Abstract: The invention relates to a liner-free label activator, adapted to be joined to another piece of equipment, such as a thermal printer. The activator has a housing including a reservoir for containing a solvent and a pump connected to the reservoir. The activator also has an applicator connected to the pump for applying solvent to a liner-free label passing thereby, an activator control system to connect to a control system of the printer, and structure for connecting the housing to the printer.

Abstract: There are provided a substrate processing apparatus, a method of manufacturing a semiconductor device, and a method of manufacturing a substrate, for growing a SiC epitaxial film at a high-temperature condition. The substrate processing apparatus comprises: a reaction chamber; a first gas supply system configured to supply at least a gas containing silicon atoms and a gas containing chlorine atoms, or a gas containing silicon and chlorine atoms; a second gas supply system configured to supply at least a reducing gas; a third gas supply system configured to supply at least a gas containing carbon atoms; a first gas supply nozzle connected to the first gas supply system or the first and third gas supply systems; a second gas supply nozzle connected to the second gas supply system or the second and third gas supply systems; and a controller configured to control the first to third gas supply systems.

Abstract: A load-lock apparatus includes a vessel arranged to change a pressure between a pressure corresponding to the vacuum chamber and the atmospheric pressure, a pressure adjusting mechanism which adjusts a pressure in the vessel to a pressure corresponding to the vacuum chamber and the atmospheric pressure, a cooling member having a cooling mechanism and arranged in the vessel to cool a substrate by having the substrate placed on or in proximity to the cooling member, a substrate deformation detection unit for detecting deformation of the substrate in the vessel, and a controller which reduces a cooling rate of the substrate when the substrate deformation is detected during a substrate cooling period until the vessel is adjusted to have the atmospheric pressure after the vessel is adjusted to have a pressure corresponding to the vacuum chamber and a high temperature substrate is loaded into the vessel from the vacuum chamber.

Abstract: Provided is a substrate processing method, which can fill an insulating film in a groove having a small width with a high aspect ratio and improve the productivity. The substrate processing method comprises loading a substrate into a processing chamber, supplying silicon compound gas including carbon and hydrogen into the processing chamber, irradiating ultraviolet light on the silicon compound gas supplied into the processing chamber to process the substrate, unloading the processed substrate from the processing chamber, and processing the inside of the processing chamber with excited oxygen-containing gas. Accordingly, an adhered matter generated when irradiating the ultraviolet light on the silicon compound gas to process the substrate and adhered to a structure such as an inner wall of the processing chamber can be processed with the excited oxygen-containing gas to modify it.

Abstract: An efficient electrostatic spray installation that can spray a wide range of conductive materials effectively while creating very small droplets with conductivities in from about 7000 pico Siemens and greater. A compact system in which one, two or more parallel sprays can be obtained at close proximity in the order of 30 to 40 mm of each other in a compact package.

Abstract: A device for painting a curved outer surface of an aircraft includes a paint applicator having a plurality of spray painting heads each assigned to one of a plurality of different base color supply units containing one of polyurethane aircraft paint and ink. The device further includes a spatially adjustable positioning device configured to move the paint applicator relative to the curved outer surface and at least one sensor device configured to determine a three-dimensional geometry of the curved outer surface. The device also includes a control unit configured to coordinate a movement of the positioning device with a paint output of the paint applicator, wherein the control unit is configured to alternately activate each of the plurality of spray painting heads so as to produce a picture motif so as to derive a two-dimensional driving geometry based on the three-dimensional geometry.

Abstract: A single, flexible, robust and low rate capable manufacturing platform that may be associated with caseless munitions firing circuits, nano and microelectromechanical (“NEMS” and “MEMS”) devices, and/or fractal antennas is described. The platform may be designed for extensive research and development in printed electronics, 3D thermo-plastics and low melt metal casting, light machining, and other processing operations necessary for the integrated fabrication of various components, such as caseless munitions components. The platform may be used in a remote location.

