Abstract: Method for conditioning paper, which comprises a first step of cooling and one of applying a liquid to the paper. In the cooling step, the temperature of the paper is reduced, e.g. below ambient temperature or below the dew point of a liquid-saturated gas mass applied in the liquid-application step. The gas may be ambient air and the liquid water. Control means monitor the amount of liquid applied to the paper by means of measuring the relative humidity of the air, the absolute humidity of the paper, the temperature of the device where the liquid is applied and the temperature of the paper. The invention also comprises a device for applying the method and it may be applied to paper emerging from a printer, e.g. a digital printer.

Abstract: The present invention is a method of developing a resist film on a substrate using a developing solution at a predetermined temperature lower than room temperature, including a first cooling step of mounting and cooling the substrate on a cooling plate at a temperature lower than room temperature and higher than the predetermined temperature in a cooling apparatus; a second cooling step of then carrying the substrate into a developing apparatus and supplying a rinse solution at the predetermined temperature or lower onto the substrate to cool the substrate in the developing apparatus; a developing step of then supplying the developing solution onto the substrate and developing the resist film on the substrate to form a resist pattern in the resist film; and a cleaning step of then supplying a rinse solution at the predetermined temperature onto the substrate to clean a front surface of the substrate.

Abstract: A method for hot-dip galvanizing metal tubes, may include placing a rack of metal tubes in an acid bath; removing the rack of metal tubes from the acid bath; placing the rack of metal tubes in a molten bath; removing the rack of metal tubes from the molten bath; and quenching the rack of metal tubes in a shower.

Abstract: The present inventions provide method and apparatus that employ constituents vaporized from one or more constituent supply source or sources to form one or more films of a precursor layer formed on a surface of a continuous flexible workpiece. Of particular significance is the implementation of vapor deposition systems that operate upon a horizontally disposed portion of a continuous flexible workpiece and a vertically disposed portion of a continuous flexible workpiece, preferably in conjunction with a short free-span zone of the portion of a continuous flexible workpiece.

Abstract: A device for treating wafers on assembly carriers is disclosed. A wafer to be treated can be fixed on a liquid film that is located between the front side of the wafer and the assembly carrier by freezing of the film.

Abstract: Apparatuses useful in printing, fixing devices and methods of preheating substrates in apparatuses useful in printing are provided. An exemplary embodiment of the apparatuses useful in printing includes a first member including a first surface; a second member including a second surface forming a nip with the first surface; a substrate cooler disposed downstream from the nip to receive a first substrate exiting the nip, the substrate cooler removing heat from the first substrate by conduction; a substrate pre-heater disposed upstream from the nip; and a first heat transfer system for transferring heat from the substrate cooler to the substrate pre-heater. The substrate pre-heater applies the heat to conductively pre-heat a second substrate before the second substrate enters the nip.

Abstract: A method of masking cooling holes of a turbine component, in particular a turbine blade or vane, for a coating process is provided. The component includes an external surface to be coated, at least one internal cavity having an opening towards the outside of the component, and cooling holes extending from the at least one internal cavity to the external surface. The method comprises the steps of: filling the cooling holes with a masking material and hardening the masking material. The masking material, water, is used to fill in the cooling holes. The hardening is done by freezing the water to water ice. A method of coating an external surface of a turbine component and a device for use in a masking process for masking cooling holes in a turbine component are also provided.

Abstract: The invention refers to a device and method for treating a peripheral region of a sandwich component, in particular of a sandwich component having a honeycomb structure and two spaced-apart coating layers and a core structure having a plurality of cavities. The invention is characterized by applying a layer of liquid thermoplastic material onto an peripheral region of the sandwich component such that thermoplastic material penetrates into cavities in the core structure of the sandwich component, and hardening the applied thermoplastic material.

Abstract: A patch application system is provided comprising a powder application booth. The powder application booth comprises a powder block to temporarily house the powder prior to ejection, a nozzle insert to guide the powder onto the screw, a support stand to adjust the powder block to the appropriate position relative to the screw for a desired patch location and size, a powder cup to deliver the powder to the powder block. A programmable logic controller electronically coupled to the micro air-switch valve controls the duration the air-switch valve remains open. The entire process may be automated by including a screw hopper to temporarily store a plurality of screws, a bowl feeder receiving the screws and delivering the screws to a rotating disk, wherein the rotating disk passes the screws through a heating element and presents the heated screws to the powder application booth.

