Abstract: Disclosed is a liquid processing apparatus including first and second cups installed so as to surround a rotation holding unit of a substrate and guide a processing liquid scattered from the rotating substrate downwards. A first driving unit and a second driving unit elevate the first cup and the second cup between a position receiving the processing liquid and the lower position thereof. A controller controls that the first cup and the second cup are ascended at the same time by transferring the driving force of the first driving unit while the first cup or a first elevating member thereof is overlapped with the second cup or a second elevating member thereof from the lower side by setting the ascending speed of the first cup to be higher than the ascending speed of the second cup when the first and second cups are ascended at the same time.

Abstract: There is provided a biochemical analyzer and a method of cleaning fluid components of the same. The biochemical analyzer includes a reagent adding mechanism, a sample adding mechanism, at least one reaction cup, a cleaning mechanism and a waste pipeline connected to the cleaning mechanism. A control system is employed, wherein the control system has a cleaning mode for cleaning fluid components of the biochemical analyzer, having: a) a water injection step; and b) a water discharge. With the cleaning method, the fluid components such as the water drawing device and waste valve on the waste pipeline may be automatically cleaned without manual intervention.

Abstract: A filter cleaning device includes a cleaning chamber operable to receive a gas filter to be cleaned, the cleaning chamber having an inlet through which a gas flow can be admitted and an outlet for gas flow leaving the cleaning chamber, the inlet and outlet being arranged such that the airflow is forced to pass through at least a part of the filter when inserted, the filter cleaning device further comprising a mechanical agitation arrangement operable, in one mode of operation, to generate a linear oscillation along an axis of the filter when inserted and, in another mode of operation, to rotate the filter about an axis of rotation.

Abstract: The substrate treatment method is for treating a substrate with a chemical liquid in a treatment chamber. The method includes a higher temperature chemical liquid supplying step, and a rinse liquid supplying step after the higher temperature chemical liquid supplying step. The rinse liquid supplying step includes: a peripheral edge portion treating step of supplying the rinse liquid selectively onto a center portion of the front surface of the substrate so that a chemical liquid treatment is inhibited on the center portion while being allowed to proceed on a peripheral edge portion of the front surface of the substrate; and an entire surface rinsing step of spreading the rinse liquid over the entire front surface of the substrate to replace the chemical liquid with the rinse liquid on the entire front surface of the substrate after the peripheral edge portion treating step.

Abstract: This disclosure dramatically extends by a factor of 5 to 7, the effective service-life of steel shaving blades by chelating mineral molecules in common tap water, thus preventing them from accumulating and attaching to the blade surfaces.

Abstract: A method for cleaning a post-sputter flat media disk, comprises submerging the disk in a wet conveyor containing a liquid, loading the disk onto a spindle of a spindle system, rotating the disk, engaging the disk on both sides with a pair of rollers such that the disk is wiped on both sides at a disk-roller interface due to the motion of the spindle system, and dispensing a slurry at the disk-roller interface.

Abstract: A cleaning liquid is pressurized and superheated to a condition, in which temperature of the cleaning liquid is above an atmospheric boiling point. A product to be cleaned is interposed between a pair of liquid holding blocks, so that gaps are respectively formed between side surfaces of the product and the liquid holding blocks. The pressurized and superheated liquid is injected to the product so that layers of condensate of vapor of injected cleaning liquid are formed in the gaps. Contamination on the surface of the product is removed by the cleaning liquid and the surface is dried by latent heat of the condensate of the vapor of the cleaning liquid.

Abstract: A method for drying substrates using isopropyl alcohol (IPA) includes: a pre-stage in which heated fluid is injected to a bottom surface of a substrate to raise a temperature of the substrate simultaneously to injection of an organic solvent to a top surface of the substrate and injection of a dry gas to the top surface thereof to improve a vaporization power of the organic solvent; and a final stage in which the injection of the heated fluid is stopped and the organic solvent and the dry gas are injected to the top surface of the substrate.

Abstract: An apparatus for cleaning an article may include a cleaning head. The cleaning head may have a lower edge and may include an annular steam chamber and a steam nozzle. The annular steam chamber may define a vacuum chamber that may be configured to receive the article therewithin. The annular steam chamber may have a plurality of discrete apertures positioned in vertically spaced relation to the lower edge. The steam nozzle may be configured to provide steam to the annular steam chamber for discharge through the apertures into the vacuum chamber.

