Abstract: The invention is a method of forming extrudate having substantially uniform thickness. A shim is formed which has a thickness variation of less than or equal to about 0.5 mil (13 microns) total indicated runout. This shim is disposed between a first die portion having a first surface and a second die portion having a second surface. A slot is formed between the first surface and the second surface. The slot has a height dimension substantially the same as the shim thickness. Flowable material is extruded through the slot.

Abstract: A resin-encapsulation method of the present invention for electronic parts by a stencil printing, in which a resin filling opening in a stencil is filled with a resin while a squeegee is being moved over the stencil, is characterized in that elevation control of the squeegee is made in a finish printing process at a position close to an end portion of the resin filling opening on a squeegee movement terminal side so as to scrape the excess of the filing resin out of the resin filling opening.

Abstract: To keep a printing paste, which is most influential to a printing performance, always in a uniform state, carry out printing at a high accuracy and in a stable manner, and use an expensive paste with no waste, there is provided a printing paste automatic supplying apparatus which supplies a predetermined amount of printing paste (5) by charging the printing paste (5) in a printing paste supply bag (15) and pressurizing the printing paste (5), provided with a mechanism for opening and closing a printing paste supply port (7) by bringing a printing paste supply plate (6) having the printing paste supply port (7) into contact with the back surface side of a squeegee (4) and vertically moving them, and further provided with a scraper (9) which scrapes up the printing paste on a screen printing plate (3).

Abstract: An apparatus including: a tank with a closed base end and an open top end, and adapted to contain a coating formulation; and a receiver member with at least a cone shape, where the base of the cone is attached to the interior and to the base end of the tank and adapted to receive an article for coating.

Abstract: A vacuum print system comprising: an outer shell to define an airtight inner space and having a closure door at a ceiling thereof; a printer provided in the airtight inner space; a worktable to supply a work to the printer provided in the airtight inner space operable to move; and an air exhaust system connected to the airtight inner space is disclosed. The worktable is operable to move between a sealing position and a work supplying position. The worktable at the sealing position divides the airtight inner space into two airtight compartments, a first compartment having the closure door, and a second compartment having the printer provided therein and the air exhaust system connected thereto. The worktable at the work supplying position supplies the work to the printer. Further, the closure door is operable to open to take the work in and out when the worktable is at the sealing position.

Abstract: An encapsulant applicator comprising a flexor formed of a resilient material and a substantially rigid blade is described. The blade is attached to the flexor in a way that during a smoothing process, a force applied through the flexor is distributed across the second edge of the blade. Another aspect of the invention pertains to a system for forming a substantially uniform layer of material on a surface of a semiconductor wafer. The system of the present invention includes a stencil, an applicator and a conveyor device. The stencil is placed over the surface of the wafer so that an opening in the stencil exposes a portion of the surface of the wafer. The conveyor device is connected to the flexor so that during the smoothing process, the conveyor device moves the applicator across the opening of the stencil. Yet another aspect of the invention pertains to a method for applying a substantially uniform layer of flowable material to a surface of a semiconductor wafer using the applicator as described.

Abstract: An apparatus and method is disclosed for applying a coating of material to a predefined area on a surface of a part. A movable stencil is provided having a wall or surface with a predefined aperture corresponding to a pattern of the defined area to be coated. A wiper, such as a doctor blade or squeegee, is provided for filling the aperture with the coating of material to be applied to the part. A pad, preferably of silicon rubber, is provided for receiving the coating of material as the coating material passes through the aperture of the stencil and for applying the coating of material to the part in response to relative movement between the part and the pad.

Abstract: A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.

Abstract: A device for dosing and distribution of hotmelt on a substrate is provided. The device includes substrate throughput, hotmelt supply, at least one hotmelt application position with a stencil, hotmelt distribution and a squeegee device. The hotmelt distribution includes a hotmelt dispensing nozzle. A dosing unit and drive for moving the dosing unit to and fro along said squeegee device are also provided. The hotmelt dispensing nozzle is fitted on the movable dosing unit.

