following components (a) to (d): (a) silicon dioxide, (b) at least one basic substance selected from the group consisting of an inorganic salt of an alkali metal, an ammonium salt, piperazine and ethylenediamine, (c) at least one chelating agent selected from the group consisting of a compound represented by the following general formula [1] and its salt: wherein each of R1 and R2 which are the same or different, is a lower alkylene group, and n is an integer of from 0 to 4, and (d) water.
    Type: Grant
    Filed: February 1, 2002
    Date of Patent: February 8, 2005
    Assignee: Fujimi Incorporated
    Inventors: Akihiro Kawase, Masao Okamura, Yutaka Inoue
  • Patent number: 6849099
    Abstract: There is provided a polishing composition that reduces erosion and is used in a final polishing step of a semiconductor device manufacturing process. The polishing composition contains colloidal silica, a periodic acid compound, ammonia, ammonium nitrate and water and its pH is 1.8 to 4.0.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: February 1, 2005
    Assignee: Fujimi Incorporated
    Inventors: Koji Ohno, Chiyo Horikawa, Kenji Sakai, Katsuyoshi Ina
  • Patent number: 6843816
    Abstract: A cerium-based abrasive and a production method of the cerium-based abrasive excellent in polishing properties of a high polishing speed and scarce formation of polishing scratches are provided by keeping the color of the abrasive in specified ranges or stably making fluorine be contained in the abrasive. For example, as such a cerium-based abrasive, examples include a cerium-based abrasive containing cerium oxide as a main component and having an L* value in a range not lower than 65 and or lower 90, an a* value in a range 0 or higher but 15 or lower, and a b* value in a range 10 or higher but 30 or lower in the case the color is expressed by an L*a*b* color system.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: January 18, 2005
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Terunori Ito, Naoyoshi Mochizuki, Hiroyuki Watanabe, Yoshitsugu Uchino, Akira Shimogawara
  • Publication number: 20040244300
    Abstract: An object of the present invention is to provide a metal polishing composition which can polish a metal such as Cu and Ta at a high speed, has a higher efficiency of washing for a hydrophobic low dielectric constant film, and is excellent stability without precipitation of a polishing particle during storage (excellent in stability for storing). The object is achieved by a metal polishing composition comprising an anionic surfactant having 2 or more anionic functional groups in a molecule, a polishing abrasive, an inorganic salt, and water.
    Type: Application
    Filed: May 27, 2004
    Publication date: December 9, 2004
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Naoki Ichiki, Yasuo Matsumi, Masayuki Takashima, Nobuyuki Katsuda
  • Patent number: 6827752
    Abstract: A problem to be solved is to provide a slurry that is capable of flattening an uneven film on a substrate with good precision, and that has good stability, not separating into two layers, solidifying through flocculated settling or undergoing changes in viscosity. This problem is solved by adding poly ammonium acrylates having different degrees of neutralization to one another as surfactants to a cerium oxide slurry containing cerium oxide particles, and suitably adjusting the total amount of polyacrylates added.
    Type: Grant
    Filed: March 12, 2003
    Date of Patent: December 7, 2004
    Assignee: EKC Technology K.K.
    Inventors: Haruki Nojo, Akitoshi Yoshida, Pascal Berar
  • Patent number: 6824578
    Abstract: A polishing material is provided in which the dispersibility of the abrasive grains of the polishing material having, as a major component, rare earth oxides including cerium oxide is made better and the hardness of abrasive grain precipitates is reduced, and at the same time high efficiency of polishing can be achieved stably. According to the present invention, in a polishing material having, as the major component, rare earth oxides including cerium oxide, any one of crystalline cellulose, calcium secondary phosphate, a condensate of sodium &bgr;-naphthalenesulphonate and formalin, and synthetic silica is contained as an anti-solidification agent capable of softening abrasive grain precipitates of the polishing material when the abrasive grains of the polishing material are dispersed into a dispersion medium, and sodium hexametaphosphate or pyrophosphate is contained as a dispersant capable of dispersing the abrasive grains of the polishing material into the dispersion medium.