Abstract: Method for cleaning a steam nozzle (7) of a beverage preparation machine comprising a rinsing container (12) having a top opening (22) and a draining device (23) for evacuating the liquid contained therein; a feed device for feeding the nozzle with liquid; a device (13) for moving the nozzle vertically so that its free end (7a) enters the container (12); and a control unit for controlling the moving and feeding devices. It includes a rinsing sequence with the following steps: the lowering of the nozzle (7) into the rinsing position inside the container; the filling of the container (12) with liquid by the nozzle; and the draining of the container (12) activated by the control unit connected to the moving and feeding devices.

Abstract: A foreign matter removal device 10 preliminary cleans the work 50 in a bucket 12 housed in an input tank 15, then further cleans the work 50 in buckets 13, 14 housed in cleaning tanks 16, 17 by agitating cleaning liquid while inverting the buckets to transfer the work to a subsequent bucket. Particularly, the bottom of the cleaning tank is formed such that the nearer to a center of the bottom, the deeper the bottom becomes. The cleaning liquid overflowing from the cleaning tanks are stored in auxiliary tanks 22, 23. First and second ejection units 29a, 29b are arranged at different heights in the cleaning tank to generate a circulating flow in the cleaning liquid.

Abstract: A cleaning device for cleaning a substrate is provided. In one aspect, the cleaning device includes a brush including a first end, a second end opposed to the first end, an outer surface, and a hollow bore defined in the brush about a central axis of the brush. The brush defines a first cross-sectional area near the first end and a second cross-sectional area near the second end. Both the first and second cross-sectional areas are generally perpendicular to the central axis and the second cross-sectional area is greater than the first cross-sectional area.

Abstract: There is provided a substrate processing method including cleaning a substrate by immersing the substrate in a cleaning solution in a longitudinal direction while the cleaning solution is supplied to a cleaning tank; transferring the substrate picked up from the cleaning tank to a drying chamber while holding the substrate in a longitudinal direction; and drying the substrate in the drying chamber communicating with an upper area of the cleaning tank by alternately supplying a first drying gas containing vapor of a solvent for removing a liquid and a second drying gas without containing the vapor of the solvent for removing the liquid to an area where the substrate is exposed between the upper area of the cleaning tank and the drying chamber after an upper end of the cleaned substrate is picked up from a liquid surface of the cleaning solution.

Abstract: A method for drying a workpiece using an apparatus comprising a liquid bath for immersing said workpiece, a deionized water supply for supplying deionized water to said bath, a partially enclosed volume of heated inert gas located above said liquid bath and a heated inert gas supply for supplying heated inert gas. A first holder is used for holding said workpiece in said liquid bath with a vertical orientation between the first holder and said liquid bath and a second holder, comprising a horizontal member, that is able to hold said at least one workpiece in such a way as to substantially prevent said workpiece from sliding along said horizontal member.

Abstract: The invention relates to a device for draining and rinsing containers (1) filled with fluid, comprising an accommodating unit (4) for accommodating the container (1) and comprising a removal unit, which has a removal line (9), a coupling (8) connected to the removal line (9) for connecting to a removal opening (2) of the container (1), and a pumping apparatus (11) by means of which the fluid in the container can be pumped out of the container, and comprising a rinsing unit, which has a rinsing pin (14), a rinsing line (17) connected to the rinsing pin, and a control apparatus (13), wherein the rinsing pin (14) can be moved by means of the control apparatus (13) in such a way that the rinsing pin automatically pierces a wall (7) of the container (1) and rinses out the container (1) after the container has been drained.

Abstract: A semiconductor substrate cleaning method includes cleaning a semiconductor substrate formed with a line-and-space pattern, rinsing the substrate, supplying the rinse water to rinse the substrate, and drying the substrate. The rinsing includes supplying deionized water and hydrochloric acid into a mixing section to mix the deionized water and the hydrochloric acid into a mixture, heating the mixture in the mixing section by a heater, detecting a pH value and a temperature of the mixture by a pH sensor and a temperature sensor respectively, adjusting an amount of hydrochloric acid supplied into the mixing section so that the rinse water has a predetermined pH value indicative of acidity, and energizing or de-energizing the heater so that the temperature of the mixture detected by the temperature sensor reaches a predetermined temperature, thereby producing the rinse water which has a temperature of not less than 70° C. and is acidic.