Abstract: To keep a printing paste, which is most influential to a printing performance, always in a uniform state, carry out printing at a high accuracy and in a stable manner, and use an expensive paste with no waste, there is provided a printing paste automatic supplying apparatus which supplies a predetermined amount of printing paste (5) by charging the printing paste (5) in a printing paste supply bag (15) and pressurizing the printing paste (5), provided with a mechanism for opening and closing a printing paste supply port (7) by bringing a printing paste supply plate (6) having the printing paste supply port (7) into contact with the back surface side of a squeegee (4) and vertically moving them, and further provided with a scraper (9) which scrapes up the printing paste on a screen printing plate (3).

Abstract: A squeegee head having a volume-variable container and a printing space is used. The volume-variable container is variable in capacity with pressures applied thereto. The volume-variable container includes a projecting portion having a plurality of projections, a push-plate with a plurality of through-holes formed therein, and a side wall. A paste is stored in the volume-variable container. The projecting portion is pressurized to move and the paste is pushed out into the printing space from the through-holes, and then, the projections are fitted into the through-holes. In this way, the paste being stable in viscosity is completely pushed out into the printing space without wasting at all.

Abstract: A screen printer for printing paste on a board by sliding a squeegee head on a mask plate. A pushing plate pressurizes solder paste in the squeegee head, and pressurized paste is led to a paste container from both outer parts in a printing width direction inward towards a printing center through a solder dispensing hole provided on both ends of the paste container. This configuration allows to print in accordance with the time-line supply sequence, regardless of the printing width of the board to be printed. This screen printer thus prevents the degradation and the consequent need for disposal of solder paste due to its retention in the squeegee head for long periods.

Abstract: A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.

Abstract: A printer includes a dispensing head for dispensing viscous material, such as solder paste. The dispensing head defines a chamber and includes at least one source port and a dispensing slot, wherein the viscous material flows from a supply mounted to the source port, into the chamber and out the dispensing slot. Within the chamber, a stirring mechanism is mounted. The stirring mechanism is coupled to a drive mechanism that displaces the stirring mechanism through the chamber, thereby stirring the viscous material. The stirring mechanism is particularly effective in preventing or reducing compaction of solder paste within the chamber.

Abstract: A method and apparatus are disclosed for applying solder mask to an area respective of a plurality of receiving pads on a Printed Circuit Board. The solder mask can be at least partially removed during the component removal process exposing the conductor, via and annular ring. The exposed conductor, via and annular ring can cause defects and unreliable solder joints should the solder flow along the conductor and into the via. A small stencil can be used to apply solder mask in a desirable pattern to a selective area of a PCB. Alternatively, an elastomeric transferring apparatus can be used. Various methods can be included to assist in aligning the applicator to the desired area such as an overlaid, dual imaging system.

Abstract: A modular coating apparatus is disclosed which is adapted to couple to a host system, such as a cluster or in-line type coating system, as well as to operate in stand-alone fashion. The coating apparatus uses extrusion to initially deposit a film having a desired thickness. The substrate upon which the film is deposited may be spun to further distribute the film. Various embodiments of the coating apparatus are disclosed including embodiments utilizing a shim to mask the substrate and embodiments utilizing a rotatable chuck to facilitate cleaning of the substrate and/or the chuck. Preferably the various embodiments are sub-modules which may be interchanged in the main module as desired.

Abstract: A screen printing apparatus and method for forming printed wiring on a substrate, such as a wafer. The apparatus includes a reservoir disposed beneath a screen having a plurality of openings forming a pattern thereon. Disposed within the reservoir is a printing paste. The screen is pressed into the printing paste such that convex structures are formed on the upper surface of the screen, and are printable onto the substrate. A wiper is also movably disposed within the reservoir, cooperating with the screen to establish contact between the screen and the substrate.