    Type: Grant
    Filed: March 6, 2003
    Date of Patent: November 30, 2004
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Yoshitsugu Uchino, Hidehiko Yamasaki, Shigeru Kuwabara
  • Patent number: 6824579
    Abstract: Polishing rate selectivity is increased by providing a polyelectrolyte in the polishing slurry. The polishing selectivity of silicon oxide to silicon nitride is enhanced by using an anionic polyelectrolyte. The polishing selectivity of metals to silicon oxide, silicon nitride and/or silicon oxynitride is increased by using a cationic polyelectrolyte.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: November 30, 2004
    Assignee: International Business Machines Corporation
    Inventor: Maria Ronay
  • Patent number: 6821309
    Abstract: A slurry for chemical mechanical polishing (CMP) of a copper or silver containing film provides at least one reactant for reacting with the copper or silver film to form a soft layer on the surface of the copper or silver film. The soft layer has a hardness less than the copper or silver film. The slurry preferably includes either no particles or particles which are softer than the copper or silver layer. A method for chemical mechanical polishing (CMP) a copper or silver containing film includes the steps of providing a slurry for reacting with the copper or silver film to form a soft layer on the surface of the copper or silver film and uses either no particles or particles softer than the copper or silver film, applying the slurry to the copper or silver film to form the soft layer, and removing the soft layer using a polishing pad.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: November 23, 2004
    Assignee: University of Florida
    Inventors: Rajiv K. Singh, Seung-Mahn Lee
  • Patent number: 6818031
    Abstract: A polishing composition comprising an abrasive, an oxidizing agent, a polishing accelerator, and water, wherein the polishing accelerator comprises an organic phosphonic acid; a method for manufacturing a substrate, comprising polishing a substrate to be polished with the above polishing composition; a method for polishing a substrate comprising polishing a substrate to be polished with the above polishing composition; a process for reducing fine scratches of a substrate, comprising polishing a substrate to be polished with the above polishing composition; and a process for accelerating polishing of a magnetic disk substrate, comprising applying the above polishing composition to a magnetic disk substrate to be polished. The polishing composition is highly suitable for polishing a magnetic disk substrate requiring high surface quality to be used in memory hard disk drives.
    Type: Grant
    Filed: April 24, 2002
    Date of Patent: November 16, 2004
    Assignee: Kao Corporation
    Inventor: Yoshiaki Oshima
  • Patent number: 6818030
    Abstract: The present invention provides a process for producing particles suitable for use as abrasives in chemical-mechanical polishing slurries. The process according to the invention includes mixing at least one crystallization promoter such as Ti[OCH(CH3)2)]4 with at least one cerium compound and at least one solvent, and subjecting said mixture to hydrothermal treatment at a temperature of from about 60° C. to about 700° C. to produce the particles. Particles formed in accordance with the present invention exhibit a large crystallite size, and can be used to polish silicon-containing substrates to a high degree of planarity at a relatively high rate.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: November 16, 2004
    Assignee: Ferro Corporation
    Inventors: Xiangdong Feng, Yie-Shein Her
  • Patent number: 6814767
    Abstract: The present invention provides a polishing composition that inhibits the occurrence of erosion. The polishing composition contains silicon oxide, a polyoxyethylene alkyl ether sulfate, a benzotriazole corrosion inhibitor, an acid, and water. The silicon oxide is preferably colloidal silica, the acid is preferably lactic acid, and the pH of the polishing composition is preferably 1.5 to 4.0.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: November 9, 2004
    Assignee: Fujimi Incorporated
    Inventor: Tatsuhiko Hirano
  • Patent number: 6814766
    Abstract: A polishing composition for polishing a semiconductor device having at least a tungsten film and an insulating film, which comprises the following components (a) to (d): (a) silicon dioxide, (b) periodic acid, (c) at least one pH controlling agent selected from the group consisting of ammonia, potassium hydroxide, sodium hydroxide, ammonium periodate, potassium periodate and sodium periodate, and (d) water.
