Abstract: Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces.

Abstract: A fret saw includes a cutting wire and fixed abrasive grains provided on the cutting wire by electroplating. Each of the fixed abrasive grains includes a core and a hard film coated on the core. The core is 1 to 60 micrometers in diameter. The core is made of a material selected from the group consisting of a Ti metal and a Ti alloy. The hard film is 1 to 40 micrometers thick. The hard film covers about 30% to 90% of the surface of the core.

Abstract: Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces.

Abstract: Wire spools used for multiple wire saws for slicing one or more wafers from a workpiece composed of semiconductor material using a wire web including parallel wire sections coated with bonded abrasive grain. The wire spools include a first wire spool configured as a dispensing spool and a second wire spool configured as a receiver spool. A sawing wire coated with bonded abrasive grain runs from the first wire spool via at least one deflection roll to the wire web and from the wire web via at least one deflection roll to the second wire spool. The sawing wire enters into guide grooves of the deflection rolls at an alignment angle ?1 and exits the guide grooves of the deflection rolls at an alignment angle ?2. The sawing wire has a single layer winding on each of the first and second wire spools.

Abstract: A method of manufacturing a group III nitride crystal substrate slices a group III nitride crystal body with a saw wire which includes a steel wire having a carbon concentration of 0.90-0.95 mass %, a silicon concentration of 0.12-0.32 mass %, a manganese concentration of 0.40-0.90 mass %, a phosphorus concentration of 0.025 mass % or less, a sulfur concentration of 0.025 mass % or less, and a copper concentration of 0.20 mass % or less, and has a diameter of not less than 0.07 mm and less than 0.16 mm, a tensile strength at break of higher than 4200 N/mm2, and a curl size of 400 mm or more, with a tension of not less than 50% and not more than 65% of the tension at break applied to the saw wire. Thus, group III nitride crystal substrates with small warpage can be manufactured.

Abstract: An abrasive article having a substrate, a tacking film overlying the substrate, abrasive particles comprising a coating layer bonded to the tacking film such that a bond between the coating layer and the tacking film defines a metallic bonding region, and a bonding layer overlying the abrasive particles and the tacking film,

Abstract: A machine for cutting blocks of natural or similar types of stone includes a plurality of diamond-wire loops, wound about an assembly for the support and transmission of the cutting motion to said diamond-wire loops and at least one assembly for supporting, tensioning and guiding the diamond-wire loops; said assemblies move vertically in unison on the structure of the machine; and presents said supporting, tensioning and guiding assembly comprising a set of pulleys for the support and return of each diamond-wire loop, which are mounted and registered, for wire tensioning, on a movable tensioning means whose registration movement is actuated by a tensioning control means, independently of the movable tensioning means of contiguous diamond wires.

Abstract: The present disclosure relates to a wire and a method of forming a wire including an iron based glass forming alloy including iron present in the range of 43.0 to 68.0 atomic percent, boron present in the range of 12.0 to 19.0 atomic percent, nickel present in the range of 15.0 to 17.0 atomic percent, cobalt present in the range of 2.0 to 21.0 atomic percent, optionally carbon present in the range of 0.1 to 6.0 atomic percent and optionally silicon present in the range of 0.4 to 4.0 atomic percent, wherein said wire has a thickness of 140 ?m or less and wherein said wire includes spinodal glass matrix microconstituents. The wire may be used in abrading a substrate.

Abstract: Embodiments of the disclosure provide an aggregate cutting saw chain having a pitch in the range of approximately 0.440 to approximately 0.450. Embodiments also include tie straps and/or other components having fluid distribution features.

Abstract: The invention relates to a wire saw having a saw wire drive sheave (2) for driving an endless saw wire, a motor having a motor output shaft directly or indirectly connected to the drive sheave (2) characterized in a at least one torsion suspension device (27), between the motor output shaft and the drive sheave (2), for dampening or absorbing torsion jerk/s to or from the endless saw wire (1).

Abstract: A wire saw work piece support device (200) has a support surface (214, 314) adapted for supporting a work piece (100) being sawed by a wire saw (1) during sawing, the support surface (214, 314) defining a support plane. The wire saw work piece support device comprises: a solid support body (210); and at least one wire receiving volume (220, 230) for receiving therein a wire (10) of the wire saw 1 during sawing, the at least one wire receiving volume (220, 230) having a work piece side delimited by the support plane, and a base side delimited by a surface portion (224) of the solid support body (210), wherein the at least one wire receiving volume (220, 230) has a thickness between the work piece side and the base side of at least 60 mm in a direction orthogonal to the support plane.