Abstract: A substrate transfer system to reduce total processing time by transferring a substrate at a first delivery stage to a process block where processing can be carried out earliest. The substrate processing apparatus includes a first transfer device delivering a wafer with respect to a substrate carrier, and a second transfer device delivering a wafer between a plurality of process blocks and the first transfer device via a first delivery stage, to transfer the wafer with respect to the process blocks. The process block where there is no wafer or where processing of the last wafer within the relevant process block will be completed earliest is determined based on processing information of the wafers from the process blocks, and the wafer of the first delivery stage is transferred by the second transfer device to the relevant process block. This ensures smooth transfer of the wafer to the process block.

Abstract: Printed sheets are delivered from a printer to a coating machine which feeds the sheets successively to a coating nip formed between a coating cylinder and an impression cylinder. A transport mechanism advances the sheets through the coating nip. The arrival of each sheet is sensed, and a control unit determines a speed necessary for each sheet to be initially fed in order to reach the coating nip simultaneously with an image area of the coating cylinder and with grippers of the transport mechanism, as well as at a speed equal to a surface speed of the coating cylinder. Independently driven rollers advance each sheet at that sheet's determined speed (e.g., acceleration or deceleration).

Abstract: A microdeposition system and method includes a head with a plurality of nozzles. A controller generates nozzle firing commands that selectively fire the nozzles to create a desired feature pattern. Configuration memory stores voltage waveform parameters that define a voltage waveform for each of the nozzles. A digital to analog converter (DAC) sequencer communicates with the configuration memory and the controller and outputs a first voltage waveform for a first nozzle when a nozzle firing command for the first nozzle is received from the controller. A resistive ladder DAC receives the voltage waveforms from the DAC sequencer. An operational amplifier (opamp) communicates with the resistive ladder DAC and amplifies the voltage waveforms. The nozzles fire droplets when the voltage waveforms received from the opamp exceed a firing threshold of the nozzle.

Abstract: A processing system for performing atomic layer deposition (ALD) including a process chamber, a substrate holder provided within the process chamber, and a gas injection system configured to supply a first process gas and a second process gas to the process chamber. The gas injection system is configured to introduce the first process gas and the second process gas to the processing chamber at a first location and a second location, wherein at least one of the first process gas and the second process gas is alternatingly and sequentially introduced between the first location and the second location.

Abstract: There are provided a substrate coating method and a substrate coating apparatus to achieve the uniformity of a coating-liquid film and the improvement of the yield by inhibiting the bubbles generated during the application of a coating liquid. Also, there are provided a substrate coating method and a substrate coating apparatus to achieve the effective availability of the coating liquid and the uniformity of the coating-liquid film. According to one example, a substrate coating method includes forming a liquid pool of deionized water by rotating the substrate at low speed of a first rotation speed and supplying deionized water to the center of the substrate, mixing the water-soluble coating liquid with the deionized water by supplying the coating liquid to the center of the substrate in a state where the substrate is rotated at the first rotation speed, and forming the coating-liquid film by rotating the substrate at a second rotation speed higher than the first rotation speed.

Abstract: A device and method for curing photoactivatable paint coatings. An exemplary device may include a light chamber housing supported by a frame and undercarriage, the wall portions of the light chamber having a peripheral region terminating at a light emission region. A UV light source may be located within the light chamber. A motorized carrier may be provided and configured to controllably index and/or oscillate the UV light source along a travel path within the housing. The light chamber may be located adjacent a target paint cure location on a work piece, with the UV light emission region facing the paint cure location. Once properly located, the UV light source may be indexed and/or oscillated along the travel path to deliver UV light to the target paint cure location so as to cure UV curable paint thereon.

Abstract: Film forming equipment (20) is provided with a treatment container (22), a gas supplying system for supplying the container with a treatment gas including a film forming gas, and an exhaust system for exhausting the atmosphere in the container. In the treatment container, a placing table (46) having a placing plane for placing a flat board shaped body to be treated (W) is arranged. The body to be treated on the placing table is heated by a heater (80). A clamping apparatus (56) is provided to abut/separate to and from a surface peripheral part of the body to be treated, so as to press/release the body to be treated on and from the placing table. On the placing plane of the placing table, a suction structure (92) having a recessed part (94) is formed for temporarily sucking the body to be treated by pressure difference, by forming a substantially hermetic space between the placing plane and the rear plane of the body to be treated.