    Type: Grant
    Filed: August 8, 2002
    Date of Patent: November 9, 2004
    Assignee: Fujimi Incorporated
    Inventors: Koji Ohno, Kenji Sakai, Katsuyoshi Ina
  • Publication number: 20040216389
    Abstract: This invention relates to a chemical mechanical polishing slurry comprising polishing grains, ammonium nitrate as an oxidizing agent, 1,2,4-triazole as a polishing promoter for a copper metal film and water and having a pH within a range of 3 to 4. The polishing slurry is suitable for forming a damascene copper-based metal interconnection comprising a tantalumr-based metal as a barrier metal film material.
    Type: Application
    Filed: February 13, 2004
    Publication date: November 4, 2004
    Applicants: NEC ELECTRONICS CORPORATION, TOKYO MAGNETIC PRINTING CO., LTD
    Inventors: Yasuaki Tsuchiya, Toshiji Taiji, Tetsuyuki Itakura, Shin Sakurai, Kenichi Aoyagi, Tomoyuki Ito
  • Patent number: 6811583
    Abstract: A polishing composition for a substrate for a magnetic disk, which comprises: (a) a polishing accelerator composed of at least one compound selected from the group consisting of malic acid, glycolic acid, succinic acid, citric acid, maleic acid, itaconic acid, malonic acid, iminodiacetic acid, gluconic acid, lactic acid, mandelic acid, crotonic acid, nicotinic acid, aluminum nitrate, aluminum sulfate and iron(III) nitrate, (b) an edge sagging preventive agent composed of at least one compound selected from the group consisting of a polyvinylpyrrolidone, a polyoxyethylene sorbitan fatty acid ester and a polyoxyethylene sorbit fatty acid ester, (c) at least one abrasive selected from the group consisting of aluminum oxide, silicon dioxide, cerium oxide, zirconium oxide, titanium oxide and silicon carbide, and (d) water.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: November 2, 2004
    Assignee: Fujimi Incorporated
    Inventor: Tomoaki Ishibashi
  • Publication number: 20040211337
    Abstract: A polishing slurry composition for CMP comprising 0.5 to 5% by weight of a silica-coated ceria powder dispersed in an aqueous medium can be beneficially used in the planarization of the surfaces of various film layers of semi-conductors and electro-luminescent devices.
    Type: Application
    Filed: February 19, 2004
    Publication date: October 28, 2004
    Inventors: In Yeon Lee, Sang Tae Kim, Yun Ju Cho, Sang Kyu Park, Kyoung Jun Kim
  • Publication number: 20040198584
    Abstract: The present invention provides nanoporous &agr;-alumina powders comprising powder comprising interconnected &agr;-alumina primary particles having an average particle size of less than about 100 nm and an interpenetrated array of pores or voids. The invention also provides nanosized &agr;-alumina powders comprising &agr;-alumina particles having an average particle size of less than about 100 nm and slurries, particularly aqueous slurries, which comprise nanosized &agr;-alumina powders of the invention. The invention further provides methods of manufacturing nanoporous &agr;-alumina powders and nanosized &agr;-alumina powders of the invention and methods of polishing using slurries of the invention.
    Type: Application
    Filed: April 2, 2003
    Publication date: October 7, 2004
    Applicant: Saint-Gobain Ceramics & Plastic, Inc.
    Inventor: Yuhu Wang
  • Patent number: 6800105
    Abstract: An abrasive for metal having particle that have a functional group capable of trapping a metal ion, a process for producing the abrasive, and a polishing composition having the abrasive, an oxidizing agent and water, are provided.
