Abstract: An adhesive agent applying apparatus has an ejecting section that ejects a thermoplastic adhesive agent and applies the thermoplastic adhesive agent onto one surface of a continuous sheet, traveling in a predetermined travel path and relevant to an absorbent article, by ejecting the thermoplastic adhesive agent from the ejecting section. The apparatus includes a contacting-detaching mechanism that causes relative movement between the continuous sheet and the ejecting section along a contacting-detaching direction, an ejecting mechanism that performs an ejecting operation of the thermoplastic adhesive agent from the ejecting section, and a controller that controls the contacting-detaching mechanism and the ejecting mechanism.

Abstract: An ion implantation system and method, providing cooling of dopant gas in the dopant gas feed line, to combat heating and decomposition of the dopant gas by arc chamber heat generation, e.g., using boron source materials such as B2F4 or other alternatives to BF3. Various arc chamber thermal management arrangements are described, as well as modification of plasma properties, specific flow arrangements, cleaning processes, power management, eqillibrium shifting, optimization of extraction optics, detection of deposits in flow passages, and source life optimization, to achieve efficient operation of the ion implantation system.

Abstract: An apparatus for controlling a color of a film includes a dyeing bath to dip a washed PVA film in an aqueous iodine solution and an aqueous potassium solution and then dye the PVA film therewith, a complementary bath to dip the PVA film in an aqueous potassium solution and then dye the PVA film therewith, a device oven to dry the PVA film having the oriented iodine and potassium, a 4-stage oven to dry the PVA film dried in the device oven, and a central controller to predict a color value of the polarizing film.

Abstract: The present invention relates to an article fabrication system having a plurality of material deposition tools containing one or more materials useful in fabricating the article, and a material deposition device having a tool interface for receiving one of the material deposition tools. A system controller is operably connected to the material deposition device to control operation of the material deposition device. Also disclosed is a method of fabricating an article using the system of the invention and a method of fabricating a living three-dimensional structure.

Abstract: This disclosure describes a module web coating system and components thereof including a more uniform atmospheric control pumping mechanism and gas curtain separation system. A modular web coating system may include an unwind module, any number of process modules, and a rewind module. The process modules are interchangeable and independently operable. In addition, this disclosure describes a more uniform pumping system in which process gas is removed from multiple locations or slits spaced around a process chamber and, in an example, around a process device such as a deposition source. The gas curtain system utilizes a zone between process chambers into which separation gas is injected. Gas from the chambers is continuously removed thereby operating the chambers under negative pressure and preventing process gas from one chamber bleeding into an adjacent chamber.

Abstract: The various embodiments of the invention provide for relative movement of the substrate and a process head to access the entire wafer in a minimal space to conduct combinatorial processing on various regions of the substrate. The heads enable site isolated processing within the chamber described and method of using the same are described.

Abstract: Disclosed is an apparatus for depositing a thin film of material on a substrate and a regeneration process. The apparatus includes a chamber, a cryogenic panel disposed inside the chamber, a sample holder able to support a substrate, a gas injector able to inject a gaseous precursor into the chamber, a first trap connected to the vacuum chamber and able to trap a part of the gaseous precursor released by the cryogenic panel, the first trap having a fixed pumping capacity S1. The apparatus for depositing a thin film of material on a substrate includes a second trap having a variable pumping capacity S2 able to be regulated in function of the gaseous precursor partial pressure, the first and second trap providing a total pumping capacity S=S1+S2 sufficient to maintain the gaseous precursor partial pressure in the vacuum chamber under a determined pressure PL.

Abstract: Embodiments of the present invention relate to apparatus for improving uniformity and film stress of films deposited during plasma process of a substrate. According to embodiments, the apparatus includes a tuning electrode and/or a tuning ring electrically coupled to a variable capacitor for tuning high frequency RF impedance of the electrode and a low frequency RF termination to ground. The plasma profile and resulting film thickness can be controlled by adjusting the capacitance of the variable capacitor and the resulting impedance of the tuning electrode. The film stress of the film deposited on the substrate can be controlled, i.e., increased, by terminating the low frequency RF during processing.

Abstract: A system includes a tuning element comprising a shaft and a tuning stub. The tuning stub includes a surface with a center point. The shaft is connected to the surface of the tuning stub at a location that is offset from the center point. A waveguide includes an opening into an inner portion of the waveguide. The shaft passes through the opening and the tuning stub is arranged in the inner portion of the waveguide. A first actuator selectively rotates the shaft.