Abstract: An apparatus and method for manufacturing a pharmaceutical dose which dispenses a variable selectable quantity of at least one pharmaceutical onto a pharmaceutical receiving medium. The quantity of the dispensed pharmaceutical(s) are controllably dispensed to customize each pharmaceutical dose to suit the needs of a particular user. The apparatus is coupled by an external telecommunication network to a remote signal source for receiving pharmaceutical quantity and type data for custom manufacturing a pharmaceutical dose. In one aspect, a replaceable cartridge contains a reservoir carrying at least one pharmaceutical component and a fluid drop generator which is mountable in the fluid dispenser. The reservoir may contain a number of separate compartments, each carrying different pharmaceutical component.

Abstract: A system and method for the automated or “robotic” application of hardfacing to a surface of a drill bit.

Abstract: The present invention provides a processing apparatus including a processing unit configured to process a processing object in a processing chamber by bringing a mask into contact with the processing object at a predetermined position, a base configured to hold the processing object on a holding surface, a structure configured to connect the base in a portion opposite to the holding surface of the base, and a driving unit configured to change a processing position of the processing object by pivoting the structure about a rotation shaft parallel to the holding surface of the base, the processing unit including an operation unit configured to perform, at an identical position, a fixing process and a release process, and a deposition processing unit configured to perform a deposition process on the processing object while the mask is in contact with the processing object.

Abstract: A spray coating apparatus comprises a spray gun (12) operable to deposit a sprayed coating via a spray nozzle (18) onto a surface, a mapping means (22) associated with the spray gun (12) operable to ascertain and store topographical characteristics of the surface, a position sensor (28) operable to ascertain the position of the spray gun (12) relative to the surface, a coating thickness monitor (26) operable to ascertain the thickness of a coating applied to the surface, and a nozzle control means (24) operable to control the deposition of the sprayed coating, wherein the nozzle control means (24), in use, control the deposition of the sprayed coating in response to information provided by the position sensor (28), the coating thickness monitor (26) and the mapping means (22).

Abstract: An apparatus for manufacturing a color filter includes a stage on which a base having a target discharge area is adapted to be placed, a plurality of discharge heads having a first discharge head filled with a functional material, and a second discharge head filled with a liquid, and a control unit operatively coupled to the stage and the plurality of discharge heads. The control unit controls the stage and the plurality of discharge heads such that the stage and the plurality of discharge heads move relative to each other and a droplet of the functional material from the first discharge head and a droplet of the liquid from the second discharge head are discharged in the same target discharge area. The surface tension or viscosity is lower than that of the functional material.

Abstract: Disclosed are a method and an apparatus for preparing a polycrystalline silicon rod using a mixed core means, comprising: installing a first core means made of a resistive material together with a second core means made of silicon material in an inner space of a deposition reactor; electrically heating the first core means and pre-heating the second core by the first core means which is electrically heated; electrically heating the preheated second core means; and supplying a reaction gas into the inner space in a state where the first core means and the second core means are electrically heated for silicon deposition.

Abstract: A semiconductor device, which suppresses formation of an organic impurity layer and has excellent adhesiveness to a copper film and a metal to be a base, is manufactured. A substrate (wafer W) coated with a barrier metal layer (base film) 13 formed of a metal having a high oxidation tendency, such as titanium, is placed in a processing chamber. At the time of starting to supply water vapor or after that, a material gas containing an organic compound of copper (for instance, Cu(hfac)TMVS) is supplied, and a copper film is formed on the surface of the barrier metal layer 13 whereupon the oxide layer 13a is formed by the water vapor. Then, heat treatment is performed on the wafer W, and the oxide layer 13a is converted into an alloy layer 13b of a metal and copper which constitute the barrier metal layer 13.