    Type: Grant
    Filed: January 9, 2001
    Date of Patent: October 5, 2004
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Kazumasa Ueda, Masayuki Takashima
  • Publication number: 20040187393
    Abstract: The present invention relates to a polishing composition more suitable for use in polishing synthetic resin products or metal products. The polishing composition includes a reaction product produced by a reaction between a polyalkylene oxide and a compound having a functional group having reactivity with a hydroxyl group, aluminum oxide, a polishing accelerator including at least one salt selected from the group consisting of a metal salt of an inorganic acid or organic acid and an ammonium salt of an inorganic acid or organic acid, and water.
    Type: Application
    Filed: March 30, 2004
    Publication date: September 30, 2004
    Inventors: Tatsuhito Mutoh, Hirohito Kitano
  • Publication number: 20040177786
    Abstract: A wax or polish also known as a surface protectant where ones primary reason for applying it is to impart a long lasting and specific scent or fragrance to a surface, such as that of an automobile, or any other surface of choice. As a secondary consideration the product will also offer surface protection from the elements.
    Type: Application
    Filed: March 14, 2003
    Publication date: September 16, 2004
    Inventors: Leo Roy Durocher, Joseph Thomas Hesseling
  • Patent number: 6786944
    Abstract: An aqueous dispersion for chemical mechanical polishing that is hard to putrefy, scarcely causes scratches, causes only small dishing and is suitable for used in a micro isolating step or a planarizing step of an inter layer dielectric in production of semiconductor devices, which dispersion comprises ceria particles, a preservative composed of a compound having a heterocyclic structure containing a nitrogen atom and a sulfur atom in the ring, such as an isothiazolone compound, and an organic component such as organic abrasive grains composed of resin particles, a dispersing agent composed of a water-soluble polymer having a specific molecular weight or the like, a surfactant and/or an organic acid or a salt thereof contained in an aqueous medium, wherein the ceria particles, preservative and organic component are contained in proportions of 0.1 to 20% by mass, 0.001 to 0.2% by mass and 0.
    Type: Grant
    Filed: April 14, 2003
    Date of Patent: September 7, 2004
    Assignee: JSR Corporation
    Inventors: Masayuki Hattori, Michiaki Ando, Kazuo Nishimoto, Nobuo Kawahashi
  • Patent number: 6786945
    Abstract: A polishing slurry and a polishing method which are suitably used in a CMP technique for flattening a surface of a substrate in a production process of a semiconductor device. The polishing slurry comprises particles and a medium in which at least a part of the particles are dispersed, wherein the particles are made of at least one of (1) a cerium compound selected from cerium oxide, cerium halide and cerium sulfide and having a density of 3 to 6 g/cm3 and an average particle diameter of secondary particles of 1 to 300 nm and (2) a tetravalent metal hydroxide. A polishing method using the polishing slurry takes advantage of a chemical action of particles in the polishing slurry and minimizes a mechanical action of the particles, thereby achieving a decrease in scratches caused by the particles and an increase in polishing rate at the same time.
    Type: Grant
    Filed: August 13, 2003
    Date of Patent: September 7, 2004
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Youichi Machii, Naoyuki Koyama, Masaya Nishiyama, Masato Yoshida
  • Patent number: 6780212
    Abstract: A finishing composition for a variety of surfaces, including, without limitation, paints, metals, plastics and fiberglass, comprises water, wax, soap, scent, hair conditioner, mineral spirits and abrasives.
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: August 24, 2004
    Assignee: GS Technologies, Inc.
    Inventor: Michael Scott Luctman
  • Publication number: 20040159050
    Abstract: A novel CMP slurry composition used for polishing metals, the composition comprising: a dispersion solution comprising an abrasive. The slurry composition has a large particle count of about 25 to about 150,000 particles having a particle size greater than 0.5 &mgr;m in 30 &mgr;L of slurry, which is achieved by filtering the slurry composition prior to use. Also, the inclusion of a chemical activity enhancer, such as, an amine and a corrosion inhibitor, results in the appropriate copper removal rate without increasing static etch rates.
    Type: Application
    Filed: December 1, 2003
    Publication date: August 19, 2004
    Applicant: ARCH SPECIALTY CHEMICALS, INC.