Abstract: A method of applying a treating liquid to a porous body (11), in particular a pre-baked carbon component of an aluminium production cell, such as an anode block, a cathode block or a sidewall. In this method first the body (11) to be treated is inserted, with its part to be treated facing up, in the treating chamber (12). At least one sealing member (13) is then applied to the body so as to isolate a space (14) in an upper part of the treating chamber (12) around the part of the body to be treated from a lower part (15) of the treating chamber around a bottom part of the body which is not to be treated. Next, treating liquid (10) is supplied to the upper part (14) of the treating chamber to cover the part of the body to be treated with the treating liquid and applying a vacuum to intake an amount of the treating liquid into pores in the part of the body to be treated. Then the body (11) is freed from the sealing member(s) (13), and removed from the treating chamber (12).

Abstract: A stencil (8) with a tension part combined with an operational device allowing deposition of solder paste to replace constituents on an electronic board. The stencil consists of a flat sheet (1), of rectangular shape, made of synthetic flexible material or metal and outfitted with transfer openings (2) for transferring and distributing a product. Two of the parallel sides of the sheet are connected to rigid and mobile vertical tabs (3) in an affixed position on a tension unit of the sheet. The other two parallel sides of the sheet, orthogonal to the former ones, are extended with flexible walls (6), orthogonal to the sheet. Bead folds (7) separate the perforated sheet and each of the flaps and delimit the sheet. The flaps freely rotate around the folds. The invention also has an operational device consisting of arm (20) with several jointed strands outfitted with a sole means of locking (22) its joints. The stencil may be configured and moved in accordance with 6 degrees of freedom.

Abstract: A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compress on head cap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil. In another embodiment of the invention, the compression head includes a viscous material reception chamber which has a certain shape which is effective to cause said received viscous material to be selectively dispensed while having a substantially uniform velocity profile and which further provides for the creation of a substantially uniform pressure profile.

Abstract: An improved shield for preventing the contamination of a wafer back from resist is combined with process steps that further prevent this contamination. The shield is located where vortex like air currents could otherwise deposit the resist vapor on the wafer back. The shield has the general shape of a cylinder that is open at the top and closed at the bottom. The bottom provides an attachment to a conventional part of the wafer coater and also forms part of the shield. The sides are arranged to extend close to the wafer back at a radius just less than the radius of the wafer. In the improved process, the spindle of the wafer chuck is not rotated at more than 1200 revolutions per minute in any of the wafer spinning operations, and the conventional step of washing the wafer back with a solvent is performed only at the end of the other operations.

Abstract: A thin film product having a nanostructured surface, a laminate product including the thin film and a temporary substrate opposite the nanostructured surface, a laminate product including the thin film and a final substrate attached to the nanostructured surface and a method of producing the thin film products. The thin film is particularly useful in the electronics industry for the production of integrated circuits, printed circuit boards and EMF shielding. The nanostructured surface includes surface features that are mostly smaller than one micron, while the dense portion of the thin film is between 10-1000 nm. The thin film is produced by coating a temporary substrate (such as aluminum foil) with a coating material (such as copper) using any process. One such method is concentrated heat deposition or a combustion, chemical vapor deposition process.

Abstract: An apparatus applies a coating medium onto a coating area of a moving substrate. In the case of direct application, the coating medium is applied onto the outer surface of a material web such as paper or carton, or, in the case of indirect application, the coating medium is applied onto the outer surface of a transfer element such as a transfer roll, which transfers the coating medium onto the material web. The coating mechanism is provided with at least one opening for the discharge of coating medium onto the substrate. A panel element is positioned on at least one side of the two margins of the coating area a certain distance after the opening of the discharge element relative to the direction of discharge of the coating medium in order to prevent any deposits of the coating medium outside of the coating area, which thus defines the respective margins of the coating area.

Abstract: A method and apparatus for achieving a consistent depth of immersion of a semiconductor element into an exposed surface of an adhesive material pool when applying the adhesive material, conductive or non-conductive, to the semiconductor element or portion thereof. The consistent depth of immersion is defined by a stop which is attached to a reservoir used to form the adhesive material pool, attached to a stencil which is used in conjunction with the reservoir to form a level upper surface on the adhesive material, or operates independently from the reservoir and/or stencil.