Abstract: A dispensing apparatus includes a dispensing unit having a main body, a channel through the main body, and a plurality of nozzles connected to the main body, the plurality of nozzles being configured to dispense fluid flowing in the channel, a gap sensor unit configured to determine size of gaps between adjacent nozzles in the dispensing unit, and a thermal expansion adjusting unit configured to thermally expand or contract the main body of the dispensing unit to adjust the gap size between adjacent nozzles to a predetermined size, based on the gap size determined by the gap sensor unit.

Abstract: The present invention provides a liquid crystal (LC) coating apparatus and an LC coating method. The LC coating apparatus comprises a plurality of liquid crystal coating devices, at least one real-time detector and a controller. The LC coating method comprises the following steps: utilizing the LC coating devices to coat a LC on a substrate; utilizing the real-time detector to real-time detect the LC coated on the substrate and outputting a detection signal; and utilizing the controller to control the LC coating devices according to the detection signal. The present invention can real-time monitor the coating status of the LC for coating and forming a uniform LC film.

Abstract: An in situ apparatus, system, and method for cladding or repairing cladding in installed pipelines are presented. The apparatus can include a coating collar, a material reservoir, a cladding head, an adjustable cladding chamber, and a chamber controller. The coating collar can include an external surface, a first circumferential wall, and a second circumferential wall and forms the adjustable cladding chamber along with interior wall of the pipe. The coating collar can have an aperture to include and allow deployment of the cladding head through it. The cladding head can be operatively coupled with the cladding material reservoir to allow efficient deployment of the cladding material on the pipe surface. The chamber controller can be coupled with the adjustable cladding chamber to control dimensions of the chamber thus restricting and controlling the environment and enabling efficient functioning of the cladding head and limiting grain growth in applied nanoclad materials.

Abstract: The present disclosure is directed to a process for applying a waterborne coating composition in a spray booth and a system thereof. The disclosure is particularly directed a process for introducing water into incoming air for the spray booth to produce a conditioned spray booth having appropriate humidity levels. The process of this disclosure is particularly useful for applying waterborne coating composition having effect pigments in a low humidity and high temperature climate.

Abstract: Marking information relating to use of a marking device to perform a marking operation may be acquired from one or more input devices, logged/stored in local memory of a marking device, formatted in various manners, processed and/or analyzed at the marking device itself, and/or transmitted to another device (e.g., a remote computer/server) for storage, processing and/or analysis. In one example, a marking device may include one or more environmental sensors and/or operational sensors, and the marking information may include environmental information and operational information derived from such sensors. Environmental and/or operational information may be used to control operation of the marking device, assess out-of-tolerance conditions in connection with use of the marking device, and/or provide alerts or other feedback. Additional enhancements are disclosed relating to improving the determination of a location (e.g.

Abstract: A method of forming patterns on transparent substrates using a pulsed laser is disclosed. Various embodiments include an ultrashort pulsed laser, a substrate that is transparent to the laser wavelength, and a target plate. The laser beam is guided through the transparent substrate and focused on the target surface. The target material is ablated by the laser and is deposited on the opposite substrate surface. A pattern, for example a gray scale image, is formed by scanning the laser beam relative to the target. Variations of the laser beam scan speed and scan line density control the material deposition and change the optical properties of the deposited patterns, creating a visual effect of gray scale. In some embodiments patterns may be formed on a portion of a microelectronic device during a fabrication process. In some embodiments high repetition rate picoseconds and nanosecond sources are configured to produce the patterns.

Abstract: A method for applying a coating to a cable, the cable having a longitudinal direction, includes A) cleaning the surface of the cable, and B) applying coating to the cable by rotating a coating application means around the cable allowing the application of the coating. The steps are performed from a platform being moved along the cable in a movement direction by at least three wheels that are fastened in a force-locking manner to the cable. Step A) is performed in the movement direction before the wheels, and step B) is performed in the movement direction behind the wheels. The wheels are driven by a motor that can be controlled in such a manner that the platform can be positioned at predefined positions reproducibly.

Abstract: A dual-purpose facility of continuous hot-dip coating and continuous annealing is configured so as to be switched between a continuous hot-dip coated material production line and a continuous annealed material production line, and includes a gas discharge path that discharges atmosphere gas in an annealing furnace from a gas discharge port provided in an outlet side of the annealing furnace out of the annealing furnace and a path opening and closing unit for opening and closing the gas discharge path. The path opening and closing unit opens the gas discharge path when the dual-purpose facility is used as the continuous hot-dip coated material production line and closes the gas discharge path when the dual-purpose facility is used as the continuous annealed material production line.