    Inventors: Anthony Mark Pasqualoni, Deepak Mahulikar, Larry A. LaFollette, Richard J. Jenkins
  • Patent number: 6776810
    Abstract: The invention provides a chemical-mechanical polishing systems, and methods of polishing a substrate using the polishing systems, comprising (a) an abrasive, (b) a liquid carrier, and (c) a positively charged polyelectrolyte with a molecular weight of about 15,000 or more, wherein the abrasive comprises particles that are electrostatically associated with the positively charged electrolyte.
    Type: Grant
    Filed: February 11, 2002
    Date of Patent: August 17, 2004
    Assignee: Cabot Microelectronics Corporation
    Inventors: Isaac K. Cherian, Phillip Carter, Jeffrey P. Chamberlain, Kevin Moeggenborg, David W. Boldridge
  • Patent number: 6773814
    Abstract: Metal oxide particles having a metal oxide core and a silicon dioxide coating have a low structure. The particle are produced by a base dissolved in water being added under agitation to a dispersion comprising a metal oxide, at least one compound of the type XnSi(OR)4−n, and water, the reaction product being separated out, optionally washed with water and dried. The metal oxide particles coated with silicon dioxide may be used in sun screening agents and in chemical-mechanical-polishing (CMP) applications.
    Type: Grant
    Filed: August 7, 2002
    Date of Patent: August 10, 2004
    Assignee: Degussa AG
    Inventors: Kai Schumacher, Helmut Mangold, Steffen Hasenzahl, Harald Alff
  • Patent number: 6773476
    Abstract: A polishing composition comprising: (a) at least one abrasive selected from the group consisting of silicon dioxide and aluminum oxide, (b) at least one organic compound selected from the group consisting of a polyethylene oxide, a polypropylene oxide, a polyoxyethylene alkyl ether, a polyoxypropylene alkyl ether, a polyoxyethylenepolyoxypropylene alkyl ether and a polyoxyalkylene addition polymer having a C≡C triple bond, represented by the formula (1): wherein each of R1 to R6 is H or a C1-10 alkyl group, each of X and Y is an ethyleneoxy group or a propyleneoxy group, and each of m and n is a positive number of from 1 to 20, (c) at least one polishing accelerating compound selected from the group consisting of citric acid, oxalic acid, tartaric acid, glycine, &agr;-alanine and histidine, (d) at least one anticorrosive selected from the group consisting of benzotriazole, benzimidazole, triazole, imidazole and tolyltriazole, (e) hydrogen peroxide, and (f) water.
    Type: Grant
    Filed: July 23, 2002
    Date of Patent: August 10, 2004
    Assignee: Fujimi Incorporated
    Inventors: Kenji Sakai, Kazusei Tamai, Tadahiro Kitamura, Tsuyoshi Matsuda, Katsuyoshi Ina
  • Patent number: 6767393
    Abstract: A self-shining aerosol-type shoe polish composition consisting essentially of 0.5 to 25% by volume of a silicone compound, optionally 3 to 25% by volume of a drying retardant and/or 0.1 to 1% by volume of an anti-static agent component, and the remainder of liquefied gas as a solvent as well as a propellant gas, exhibits excellent drying properties and self-shining effect when sprayed on the surface of shoes.
    Type: Grant
    Filed: January 7, 2003
    Date of Patent: July 27, 2004
    Inventors: Soon-Ki Paik, Jeon-Woon Bae
  • Patent number: 6767377
    Abstract: The present invention relates to an aqueous dispersion containing a silicon dioxide powder coated with cerium oxide. In addition, the present invention provides a method of producing an aqueous dispersion containing a silicon dioxide powder coated with cerium oxide and methods of using this aqueous dispersion for chemical-mechanical polishing.
