Abstract: A wash cylinder or chamber for an automated cleaning station to clean an object or a person's body part includes nozzles on the interior of the cylinder, the nozzles of one embodiment comprising an increasing roll angle providing a novel spray pattern. Additionally, embodiments of the invention include fluid guidance and conveyance structures, angled nozzles, sealing structures, finger guards, nozzle ribs, wash chamber seating mechanisms and drains, and nozzle inlays having a plurality of nozzles. Also disclosed are methods of washing an object or body part using a wash cylinder or chamber and methods of assembling a wash cylinder or chamber.

Abstract: An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.

Abstract: An apparatus for etching a substrate includes (a) a nozzle system including at least one nozzle through which acid solution containing at least hydrofluoric acid is sprayed onto the substrate, (b) a mover which moves at least one of the nozzle system and the substrate relative to the other in a predetermined direction in such a condition that the substrate and the nozzle system face each other, (c) a filter system which filters off particles out of the acid solution having been sprayed onto the substrate, and (d) a circulation system which circulates the acid solution having been sprayed onto the substrate, to the filter system, and further, to the nozzle system from the filter system.

Abstract: The present invention provides a wafer cleaning machine, which includes a machine base, a rotating disk for bearing and driving a wafer, a first nozzle for spraying ion water to the surface of wafer, a brushing module, and a second nozzle. The rotating disk is connected with the machine base. The first nozzle is connected with the machine base and it is above the rotating disk. The brushing module is connected with the machine base and it is above the rotating disk. The second nozzle is connected with the machine base and it is above the rotating disk.

Abstract: A filter cleaning apparatus 1 is a device designed exclusively for cleaning a cartridge filter used in a fluidized bed granulator. A cleaning liquid 10 is reserved in a processing container 2. In the processing container 2, a cartridge filter 3 is placed in the state of being immersed in the cleaning liquid 10. The filter 3 is so disposed as to be capable of rotating around a rotational axis line O that is substantially horizontal in the processing container 2. Air nozzles 8 are disposed below the cartridge filter 3. An uplift pressure of bubbles rising out of the liquid into the atmosphere is added to a bubble flow BF jetted from the air nozzles 8. As a result of the synergic effect of the jet pressure of the bubble flow BF and the uplift pressure, the filter 3 rotates in an efficient way, leading to an improvement in cleaning efficiency.

Abstract: An etching apparatus for substrates includes an etching tank including an etching solution, a cassette having a plurality of substrates mounted therein and which is installed inside the etching tank, a porous plate installed on a lower surface of the cassette and a plurality of discharge sections provided in the porous plate corresponding to the substrates and each of the discharge sections having a plurality of discharge ports. The etching apparatus further includes a plurality of first lines connected to the discharge ports respectively, and supplied with a gas to provide bubbles to the substrates through the discharge ports. The first lines are divided into a plurality of groups, and at least one group is supplied with a gas having a pressure different from a pressure of a gas supplied to other groups.

Abstract: An apparatus (100) for spraying an etchant solution on a preformed printed circuit board (30) includes a number of feed pipes (40) for supplying the etchant solution and a number of nozzles (45) mounted on the feed pipes. Each of the feed pipes has a middle portion (402) and two end portions (401). The middle portions of the feed pipes are located on a first plane and the end portions of the feed pipes are located on a second plane parallel to the first plane. The number of nozzles are mounted on the middle portion and the two end portions of each feed pipe. The number of nozzles are in fluid communication with the feed pipes.

Abstract: A sheetfed resist removing apparatus having a substrate (111) being a cleaning object placed therein, includes a treatment chamber (101) forming a closed space, and a spray nozzle (102) to spray a cleaning liquid in a form so-called liquid drops over a surface of the substrate (111), in which the treatment chamber (101) forms the closed space containing the substrate (111) such that the placed substrate (111) faces the spray nozzle (102). This structure allows a cleaning liquid to be in the form of liquid drops in consideration of energy reduction, and permits desirable regulation of the temperature of the liquid drops when the liquid drops contact with the resist film in spraying the cleaning liquid over the resist film on the surface of the substrate (111) to thereby remove the resist film, so that secure removal of the resist film can be accomplished.