Abstract: A diamond wire saw device including a diamond sawing wire. At least two diamond sawing wires are arranged in the front and back of a cutting working surface along a cutting feed direction, or at least two groups of the diamond sawing wires are arranged in the front and back of more than one parallel cutting working surface. The diamond sawing wires in the same group are parallel to one another to form a layer of cutting mesh surface. The diameter of a latter diamond sawing wire or a latter group of diamond sawing wires is equal to or greater than that of a former diamond sawing wire or a former group of diamond sawing wires.

Abstract: A sawing device for sawing silicon blocks comprises at least one cutting element for sawing silicon blocks, the cutting element being drivable by means of a drive device, at least one guide device, with the at least one cutting element being alignable along a predetermined path by means of the at least one guide device, and at least one monitoring device for monitoring the position of the at least one cutting element.

Abstract: Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers. The workpieces can be aligned within a holder to produce wafers using the device and methods presently provided. The holder rotates about its central axis, which translates to workpieces moving in orbit around this axis. A single abrasive wire, or multiple turns of wire stretched tightly between wire guides, is then contacted with the rotating holder to slice the workpieces.

Abstract: A wire saw assembly having a slide frame, support frames, a tensioning carriage, and a diamond wire cutting saw. The slide frame has a mounting plate attached slidably to mounting plate rails. The mounting plate engages a lead screw so that rotation of the lead screw moves the mounting plate along the mounting plate rails towards or away from a work piece. Two support frames are attached to the mounting plate. Each support frame has two drive wheels and a hydraulic motor for each drive wheel. A hydraulic fluid flow divider distributes hydraulic fluid evenly to each hydraulic motor so that the drive wheels operate in unison. The tensioning carriage has a slide plate with an idler pulley attached slidably to the slide plate rails. The slide plate engages a threaded rod so that rotation of the threaded rod moves the slide plate and idler pulley along the slide plate rails to increase or decrease the tension in the wire saw.

Abstract: The present invention is a band saw cutting apparatus including: a cutting table on which an ingot is horizontally placed; an endless-belt blade provided in a tensioned state between pulleys, the blade having a blade-abrasive-grain portion and a blade base; and a coolant spraying opening for spraying a coolant on the blade, the band saw cutting apparatus cutting the ingot by relatively feeding the blade from above to below, the blade being driven to rotate by rotating the pulleys, wherein the pulleys is configured to be rotatable about an axis thereof in both directions, and a direction of driving to rotate the blade can be changed to cut the ingot. As a result, there is provided a band saw cutting apparatus and an ingot cutting method that can stably secure the quality of the ingot to be cut, increase the lifetime of the blade, and improve the productivity.

Abstract: A method for cutting a workpiece with a wire saw includes running at least one saw wire in a lateral direction. A first abrasive grain slurry is supplied to the saw wire on two points that are separated by a predetermined distance in a lateral direction. Cutting of the workpiece is started by moving at least one of the workpiece and the saw wire relative to the other and bringing the workpiece into contact with the saw wire from above at a location between the two points on the saw wire where the first abrasive grain slurry is supplied. A second abrasive grain slurry is supplied to a part of an area where the saw wire meshes with the workpiece.

Abstract: A method for simultaneously cutting a compound rod of semiconductor material into a multiplicity of wafers. The method includes selecting a first workpiece and a second workpiece, each having two end surfaces; grinding at least one of the two end surfaces of each workpiece so as to create a ground end surface on each workpiece; cementing the ground end surface of the first workpiece to the ground end surface of second workpiece using a fastener so as to produce a compound rod piece having a longitudinal axis, wherein the fastener is disposed between the workpieces so as create a distance between the workpieces; fixing the compound rod piece in a longitudinal direction on a mounting plate; clamping the mounting plate with the compound rod piece in a wire saw; and cutting the compound rod piece perpendicularly to the longitudinal axis using the wire saw.

Abstract: A method for slicing wafers from a workpiece includes providing wire guide rolls each having a grooved coating with a specific thickness and providing rings at opposing ends of a first of the coatings of a respective wire guide roll. The rings are fixed exclusively to the first coating. A sawing wire including wire sections disposed in a parallel fashion is tensioned between the wire guide rolls. The wire sections of the sawing wire are moved relative to the workpiece so as to perform a sawing operation. A change in length of the first coating, brought about by a temperature change, is measured by measuring distances between sensors and the rings. The wire guide rolls are cooled in a manner dependent on the measured distances.