Abstract: A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated.

Abstract: A deposition system includes a drum for supporting a web substrate during deposition that defines a plurality of apertures in an outer surface for passing cooling gas. A gas manifold includes an input that is coupled to an output of a gas source and at least one output that is coupled to the plurality of apertures in the outer surface of the drum. The gas manifold provides gas to the plurality of apertures that flows between the outer surface of the drum and the web substrate, thereby increasing heat transfer from the web substrate to the drum. At least one deposition source is positioned so that material deposits on the web substrate.

Abstract: In hot ambient conditions (particularly in climates having strong sunshine) vehicle glazing panels can reach high temperatures frequently in excess of 50° C. and on occasions up to 90° C. plus. In such high temperature conditions it is a known problem that small glazing panel breaks or cracks can become elongated (or result in shattering of the glazing panel) when stresses are applied to the glazing panel. The invention provides a method of repairing a flaw (such as a crack or break) in a vehicle glazing panel by first, wetting the surface of the glazing panel in the vicinity of the flaw and then generating a forced air flow to enhance evaporation of the wetted glazing panel, and subsequently conduction a repair process on the flaw.

Abstract: A substrate mounting mechanism on which a substrate is placed is provided. The mechanism includes a heater plate having a substrate mounting surface, and a first insertion hole having large and small diameter portions, and a temperature control jacket formed to cover at least a surface of the heater plate other than the substrate mounting surface and having a non-deposition temperature a second insertion hole having large and small diameter portions. The mechanism further includes a first lift pin having a cover inserted into the large diameter portion of the first insertion hole and a shaft inserted into both the large and small diameter portions of the first insertion hole, and a second lift pin having a cover to be inserted into the large diameter portion of the second insertion hole and a shaft to be inserted into both the large and small diameter portions of the second insertion hole.

Abstract: A mask adhesion unit for a deposition apparatus includes a magnetic assembly, a cap plate spaced apart from the magnetic assembly, and a magnetic control unit between edges of the magnetic assembly, and the cap plate. A deposition apparatus using the same is capable of adhering a substrate and a mask assembly together using the mask adhesion unit to improve deposition precision, while preventing deformation of a slit of the mask assembly.

Abstract: A localised extraction system (2) which allows a paint finishing process to be carried out without the need for a traditional spraybooth. The system (2) comprising a frame (36) with means to attach it about a portion of a surface which requires spraying and/or curing and/or drying, the frame (36) forming a localised containment wall thereabout, the frame (36) having an extraction means which draws air from the central aperture (38) of the frame and at the same time draws any paint overspray out of the aperture (38) for safe disposal. The frame (36) may comprise deflection means to retain overspray within the confines of the frame (36) and an optional curing unit which fits into the frames opening to cure the painted surface with the extraction operating at the same time to draw paint fumes emitted during drying. The extraction system, may additionally comprise a drying unit having means to supply a stream of forced air into the frame to facilitate drying.

Abstract: A substrate processing apparatus including: a heating part for heating a wafer; a transport part through which a wafer is transported; a first transfer arm that receives a wafer from the heating part and places the wafer on the transport part; and a second transfer arm including a pair of plate-like tweezers that receives the wafer placed on the transport part from the transport part and transfers the wafer. The transport part includes a cooling plate having a cooling surface on which a wafer is placed. The cooling plate includes a temperature-adjusting channel through which a temperature-adjusting water is circulated for cooling the cooling plate to a temperature lower than a temperature of the heating process of the heating part. The cooling surface is provided with a recess that is similar in shape to and slightly larger than a planar shape of the pair of tweezers.

Abstract: An apparatus and method for treating a substrate are provided. The apparatus includes a load port, an index module, a first buffer module, a coating/developing module, a second buffer module, a pre/post-exposure treatment module, and an interface module, which are sequentially arranged in a direction. The coating/developing module includes a coating module and a developing module, which are arranged in different layers. The pre/post-exposure treatment module includes a pre-treatment module and a post-treatment module, which are disposed at different layers. The pre-treatment module coats a protective layer on the wafer before an exposure process. The post-treatment module performs a wafer cleaning process and a post-exposure bake process after the exposure process. A robot for transferring the wafer is disposed in each of the pre-treatment and post-treatment modules.