Abstract: A method and apparatus for achieving a level exposed surface of a viscous material pool for applying viscous material to at least one semiconductor component by contacting at least a portion of the semiconductor component with viscous material within a reservoir. A level viscous material exposed surface is achieved by using at least one mechanism in association with the reservoir. The mechanism is configured to level the exposed surface of viscous material and maintain the exposed surface at a substantially constant level. The reservoir may be shaped such that the exposed surface of viscous material is supplied to a precise location.

Abstract: A method and apparatus for achieving a level exposed surface of an adhesive material pool for applying the adhesive material to lead fingers of a lead frame by contacting the lead fingers with the adhesive material pool within an adhesive reservoir. The level adhesive material exposed surface is achieved by attaching a coating stencil having small apertures, such as a screen or a plate with slots, to the adhesive reservoir, such that the only upward outlet for the adhesive material is through the apertures in the coating stencil. The surface tension between walls of the small apertures and the adhesive material flattens out the exposed surface of the adhesive material. This allows a larger area to be printed with a more uniform thickness layer.

Abstract: A method and apparatus for achieving a consistent depth of immersion of a semiconductor element into an exposed surface of an adhesive material pool when applying the adhesive material, conductive or non-conductive, to the semiconductor element or portion thereof. The consistent depth of immersion is defined by a stop which is attached to a reservoir used to form the adhesive material pool, attached to a stencil which is used in conjunction with the reservoir to form a level upper surface on the adhesive material, or operates independently from the reservoir and/or stencil.

Abstract: Glass containers (3) are taken to a high temperature in an annealing furnace (7) and removed from the annealing furnace belt (5) by grips (16) of a gripping device (12). The gripping device (12) is then moved by a handling device (13) first vertically upwards, then horizontally above a fluidized bed (18) and then downwards into the fluidized bed in order to coat the glass containers (3) with a powder; it is then taken upwards out of the fluidized bed (18) and finally moved horizontally over a conveyor belt (22). There, the glass containers (3) are released from the gripping device (12) and set down on the conveyor belt (22) which takes the powder-coated glass containers (3) through a second curing region (27) in which the powder is cured to form a substantially duroplastic layer.

Abstract: A dual track stencil system includes a plurality of pairs of adjustable conveyor rails, including a first pair of conveyor rails and a second pair of conveyor rails. The first and second pairs of conveyor rails of the dual track system are advantageously adjustable to accommodate variable width circuit boards or operation of the system in single track mode. The first and second pairs of conveyor rails can be independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area, at which the circuit boards are stenciled. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. A solder dispensing unit including a squeegee arm is suspended above the stencil, parallel to and centered between the two tracks.

Abstract: A screen printing apparatus and method for forming printed wiring on a substrate, such as a wafer. The apparatus includes a reservoir disposed beneath a screen having a plurality of openings forming a pattern thereon. Disposed within the reservoir is a printing paste. The screen is pressed into the printing paste such that convex structures are formed on the upper surface of the screen, and are printable onto the substrate. A wiper is also movably disposed within the reservoir, cooperating with the screen to establish contact between the screen and the substrate.

Abstract: A method and apparatus for carrying out the deposition of a paste like and/or viscous material, such as solder paste, on a substrate through the apertures or openings of a stencil are provided for use, for example, in screen printing in the mounting of components on a printed circuit board. A hollow receptacle for the material is provided with a lower aperture which is orientated towards the stencil. The lower aperture of the receptacle is delimited defined such that its length is adjusted to the dimensions of the substrate and that its width is a function of the speed of execution of the screen printing. This delimitation is implemented by sealing members preferably comprising two wipers on respective sides of the aperture, transverse with respect to the direction of displacement of the receptacle, orientated one towards the other and inclined with respect to the horizontal between the wipers at an angle of between 120° and 180°.

Abstract: A cassette for holding and dispensing a viscous material for use in an apparatus for depositing the viscous material onto a substrate through openings formed in a stencil positioned over substrate. The cassette includes a body having a base and interior defined by first and second side walls and first and second end walls substantially orthoganol to the base. The base has a plurality of apertures formed therein, and a cover plate adapted to slide within the interior of the body. The cover plate having a plurality of protruding members wherein each of the protruding members corresponds to and is aligned with a corresponding one of the apertures of the base.