Abstract: A pan inverting system (10) comprises a rotating table (11) having a central longitudinal axis (13), the table being rotatably mounted within a static frame (15) for rotation about the longitudinal axis (13). Conveyors (21) are disposed on opposed pan-receiving surfaces (20) of the table (11). The conveyors (21) are independently operable to displace a pan (12) along the table (11) in a direction substantially parallel to the longitudinal axis (13). A pan engagement device (24) within the table (11) is operable to releasably fasten the pan (12) to the pan receiving surface (20) of the table (11), such that when the pan (12) is fastened to one of the pan receiving surfaces (20) by the pan engagement mechanism (24), rotation of the table (11) about the longitudinally extending axis (13) will invert the pan (12).

Abstract: Apparatuses, and related methods, for processing a workpiece that include particular baffle members or duct structures having an inlet proximal to an outer periphery of a workpiece and/or workpiece support.

Abstract: An edge bead removal device for a spin coater apparatus and methods of edge bead removal that overcome the deficiencies of conventional edge bead removal techniques. The edge bead removal device includes a coater cup and a head situated within the coater cup proximate to a peripheral edge of a substrate. The head is movable in a radial direction relative to an azimuthal axis of a rotatable substrate support inside the coater cup. The position of the head relative to a rim of the peripheral edge is mapped using an optical sensor. When the substrate support rotates the substrate and the head is used to dispense edge bead removal chemical, the radial position of the head is adjusted, as guided by the map, relative to the azimuthal axis to maintain a constant gap between the head and the substrate's peripheral rim.

Abstract: Solar wafer clean systems, methods and apparatus capable of receiving wafer combs that have been treated with a wire-saw cutting device and providing final clean solar wafers while the wafers are on the beam (before or without any pre-cleaning) are disclosed. Embodiments of methods and apparatus produce clean solar wafers while attached to the beam without the need for a pre-clean step or tool. As such certain of the embodiments provide efficient and cost-effective cleaning of solar wafers on the beam that is also economically viable on a commercial scale.

Abstract: An apparatus and method for cleaning polymer film are provided and include a support assembly for supporting the polymer film to be cleaned, the support assembly being constructed and arranged to move the polymer film for cleaning, and at least one nozzle disposed adjacent the polymer film for providing CO2 to the polymer film for dislodging particulate matter from the polymer film and the at least one aperture, and for cleaning thereof.

Abstract: Provided are a substrate support unit and a substrate treating apparatus and method using the same. The substrate support unit includes a first support part and a second support part. The first support part is movable in a first direction. The first support part supports a first portion of a substrate in which a processing fluid is supplied in a direction corresponding to the first direction. The second support part is movable in a second direction. The second support part supports a second portion of the substrate. At least one of the first support part and the second support part supports the substrate while the processing fluid is supplied.

Abstract: This invention concerns a component for a painting facility which is contaminated with paint during operation of the painting facility, e.g. a grating, a hanger, a cover and similar, characterized in that it is coated with a plasma polymeric coating containing oxygen, carbon and silicon.

Abstract: The present invention relates to a dishwasher, and more particularly to a dishwasher having multiple wash zones. The dishwasher has an interior tub configured to provide an interior wash chamber for washing dishes. It also has a spray arm assembly configured to spray a first flow of wash liquid over a portion of the interior tub thereby providing a first wash zone. A spray manifold fixed adjacent a lower dish rack provided within the wash chamber is configured to provide a second flow of wash liquid toward the lower dish rack, thereby providing a second wash zone.

Abstract: A plating processing device comprises: a plating bath, on which an object to be plated is mounted; and a sparger provided with plating nozzle and washing nozzle for jetting plating solution and washing solution, respectively, toward the object in such a manner that the used plating solution and washing solution are accumulated and collected in the plating bath. Plating solution is supplied to the plating nozzle from a plating solution tank. Washing solution is supplied to the washing nozzle from a washing solution tank. The used plating solution and washing solution are accumulated in the plating bath, are recovered to the plating solution tank and used again as a plating solution.

Abstract: A cleaning probe capable of providing uniform cleaning to an entire wafer while not damaging the edge portion of the wafer, and a megasonic cleaning apparatus having the cleaning probe are provided. The cleaning probe comprises a front portion located near the center of the wafer, a rear portion connected to a piezoelectric transducer, and a protrusion located between the rear portion and the front portion, located on an edge portion of the wafer, and having a larger cross section width than the front portion.