Abstract: A semiconductor film formation device has: a reaction vessel that includes a gas flow path to allow source gas to pass through and a substrate mount site provided in the gas flow path to mount a substrate; a temperature control means that is disposed opposite to the substrate mount site and close to the reaction vessel to control the internal temperature of the reaction vessel; and a thermal conductivity adjusting member that is disposed between the reaction vessel and the temperature control means. The thermal conductivity adjusting member has a section with a thermal conductivity different from the other section along the gas flow path.

Abstract: The present invention concerns a mmetallization device (1) for a substrate (2) by metallic material (3), comprising means (5) for generating heat suitable to melt said metallic material (3); means (4) for guiding said metallic material (3) suitable to bring said material in correspondence of said heat generating means (5); and means generating compressed air suitable to generate a compressed air jet (A) on said melt metallic material by said heat generation means (5), in order to nebulise the same so as to obtain a jet exiting from an outlet nozzle (6) and cooling nebulised particles of said metallic material (3), said jet exiting from said outlet nozzle (6) being directed on said substrate (2) so as to metalize it and said cooling being such to bring said particles from a melting state to a plastic state and at a temperature lower that the pyrolysis or decomposition temperature of said substrate (2). The present invention also concerns a metallization method.

Abstract: Methods and apparatuses are provided for assembling a structure on a support having a pattern of binding sites. In accordance with the method, a first fluid is provided on the surface of the support with the first fluid being of a type that that increases viscosity when cooled, the first fluid having first micro-components suspended therein each adapted to engage the binding sites. First fluid proximate to selected binding sites is cooled to increase the viscosity of the responsive fluid proximate to the selected binding sites so that the first micro-components suspended in the first fluid are inhibited from engaging the selected binding sites.

Abstract: A printing press is provided. The printing press includes at least one printing unit for printing a web-shaped printing material and a device for applying a liquid mixture of a silicone oil concentrate and at least water to the web-shaped printing material. The device includes reservoir for the silicone oil concentrate, a supply source for the water, a mixing tank for the silicone oil concentrate and the water, an applicator for transferring the liquid mixture onto the printing material. The applicator has at least one container for the liquid mixture. The device also includes a buffer tank for the silicone oil concentrate separate from the mixing tank. The buffer tank receives the silicone oil concentrate from the reservoir. The printing press also includes a cooling roll for the web-shaped printing material.

Abstract: An epitaxy processing system and its processing method for enhancing operation efficiency is provided. The system includes a stacked cassette, a transportation device, a reaction chamber, and a cooling device. The cooling device can rapidly cool down susceptor and processed wafers without damaging the epitaxy layer. The cluster system design minimizes the footprint of system, reduces the operation cost, and increases throughput and thereby enhances the productivity of the system.

Abstract: A method for treating workpieces that consist of porous carbon material with liquid silicon with the formation of silicon carbide, comprising the steps: Preheating porous carbon workpieces under inert gas to the selected operating temperature TB1, feeding liquid silicon to the porous carbon workpieces at an operating pressure pB2 and an operating temperature TB2, and impregnating the porous carbon workpieces with liquid silicon, reaction of the liquid silicon in the workpiece at a temperature TB3 with the formation of silicon carbide that consists of carbon and silicon, gassing the workpiece with inert gas and cooling from the operating temperature TB3 to the conditioning temperature Tk, cooling the workpieces to room temperature, the temperature TB3 being greater than or equal to the temperature TB2, and the workpiece in step d of the method no longer being in contact with liquid silicon outside of the workpiece.

Abstract: A substrate processing apparatus comprises a processing chamber for storing a boat supporting multiple substrates and for processing the multiple substrates, a heater unit installed around the processing chamber for heating the substrates, and a coolant gas supply nozzle including a pipe section extending perpendicular to a main surface of the substrate supported in the boat stored in the processing chamber, and a spray hole formed on the pipe section for spraying coolant gas to at least two of the multiple substrates, wherein the coolant gas supply nozzle is formed so that the cross sectional area of the pipe section in the area where the spray hole is formed is larger than the total opening area of the spray hole.