Abstract: A method for slicing wafers from a workpiece includes providing wire guide rolls that each have a grooved coating with a specific thickness, providing a fixed bearing respectively associated with each wire guide roll and providing a sawing wire including wire sections disposed in a parallel fashion. The wire sections are tensioned between the wire guide rolls and are moved relative to the workpiece so as to perform a sawing operation. The wire guide rolls cooled and the fixed bearings are cooled independently of the wire guide rolls.

Abstract: The present invention is a slicing method and a wire saw apparatus including winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel in a reciprocating direction, in which the ingot is sliced with controlling a temperature of the ingot by supplying a slurry for adjusting an ingot temperature to the ingot independently from the slurry for slicing while the slurry for adjusting an ingot temperature is supplied to the ingot only at the exit side of the wire caused to travel in the reciprocating direction. As a result, there is provided a method and a wire saw apparatus in which rapid cooling of an ingot especially in a time close to end of slicing of the ingot can be alleviated, consequently degradation of a nano-topography can be suppressed, and further high-quality wafers having a uniform thickness can be sliced when slicing the ingot by using a wire saw.

Abstract: An integrated wafer processing system and a method thereof is disclosed. In one embodiment, a wafer stack of sliced wafers includes a base, and a plurality of sliced wafers extending outwardly from the base, where the plurality of sliced wafers are obtained by slicing a portion of a work piece, where the base is an uncut portion which is the remaining portion of the work piece or a plate attached by welding to the plurality of sliced wafers and where the work piece is mono-crystalline or multi-crystalline silicon. Further, the wafer stack of sliced wafers are treated in-situ in cleaning and wet chemical tanks for processes such as damage etching, texturization and oxide etching and also treated in-situ in high temperature furnaces for processes such as diffusion and anti-reflection coating.

Abstract: The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide rail of said support table (20), said fastening means (15, 26, 40) consisting of a mounting plate (15) apt to be manufactured to which said piece (10) to be sawed is bonded, and of anchoring means (26, 40) for anchoring said mounting plate (15) directly on said carriage (18).

Abstract: A saw wire includes a steel wire (11) having a steel strand (11a) with predetermined composition, an abrasive (13) fixed to the steel wire (11) by a fixing part (12), and an intermetallic compound (15) on an interface between the abrasive (13) and the fixing part (12). Tensile strength of the steel strand (11) is 3500 MPa or more, and the fixing part (12) includes a Sn-based solder containing Zn or Ag.

Abstract: A sawing rope (270) with abrasive elements (506) fixed on a steel rope (502) with a polymer jacket (504) is described and claimed. The abrasive elements (506) are made of a metallic sleeve on which an abrasive layer is deposited by means of electrolytic deposition, by means of sintering or by means of cladding for example laser cladding. Characteristic about this sawing rope (270) in view of the prior known sawing ropes is that each sleeve shows a connection or closure. Such a connection makes it possible to attach abrasive elements (506) on the rope without having to thread them on the rope (270) as is needed when making prior-art sawing ropes. The inventive sawing rope (270) can therefore be made in long lengths in a very efficient way.

Abstract: To provide a method of slicing a silicon ingot for slicing a silicon ingot using a bonded abrasive wire saw, which can reduce the consumption of the bonded abrasive wire required for the slicing process as much as possible, thereby greatly reducing the manufacturing cost and to provide a wire saw used for this method. In the method of slicing a silicon ingot using a wire saw, while a bonded abrasive wire helically wound at a constant pitch around peripheral surfaces of a plurality of rollers is run with a coolant being supplied onto the wire, and while the coolant is also supplied to a side portion of the silicon ingot to be cut where the wire passes in slicing of the silicon ingot; the silicon ingot is moved relative to the wire, thereby slicing the silicon ingot to form a plurality of silicon wafers.

Abstract: The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide rail of said support table (20), said fastening means (15, 26, 40) consisting of a mounting plate (15) apt to be manufactured to which said piece (10) to be sawed is bonded, and of anchoring means (26, 40) for anchoring said mounting plate (15) directly on said carriage (18).