Abstract: According to one embodiment, a film forming apparatus includes: a stage on which a coating object is placed; a rotation mechanism rotating the stage; an application nozzle supplying a coating material to the coating object; an application moving mechanism moving the application nozzle; a controller which controls the rotation mechanism and application moving mechanism to rotate the stage and move the application nozzle between the rotation center and the outer edge and controls the application nozzle to apply the coating material to the coating object; and a sound wave generator which generates a sound wave. The film forming apparatus projects the sound wave onto the surface of the coating film.

Abstract: Systems and methods for plasma processing of microfeature workpieces are disclosed herein. In one embodiment, a method includes generating a plasma in a chamber while a microfeature workpiece is positioned in the chamber, measuring optical emissions from the plasma, and determining a parameter of the plasma based on the measured optical emissions. The parameter can be an ion density or another parameter of the plasma.

Abstract: Disclosed is a liquid processing apparatus capable of increasing the number of arranged substrate retainers without increasing the total exhaust amount of the liquid processing apparatus. A N-number (N is an integer identical to or greater than three) of cup bodies are inhaled and exhausted in total exhaust amount E through a plurality of separate exhaustion passage each having a first damper, and through a common exhaustion passage connected in common downstream of the separate exhaustion passages. The first dampers are configured such that an external air is received from the cup body in a first intake amount of external air E1 for one of the cup bodies where a chemical liquid nozzle is placed at a setting location facing a wafer, and an external air is received from each of the other cup bodies in a second intake amount of external air E2 less than the first amount E1 and the intake amount of external air from both each of the other cup bodies and each of branched passages equals (E?E1)/(n?1).

Abstract: An adhesive application apparatus for applying a liquid adhesive to an object includes a regular application stage against which the object is placed for a regular application of the liquid adhesive to the object, a trial application stage to which a trial application of the liquid adhesive is carried out, an application unit relatively movable with respect to the regular application stage and trial application stage to carry out the regular application and trial application of the liquid adhesive, and a suction unit carrying out a suction operation of the liquid adhesive used in the trial application. The adhesive application apparatus smoothly carries out the trial application of the liquid adhesive without bothering the operation of an adhesive application line.

Abstract: Systems for the sustained, high-volume production of Group III-V compound semiconductor material suitable for fabrication of optic and electronic components, for use as substrates for epitaxial deposition, or for wafers. The equipment is optimized for producing Group III-N (nitrogen) compound semiconductor wafers and specifically for producing GaN wafers. The method includes reacting an amount of a gaseous Group III precursor as one reactant with an amount of a gaseous Group V component as another reactant in a reaction chamber to form the semiconductor material; removing exhaust gases including unreacted Group III precursor, unreacted Group V component and reaction byproducts; and heating the exhaust gases to a temperature sufficient to reduce condensation thereof and enhance manufacture of the semiconductor material. Advantageously, the exhaust gases are heated to sufficiently avoid condensation to facilitate sustained high volume manufacture of the semiconductor material.

Abstract: A method of manufacturing a semiconductor device includes: (a) supplying a first process gas from a first process gas supply unit into a process chamber via a flow rate control device to form a film on a substrate; (b) transmitting a signal representing an exhaust pressure detected by a pressure detector to a controller after the first process gas is supplied into the process chamber; (c) controlling a pressure adjustor and the flow rate control device once the signal is received by the controller such that the exhaust pressure reaches a predetermined pressure; (d) supplying a purge gas from a purge gas supply unit into the process chamber to purge an inside atmosphere after forming the first film; and (e) supplying a second process gas from a second process gas supply unit into the process chamber via the flow rate control device to form a second film.

Abstract: The present invention relates to an article fabrication system having a plurality of material deposition tools containing one or more materials useful in fabricating the article, and a material deposition device having a tool interface for receiving one of the material deposition tools. A system controller is operably connected to the material deposition device to control operation of the material deposition device. Also disclosed is a method of fabricating an article using the system of the invention and a method of fabricating a living three-dimensional structure.