Abstract: This disclosure relates to a thermal spray coating system including a table that is configured to support a component. A spray torch is configured to direct a thermal spray at a component surface. A cooling device is arranged adjacent to spray torch and configured to be in close proximity to the component surface. The cooling device includes a manifold that is connected to an air supply. The manifold has a face with multiple impingement holes less than one-eighth inch (3.1 mm) in diameter that are configured to direct cooling air on the component surface. In one example, the diameter of the impingement holes is approximately 0.059 inch (1.5 mm) and provide cooling air at a velocity of at least 400 ft per second (122 meters per second). The face is arranged within one inch (25 mm) of the component surface, in one example. Accordingly, the above cooling device uses less air and yields more consistent results in thermal coating of the component.

Abstract: An apparatus and method for processing elongated sheet material through a plurality of processing stations including a cooling station for lowering the temperature of the sheet material. The cooling station includes a plurality of individually controllable cooling zones each for controlling a portion of the transverse width of the sheet material during passage through the cooling zone. The cooling zones each include a plurality of cooling fluid directing spray nozzles and a sensor for sensing the temperature of the portion of the sheet material onto which cooling fluid has been directed by the respective cooling zone. A controller responsive to the temperature sensed at each cooling zone is operable for independently controlling the flow of cooling fluid to the fluid spray nozzles of each cooling zone based upon a preset temperature setting of the controller.

Abstract: A substrate treating apparatus is capable of promptly heating substrates after exposure, and avoiding an adverse thermal influence on an exposing apparatus. A developing block includes heating modules for heating exposed substrates. An interface block is interposed between the heating modules and the exposing apparatus to isolate the exposing apparatus from the thermal influence of the heating modules. The interface block has a transport mechanism for transporting the substrates to the heating modules, whereby the exposed substrates are promptly transferred to the heating modules.

Abstract: The present invention discloses the fabrication of polymer-coated, coated fiber composites, hybrid composites and a method and apparatus for fabricating the same. The invention provides for the maximum spraying and coating of a roving of coated fibers with molten polymer streams without making physical contact with a solid media, thus simultaneously preventing the fiber surface from getting damaged and stripping off the coating. When metal-coated fiber is used the invention improves the electromagnetic shielding properties of any subsequent product made from the inventive composite. The method and apparatus of the present invention uses sets of nozzle-type sprayers having multiple orifices to enable the thermoplastic or thermoset polymer to penetrate more efficiently into the fiber bundle, thereby providing a more uniform coverage of all fibers. The hybrid composites can consist of two or more types of reinforcements and one or more type of matrix polymer.

Abstract: A deposition method which deposits a CdS buffer layer on a surface of a solar cell from a process solution including all chemical components of the CdS buffer layer material. CdS is deposited in a deposition chamber by heating the surface of the solar cell absorber to cause the transfer of heat from the solar cell absorber layer to at least a portion of the process solution that is in contact with the surface. Used solution is cooled, and replenished in a solution container and redirected into the deposition chamber.

Abstract: An apparatus for thermally processing a microelectronic workpiece comprises a rotatable carousel assembly configured to support at least one workpiece. A driver is coupled to the carousel assembly and rotates the carousel assembly, moving the workpiece between a loading station, a heating station and a cooling station. The loading, heating and cooling stations are radially positioned about a center axis of the carousel assembly. The heating station includes a heating element and an actuator for moving the heating element into thermal engagement with the workpiece in the heating station. The cooling station includes a cooling element and an actuator for moving the cooling element into thermal engagement with the workpiece in the cooling station. A process fluid distribution manifold for delivering process fluid to the workpieces at each station extends through a central opening in the carousel assembly.

Abstract: The present invention is a hardening processing apparatus for heating a substrate coated with a coating solution to harden the coating film on the substrate, which includes a first processing chamber for mounting the substrate coated with the coating solution on a heating plate and heating the substrate to a predetermined temperature on a one-by-one basis; a first irradiation unit provided in the first processing chamber, for irradiating the substrate mounted on the heating plate with ultraviolet light; and a second processing chamber connected in a communicating manner to the first processing chamber, for mounting the substrate coated with the coating solution on a temperature adjusting plate and adjusting the substrate to a temperature lower than a processing temperature of hardening processing on a one-by-one basis, in which the substrate is heated by the heating plate while being irradiated with the ultraviolet light by the first irradiation unit so that the coating film on the substrate is hardened.