Abstract: Water-based cutting fluids for use with diamond wiresaws that are used for cutting or otherwise treating hard brittle materials, e.g., silicon ingots, comprise: A. Water-soluble, polymeric dispersing agent, typically a polycarboxylate; B. Optionally wetting agent; C. Optionally defoamer; B. Optionally corrosion inhibitor; E. Optionally chelant; F. Optionally biocide; and G. Water. Typically water comprises at least 50 weight percent of the fluid, and the polycarboxylate is grafted with a polyalkylene glycol, e.g., polyethylene glycol.

Abstract: A process is provided in which a metal chelating agent is dissolved in an aqueous or glycol-based cooling fluid to form a chelating solution with a chelating agent concentration. A silicon boule is cut with a saw to detach a silicon wafer from the boule while the interface between the silicon boule and the saw is bathed with the chelating solution during the cutting.

Abstract: An interchangeable concrete cutting chain-saw cutting assembly (500) adapted for installation upon a drive assembly (112) in exchange for a removed, different type cutting head assembly. The chainsaw cutting assembly (500) includes a housing (703) that has fasteners that releasably attach the housing (703) to a drive assembly (112) in an installed configuration. A ratio transmission (525) has a plurality of interconnected rotatable members (533, 535), each rotatable member (533, 535) having a mounting shaft (641, 643) positioned at a fixed location on the housing (703) by a bearing assembly (640, 642). The driven member (533) has a receiver that interconnects with a driveshaft (372) of the drive assembly (112) in the installed configuration whereby the driven member (533) is rotated by the drive assembly (112). The cutting chain drive member (535) operatively interconnected with a drive sprocket (707) whereby rotation of the cutting chain drive member (535) rotates the drive sprocket (707).

Abstract: Belt for cutting solid aggregate material such as natural or synthetic stone, include a main belt body comprised of a flexible material and having outer and inner loop surfaces. Multiple drive lugs project from the inner loop surface toward the interior of the loop, and each lug has a belt drive surface generally transverse to the main belt body. Multiple abrasive segments containing diamond particles are partially embedded in the main belt body, so that they form a part of the outer surface of the main belt body. Methods of manufacturing and using the cutting belt are also disclosed.

Abstract: The present invention describes electroformed thin-wall nickel core drills that are impregnated with diamond abrasives. The thin-wall core drills are formed with a plurality of raised portions and an equal plurality of recessed portions, with each raised portion alternating with a recessed portion, the raised and recessed portions are substantially parallel and are connected by transition portions. In another embodiment, some of the transition regions are formed with intermediate steps or partially raised and recessed portions. These intermediate steps or partially raised or recessed portions allow more uniform distribution of matrix material across a kerf width D1 as the core drill is spun, thereby, giving the cut edge a substantially square profile.

Abstract: Provided are an apparatus and a method for sawing a single crystal ingot. The apparatus includes a wire saw sawing an ingot, a roller driving the wire saw, and a bath containing a liquid cooling the ingot before sawing the ingot.

Abstract: A method of dividing single crystals, particularly of plates of parts thereof, is proposed, which can comprise: pre-adjusting the crystallographic cleavage plane (2?) relative to the cleavage device, setting a tensional intensity (K) by means of tensional fields (3?, 4?), determining an energy release rate G(?) in dependence from a possible deflection angle (?) from the cleavage plane (2?) upon crack propagation, controlling the tensional fields (3?, 4?) such that the crack further propagates in the single crystal, wherein G(0)?2?e(0) and simultaneously at least one of the following conditions is satisfied: ? ? G ? ? ? ? = 0 ? 2 ? ? e h ? ? if ? ? ? 2 ? G ? ? 2 ? 0 ? ? or ( 2.1 ) ? ? G ? ? ? ? 2 ? ? e h ? ? ? ? : ? ? 1 < ? < ? 2 . ( 2.

Abstract: The present invention provides a self-cleaning wiresaw cutting apparatus including a cleaning mechanism adapted to clean the components of the wiresaw before, during, or after a cutting process or to humidify the cutting region of the apparatus. The apparatus contains at least one dispenser adapted to dispense an aqueous fluid onto various components of the wiresaw.

Abstract: The present invention provides a wiresaw cutting method comprising cutting a workpiece with a wiresaw while applying an aqueous cutting fluid to the wiresaw from a recirculating reservoir of cutting fluid, monitoring at least one of a chemical property, a physical property, or both, and adjusting the chemical composition of the cutting fluid while cutting the workpiece to maintain the property being monitored. The present invention additionally provides an apparatus to perform the inventive method.