Abstract: One processing block is arranged between an indexer block and another processing block. One substrate is transported to a main transport mechanism in the one processing block by a main transport mechanism in the indexer block, transported to a first processing section and a thermal processing section by the main transport mechanism in the one processing block and processing is performed on the substrate. The substrate after the processing is transported to the main transport mechanism in the indexer block by the main transport mechanism in the one processing block. Another substrate is transported to a sub-transport mechanism in a sub-transport chamber by the main transport mechanism in the indexer block, and is transported to a main transport mechanism in another processing block by the sub-transport mechanism in the sub-transport chamber.

Abstract: A method for descaling a metal strip, in which the metal strip is guided in a direction of conveyance through at least two plasma descaling units, in which it is subjected to a plasma descaling, where the plasma descaling is followed directly or indirectly by an operation in which the metal strip is coated with a coating metal by hot dip galvanizing of the metal strip. The metal strip is coated with the coating metal by a vertical passage process. The coating metal is retained as a coating bath in a coating tank by an electromagnetic seal. The metal strip preheated by the plasma descaling is guided, without exposure to air, from the plasma descaling into a protective gas atmosphere of a continuous furnace necessary for the coating.

Abstract: A method of controlling a washing machine, capable of detecting clothes contained in the washing machine by rotating a drum. The method includes supplying a predetermined amount of water when a barrel cleaning is executed, soaking an interior of a drum in water, draining water after the interior of the drum has been soaked in the water, and detecting clothes contained in the drum by rotating the drum. Whether to perform a barrel cleaning is determined according to the existence of the clothes in the drum, so that vibration and noise are prevented from being generated in the washing machine, and accident due to the movement of the washing machine is prevented.

Abstract: Provided is a method of descaling a mask that quickly and effectively removes a material attached to the mask. The method includes: directing a laser beam onto a material attached to the mask; and removing the material attached to the mask.

Abstract: Disclosed are a device for automatically cleaning printed circuit board and a method using the same. The device includes: a printed circuit board (PCB) tray, a transferring unit, an elevator unit, a cleaning unit and a unloading deck; the elevator unit includes a horizontal part and a vertical part; when the elevator unit is descended to the lowest position, an upper surface of the transferring unit is at a same horizontal position with an upper surface of the horizontal part of the elevator unit; the elevator unit is located below the cleaning unit, and the unloading deck is located above the transferring unit. The invention can not only save manpower, but also achieve standardization of the cleaning process and improve working efficiency.

Abstract: A scrub brush housing a swab of foam material impregnated with an anti bacterial disinfectant is first placed over a female luer with an annular portion of the swab compressed against the luer and a central portion of the swab passed into the passage of the luer to effect a full contact with the surfaces of the swab. The swab is then rotated on the female luer for a time sufficient to substantially remove the biofilm on the surfaces of the luer that are contacted by the swab.

Abstract: Electrodes are conveyed edgewise along a path. The electrodes can be supported by their bottom peripheral edge and can be maintained generally vertically. A plurality of wash nozzles are positioned adjacent to the path on opposing sides thereof. Wash spray from the nozzles is directed to impinge sides of the electrode. The nozzles can be arranged linearly to form a nozzle array angled so that the wash spray impinges an upper portion prior to a bottom portion of the electrode. Separate sections for rinsing or pre-washing can be provided within a washing chamber. Used water can be collected and recycled.

Abstract: The wet treatment of wafer-shaped articles is improved by utilizing a droplet generator designed to produce a spray of monodisperse droplets. The droplet generator is mounted above a spin chuck, and is moved across a major surface of the wafer-shaped article in a linear or arcuate path. The droplet generator includes a transducer acoustically coupled to its body such that sonic energy reaches a region of the body surrounding the discharge orifices. Each orifice has a width w of at least 1 ?m and at most 200 ?m and a height h such that a ratio of h to w is not greater than 1.

Abstract: Methods and apparatuses for integrated cleaning of objects comprising a sequence of wet cleaning and vacuum drying in a same process chamber. The present integrated cleaning process can eliminate moving parts, improving the system reliability. Vacuum decontamination can be included for degassing and decontaminating the cleaned objects. In an embodiment, a cleaner system combines various movements into an integrated movement to be handled by a robot, for example, to improve the throughput. For example, an integrated robot movement comprising picking up a closed container from the input load port, moving both the lid and body together, and then depositing the body and lid separately into the appropriate positions in the cleaner to be cleaned.