Abstract: A straightening plate provided in its central part with a gas exhaust opening is disposed under a face plate serving as a heating plate. A temperature-reducing purge ring is disposed between the face plate and the straightening plate. The temperature-reducing purge ring has an outside diameter substantially equal to that of the straightening plate and is provided in its inner circumference with plural gas jetting holes. The temperature-reducing purge ring is disposed close to the face plate such that a thin gap is formed between the temperature-reducing purge ring and the face plate. When a cooling gas is jetted radially inward through the gas jetting holes of the temperature-reducing purge ring, a vacuum is created between the lower surface of the face plate and the upper surface of the temperature-reducing purge ring.

Abstract: A cooling system and method for a paper coating device, especially for cooling a coating blade of the coating device and a coating color to be coated on paper web, whereby a streaking and/or bleeding phenomena caused by accumulation of the coating color at the end of the coating blade are effectively inhibited. The cooling system comprises a cooling means equipped at a back surface of the coating blade, interconnecting hoses for communicating coolant to the cooling means, a circulating unit, and a heat-exchanging unit.

Abstract: An object is to improve use efficiency of an evaporation material, to reduce manufacturing cost of a light-emitting device, and to reduce manufacturing time needed for a light-emitting device including a layer containing an organic compound. The pressure of a film formation chamber is reduced, a plate is rapidly heated by heat conduction or heat radiation by using a heat source, a material layer on a plate is vaporized in a short time to be evaporated to a substrate on which the material layer is to be formed (formation substrate), and then the material layer is formed on the formation substrate. The area of the plate that is heated rapidly is set to have the same size as the formation substrate and film formation on the formation substrate is completed by one application of heat.

Abstract: A disclosed substrate processing apparatus comprises a heat exchange plate configured to heat and/or cool the substrate; plural protrusions provided on the heat exchange plate so as to allow the substrate to be placed on the plural protrusions, leaving a gap between the substrate and the heat exchange plate; a suction portion configured to attract the substrate onto the plural protrusion by suction through plural holes formed in the heat exchange plate; and a partition member that is provided on the heat exchange plate and lower than the plural protrusions, wherein the partition member is configured to divide the gap into two or more regions including at least one of the holes so that at least one of the two or more regions is two-dimensionally closed by the partition member.

Abstract: A manufacturing apparatus for a semiconductor device that includes a bake chamber for a wafer with a coating film formed thereon to be baked at a predetermined temperature, a cooling chamber connected to the bake chamber, a first carrying unit for the baked wafer to be carried in the cooling chamber, a first temperature control unit for the wafer carried by the first carrying unit to be cooled down, and an unloading gate for unloading the wafer cooled down from the cooling chamber.

Abstract: A population of nanocrystals having a narrow and controllable size distribution and can be prepared by a segmented-flow method.

Abstract: The invention relates to a method for coating heated work pieces.

Abstract: In a wire insulating line, a cooling device that cools down a traveling high-temperature linear material, which is resin-coated by an extruder, in cooling water includes a reservoir tank that reserves the cooling water and allows the linear material to pass therein, and water spray nozzles that are provided in plural numbers in the reservoir tank with a gap along the linear material traveling direction and spray water to the linear material in the cooling water.

Abstract: A coating and developing system includes a resist film forming unit block and antireflection film forming unit blocks stacked in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film in a small space. The coating and developing system can cope with either of a case where antireflection films are formed and where any antireflection film is not formed. Film forming unit blocks: TCT layer B3, a COT layer B4 and a BCT layer B5, and developing unit blocks: DEV layers B1 and B2, are stacked up in layers in a processing block S2. The TCT layer B3, the COT layer B4 and the BCT layer B5 are used selectively where antireflection films are formed and any antireflection film is not formed. The coating and developing system is controlled by a carrying program and software.

Abstract: An apparatus for plating a wire material is provided in which a range of the plated layer where the temperature is high and flowability is large, thus, easily generating thickness deviation, and a range of the plated layer where the temperature is low and the flowability is small, thus generating thickness deviation only with difficulty are allowed to cool in an appropriate manner, respectively, whereby a plated wire material whose thickness deviation is not more than 2.0 can be produced with high productivity in a stable manner.

Abstract: On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. Exhaust pipes for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes.

Abstract: The present invention presents an improved upper electrode for a plasma processing system, wherein the design and fabrication of an electrode plate coupled to an upper assembly advantageously provides gas injection of a process gas with substantially minimal erosion of the electrode plate.

