Abstract: The disclosed embodiments are directed to processes for removing photoreceptor coatings from a substrate, wherein the photoreceptor coatings disposed over a substrate of an electrophotographic photoreceptor. More specifically, the invention discloses a photoreceptor coatings removal process comprises subjecting an electrophotographic photoreceptor to a stripping solution that separates the coatings from the substrate.

Abstract: The present invention is a cleaning composition for use with firearms and industrial items in which all of the components of the composition are biodegradable. The selected components of the composition also have a combined flashpoint of over 200° F. The low volatility of the composition enhances the safety factor by its reduced flammability in conjunction with the low odor and other benefits obtained by the biodegradability of the composition. The composition essentially comprises a hydrocarbon solvent and a lubricant which effectively removes the fouling present within the interior arm of a firearm bore and at the same time lubricates and protects the firearm bore to help prevent the formation of rust.

Abstract: The invention provides an aqueous composition that includes a hydroxy-substituted mono-, di-, or tri-carboxylic acid; phosphoric acid; a surfactant; and water. The invention further provides a method for removing lead from the surface of metal, the method includes contacting a metal surface with an aqueous composition that includes a hydroxy-substituted mono-, di-, or tri-carboxylic acid; phosphoric acid; a surfactant; and water; to provide a metal surface with a reduced amount of leachable lead. The leachable lead on the surface of the metal can be reduced to below 1 ppb by using the composition described herein.

Abstract: The present invention relates to the use of a mixture, comprising one or more alkyl esters of fatty acids and one or more esters of fatty acids of glycerol carbonate, as a fuel or solvent.

Abstract: A method for activating the surface of a base material and an apparatus thereof, which is suited to be utilized for pretreatment in electrochemical treatment such as, for example, electroplating or the like, in which the surface of a base material such as metal can be subjected to degreasing treatment and oxide film removing treatment simultaneously, efficiently and rationally, in which productivity can be enhanced and the equipment cost can be reduced, and in which a waste solution can be rationalized so that the solution can be reutilized and the environmental pollution can be prevented. A method for activating the surface of a base material in which the surface of a member to be treated is subjected to degreasing treatment or oxide film removing treatment. Pressurized carbon dioxide is dissolved in a predetermined quantity of water, thereby preparing an oxide film removing solution having a predetermined acidic concentration.

Abstract: The present invention relates to a method for cleaning polycrystalline silicon fragments to a metal content of <100 ppbw, wherein a polysilicon fraction is added to an aqueous cleaning solution containing HF and H2O2, this aqueous cleaning solution is removed and the polycrystalline fraction thereby obtained is washed with highly pure water and subsequently dried.

Abstract: Chemical method of cleaning metallic residue from forming tools utilizing the application of a caustic material including base or mild acid to the tool for a short period of time. The caustic material is held in substantially fixed relation for a period of time to dislodge the metallic residue followed by neutralization or removal.

Abstract: A composition for removing copper from a surface comprises a polyphosphonic acid, a primary amine, and water. Optionally, the composition may also comprise a dialkanolamine and/or a trialkanolamine, a degreaser, and/or a surfactant. The pH of the composition is between 9.0 and 12.5. The method of removing copper from a surface, which may be a gun bore, involves contacting the surface with the composition.

Abstract: An apparatus and method for removing contaminants from a workpiece is described. Embodiments of the invention describe placing a workpiece on a holding bracket within a process chamber to hold and rotate the workpiece to be cleaned. A first cleaning fluid is provided to the workpiece non-device side, while a degasified liquid is provided to the workpiece device side during megasonic cleaning. The degasified liquid inhibits cavitation from occurring on and damaging the device side of the workpiece during megasonic cleaning.

Abstract: A stabilizer composition comprising a) an amine and b) a compound selected from aliphatic, non-cyclic monomeric polyunsaturated hydrocarbons and terpenes is useful for stabilizing an organic solvent against degradation.