Abstract: A system including a shuttle movable along a shuttle path, the shuttle being operable to support a sheet; a pick-up assembly including a yoke and a detection plate located above the shuttle path, the detection plate being freely supported by the yoke and movable in a vertical direction relative to the yoke with an upper limit and a lower limit defined by the yoke, wherein the yoke is operable to pick and place the sheet, and wherein the detection plate is used to detect the presence of a piece of debris on a surface of the sheet or a surface of the shuttle; and a cleaning device located adjacent to the pick-up assembly and above the shuttle path, wherein the cleaning device is operable to remove the piece of debris located on the surface of the sheet or the surface of the shuttle.

Abstract: A method for cleaning turbines on-line comprises extracting water from air directly at a turbine site having a turbine and treating the air and the extracted water to obtain extremely clean water having a conductivity of less than 3 microsiemens/cm. This extremely clean water is then fed to the turbine to clean the turbine blades while the turbine is on-line. Preferably the extremely clean water is fed through a deionizer before being fed to the turbine.

Abstract: The embodiments describe methods for controlling the particles generated when cleaning and drying a wafer in a spin rinse dryer (SRD) module. In some embodiments, the substrate surface is cooled by dispensing deionized (DI) water across the surface of the substrate, while the substrate rests on the SRD chuck. In addition, a method for controlling the particles generated when sleeves in a processing module or SRD contact a substrate surface during a clamping operation or when the sleeves are removed from the substrate surface is provided. A bottom edge or lip of the sleeves and/or the surface of the wafer contacting the sleeve is wetted during clamping/unclamping operations. Alternatively, the substrate may be wetted prior to clamping/unclamping operations.

Abstract: A non-contact edge coating apparatus applies coating material to an edge of a non-circular solar cell substrate without physical contact. The apparatus may include a rotatable substrate support configured to hold the substrate. The apparatus may further include an applicator configured to receive a coating material and apply the coating material to an edge of the substrate while the substrate is rotated without any portion of the applicator physically touching the edge of the substrate. The substrate support may be mechanically coupled to a cam, which contacts a follower mechanically coupled to the applicator. A variety of coating materials may be employed with the apparatus including hot melt ink and UV curable plating resist.

Abstract: A system and method for removing polymer residue from around a metal gate structure formed on a surface of a substrate during a post-etch cleaning operation includes determining a plurality of process parameters associated with the metal gate structure and the polymer residue to be removed. A plurality of fabrication layers define the metal gate structure and the process parameters define characteristics of the fabrication layers and the polymer residue. A first cleaning chemistry and second cleaning chemistry are identified and a plurality of application parameters associated with the first and second cleaning chemistries are defined based on the process parameters. The first and second application chemistries are applied sequentially in a controlled manner using the application parameters to substantial remove the polymer residue while preserving the structural integrity of the gate structure.

Abstract: A method for treating substrates with treating liquids, using a treating tank for storing the treating liquids, a holding mechanism for holding the substrates in a treating position inside the treating tank, first and second treating liquid supply devices, a temperature control device, and a control device. A first treating liquid is supplied into the treating tank, then a second treating liquid of lower surface tension and higher boiling point than the first treating liquid is supplied, and placed in a temperature range above the boiling point of the first treating liquid and below the boiling point of the second treating liquid. Then the second treating liquid supply device may be controlled to replace the first treating liquid with the second treating liquid, while controlling the temperature control device to maintain the second treating liquid in the same temperature range.

Abstract: An improved method for cleaning heat exchange tube bundles, fin-fans, and other elongated components, using a portable cleaning system comprising a cleaning unit having a cleaning enclosure that receives and cleans the component and a control unit that controls the operation of the system. The cleaning unit has a cleaning enclosure defining a chamber sized and configured to receive the component through a sealable lid. A roller assembly rotates the component while a spray assembly sprays cleaning fluid over and into the rotating component. The cleaning fluid is heated in the chamber using surface heating elements attached to heat transfer plates along sections of the chamber walls. A vapor recovery system captures and treats toxic vapors. In use, the cleaning system is transported to a facility to clean the components on-site using cleaning fluid supplied by the facility and discharging waste to the facility.