Abstract: A method for forming a coating film on an internal surface of an elongated tube, includes longitudinally holding the elongated tube, applying a coating solution to the internal surface of the elongated tube; and drying the coating solution while carrying out a heat process for sequentially heating the elongated tube by using a heat source. The heat process includes adjusting the descending rate of the heat source so that a through-hole in the elongated tube is clogged with the coating solution whose viscosity is reduced by heating of the heat source, and sucking the through-hole in the elongated tube from the lower side thereof so that a portion of the through-hole that is clogged with the coating solution moves downwards along the elongated tube.

Abstract: The machine is an index spraying machine. The machine has five different stations. The first station is the load/unload station. At this station, work pieces are unloaded after they have been sprayed and new work pieces to be sprayed are loaded on. New pieces then move into the pre-heat station tunnel. A third station is the spraying area. In this area, the work pieces are sprayed. After being sprayed, the work pieces move in the area where they are heated to flash off the volatile fumes. Then they move to the fifth work station where they are cooled and finally they move back into the load/unload station. The spraying area in this machine is sealed to meet NEMA 7 standards. The air capture system cascades the air, thus lowering the air volume that passes through the thermal oxidizer.

Abstract: A rewetting installation is provided for use with a printed and dried material web. A wetting device applies a silicon emulsion to at least one of a first and second side of the material web. A second wetting device is located at a distance from the wetting device or devices which are used for the renewed application of the silicon emulsion to at least one side of the material web.

Abstract: A substrate which has been subjected to heat processing in any of hot plate units is transferred to a normal cooling unit by a transfer device and subjected to cooling processing to some extent, and then transferred to a high accuracy cooling unit and subjected to cooling processing with high accuracy, and thereafter transferred to any of coating units or a developing units. Thereby, the substrate can be subjected to the cooling processing with high accuracy and thereafter to coating processing with no increase in apparatus cost and with no decrease in throughput.

Abstract: The present invention relates to a method for heat processing a substrate. After a coating film is formed on the substrate, the substrate is baked at a predetermined high temperature. The baking step is performed by first increasing the substrate temperature from a predetermined low temperature to a predetermined intermediate temperature that is lower than a predetermined reaction temperature at which the coating film reacts. Next, a second baking step maintains the substrate at the predetermined intermediate temperature for a predetermined period of time, and is followed by a third step of increasing the temperature of the substrate to the predetermined high temperature that is higher than the predetermined reaction temperature. This results in uniform temperature within the surface of the substrate when the temperature of the substrate reaches the reaction temperature. Consequently, a chemical reaction due to heat processing of the coating film within the surface of the substrate is performed uniformly.

Abstract: The invention provides a film forming apparatus that is capable of forming films sequentially with two types of film forming mechanisms in the same chamber. The film forming apparatus according to the present invention includes a Pt target disposed at one side within a film forming chamber, a sputtering output mechanism to supplying to the Pt target, a Pt vapor deposition source disposed at an other side within the film forming chamber, vapor deposition output mechanism to supply to the Pt vapor deposition source, a substrate holder disposed between the Pt target and the Pt vapor deposition source within the film forming chamber to mount a substrate, a rotating mechanism to move the substrate holder so that the substrate directs to the Pt target or to the Pt vapor deposition source, a heating mechanism to heat the substrate when the substrate is subjected to a sputtering film forming, and a cooling mechanism to cool the substrate when the substrate is subjected to vapor deposition film forming.

Abstract: A substrate holder has a disk-like body with a central recess having diameter smaller than the diameter of the substrate placed onto the upper surface of the holder. The substrate can be clamped in place by the clamps of the edge-grip mechanism or placed into a seat without the use of clamps. In both cases, the substrate forms a partial wall that confines the heating/cooling recess or chamber. The aforementioned recess is filled with a cooling or heating liquid (depending on the mode of metal deposition) selectively supplied from a liquid heating or cooling system. In order to ensure in the working chamber above the substrate a pressure slightly higher than the pressure in the cooling/heating recess, the working chamber is first filled with the working solution under the atmospheric pressure, and then the recess is filled with a heating or cooling liquid with simultaneous increase of pressure in the working chamber to a level slightly exceeding the pressure in the recess.