Abstract: By using a rare earth metal having a minimal content of impurity metal element, machining it into a member and cleaning with an organic acid-base capping agent, there is obtained a rare earth metal member composed entirely of a rare earth metal and containing not more than 100 ppm of impurity metal element in a sub-surface zone, which member is characterized by a high surface purity, a large grain size, minimized grain boundaries, and improved halogen resistance or corrosion resistance.

Abstract: The invention relates to a method of cleaning the surface of a material (4) that is coated with an organic substance. The inventive method is characterised in that it comprises the following steps, consisting in: introducing the material (4) into a treatment chamber (2), having a pressure of between 10 mbar and 1 bar therein, which is supplied with a gas stream containing at least 90 volume percent of oxygen; and generating a plasma by passing an electric discharge between the surface of the material and a dielectric-covered electrode (5a, 5b, 5c, 5d, 5e, 5f, 5g) in order to break down the organic substance under the action of the free radicals O thus produced. The invention also relates to an installation (1) that is used to carry out said method.

Abstract: Process kit shields for use in a process chamber and methods of use thereof are provided herein. In some embodiments, the process kit shield may include a body having a wall comprising a first layer and a second layer bonded to the first layer, wherein the first layer comprises a first material resistant to a cleaning chemistry utilized to remove material disposed on the first layer during processing, and wherein the second layer comprises a second material different than the first material and having a coefficient of thermal expansion substantially similar to that of the first material. In some embodiments, the process kit shield may be disposed in a process chamber having a processing volume and a non-processing volume.

Abstract: A composition for removing a residue from a wiring board containing an oxidizing agent and an azole compound and having a pH of from 1 to 7 and a cleaning method of a wiring board for removing a residue after dry etching by using this composition are provided. By using the composition for removing a residue of the present invention, in manufacturing a wiring board, residues remaining after dry etching which are derived from a resist or metals can be effectively removed without corroding titanium or titanium alloys with high corrosiveness. In particular, a semiconductor device using a wiring board containing titanium or titanium alloys can be efficiently manufactured.

Abstract: A cleaning composition based on an aqueous or non-petroleum solvent, and useful for cleaning exterior surfaces such as aircraft exterior surfaces and other metal, glass, rubber and polymer surfaces possesses solvent-like properties with respect to greasy soils; inhibits corrosion and degradation of rubber; is biodegradable; forms a stable emulsion with water; remains optically clear and stable at multiple dilutions with water; and conforms to MIL-PRF 87937D. The composition includes at least one fatty acid methyl ester, at least one ethoxylated alcohol having an HLB ranging from about 10 to about 14, at least one alkyl polyglycoside having an HLB ranging from about 10 to about 14, at least one hydrotrope, an alkali metal silicate, at least one corrosion inhibitor in an amount effective to prevent corrosion on metals, and water.

Abstract: An aqueous, concentrated neutral detergent composition for use in cleaning medical instruments and metal components (parts, tools, utensils, vessels, equipment, and surfaces) having scale control and corrosion inhibition properties when diluted to about 1/40 ounce per gallon to about 1/10 ounce per gallon in potable water. In addition, the concentrate may be applied directly to metal surfaces, such as stainless steel, to remove rust and other stains, without causing any additional corrosion or other damage to the metal surface.

Abstract: A method of wet cleaning a surface is disclosed. The method of wet cleaning a surface of at least one material chosen from silicon, silicon-germanium alloys, A(III)/B(V)-type semiconductors and epitaxially grown crystalline materials, such as germanium, includes the following successive steps: a) the surface is brought into contact with an HF solution; b) the surface is rinsed with acidified, deionized water, then a powerful oxidizing agent is added to the deionized water and the rinsing is continued; c) optionally, step a) is repeated, once or twice, while optionally reducing the contacting time; d) step b) is optionally repeated, once or twice; and e) the surface is dried.