    Type: Grant
    Filed: February 5, 2003
    Date of Patent: July 27, 2004
    Assignee: Degussa AG
    Inventors: Kai Schumacher, Helmut Mangold, Juergen Meyer, Wolfgang Lortz, Christoph Batz-Sohn
  • Patent number: 6764539
    Abstract: A process for producing a hardenable composition with high storage stability containing scaly silica particles which consist essentially of foliar secondary silica particles and have a laminated structure, said process comprising: (1) a step of subjecting a silica sol, a silica hydrogel or hydrous silicic acid to hydrothermal treatment in the presence of an alkali metal salt to form tertiary agglomerated particles of the scaly silica in the form of porous three-dimensional disorderly agglomerates of foliar secondary silica particles, each secondary particle being formed by a parallel face-to-face alignment of a plurality of flaky primary particles which are overlaid one on another, and (2) a step of disintegrating and dispersing the tertiary agglomerated particles of silica in an organic polymer in the form of an aqueous emulsion by a wet method.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: July 20, 2004
    Assignees: Asahi Glass Company, Limited, Dohkai Chemical Industry Co., Ltd.
    Inventors: Kunihiko Terase, Masaki Inoue, Atsunari Fujii, Eiichi Ono, Takayoshi Sasaki
  • Publication number: 20040134376
    Abstract: The present invention provides a polishing composition that inhibits the occurrence of erosion. The polishing composition contains silicon oxide, a polyoxyethylene alkyl ether sulfate, a benzotriazole corrosion inhibitor, an acid, and water. The silicon oxide is preferably colloidal silica, the acid is preferably lactic acid, and the pH of the polishing composition is preferably 1.5 to 4.0.
    Type: Application
    Filed: September 30, 2003
    Publication date: July 15, 2004
    Inventor: Tatsuhiko Hirano
  • Patent number: 6761747
    Abstract: An aqueous dispersion containing abrasive particles comprises abrasive particles having superparamagnetic metal oxide domains in a non-magnetic metal oxide or non-metal oxide matrix. The abrasive particles of the aqueous dispersion can have an average particle size of below 400 nm and a BET surface area of 50 to 600 m2/g. The dispersion can be produced by dispersing the abrasive particles with an energy of at least 200 kJ/m3 using a device in which the abrasive particles are first subjected to high pressure, then decompressed through a nozzle so that the abrasive particles collide with one another or against sections of wall in the device. The aqueous dispersion can be used for chemical mechanical polishing (CMP).
    Type: Grant
    Filed: October 24, 2002
    Date of Patent: July 13, 2004
    Assignee: Degussa AG
    Inventors: Heiko Gottfried, Markus Pridoehl, Berthold Trageser, Guido Zimmermann, Stefan Heberer, Heike Muehlenweg
  • Publication number: 20040111976
    Abstract: A composition is described that comprises an abrasive, and a hydrocarbon containing component that is coupled to the abrasive. Such a composition may be included in a slurry that is used to polish a substrate, when forming a semiconductor device. Also described is a method for modifying a surface of an abrasive that comprises coupling a hydrocarbon containing component to the surface of the abrasive.
    Type: Application
    Filed: December 12, 2002
    Publication date: June 17, 2004
    Inventor: Mark F. Buehler
  • Patent number: 6749673
    Abstract: Furniture polishes, and methods for their use, are disclosed. The polishes are liquids in the form of a dispersion which is a biliquid foam with a thickener, where the foam is structured as an oil-in-water complex. The dispersion has an oil portion having a polysiloxane and/or a hydrocarbon oil such as a mineral oil. There is also surfactant such as one nonionic surfactant and one more polar surfactant. Water is also provided. The polish is preferably essentially free alcohols.
    Type: Grant
    Filed: November 8, 2002
    Date of Patent: June 15, 2004
    Assignee: S. C. Johnson & Son, Inc.