Abstract: A method and system for cleaning a substrate in a multi-module cleaning assembly is provided. The method begins by receiving the substrate into the cleaning module. A cleaning chemistry, at a temperature elevated from an ambient temperature, is applied onto a top surface of the substrate. Concurrent with application of the cleaning chemistry, vapors are exhausted from the cleaning chemistry through a port located below a bottom surface of the substrate with the vapor exhaustion providing a negative pressure relative to a pressure external to the cleaning module. The application of the cleaning chemistry is terminated, followed by termination of the exhausting of the vapors. The substrate is dried after the flowing of inert gas is terminated.

Abstract: The invention relates to a method for the removal of coatings from scrap materials (3), wherein the scrap (3) is brought into contact with a liquid and, while the coating removal process is performed, moves within a conveying trough (2) of a vibrating conveyor (1) in a direction (6) from the inlet end (7) towards the outlet end (8) of said conveying trough (2). The invention is of special importance for the dezincing of steel scrap. The method operates on a continuous basis with the removal of coatings being efficiently accomplished.

Abstract: A method for removing the edge bead from a substrate by applying an impinging stream of a medium that is not a solvent for the material to be removed. The medium is applied to the periphery of the substrate with sufficient force to remove the material. Also, an apparatus to perform the inventive method.

Abstract: The present invention provides a liquid composition for removing dental cement from the surface of non-living objects, comprising i) an inorganic base; ii) a complexing agent; iii) optionally a surfactant; and iv) an aqueous solvent. In a preferred embodiment, the composition comprises a surfactant, and an aqueous solvent comprising water mixed with a polar solvent miscible with water, preferably alcohol. Said objects to be cleaned comprise workpieces and instruments used in restoration work. Said workpieces may comprise crowns, bridges, inlays, and other prostheses. Said instruments may, comprise, for example, tools used during the dental operation which contacted the cement.

Abstract: A substrate is moved in a linear direction simultaneously between a processing face of an upper proximity head and a processing face of a lower proximity head. As the substrate is moved, a first meniscus of processing liquid is generated between the processing face of the upper proximity head and a top surface of the substrate, and a second meniscus of processing liquid is generated between the processing face of the lower proximity head and a bottom surface of the substrate. The first meniscus has a meniscus protrusion extending in the linear direction in which the substrate is moved and positioned on a trailing side of the first meniscus relative to the linear direction in which the substrate is moved. The meniscus protrusion is centered on the substrate relative to a diameter of the substrate as measured perpendicular to the linear direction in which the substrate is moved.

Abstract: A liquid processing apparatus including: a second housing; a first housing capable of being brought into contact with the second housing; a holding part configured to hold an object to be processed; a rotation driving part configured to rotate the object to be processed held by the holding part; front-side process-liquid supply nozzle configured to supply a process liquid onto a peripheral portion of a front surface of the object to be processed held by the holding part; and a storage part disposed on a side of a rear surface of the object to be processed held by the holding part, the storage part being configured to store the process liquid having been passed through the object to be processed. The respective first housing and the second housing can be moved in one direction, so that the first housing and the second housing can be brought into contact and separated from each other.

Abstract: A substrate processing apparatus includes a transferring unit disposed in a connecting part of a washing processing cell and an indexer cell. The transferring unit includes an inverting support portion for supporting a substrate in a horizontal posture, a feed supporting portion disposed at an interval in a vertical direction from the inverting support portion for supporting the substrate in the horizontal posture, and an interposing and inverting mechanism for inverting the substrate to be supported by the inverting support portion and bringing the inverted substrate to be supported by the inverting support portion again. A part of the substrate to be supported by a feed supporting portion is disposed in an inversion region for the substrate to be inverted by the interposing and inverting mechanism.

Abstract: The demulsifying cleaning of metallic surfaces which may be contaminated with oil(s) with at least one further nonpolar organic compound, with fat(s), with soap(s), with particulate dirt or with at least one anionic organic compound using an aqueous, alkaline, surfactant-containing bath solutions.