Abstract: A wave solder pallet having a first side that is adapted to receive a printed circuit board and a plurality of through holes or apertures that will allow solder to be transmitted through to selected regions on the printed circuit board. The surface of the base plate that is positioned adjacent the solder wave has channels formed therein, the channels being tapered inwardly so that the overall volume of the channel is greatest at the periphery of the pallet. The increased volume of the channel reduces the pressure effect of the solder wave as it contacts the pallet at the periphery thereby reducing the amount of solder that is splashed over the pallet. The tapering of the channel uniformly increases the pressure so that the pressure effect of the solder wave is increased when it travels through the apertures.

Abstract: A molded selective solder pallet and a method for fabricating a molded selective solder pallet for use in a wave soldering process to selectively affix solder to an area of a circuit board having an electronic component thereon. The selective solder pallet according to the present invention includes a mold base configured having an aperture formed through its cross-section. A high temperature casting material is molded within the mold base and configured to have at least one recess and at least one solder flow opening. A high temperature silicone casting material may be employed as the high temperature casting material.

Abstract: A nozzle apparatus and method of use for extruding a conductive paste through a stencil or screen onto a substrate are disclosed. The nozzle includes a body and a conformable insert for contacting the screen. The method comprises the steps of obtaining a substrate and a patterned screen, contacting the screen with a nozzle comprising a nozzle body and a conformable nozzle insert, and extruding a paste through the nozzle and screen onto the substrate. The apparatus and method are particularly useful for producing patterned lines from extruded pastes in the manufacture of microelectronic components.

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area at which the circuit boards are stenciled and includes a stencil having two patterns formed thereon. In one embodiment, the stencil system includes a solder dispensing system for dispensing solder paste onto the stencil.

Abstract: A paste dispensing system for dispensing paste to a substrate such as a ceramic greensheet or other electronic component substrate comprises a reservoir for holding the paste and a nozzle housing in fluid communication with the reservoir and having an opening therein through which the paste is dispensed. The nozzle housing has disposed therein a rotatable slotted shutter which is in fluid communication with the reservoir and which has an auger disposed in the shutter. The auger when actuated, draws paste from the reservoir into the shutter, advances the liquid material through the shutter and circulates the paste back to the reservoir. When it is desired to dispense the paste, the shutter is rotated so that the slot in the shutter communicates with a slot in a nozzle plate connected to the nozzle housing through which slot the paste is dispensed. The paste is continually circulated through the paste dispensing system by the auger whether or not paste is being dispensed.

Abstract: The present invention is embodied in a method for screen printing a target object, such as a substrate, which allows for the removal of a misaligned screen printed pattern without causing damage to the target object. A removable barrier layer is applied to the substrate and the pattern screen printed on the removable barrier layer. If the pattern is not properly aligned, the removable barrier layer with the screen printed pattern attached is removed from the substrate and the substrate can be reprinted. If the pattern is properly aligned, only the removable barrier layer is removed and the pattern drops onto and adheres to the substrate.

Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.

Abstract: An installation for coating the surface of a web of material with a paste. A printing screen has a doctor blade lying within for applying the print paste through holes in the printing screen onto the web. A counter roll cooperates with an electromagnet to producing a controllable level of contact pressure of the doctor blade against the printing screen. The roll body of the counter roll is provided with a coating that has piezoelectric elements and is divided into sections specific to the width, each section being individually controllable. This permits dynamic control of the application of paste over the width of the web.

Abstract: A simplified printer comprises: a base plate having a pedestal on which an object to be printed is placed; and a pressure plate, one end of which is pivotably connected with one end portion of the base plate; and adhesive members respectively arranged on the pedestal and a portion of the pressure plate opposed to the pedestal.