Abstract: A plasma processing tool for fabricating a semiconductor device on a semiconductor wafer includes an optical window disposed on a plasma chamber, remotely from a plasma region. The window is thermally connected to an electrical heater element capable of maintaining the window at a temperature of at least 30° C. A heater controller provides electrical power to the heater element. During operation of the plasma processing tool, the heater controller provides power to the heater element so as to maintain the window at a temperature of at least 30° C. during at least a portion of a plasma process step in which by-products are produced in the plasma chamber.

Abstract: A plasma reactor having a reactor chamber and an electrostatic chuck with a surface for holding a workpiece inside the chamber includes a backside gas pressure source coupled to the electrostatic chuck for applying a thermally conductive gas under a selected pressure into a workpiece-surface interface formed whenever a workpiece is held on the surface and an evaporator inside the electrostatic chuck and a refrigeration loop having an expansion valve for controlling flow of coolant through the evaporator. The reactor further includes a temperature sensor in the electrostatic chuck and a memory storing a schedule of changes in RF power or wafer temperature.

Abstract: A substrate processing system of forming a resist pattern having a molecular resist of a low molecular compound on a substrate includes a film forming device configured to form a resist film on the substrate; an exposure device configured to expose the formed resist film; and a developing device configured to develop the exposed resist film. The film forming device includes a processing chamber configured to accommodate therein the substrate; a holding table that is provided in the processing chamber and configured to hold the substrate thereon; a resist film deposition head configured to supply a vapor of the molecular resist to the substrate held on the holding table; and a depressurizing device configured to depressurize an inside of the processing chamber to a vacuum atmosphere.

Abstract: A substrate processing system includes a processing chamber including a showerhead, a plasma power source and a pedestal spaced from the showerhead to support a substrate. A filter is connected between the showerhead and the pedestal. A variable bleed current circuit is connected between the filter and the pedestal to vary a bleed current. A controller is configured to adjust a value of the bleed current and configured to perform curve fitting based on the bleed current and DC self-bias voltage to estimate at least one of electrode area ratio, Bohm current, and radio frequency (RF) voltage at a powered electrode.

Abstract: A bridge cable maintenance apparatus attaches to a cable and includes two drivetrains. Once attached, the apparatus is remotely directed along the longitudinal extent of the cable by the first drivetrain. The second drivetrain rotates attachments about the cables axis. The attachments include a variety of maintenance devices that are fastened to the end of the apparatus and allow the user to remotely and safely inspect, paint, clean, and repair the cable.

Abstract: A device for producing or building up a metal part by sintering and laser fusion, the device including a laser beam generator, a mechanism for deflecting the beam to scan a surface of the part to be produced, a sintering pan including a metal powder used to cover the surface of the part and to be melted by the laser beam to thicken the part, and at least one mechanism for heating powder contained in an area of the sintering pan by induction.

Abstract: A coating apparatus including: a coating part having a nozzle which ejects a liquid material including a solvent and a plurality of metals to a substrate, a storing part which is connected to the nozzle and stores the liquid material, and an ultrasonic wave oscillating part which oscillates an ultrasonic wave to the liquid material stored in the storing part.

Abstract: A film deposition apparatus is disclosed. The apparatus comprises: a reaction chamber, a susceptor, a heating module, a driving module, and a cooling module. The susceptor is used for bearing at least one wafer; the heating module is used for heating the wafer; the driving module is used for driving the susceptor to rotate. The cooling module is disposed between the heating module and the driving module. The cooling module is configured to make the temperature distribution between the heating module and the driving module discontinuous.

Abstract: A polycrystalline silicon producing method includes: the first process and the second process. In the first process, a surface temperature is maintained at a predetermined range by adjusting the current value to the silicon seed rod, and the raw material gas is supplied while maintaining a supply amount of chlorosilanes per square millimeter of the surface of the rod in a predetermined range until a temperature of the center portion of the rod reaches a predetermined temperature lower than the melting point of the polycrystalline silicon, and in the second process, a previously determined current value is set corresponding to a rod diameter and the supply amount of the raw material gas per square millimeter of the surface of the rod is decreased to maintain the surface temperature and the temperature of the center portion of the rod at predetermined ranges, respectively.

Abstract: An adhesive agent applying apparatus has an ejecting section that ejects a thermoplastic adhesive agent and applies the thermoplastic adhesive agent onto one surface of a continuous sheet, traveling in a predetermined travel path and relevant to an absorbent article, by ejecting the thermoplastic adhesive agent from the ejecting section. The apparatus includes a contacting-detaching mechanism that causes relative movement between the continuous sheet and the ejecting section along a contacting-detaching direction, an ejecting mechanism that performs an ejecting operation of the thermoplastic adhesive agent from the ejecting section, and a controller that controls the contacting-detaching mechanism and the ejecting mechanism.