Abstract: An aqueous, concentrated neutral detergent composition for use in cleaning medical instruments and metal components (parts, tools, utensils, vessels, equipment, and surfaces) having scale control and corrosion inhibition properties when diluted to about 1/40 ounce per gallon to about 1/10 ounce per gallon in potable water. In addition, the concentrate may be applied directly to metal surfaces, such as stainless steel, to remove rust and other stains, without causing any additional corrosion or other damage to the metal surface.

Abstract: The present invention relates to a novel etching solution suitable for characterizing defects on semiconductor surfaces, including silicon germanium surfaces, as well as a method for treating semiconductor surfaces with an etching solution as disclosed herein. This novel etching solution is chromium-free and enables a highly sufficient etch rate and highly satisfactory etch results.

Abstract: A method of cleaning a wafer after an etching process is provided. A substrate having an etching stop layer, a dielectric layer, a patterned metal hard mask sequentially formed thereon is provided. Using the patterned metal hard mask, an opening is defined in the dielectric layer. The opening exposes a portion of the etching stop layer. A dry etching process is performed in the environment of helium to remove the etching stop layer exposed by the opening. A dry cleaning process is performed on the wafer surface using a mixture of nitrogen and hydrogen as the reactive gases. A wet cleaning process is performed on the wafer surface using a cleaning solution containing a trace amount of hydrofluoric acid.

Abstract: A method for cleaning a work string which may have been used to inject drilling muds, cement slurries, cement displacement materials and the like into a well where the work strong may contain drilling mud residues, cement slurry residues, cement slurry displacement materials, pipe thread lubricants, pipe dope and the like, as well as corrosion on the inside of the work string by injecting a dispersion slug into and recovering the dispersion slug from the work string.

Abstract: The invention relates to methods and compositions for removing metal oxide soils from surfaces. The compositions include an anionic surfactant and a pH adjuster at an acidic pH. In one embodiment, the invention relates to a method of removing a metal oxide soil from a surface by (1) applying a use composition to the surface, the use composition having a pH adjuster in an amount sufficient to provide a use pH at or below 7, an anionic surfactant in an amount to remove a portion of the metal oxide soil, and a carrier, (2) removing the metal oxide soil from the surface with the use composition, and (3) rinsing the surface to remove the use composition and the metal oxide soil.

Abstract: A method for achieving high purity in a jig for semiconductor heat treatment includes subjecting a semiconductor heat treatment jig made of a substrate having a surface covered with a silicon carbide film grown by chemical vapor deposition or a semiconductor heat treatment jig made of a silicon carbide film grown by chemical vapor deposition to high-temperature oxidation heat treatment so as to form an oxide film on a surface of the silicon carbide film, and removing the oxide film.

Abstract: An aqueous, concentrated neutral detergent composition for use in cleaning medical instruments and metal components (parts, tools, utensils, vessels, equipment, and surfaces) having scale control and corrosion inhibition properties when diluted to about 1/40 ounce per gallon to about 1/10 ounce per gallon in potable water. In addition, the concentrate may be applied directly to metal surfaces, such as stainless steel, to remove rust and other stains, without causing any additional corrosion or other damage to the metal surface.

Abstract: The invention is generally related to cleaning compositions and methods of using same. More particularly, the invention is related to cleaning compositions which are substantially free of volatile organic chemicals.

Abstract: The present invention relates to a method for characterizing defects on silicon surfaces, such as silicon wafers, a method for treating silicon surfaces with an etching solution, and an etching solution to be employed in the treating and defect characterization of such silicon wafer surfaces.

Abstract: The present invention relates to a method for treating plastic substrates structured by means of a laser or generation of seed structures on the surface that are suitable for subsequent metallization. The substrates, after the laser structuring, are brought into contact with a process solution that is suitable for removal of the unintentional deposits that arise during the laser structuring. The treatment of the laser-structured substrates with a mixture of wetting agents and compositions that support the cleaning before metallization leads to sufficient removal of the unintentionally deposited metal seeds, without having a lasting damaging effect on the planned structured surface paths.