Abstract: The embodiments fill the need enabling deposition of a thin and conformal barrier layer, and a copper layer in the copper interconnect with good electro-migration performance and with reduced risk of stress-induce voiding of copper interconnect. Electromigration and stress-induced voiding are affected by the adhesion between the barrier layer and the copper layer. A functionalization layer is deposited over the barrier layer to enable the copper layer being deposit in the copper interconnect. The functionalization layer forms strong bonds with barrier layer and with copper to improve adhesion property between the two layers. An exemplary method of preparing a substrate surface of a substrate to deposit a functionalization layer over a metallic barrier layer of a copper interconnect to assist deposition of a copper layer in the copper interconnect in order to improve electromigration performance of the copper interconnect is provided.

Abstract: The present invention provides a manufacturing apparatus of a semiconductor device, having a pattern-forming apparatus using a droplet-discharging method that is suitable for a large substrate in mass production. A plurality of pattern-forming apparatuses using a droplet-discharging method and a plurality of heat-treatment chambers are provided, and each of which is connected to one transfer chamber, which is a multi-chamber system. Discharging and baking are conducted efficiently to improve productivity. A gas is blown in the same direction as the scanning direction (or a scanning direction of a discharging head) on a substrate just after a droplet is landed, by providing a blowing means in the pattern-forming apparatus, and a heater is provided in a gas-flow path for local baking.

Abstract: A thermal processing unit of a thermal processor for anti-reflection films includes: a covering nozzle for covering a substrate from above supported by a thermal processing plate and discharging an adhesion enhancing agent to a periphery of a substrate supported by the thermal processing plate; and a vaporization processor for supplying an adhesion enhancing agent in the vapor phase to the covering nozzle. While a substrate placed over the thermal processing plate is being subjected to thermal process, a control part causes the covering nozzle to discharge an adhesion enhancing agent in the vapor phase onto a periphery of a substrate to realize adhesion enhancement process. Thus, the adhesion between a resist coating film and a substrate surface in the periphery of a substrate is enhanced. Further, parallel implementation of thermal process and adhesion enhancement process exerts no influence on throughput.

Abstract: A printer for digital printing in which ink is deposited in metered amounts on a substrate. The printer includes a wheel rotatable by a shaft of a motor, an idler disposed in a paint reservoir, and a segment of wire disposed around the wheel and the idler. A computer controls movement of the wire by controlling the rotation of the wheel. As the motor rotates the wheel, electroluminescent material contained within the paint reservoir coats the wire and is drawn by the wire in front of an air stream, which pulls the electroluminescent material from the wire and carries it toward the substrate to make an electroluminescent sign.

Abstract: Described is a method for manufacturing a display including a substrate on which a structure, such as, for instance, a matrix structure in relief, is provided, which structure bounds a number of areas, wherein, with the aid of an inkjet printhead, substantially in each area an amount of liquid is deposited, wherein with the aid of at least one sensor a measurement is performed on the substrate to determine the position of a respective area, and on the basis of the thus determined position the printhead is controlled to deliver an amount of liquid at the correct place. Also described is an apparatus for carrying out the method, a substrate for use in the method and a display obtained with the method.

Abstract: A liquid application apparatus includes: an application roller having an application surface for applying a liquid to a medium, at least the application surface of the application roller being constituted by an elastic body; a liquid holding unit including an abutting part which abuts against a circumferential surface of the application roller so as to form a liquid holding space, the abutting part including a measuring roller which has a projection-recess surface capable of holding a specific amount of the liquid; and a drive control device which rotates the application roller and the measuring roller in such a manner that the liquid is transferred from the application surface to the medium while the liquid is supplied to the application surface from the liquid holding unit, and which halts rotation of the measuring roller while rotating the application roller after an end of application of the liquid to the medium.

Abstract: A sheet humidifying device includes a pair of humidifying rollers which form a nip portion by pressure contacting against each other and giving water to a sheet passing through the nip portion, a water-supply roller that pressure contacts the humidifying roller and supplies water to the humidifying roller, a water vessel that stores water to be supplied to the water-supply roller, and a pressure-contact releasing section that releases pressure-contact of the pair of humidifying rollers and releases pressure-contact between the humidifying roller and the water-supplying roller.