Abstract: A substrate cleaning device comprises a chamber for cleaning a substrate; a substrate support installed in the chamber providing a surface for supporting the substrate during cleaning thereof; at least one cleaning solution supply outlet for spraying a cleaning solution onto a surface of the substrate; a vibration force generator for supplying a vibratory action; a vibration force generating shaft which receives said vibratory action from the vibration force generator so that said vibration force generating shaft vibrates for agitating the cleaning solution on the substrate; and a vibration force distributor for preventing a vibration force from being concentrated on a portion of the substrate below the vibration force generating shaft.

Abstract: A degreasing jig assembling apparatus includes a robot arm and a table or a conveyor on which a degreasing jig including a bottom plate and a cover member is placed. A ceramic molded body is mounted on the degreasing jig upon degreasing the ceramic molded body. The ceramic molded body is mounted on the degreasing jig on the table or the conveyor. The degreasing jig assembling apparatus further includes a molding body mounting mechanism and a cover member. The molding body mounting mechanism mounts the ceramic molded body at a predetermined position on the bottom plate placed on the table or the conveyor by using the robot arm. The cover member attaching mechanism attaches the cover member to the bottom plate in a manner so as to cover the ceramic molded body mounted on the bottom plate.

Abstract: An first example method and apparatus for etching and cleaning a substrate comprises device with a first manifold and a second manifold. The first manifold has a plurality of nozzles for dispensing chemicals onto the substrate. The second manifold is attached to a vacuum source and/or a dry air/gas source. A second example embodiment is a wafer cleaning device and method that uses a manifold with capillary jet nozzles and a liquid capillary jet stream to clean substrates.

Abstract: An apparatus for wafer cleaning includes an enclosure. A stage is within the enclosure. At least one first wall is within the enclosure, around the stage. A plate is within the enclosure and above the stage, operable to enclose a first region between the stage and the first wall. The apparatus further includes an exhauster fluidly coupled to the first region between the stage and the first wall.

Abstract: A system and method for cleaning a substrate, such as a semiconductor wafer, utilizes a rotatable wafer supporting assembly with a cylindrical body to provide stability for the substrate being cleaned, even at high rotational speeds. The rotatable wafer supporting assembly may include wafer holding mechanisms with pivotable confining members that are configured to hold the substrate using centrifugal force when the wafer supporting assembly is rotated. In an embodiment, the cleaning system may include a positioning system operatively connected to an acoustic transducer to provide meaningful control of the acoustic energy applied to a surface of the substrate by selectively changing the distance between the acoustic transducer and the substrate surface so that the substrate can be cleaned more effectively.

Abstract: A produce cleaning machine provides baskets for holding large and small produce items and water sprayers for directing water jets onto the produce from above and below. One basket is motorized to rotate to more evenly clean the produce, while a further basket can be rolled in and out of the machine to make loading and unloading easier. The force of the spray is adjustable and the rotational speed of the motor is as well to provide for special handling of the produce. Rotation after cleaning is used to help dry the produce, and ultraviolet emission is used to sanitize the produce.

Abstract: An apparatus for cleaning a wafer includes a plurality of holders for contacting and securing peripheral portions of a wafer, and for rotating the wafer, a first plate disposed to face a first surface of the wafer, the first plate having a plurality of first nozzles for spraying a first cleaning solution onto the first surface of the wafer, and a second plate disposed to face a second surface of the wafer that is opposite to the first surface, the second plate having a plurality of second nozzles for spraying a second cleaning solution onto the second surface of the wafer. In operation, the first and second plates and the wafer are rotated in opposite directions. The opposite rotation causes the cleaning solutions to flow abruptly thereby increasing a frictional force between the surfaces on the wafer and the cleaning solutions to improve the efficiency of the cleaning process.

Abstract: Embodiments of the invention provide a semiconductor wafer cleaning apparatus and a related method. In one embodiment, the invention provides a semiconductor wafer cleaning apparatus comprising a wafer stage adapted to support a wafer; a first cleaning unit adapted to spray a first cleaning solution onto the wafer to remove particles from the wafer, wherein the first cleaning solution prevents static electricity from being generated on the surface of the wafer; and a second cleaning unit adapted to provide a second cleaning solution onto the wafer and oscillate a quartz rod to remove particles from the wafer, wherein the second cleaning solution makes a surface of the wafer hydrophilic.