Abstract: A recording medium surface property modifying apparatus is disclosed. The recording medium surface property modifying apparatus includes a conveying unit which conveys a recording medium in a predetermined direction; a discharging electrode which rotates and comes into contact with a face to be treated of the recording medium which is conveyed by the conveying unit to cause the face to be treated to be in contact with plasma to modify a surface property of the recording medium; and a hollow-shaped cover member which covers a plasma treatment unit which includes the discharging electrode, the recording medium surface property modifying apparatus further including a humidity control unit which controls, in advance, humidity of the plasma treatment unit in alignment with acidity of the recording medium which undergoes the surface property modifying treatment.

Abstract: There is provided a chemical vapor deposition apparatus, including: a reaction chamber including a support part having a wafer placed thereon and a gas supply part supplying a process gas to a reactive space formed above the support part to allow a thin film to be grown on a surface of the wafer; a heat exchanger changing a temperature of the process gas, supplied to the reactive space through the gas supply part, to allow the process gas to be maintained at a set temperature: and a controller regulating a flow rate of the process gas, and detecting a temperature difference between a temperature of the process gas and the set temperature to thereby control the heat exchanger to supply the process gas to the reactive space while the process gas is maintained at a reference temperature set according to each stage.

Abstract: A film formation apparatus includes a processing chamber configured to keep an inside thereof in a decompressed state, a gas introduction path configured to introduce a predetermined source gas into the processing chamber, a catalyst provided inside the processing chamber in such a way that the source gas introduced through the gas introduction path comes into contact with a surface of the catalyst or passes near the surface thereof, a power supply unit configured to apply energy to the catalyst to heat the catalyst, a detector provided below the catalyst, and a controller configured to detect an electric current flowing through the detector or a voltage from the detector and to judge a contact state between the catalyst and the detector.

Abstract: A manufacturing equipment for galvannealed steel sheet includes coating tub to coat steel sheet dipped in coating bath wherein the bath including molten zinc and Al is stored at bath temperature T1, separating tub to separate by flotation top-dross by precipitating the top-dross in the bath wherein the bath transferred from the coating tub is stored at bath temperature T2 lower than T1, Fe of the bath is supersaturated, and Al concentration A2 of the bath is controlled to high concentration by supplying first metal, adjusting tub to adjust Al concentration A3 of the bath by supplying second metal wherein the bath transferred from the separating tub is stored at bath temperature T3 higher than T2, Fe of the bath is unsaturated, and dross is dissolved, and circulator to circulate the bath in order of the coating tub, the separating tub, and the adjusting tub.

Abstract: The description relates to an adjustable nozzle capable of pivoting about an axis of the nozzle and translating along the axis of the nozzle. A high density plasma chemical vapor deposition (HDP CVD) chamber houses a plurality of adjustable nozzles. A feedback control system includes a control unit coupled to the adjustable nozzle and the HDP CVD chamber to form a more uniform thickness profile of films deposited on a wafer in the HDP CVD chamber.

Abstract: A sputter source is provided. The sputter source includes a shaft extending through a central region of the sputter source. A first end of the shaft is coupled to a drive and a second end of the shaft is coupled to a bottom plate. A first plate having a ramped surface is included where the first plate is stationary. A second plate having a ramped surface is provided where the second plate is disposed above the first plate such that portions of the ramped surfaces contact each other. The second plate is coupled to the shaft, wherein the second plate is operable to rotate and move axially as the shaft rotates in a first direction and wherein the second plate is operable to remain stationary as the shaft rotates in a second direction.

Abstract: A manufacturing equipment for galvanized steel sheet includes coating tub to coat steel sheet dipped in coating bath wherein the bath including molten zinc and Al is stored at bath temperature T1, separating tub to separate by a flotation top-dross by precipitating the top-dross in the bath wherein the bath transferred from the coating tub is stored at bath temperature T2 lower than T1, adjusting tub to dissolve dross wherein the bath transferred from the separating tub is stored at bath temperature T3 higher than T2 and Fe of the bath is unsaturated, and circulator to circulate the bath in order of the coating tub, the separating tub, and the adjusting tub.