Abstract: A washing plant (10) comprises a battery (12) of washing and heat-disinfection machines (14, 16, 18) disposed along an alignment axis (X), able to operate in parallel with respect to each other in order to effect the washing and heat-disinfection, at least a translator slider (20) mobile in an automatic manner parallel to the alignment axis (X) in a front position to said battery (12), which receives the objects to be washed and both transports them in correspondence to the entrance of one of the machines (14, 16, 18) selected on each occasion depending on the washing program set or depending on availability, and moves them inside the desired machine (14, 16, 18) in a direction of feed (F) substantially perpendicular to said alignment axis (X), transport means (24) being provided to direct the objects to be washed toward the translator slider (20) operating in a direction of transport (Y) substantially parallel to said alignment axis (X).

Abstract: A method for cleaning a substrate is provided. The method initiates with applying an activation solution to a surface of the substrate. The activation solution and the surface of the substrate are contacted with a surface of a solid cleaning surface. The activation solution is absorbed into a portion of the solid cleaning element and then the substrate or the solid cleaning surface is moved relative to each other to clean the surface of the substrate. A method for cleaning the surface of the substrate with a solid cleaning element that experiences plastic deformation is also provided. Corresponding cleaning apparatuses are also provided.

Abstract: A machine is presented for the cleaning of jewelry. The machine allows the manual or automatic cleaning of jewelry. Under both modes of operation, the jewelry is secured by a user to a support bracket inside a transparent, water-tight cylindrical wash chamber. When in manual mode, the user can direct the spray of wash fluid onto the jewelry by rotating the jewelry using a trackball. When used in automatic mode, the machine washes the jewelry during a preset washing cycle. For both modes, the washing cycle is followed by the drying cycle where a blower directs air onto the jewelry for a set time period to blow off excess moisture. The drying cycle concludes with a blower venting the cylindrical wash chamber to remove residual moisture from the wash chamber and the jewelry. After the cleaning, the user removes the jewelry from the machine.

Abstract: A method of web cleaning, particularly relatively soft polymeric webs, without using dipping baths or ultrasonic energy. The method includes conveying the web against a backup roller and spraying the web with a high pressure liquid while the web is supported by the backup roller. Thereafter, residual fluid from the high pressure stream is stripped from the web by a gas curtain while the web is supported by the backup roller. In many convenient embodiments, the web is contacted with a cleaning roller while the web is in contact with the backup roller.

Abstract: A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes the steps of: forming a photosensitive film made of a photosensitive material on the substrate by said first processing unit before exposure processing by said exposure device. The method also includes applying washing processing to the substrate by said second processing unit after the formation of said photosensitive film by said first processing unit and before the exposure processing by said exposure device and transporting the substrate after the washing processing to said exposure device. The method further includes transporting the substrate from said exposure device and applying development processing by said third processing unit to the substrate transported after the exposure processing by said exposure device.

Abstract: An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.

Abstract: Semiconductor wafers are treated in a liquid container filled at least partly with a solution containing hydrogen fluoride, such that surface oxide dissolves, are transported out of the solution along a transport direction and dried, and are then treated with an ozone-containing gas to oxidize the surface of the semiconductor wafer, wherein part of the semiconductor wafer surface comes into contact with the ozone-containing gas while another part of the surface is still in contact with the solution, and wherein the solution and the ozone-containing gas are spatially separated such that they do not come into contact with one another.

Abstract: A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back

Abstract: A method for cleaning containers, in particular bottles of glass or plastics, and a cleaning machine with at least one cleaning medium, with the containers cleaned at least in one station preferential for the cleaning result and/or in a procedure step with at least essentially chemical-free cleaning media. The cleaning medium is advantageously a granular material, in particular granular ice, carried under pressure with compressed air or compressed water. The cleaning machine suited for carrying out the method includes downstream of an unpacking and presoaking station, a pre-cleaning station with a high pressure water blasting pre-cleaning section, and subsequently an intensive cleaning station with at least one intensive cleaning section to which a pressure blasting system for chemical-free, granular material and a carrier medium are associated, and a disinfection station following the intensive cleaning station.

Abstract: Methods of cleaning workpieces are described. One method includes performing both a sonication cleaning operation and a rinse cleaning operation within a single cleaning tank. Another cleaning method described includes the use of cross flow of cleaning liquid within a cleaning tank while performing a rinse clean. The cleaning method includes the oscillation of one or more workpieces in the cleaning tank to perform the rinse clean.