Abstract: A substrate treating apparatus for performing a predetermined treatment of substrates includes a treating tank for storing a treating solution, a holder for holding a plurality of substrates arranged in one direction inside the treating tank, and a bubble generating device for generating bubbles in the treating solution stored in the treating tank. The bubble generating device includes a plurality of cylindrical bodies extending in the one direction and arranged in a direction perpendicular to the one direction. Each of the cylindrical bodies is at least partly formed of a porous member extending in the one direction.

Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.

Abstract: An apparatus and method for cleaning surfaces of semiconductor wafers utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of cleaning fluid formed on a semiconductor wafer surface to increase the amount of gaseous material that reaches the wafer surface through the boundary layer.

Abstract: A cleaning device for use in the production of semiconductor components comprises two feed devices with which a fluid medium is guided across a respective surface of an object to be cleaned so that different faces of the object are simultaneously cleaned. At least two gas feeding devices, having one means each for directing a gas flow onto the surface of the object to be cleaned, open into a cleaning chamber supplying a pressurized cleaning gas. At least two extraction means are connected to the outside of the cleaning chamber for discharging the gas fed to the cleaning chamber. The object can be introduced into the cleaning chamber through at least one gap. At least two ionization means are used to ionize the gas and the particles that are present in the cleaning chamber. One ionization means each is mounted between a direction means and an extraction means.

Abstract: In accordance with one embodiment there is provided a method of improving the performance of a substrate cleaner of the type having a megasonic probe with a probe shaft extending generally parallel to a surface of a rotating substrate, and at least one dispenser for applying a cleaning liquid onto the surface of the substrate, wherein the megasonic probe agitates the liquid on the surface. The method comprising dissolving gas in the liquid before the liquid reaches the dispenser. In accordance with another embodiment, an apparatus for cleaning substrates comprises a rotary fixture which is adapted to support a substrate and rotate the substrate about a first axis, a probe having a probe shaft extending generally parallel to a surface of the substrate, and a megasonic transducer in acoustically coupled relation to the probe.

Abstract: A substrate treatment apparatus comprises a treatment vessel, a substrate holder for rotating the substrate in a horizontal plane in the treatment vessel, a nozzle unit arranged in an upper part of the treatment vessel such that a liquid is downwardly fed, a feed line for feeding the liquid to the nozzle unit, and a chamber enclosing therein the apparatus in its entirety. The nozzle unit is constructed in a form of a bar such that as viewed in plan, the liquid ejected from the nozzle unit reaches the substrate with an area range having a length not smaller than a diameter of the substrate and a width smaller than the diameter of the substrate.

Abstract: A cleaning apparatus includes upper and lower nozzle assemblies supplying a cleaning liquid to edge and bottom sections of a semiconductor substrate. The upper nozzle assembly has a first nozzle supplying the cleaning liquid onto the edge section, and second and third nozzles supplying a nitrogen gas for preventing the cleaning liquid from moving into a center portion of the semiconductor substrate. The cleaning liquid supplied to the edge section flows from the edge section towards a side section of the semiconductor substrate due to the rotation of the semiconductor substrate. An ultrasonic wave generator is provided above the edge section for generating ultrasonic waves. The ultrasonic waves are applied to the cleaning liquid supplied onto the edge and bottom sections, thereby improving the cleaning efficiency. The cleaning apparatus has a guide to guide the cleaning liquid supplied to the edge section toward the side section.

Abstract: A substrate cleaning apparatus is provided that includes a cleaning cup for receiving a to-be-cleaned substrate, a table in the cleaning cup, a first, second, and third nozzles, a pure water heating mechanism configured to supply hot pure water, a branch line, a control mechanism, and an open/close valve, provided between the branch line and the pipe, wherein the open/close valve is configured to interrupt emission of hot water from the third nozzle by opening the open/close valve to lower the pressure in the pipe.

Abstract: The present invention provides a method and an apparatus for cleaning substrates. The cleaning chamber defines a processing cavity adapted to accommodate a substrate therein. In one embodiment, the cleaning chamber includes a chamber body having a processing cavity defined therein. A substrate is disposed in the processing cavity without contacting other chamber components by a Bernoulli effect and/or by a fluid cushion above and/or below the substrate. Fluid is flowed into the processing cavity at an angle relative to a radial line of the substrate to induce and/or control rotation of the substrate during a cleaning and drying process.