Abstract: A gas flow of a gas pipe is indicated before an electromagnetic valve is actually opened, so that the electromagnetic valve can be prevented from being opened or closed by a wrong manipulation or hazards caused by undesired mixing of gases can be avoided so as to improve safety. The substrate processing apparatus includes a state detection unit configured to detect an opening/closing request state and an opening/closing state of a valve installed at a gas pipeline; and a indication unit configured to indicate a gas flow state of the gas pipeline predicted according to the opening/closing request state and a gas flow state of the gas pipeline when the valve is opened, in a way that each state is distinguished.

Abstract: A photoresist-coating apparatus includes a substrate on which a particle-detecting area and an invalid particle-detecting area are defined, a nozzle discharging photoresist to the substrate and moving along a direction, and a particle-detecting sensor controlling on and off of the nozzle in the particle-detecting area according to presence of particles, wherein in the invalid particle-detecting area, the nozzle operates independently from detection of the particle-detecting sensor.

Abstract: A material deposition system for depositing materials on an electronic substrate with a material deposition system is disclosed. The deposition system includes a frame, a gantry system coupled to the frame, a deposition head coupled to the gantry system and configured to deposit dots of low viscous and semi-viscous material on the electronic substrate, and a controller configured to control the operation of the material deposition system, including the operation of the gantry system and the deposition head. The system is capable of depositing a line or a pattern of material on the electronic substrate by moving the deposition head along an axis of motion that is substantially non-parallel to a direction of the line or pattern. Other deposition systems and methods are further disclosed.

Abstract: A coating device includes a reaction device, a mixing device, a deposition device, a first switching device and a second switching device. The reaction device defines a reaction chamber. The mixing device is connected to the reaction device and defines a mixing chamber that communicates with the reaction chamber. The deposition device is connected to the mixing device and defines a deposition chamber that communicates with the mixing chamber. The first switching device is configured to communicate the reaction chamber and the mixing chamber and separate the reaction chamber from the mixing chamber. The second switching device is configured to communicate the mixing chamber and the deposition chamber and separate the mixing chamber from the deposition chamber.

Abstract: An additive manufacturing process performed by an additive manufacturing machine includes strain gauges that detect stress within a part during fabrication within a defined workspace. When the detected stress is exceeds a desired level the fabrication steps are paused and a stress relieving process is performed within the chamber without moving the part. The additive manufacturing machine includes heaters and coolers for changing the temperature within the chamber to perform the desired stress relieving process in the same space as fabrication is performed. Once it is confirmed that stresses within the part are within acceptable limits the part fabrication process is resumed.

Abstract: An additive manufacturing process includes the steps of measuring a parameter of a part supported within a workspace after a heat treat or other stress relieving process. The measured parameter being a part characteristic that is desired to be within a desired range prior to proceeding with an additional fabrication process. The process further includes the step of applying at least one additional layer on the part based on the measured parameter to adjust the measured parameter to within the desired range.

Abstract: The present invention relates to a photoresist coater, which includes a receiving space consisting a top slab and a bottom slab, supporting pins and a carrying tray disposed in the receiving space. The supporting pins are coupled to the carrying tray. The photoresist coater further includes an adjustment mechanism disposed in the receiving space for automatically adjusting a height of the carrying tray. The adjustment mechanism is coupled to the carrying tray. The present invention further relates to a photoresist coater carrying system. The carrying system and the corresponding photoresist coater have a simpler way of operation and higher adjustment accuracy.

Abstract: An approach is described for manufacturing wavelength conversion components for lighting devices which employ in-line process controls to minimize the amount of perceptible variation in the amount of photo-luminescent material that is deposited in the wavelength conversion components. Weight measurements are utilized in the manufacturing process to control and minimize the amount of the variations. In this approach, the weight of the product during manufacturing is used as a surrogate to a measure of the amount of photo-luminescent material in the component, and hence a surrogate for the expected color properties of the manufactured product. By measuring and checking for weight variations for the component, one can quickly determine with reasonable confidence whether there are any variations in the amount of photo-luminescent in the component.

Abstract: A system for controlling a boundary of spreading liquid adhesive on a surface is disclosed. The system includes one or more ultra-violet (UV) sources configurable to emit UV light onto the liquid adhesive; and a control circuit coupled to the one or more UV sources and configured to control the one or more UV sources to selectively apply the UV light at selected locations on the liquid adhesive to cure the adhesive and prevent its further spread at those locations.