Abstract: The throughput in the overall gate stack forming process is improved. When using a cluster apparatus to perform a gate stack forming process including a high dielectric film forming step, a plasma nitriding step, an annealing step and a gate electrode forming step, the final ongoing gate electrode forming step is stopped in the middle, and the remainder of the gate electrode forming step is performed on multiple wafers as batch processing. This shortens the standby time for consecutive steps in the cluster apparatus to improve the throughput in the overall gate stack forming process.

Abstract: A substrate treating apparatus for treating substrates includes a plurality of substrate treatment lines arranged vertically for carrying out plural types of treatment on the substrates while transporting the substrates substantially horizontally, and a controller for changing processes of treatment carried out on the substrates for each of the substrate treatment lines. By changing the processes of treatment carried out for the substrates for each substrate treatment line, the processes of treatment carried out for the substrates can be changed for each substrate conveniently. Thus, a plurality of different processes of treatment corresponding to the number of substrate treatment lines can be carried out in parallel for the respective substrates.

Abstract: An object of the present invention is to maintain a coating and developing system by remotely operating it more safely. The present invention is a maintenance system of a substrate processing apparatus, including a remote operation unit for operating the substrate processing apparatus from a remote place by transmitting a remote operation information to a side of the substrate processing apparatus through a communication network and providing the remote operation information to the substrate processing apparatus, and a communication control unit for receiving the remote operation information transmitted to the side of the substrate processing apparatus and providing the remote operation information to the substrate processing apparatus. The communication control unit provides the remote operation information to the substrate processing apparatus only when there is an allow setting for the remote operation by a worker in the side of the substrate processing apparatus.

Abstract: The present invention is a film forming method for an SiOCH film, comprising a unit-film-forming step including: a deposition step of depositing an SiOCH film element by using an organic silicon compound as a raw material and by using a plasma CVD method; and a hydrogen plasma processing step of providing a hydrogen plasma process to the deposited SiOCH film element, wherein the unit-film-forming step is repeated several times so as to form an SiOCH film on a substrate.

Abstract: When a solution sprayed by a spray nozzle portion reaches one surface portion of a substrate, a thin film forming material contained the solution decomposes thermally because the substrate is heated to a prescribed temperature, and a thin film is formed on the one surface portion of the substrate. An imaging section obtains a prescribed information on the thickness of a thin film to be formed on one surface portion of the substrate, and a main control section controls a valve section based on the prescribed information from the imaging section. Since, based on the prescribed information on the thickness of a thin film to be formed on one surface portion of the substrate, the main control section allows the spraying nozzle portion to spray the solution therefrom, a thin film of the desired thickness can be formed with high accuracy.

Abstract: The disclosed subject matter relates to systems and methods for preparing epitaxially textured polycrystalline films. In one or more embodiments, the method for making a textured thin film includes providing a precursor film on a substrate, the film includes crystal grains having a surface texture and a non-uniform degree of texture throughout the thickness of the film, wherein at least a portion of the this substrate is transparent to laser irradiation; and irradiating the textured precursor film through the substrate using a pulsed laser crystallization technique at least partially melt the film wherein the irradiated film crystallizes upon cooling to form crystal grains having a uniform degree of texture.

Abstract: Productivity and product yield, as well as the step coverage and the adhesion are improved. A film forming process includes an initial film forming step, and a main film forming step. In the initial film forming step, a step of supplying a material gas into a processing chamber to adsorb the material gas on the substrate, and a step of supplying a first reaction gas not containing oxygen atoms into the processing chamber to cause a reaction with the material gas adsorbed on the substrate in order to from a thin film on the substrate, are repeated multiple cycles to form the thin film with the specified thickness on the substrate.

Abstract: Some embodiments of the disclosed surface patterning systems and methods utilize a surface patterning tool coupled to a support and adapted to deposit material onto a substrate, a controller, and first, second, and third actuators electrically coupled to and controlled by the controller. In some embodiments, the first, second, and third actuators are operable to move the substrate in X, Y, and Z directions, respectively, with respect to the surface patterning tool, wherein the substrate is movable by the first, second, and third actuators to different positions with respect to the surface patterning tool, and wherein material is transferable from the surface patterning tool to the substrate in each of the different positions to define the desired surface pattern. One or more of the actuators in some of the disclosed embodiments are piezoelectric actuators.