Abstract: An apparatus for dispensing solder paste for application through a stencil or a screen to a circuit board includes a housing having an elongated chamber along a longitudinal axis and a rotatable member within the chamber. The housing has an inlet connected to a supply of solder paste and an elongated opening at the bottom of the chamber for delivering solder paste from the chamber. The rotatable member creates a pressure gradient within the chamber and causes delivery of the solder paste through the opening at controlled pressure. The rotatable member is spaced from an inner surface of the housing defining the chamber. The axis of rotation of the rotatable member is movable in two directions and the speed of rotation is adjustable. The forces on the rotating member are monitored in order to monitor solder conditions.

Abstract: An apparatus is provided for applying solder paste to the contact elements of ball grid array components, which is economical to manufacture and simple to handle, and which nonetheless offers the possibility of being able to apply a desired amount of solder precisely to the contact elements of a ball grid array component.

Abstract: A device for preserving solder paste in the manufacturing of printed circuit board assemblies. In one embodiment, the preserving device has a frame adapted to be positioned on a stencil plate of a solder paste stenciling machine and a cover coupled to the frame. The frame has a wall that is configured to substantially surround at least a portion of the solder paste on the stencil plate between printing cycles. In a preferred embodiment, the wall is configured to surround a working region on the stencil plate defined by the area on the stencil plate that the solder paste contacts during a printing cycle. The cover is coupled to the frame to form a protective compartment that substantially houses the solder paste between printing cycles. As a result, the preserving device restricts the airflow across the solder paste to protect the solder paste from environmental elements within the stenciling machine.

Abstract: A dual track stencil system includes a first set of rails and a second set of rails, each of the rails being independently controlled for allowing for independent movement of circuit boards through the stencil system for processing. The stencil system includes a working area, at which the circuit boards are stenciled. A stencil, having two patterns, each aligned with a respective working area of each track is suspended above the dual track system. A solder dispensing unit including a squeegee arm is suspended above the stencil, parallel to and centered between the two tracks. During operation, a circuit board enters the working area, is raised to engage with the stencil, and the squeegee arm traverses that portion of the stencil pattern currently engaging the board, thereby dispensing solder through the pattern and stenciling the board. The stencil system operates to process two boards on one track before advancing to the second track for processing another pair of boards.

Abstract: An apparatus and a method for its use for plating pin grid array packaging modules, with a fixture capable of simultaneously holding a plurality of said pin grid array modules such that three-dimensional bottom surface metallurgy (BSM) is sealingly protected during plating of top surface metallurgy (TSM).

Abstract: A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression headcap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil. The compression headcap includes two generally parallel wiper blades that are biased into sliding communication with the stencil. Longitudinal diffuser plates guide and equalize the flow of the viscous material into the volume between two generally parallel wiper blades.

Abstract: Applying adhesive in a desired pattern on a substrate by determining one or more inspection sites for monitoring adhesive deposition, applying adhesive to a substrate with a stencil or screen printer, viewing the inspection sites with a camera that generates image signals, and processing the image signals to determine if adhesive has been properly applied at the inspection sites.

Abstract: There is disclosed an assembly for selectively coating a hollow, cylindrical first substrate defining a first open end region having an outer surface and an inner surface and a second open end region, the assembly including a first plug member fabricated from a nonwetting material, wherein the plug member has a bottom surface defining a pallet coupling feature and a top surface defining a cavity region encompassed by a circumferentially extending rigid side wall having an outer surface and an inner surface, wherein the first end region of the substrate is disposed in the cavity region where the inner surface of the side wall grips the outer surface of the first end region of the substrate to couple the first plug member to the first end region, whereby the plug member minimizes coating of the outer surface and the inner surface of the first end region of the substrate by a coating solution.

Abstract: A universal fixture for holding printed circuit boards during stencil printing and other manufacturing processes related to printed circuit boards. In one embodiment, a universal fixture for holding a printed circuit board has a platform with a work surface, a first support member attached to the platform to hold a portion of a printed circuit board, and a second moveable support member attached to the first support member to support another portion of the printed circuit board. The platform is preferably adapted to be attached to a workstation of a processing machine, such as a stenciling machine for printing solder or adhesive onto the printed circuit board. The first support member preferably has an elongated sidewall, a first endwall extending transversely from the sidewall, and a second endwall spaced apart from the first endwall along the sidewall and extending transversely from the sidewall.