Abstract: A method and apparatus of cutting and cleaning wafers in a wire saw is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located substantially in a vertical plane and move in a substantially vertical direction, a first top outlet and a second top outlet located in a top position with respect to a work piece for applying fluids during sawing, and at least one chute located substantially below the work piece for receiving the fluids, wherein the work piece is impelled against the vertical wire web by horizontal movement and the fluids flow in a vertical direction against and into the work piece for slicing and cleaning wafers.

Abstract: A method and a device for cutting a workpiece (1, 21) in a wire saw is described, wherein a workpiece (1, 21) is fixed in a wire saw by means of a mounting beam (2, 22). In the method according to the invention, the generation of a mark or a step on the cutting area along the cutting slit at the transition from the workpiece to the mounting beam (2, 22) is moved further to the edge of the cutting area or is avoided entirely. Therefore, the workpiece (1, 21) is held during the cutting operation in the wire saw by a mounting beam (2, 22) such that while one of the two piercing points (9; 29) lies on the surface of the workpiece (1, 21) and while simultaneously the other (10; 30) of the two piercing points (9, 10; 29, 30) lies on the surface of the mounting beam (2; 22), the piercing point lying on the surface of the workpiece is the entry side piercing point.

Abstract: The present invention relates to a method and a system for manufacturing wafer-like slices from a body of a substrate material, especially for use in the manufacture of semiconductor devices. The method comprises providing a slicing device with a cutting wire equipped on its surface with abrasive particles; providing an aqueous cooling and lubricating fluid, said fluid having an ionic strength corresponding to an electrical conductivity of about 30 IJS/cm or less; cutting said body with said cutting wire into slices while dispensing said cooling and lubricating fluid into a kerf area where said cutting wire contacts and cuts said body, said cooling and lubricating fluid promoting removal of powdered substrate material from said kerf area resulting in spent fluid; and removing said spent fluid from said cutting device and recovering said powdered substrate material from said spent fluid.

Abstract: A protection device for a rope saw assembly (5) includes at least two, telescopically displaceable relative to each other, cover members (12, 13) having each a circular cross-section, an extending along a longitudinal axis receiving space (14) for the saw rope (8), and a longitudinally extending opened slot (15, 16), and provided each with a securing device (18, 20) located on one end (17, 19) of each of the cover members (12, 13) for securing a respective cover member (12, 13) to a respective deflection roller (6, 7) of the rope saw assembly (5).

Abstract: The sawing machine comprises a guide pulley composed of a plurality of wheels of the same diameter, coaxial and mutually juxtaposed side by side in a pack on a corresponding shaft or the like According to the invention, in said wheel pack of the guide pulley (P2) a wheel (P21) presenting at least an external circumferential groove (P21?) and a wheel (P22) presenting a plurality of external circumferential grooves (P22?) are alternated in a repetitive sequence. Said wheels (P21, P22) comprise a radially internal part (P21.1, P22.1), at which they are mutually juxtaposed in a pack. Each wheel (P21) presenting at least a groove (P21?) comprises a radially external part (P21.2) having an external annular rim (P21.3) of lesser width than the thickness of said internal part (P21.1) thereof, while each wheel (P22) presenting a plurality of grooves (P22?) comprises a radially external part (P22.2) having an external annular rim (P22.3) of a width greater than the thickness of said internal part (P22.

Abstract: Saws (1) for cutting or sawing harder materials, such as concrete, concrete structures, brick and stone, have an endless cutting member (4) that is driven through a transmission assembly (11, 20) being supported in the saw and having a drive member and that is guidingly supported on a cutting member supporting portion (3). In such a saw a clamping member is provided that for providing a friction drive contact between the drive member, the clamping member and the cutting member is biased in a direction towards the drive member with driven parts (7) of the cutting member introduced there between, whereby an essentially reduced load on the actual saw, its parts and the cutting member is obtained as well as an improved functionality in the form of an increased flexibility and safety during operation of the saw. The invention also relates to a transmission assembly as well as a cutting member for such a saw.