Abstract: A device for applying an even, thin fluid layer, in particular a phosphoric acid layer, onto substrates, in particular silicon cells for photovoltaic application, is provided with a process chamber, which is provided with a fluid pan and a high-frequency ultrasound device that converts the fluid into fluid mist, and with a transport device that is arranged beneath a fluid-mist dropping shaft of the process chamber for the substrates.

Abstract: A substrate treating system includes a coating apparatus having a resist coating unit, an exposing apparatus having an exposing machine and a heat-treating unit, and a controller for controlling the resist coating unit, exposing machine and heat-treating unit. The controller coordinates schedules of treatment in the coating apparatus and exposing apparatus, such that the coating apparatus can operate efficiently despite an increase in the processing time of the exposing machine.

Abstract: A sheet material dispenser for dispensing portions of sheet material to which a liquid composition has been applied includes a feed mechanism for holding and advancing the sheet material, and a drive mechanism which displaces a carriage along a path of motion. An applicator assembly, deployed on the carriage, includes at least one container containing a composition to be applied to the sheet material and at least one applicator for directing a quantity of the composition towards a surface of the sheet material. In preferred cases, each container and a corresponding applicator are combined as an interchangeable prefilled dispensing container to facilitate user replacement. A controller actuates the applicator assembly to apply a quantity of the composition to the surface of the sheet material while the drive mechanism carries the applicator assembly along the path of motion.

Abstract: The invention relates to a method and apparatus for application of a decorative pattern to a substrate coated with a coating layer, an element comprising a surface coated with a coating layer with such a pattern, as well as a device provided with such an element. The method employs laser ablation of the pattern in a coating layer, followed by the application of ink in the laser-ablated pattern. The method according to the invention is more flexible with respect to the nature of the coating than known methods.

Abstract: In a substrate-processing apparatus for performing coating, baking and developing processes on a semiconductor substrate, a first processing block performs a coating process and a developing process. A second processing block is disposed opposite to the first processing block to heat-treat substrates. A main transfer block is disposed between the first and second processing blocks to transfer the substrates. A third processing block is disposed on one side of the main transfer block in a direction perpendicular to an arrangement direction of the first and second processing blocks to adjust a temperature of the substrates. An auxiliary transfer block is disposed adjacent to the second and third processing blocks to transfer the substrates between the second and third processing blocks. Thus, an overload of the main transfer block may be reduced.

Abstract: For a substrate (W) placed in an airtight processing vessel (1), plasma is generated by introducing a microwave to a radial line slot antenna (4). Conditions are set such that the pressure in the processing vessel is in the range of from 7.32 Pa to 8.65 Pa, the microwave power is in the range of from 2000W to 2300W, the distance (L1) between the surface of the substrate and an opposed face of a raw-material supply member (3) is in the range of from 70 mm to 105 mm, and the distance (L2) between the surface of the substrate and an opposed face of a discharge gas supply member (2) is in the range of from 100 mm to 140 mm. Under these conditions, a raw-material gas consisting of a cyclic C5F8 gas is activated based on energy of the microwave. Consequently, film-forming species containing C4F6 ions and/or C4F6 radicals in a greater content can be obtained. Thus, a fluorine-added carbon film excellent in the leak properties and heat stability can be securely formed.

Abstract: In a substrate-processing apparatus for performing coating, baking and developing processes on a semiconductor substrate, a first processing block performs a coating process and a developing process on substrates. A second processing block is disposed opposite to the first processing block to heat-treat the substrates. The first processing block includes upper, middle and lower unit blocks. The upper and lower blocks include at least one coating unit for forming a layer on the substrates and at least one developing unit for developing a photoresist layer on the substrates, respectively. The middle unit block is detachably disposed between the upper and lower unit blocks and includes at least one of coating units and developing units. The configuration of the middle unit block may vary according to a process recipe to improve the throughput of the substrate-processing apparatus.