Abstract: The present invention provides a megasonic cleaning apparatus configured to provide effective cleaning of a substrate without causing damage to the substrate. The apparatus includes a probe having one of a variety of cross-sections configured to decrease the ratio of normal-incident waves to shallow-angle waves. One such cross-section includes a channel running along a portion of the lower edge of the probe. Another cross-section includes a narrow lower edge of the probe. Another cross-section is elliptical. Another cross-section includes transverse bores originating in the lower edge of the probe. As an alternative to, or in addition to, providing a probe having a cross-section other than circular, the present invention may also provide a probe having a roughened lower surface.

Abstract: There are provided an electroless plating apparatus and a post-electroless plating cleaning method which can remove Co or Ni particles, produced upon electroless plating onto Cu interconnects of an electronic circuit substrate and remaining on a silicon oxide film as an interlevel dielectric, without exerting an adverse influence on the Cu interconnects. The electroless plating apparatus for carrying out electroless plating of the surface of interconnects formed in a surface of an electronic circuit substrate having fine circuit patterns of conductive metal interconnects, includes: a substrate transfer device (62, 76, 86); a loading station (58) disposed in association with the substrate transfer device; at least one electroless plating cell (82) disposed in association with the substrate transfer device; and a scrub cleaning device (66a) and/or a solution cleaning device (66c) disposed in association with the substrate transfer device.

Abstract: A guide wire holding apparatus includes a tray, one or more raised corrugated areas, a fluid source, a syringe, a valve, a drainage system, and one or more coupling devices. Each of the one or more raised corrugated areas is located on the inner surface of the tray and includes one or more slots. A reservoir is formed by the inner surface of the tray and the tray end caps. A flow of fluid provided by the fluid source or the syringe and controlled by the valve partially fills the reservoir. The height of the fluid in the reservoir is partially controlled by the location of the cap hole. Preferably, the cap hole is located at a height that causes the guide wire, which is shown resting in a slot formed in the one or more raised corrugated areas, to be slightly submerged when fluid is flowing from the fluid source or syringe to the drainage system.

Abstract: A cleaning apparatus for medical and/or dental tool provides a possibility to clean the burrs and brushes (files) of the remained tooth material on them after operation on patient. An improved cleaning apparatus for medical and/or dental tool includes a container, comprising a neck with an opening and at least one of a plurality of apertures located in the lower part of the neck, a fluid stream reflector of a lid, which includes a connector comprising a fluid inlet pipe which is coupled by a tubular means with a fluid line via controllable valve, and a cylindrical stand connected to the base, providing a stable position of the container during cleaning process.

Abstract: A method for cleaning a glass substrate before photoresist coating, which method can remove oxide compounds and organic residues from the surface of a metal layer of the glass substrate, comprises the steps of firstly providing an alkaline developer in a concentration of between 0.35% and 0.45%; later immersing the metal film of the glass substrate in the alkaline developer; then rinsing the metal film of the glass substrate after immersed with clean water; and lastly having the surface of the metal film of the glass substrate in a dry treatment.

Abstract: Provided is a wafer rotary holding apparatus by which a reduced pressure is created on an upper surface of a rotary disk by a simple and easy-to-make mechanism with no need of any of a vacuum source apparatus, a compressed air supply apparatus, a compressed gas supply apparatus and other apparatuses in use; a wafer can be held while rotating with no contact to a rear surface thereof; a degree of pressure reduction can be adjusted with ease and even a thin wafer (of 0.1 mm or less in thickness) can be held while rotating with no deformation; and the wafer with a bowing can be held while rotating with no correction of the bowing. A wafer rotary holding apparatus includes: a rotary disk on which a fluid flow path is formed; a through hole formed in a central section of the rotary disk; and a plurality of wafer rests provided on an upper surface of the rotary disk.

Abstract: A system and method for processing an edge of a substrate includes an edge roller and a first proximity head. The first proximity head being mounted on the edge roller. The first proximity head capable of forming a meniscus and including a concave portion and multiple ports opening into the concave portion. The concave portion being capable of receiving an edge of a substrate and the ports including at least one process liquid injection port, at least one vacuum port and at least one surface tension control port.