Abstract: The invention provides a method and apparatus for removing magnetic or magnetized contaminants from a wiresaw cutting slurry during a wiresaw cutting process. The apparatus comprises a recirculating slurry dispensing system that defines the slurry flow pathway. The recirculating dispensing slurry system comprises a magnetic separator for removing magnetic or magnetizable contaminants from the slurry, wherein the purified slurry is discharged back into recirculation within the recirculating slurry dispensing system.

Abstract: The present invention provides an aqueous wiresaw cutting fluid composition that reduces the amount of hydrogen produced during a wiresaw cutting process. The composition is comprised of an aqueous carrier, a particulate abrasive, a thickening agent, and a hydrogen suppression agent.

Abstract: The present invention provides a method of improving nanotopography of a surface of a wafer sliced from an ingot by using a wire saw apparatus, including improving straightness of feed of a work feed table which is included in the wire saw apparatus and used for feeding the ingot to a wire row formed by winding a wire around a plurality of rollers, and also provides a wire saw apparatus for slicing an ingot to manufacture a wafer, including: a wire row formed by winding a wire around a plurality of rollers; a work feed table for holding and feeding the ingot to the wire row; and a linear-motion guide for linearly guiding the work feed table, wherein a component having a wavelength of 20 to 200 mm in straightness of feed of the work feed table satisfies a PV value ?1.0 ?m. As a result, there are provided the method of eliminating slice waviness having periodicity to improve the nanotopography of the surface of the wafer and the wire saw apparatus.

Abstract: The present invention relates to an apparatus and to a method for cutting a concrete structure using a diamond wire saw. More particularly, the present invention relates to an environmentally-friendly cutting apparatus using a wire saw and to a cutting method using the same, capable of completely collecting concrete sludge and dust generated during the cutting of the concrete structure without deteriorating work efficiency, and specially controlling the sludge generated during underwater cutting in an efficient manner to prevent environmental contamination. The cutting apparatus of the present invention comprises a jig case and a sealing cover unit for sealing the cut surface of a target structure for cutting, a wire saw, and a jig for changing the direction (a set of pulleys for guiding the wire saw), thus perfectly preventing dust and sludge generated during cutting of the structure from being exposed to the air or water to prevent environmental contamination.

Abstract: An ingot cutting apparatus having at least one coolant pocket storing the coolant to be supplied to the blade, wherein the blade-abrasive-grain portion is brought into contact with the coolant stored in the at least one coolant pocket by causing the blade-abrasive-grain portion of the blade to travel through a groove portion provided at an upper portion of the at least one coolant pocket while driving to rotate the blade so that the coolant is supplied to the blade.

Abstract: The present invention provides a substrate formed at a low cost and having a controlled plate shape, an epitaxial layer provided substrate obtained by forming an epitaxial layer on the substrate, and methods for producing them. The method for producing the substrate according to the present invention includes an ingot growing step serving as a step of preparing an ingot formed of gallium nitride (GaN); and a slicing step serving as a step of obtaining a substrate formed of gallium nitride, by slicing the ingot. In the slicing step, the substrate thus obtained by the slicing has a main surface with an arithmetic mean roughness Ra of not less than 0.05 ?m and not more than 1 ?m on a line of 10 mm.

Abstract: The present invention is a band saw cutting apparatus including: a cutting table on which an ingot is horizontally placed; an endless-belt blade provided in a tensioned state between pulleys, the blade having a blade-abrasive-grain portion and a blade base; and a coolant spraying opening for spraying a coolant on the blade, the band saw cutting apparatus cutting the ingot by relatively feeding the blade from above to below, the blade being driven to rotate by rotating the pulleys, wherein the pulleys is configured to be rotatable about an axis thereof in both directions, and a direction of driving to rotate the blade can be changed to cut the ingot. As a result, there is provided a band saw cutting apparatus and an ingot cutting method that can stably secure the quality of the ingot to be cut, increase the lifetime of the blade, and improve the productivity.

Abstract: The wire saw for sawing a work piece, e.g. to make silicon wafers for electronic applications, has two or more sawing fields (10, 20) each having a number of saw wires (11, 21) stretched between respective wire guiding cylinders (3, 4; 5, 6). The sawing fields are disposed one above the other. A first sawing field (10) includes deflection rollers (7) for deflecting slack sides (14) of its saw wires that face a second sawing field (20). The slack sides (14) of the saw wires of the first sawing field are guided over the deflection rollers (7) so as to deflect the saw wires and thus increase distances of their slack sides (14) to sawing sides (23) of the saw wires of the second sawing field (20).