Abstract: A process for making controlled release pharmaceutical formulations is provided, which comprises supplying a plurality of solutions with syringe pumps for fluid bed coating, coating a substrate with a pH dependent soluble polymer solution, coating the polymer coated substrate with at least one layer of a solution of a therapeutically active substance and at least one layer of a second polymer solution, and alternating the layers so that the number, order, and volume of the layers controls the release of the therapeutically active substance. In alternate embodiments, the consecutively applied layers may contain coating materials, active ingredients or a mixture of coating materials and active ingredients; the layers can be applied in varying order. Also provided is a system for applying the coatings, wherein the syringe pumps are controlled by a computer in accordance with predetermined instructions.

Abstract: A shaft assembly of a lens coating system includes a first portion reversibly engagable with a second portion. A reciprocating drive disengages and subsequently re-engages the shaft first and second portions. A lens holder is coupled to an arm, which is coupled to the shaft first portion. Another drive, coupled to the shaft second portion, rotates the arm about an axis of the shaft assembly, when the first and second portions are engaged, such that the lens holder travels along a pathway surrounding the assembly. The system includes a plurality of stations, each station having an opening along the pathway, so that the rotating drive may transfer the lens holder into proximity with each station, when the shaft first and second portions are engaged, and the reciprocating drive may transfer a lens, held by the lens holder, into and out from each station through the opening thereof.

Abstract: Apparatus for manufacturing a three-dimensional object (3) by solidifying a powdery constituent material layer by layer at the positions corresponding to the profile of the object (3) to be manufactured in the corresponding layer, by the action of a laser or another energy source comprises a support (2) on which the object (3) is formed and an applicator (6, 7) for applying a layer of the constituent material onto the support or a layer at least partially solidified in advance. The applicator (6, 7) has a receiving device (40) for receiving a applying module such as a blade module (30). The receiving device (40) is formed in a way so that the applying module (30) can be exchangeably inserted into and removed from the receiving device (40) in a way that a predetermined position of the applying module (30) in the receiving device (40) is reproducibly determined.

Abstract: A developing method comprises determining in advance the relation of resist dissolution concentration in a developing solution and resist dissolution speed by the developing solution, estimating in advance the resist dissolution concentration where the resist dissolution speed is a desired speed or more from the relation, and developing in a state in which the resist dissolution concentration in the developing solution is the estimated dissolution concentration or less.

Abstract: A spray device for coating a surface of a human body with a spray liquid, the spray device including at least one nozzle and at least one liquid container, wherein the at least one liquid container is adapted to hold a volume of spray liquid substantially equal to an amount required to apply a single dosage of the spray liquid for coating a surface of a human body. The spray device further includes a liquid channel adapted to connect the at least one liquid container to the at least one nozzle, and a spray valve adapted to cause the spray liquid to flow from the at least one liquid container to the at least one nozzle using the liquid channel. The spray device still further includes a control device adapted to control the operation of the spray device; and a mounting device for mounting the spray device to a mounting surface.

Abstract: An obstruct of this invention is to downsize a chamber, consequently a film forming system, to improve a film thickness distribution and to improve throughput of film forming by increasing the amount of the vaporized liquid precursor. The film forming system 1 is to form a film by vaporizing a liquid precursor and then depositing the vaporized liquid precursor on a substrate W, and comprises a chamber 2 inside of which the substrate W is held and multiple injection valves 3 that are arranged at different positions in the chamber 2 and that directly inject the identical liquid precursor in the chamber 2, vaporize the identical liquid precursor by flash boiling and then supply the vaporized liquid precursor.

Abstract: An assembly for processing substrates, which processing comprises a vacuum deposition process, such as, for instance, sputtering, CVD or PECVD, which vacuum deposition process is carried out in at least one process chamber, the assembly being provided with a conveying device for moving the substrates from a vacuum lock to a process chamber, the conveying device, which extends in a vacuum space, permitting a continuous conveyance of a substrate adjacent the at least one process chamber and permitting an intermittent conveyance adjacent at least the at least one vacuum lock.