    Inventors: Timothy I. Moodycliffe, Ralph W. Oakeson, Lynn M. Werkowski
  • Patent number: 6750257
    Abstract: The present invention provides the colloidal silica slurry which does not have a bad influence, such as corrosion, to a silicon wafer and wiring material on a silicon wafer and inhibits growth of microbes, and whereof preserving stability is high because stability of particle diameters of a colloidal particle is superior and using for a long period continuously is possible. For providing the above, the colloidal silica slurry wherein hydrogen peroxide from 5 to 100 ppm is added.
    Type: Grant
    Filed: January 15, 2001
    Date of Patent: June 15, 2004
    Assignee: Fuso Chemical, Ltd.
    Inventors: Shigetoyo Matsumura, Yukio Okada, Tatsuo Manaki, Keiji Toyama, Masatoshi Sakai
  • Patent number: 6746522
    Abstract: An ultrahigh molecular weight polymer, such as ultrahigh molecular weight polyisobutylene, is used as an additive to enhance the coating properties of a solvent. The polyisobutylene has a molecular weight of at least 2.5-3.0 million daltons, preferably greater than about 6 daltons, and is provided in a preferred concentration of 0.05 to 0.3%. The solvent can be a medicinal grade mineral oil. Other suitable solvents include hydrocarbon oil and low viscosity, synthetic compositions. In all cases, the coating properties of the solvent are greatly enhanced by the addition of ultrahigh molecular weight polyisobutylene. In another aspect of the invention, ultrahigh molecular weight polyisobutylene is used as an additive to enhance the viscoelasticity of a mineral oil based sunscreen formulation. In still another aspect of the invention, the fibers of a fabric material are coated with an ultrahigh molecular weight polymer to greatly strengthen the fabric.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: June 8, 2004
    Assignee: GTAT, LLC
    Inventors: Jerry C. Trippe, Albert F. Hadermann, James A. Cole
  • Patent number: 6746498
    Abstract: A composition is described that comprises an abrasive, and a hydrocarbon containing component that is coupled to the abrasive. Such a composition may be included in a slurry that is used to polish a substrate, when forming a semiconductor device. Also described is a method for modifying a surface of an abrasive that comprises coupling a hydrocarbon containing component to the surface of the abrasive.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: June 8, 2004
    Assignee: Intel Corporation
    Inventor: Mark F. Buehler
  • Patent number: 6743078
    Abstract: Methods and apparatus for chemical mechanical planarization of an article such as a semiconductor wafer use polishing slurries including a carbon dioxide solvent or a carbon dioxide-philic composition. A carbon dioxide cleaning solvent step and apparatus may also be employed.
    Type: Grant
    Filed: May 28, 2003
    Date of Patent: June 1, 2004
    Assignee: Micell Technologies, Inc.
    Inventors: James B. McClain, Joseph M. DeSimone
  • Patent number: 6743268
    Abstract: A tantalum-based liner for copper metallurgy is selectively removed by chemical-mechanical planarization (CMP) in an acidic slurry of an oxidizer such as hydrogen peroxide, deionized water, a corrosion inhibitor such as BTA, and a surfactant such as Duponol SP, resulting in a high removal rate of the liner without appreciable removal of the exposed copper and with minimal dishing.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: June 1, 2004
    Assignee: International Business Machines Corporation
    Inventors: William J. Cote, Daniel C. Edelstein, Naftali E. Lustig
  • Patent number: 6743267
    Abstract: Gel-free colloidal abrasive polishing compositions and associated methods for polishing (e.g., chemical mechanical polishing) are described. These abrasive polishing compositions are comprised of a surface-modified colloidal abrasive that has been modified with a boron-containing compound(s), such as boron surface-modified colloidal ceria or silica. These compositions are useful in chemical mechanical planarization (CMP) applications as well as in substrate polishing applications. These abrasive compositions are most often negatively-charged colloids, which remain as stable negatively-charged colloids even in acidic media.
    Type: Grant
    Filed: September 17, 2002
    Date of Patent: June 1, 2004
    Assignee: DuPont Air Products Nanomaterials LLC
    Inventors: Peter Jernakoff, Junaid Ahmed Siddiqui