Abstract: A car wash includes a frame, a guide rail device for moving the car to be washed, and a cleaning apparatus. The cleaning apparatus includes a pair of first cleaning mechanisms and a pair of second cleaning mechanisms. Each of the first cleaning mechanism and the second cleaning mechanisms includes a pivotal frame, a cleaning unit attached to the pivotal frame, and a return unit for returning the pivotal frame to its initial position. The pivotal frames are returned to their position by gravity.

Abstract: A substrate cleaning apparatus and method for a liquid crystal display panel capable of removing foreign substances attached to the lower and upper surfaces of a substrate as well as onto the side surface thereof. The apparatus includes upper and lower cleaning modules arranged in such a manner as to contact the upper and lower surfaces of the substrate. Also, a side-cleaning module is arranged at the side surfaces of the substrate.

Abstract: In accordance with one embodiment there is provided a method of improving the performance of a substrate cleaner of the type having a megasonic probe with a probe shaft extending generally parallel to a surface of a rotating substrate, and at least one dispenser for applying a cleaning liquid onto the surface of the substrate, wherein the megasonic probe agitates the liquid on the surface. The method comprising dissolving gas in the liquid before the liquid reaches the dispenser. In accordance with another embodiment, an apparatus for cleaning substrates comprises a rotary fixture which is adapted to support a substrate and rotate the substrate about a first axis, a probe having a probe shaft extending generally parallel to a surface of the substrate, and a megasonic transducer in acoustically coupled relation to the probe.

Abstract: Semiconductor wafers are cleaned using megasonic energy to agitate cleaning fluid applied to the wafer. A source of energy vibrates an elongated probe which transmits the acoustic energy into the fluid. The probe has a solid cleaning rod and a flared or stepped rear base. In one form, the probe is made of one piece, and in another, the rod fits into a socket in the base. This enables a rod to be made of material which is compatible with the cleaning solution, while the base may be of a different material. A heat transfer member acoustically coupled to the probe base and to a transducer conducts heat away from the transducer. A housing for the heat transfer member and the transducer supports those components and provides means for conducting coolant through the housing to control the temperature of the transducer. In another arrangement, an end of the housing is coupled between the transducer and the probe.

Abstract: The present invention provides a megasonic cleaning apparatus configured to provide effective cleaning of a substrate without causing damage to the substrate. The apparatus includes a probe having one of a variety of cross-sections configured to decrease the ratio of normal-incident waves to shallow-angle waves. One such cross-section includes a channel running along a portion of the lower edge of the probe. Another cross-section includes a narrow lower edge of the probe. Another cross-section is elliptical. Another cross-section includes transverse bores originating in the lower edge of the probe. As an alternative to, or in addition to, providing a probe having a cross-section other than circular, the present invention may also provide a probe having a roughened lower surface.

Abstract: Disclosed is a substrate processing method including a substrate rotating step for rotating a substrate with the substrate held almost horizontally within a chamber; a peripheral edge processing step for discharging a processing liquid to a lower surface of the substrate rotated in the substrate rotating step and causing the processing liquid to flow around an upper surface of the substrate at a peripheral edge thereof from the lower surface of the substrate to process the peripheral edge of the upper surface of the substrate in the chamber; and a both-surface processing step for discharging the processing liquid to both the surfaces of the substrate rotated in the substrate rotating step to process both the surfaces of the substrate in the chamber.

Abstract: A floating cleaning device that cleans marine growth from float and skirt type oil booms. The cleaning device is a floating platform with ramps at the front and rear with tracks that guide the movement of the oil boom past a series of spray washers supplied with pressurized water to remove the marine growth from the oil boom.

Abstract: A cryogenic cleaner for and a method of performing cleaning of a surface that must be substantially free of contaminants has a resiliently mounted nozzle for spraying a cryogenic cleaning medium on the surface. The nozzle is driven in an oscillatory manner at a predetermined amplitude and frequency so the nozzle spray is delivered in a manner to provide pulsing of the spray and to provide as “snow plow” effect on contaminants as the spray delivers the cleaning medium against the surface. The surface is transported past the nozzle, and the cleaning occurs in an enclosed controlled environment.