Abstract: Systematic and effective methodology to clean capacitively coupled plasma reactor electrodes and reduce surface roughness so that the cleaned electrodes meet surface contamination specifications and manufacturing yields are enhanced. Pre-cleaning of tools used in the cleaning process helps prevent contamination of the electrode being cleaned.

Abstract: Methods are disclosed for cleaning a material by applying a cleaning composition having one or more biosurfactants and one or more enzymes to the material. During use, the material is agitated with the cleaning composition. The cleaning composition can be used as a fabric cleaner, carpet cleaner, deodorizer, disinfectant, all purpose cleaner, kitchen counter cleaner, window cleaner, bar soap additive, septic and sewage cleaner, driveway and street cleaner, circuit board cleaner, wheel cleaner, toxic waste cleaner, clean-room cleaner, oil spill cleaner, soil treatment, or metal cleaner.

Abstract: A method and composition for removing silicon-containing particulate material, such as silicon nitrides and silicon oxides, from patterned Si/SiO2 semiconductor wafer surfaces is described. The composition includes a supercritical fluid (SCF), an etchant species, a co-solvent, a surface passivator, a binder, deionized water, and optionally a surfactant. The SCF-based compositions substantially remove the contaminating particulate material from the wafer surface prior to subsequent processing, thus improving the morphology, performance, reliability and yield of the semiconductor device.

Abstract: The present invention is a substantially nonabrasive, liquid car cleaner composition which cleans car surfaces without an external source of water to wash or rinse. The liquid cleaner is a composition of up to toxaphene 15%, sodium lauryl sulfate 10%, paraffin 10%, isopropyl alcohol 15%, and water 50%.

Abstract: A method for cleaning contaminated surfaces of surgical waste management equipment. The method includes rinsing surfaces of the equipment with water to remove water soluble contaminants and waste material. A rinse solution is applied to the surfaces of the equipment to provide a residual film thereon. The rinse solution includes a first nonionic alkoxylated alcohol surfactant having an HLB value ranging from about 10 to about 15, a second nonionic alkoxylated alcohol surfactant having an HLB value ranging from about 16 to 20, an aqueous solvent, and optionally, a bio-film permeation agent. A total of the first surfactant and the second surfactant in the composition ranges from about 2 to about 20 percent by weight of a total weight of the composition, and a ratio of the second surfactant to the first surfactant in the composition ranges from about 2:1 to about 4:1.

Abstract: A composition having a first nonionic alkoxylated alcohol surfactant having an HLB value ranging from about 10 to about 15, a second nonionic alkoxylated alcohol surfactant having an HLB value ranging from about 16 to 20, an aqueous solvent, and optionally, a bio-film permeation agent. A total of the first surfactant and the second surfactant in the composition ranges from about 2 to about 20 percent by weight of a total weight of the composition, and a ratio of the second surfactant to the first surfactant in the composition ranges from about 2:1 to about 4:1.

Abstract: A cleaning composition which may be a stainless steel cleaning composition comprising a branched ester and an organic solute. The use and a method of using the cleaning composition is also included within the scope of the present invention.

Abstract: The present disclosure provides a method of cleaning a semiconductor substrate after a DRIE etch process, wherein residue from the DRIE process is removed without damaging the substrate. The process may include contacting the micro-fluid ejection head with an aqueous solution of TMAH, stripping a photoresist etch mask from the micro-fluid ejection head, and dissolving a passivating coating from the substrate. Then the substrate may be contacted with an acidic solution. The method may further include rinsing and drying the substrate.

Abstract: A cleaning method for a combustor comprises positioning a spray portion of a nozzle through an igniter plug boss and spraying an acid solution inside the combustion chamber. The acid solution impinges the inner liner and the outer liner, dissolving contaminant deposits inside the effusion holes. The nozzle can have a second spray portion outside the combustion chamber to provide acid solution to the radially outward surface of the outer liner. After cleaning, distilled water is sprayed through the nozzle to remove the acid solution residue from the combustor. The used acid solution and distilled water can be collected, filtered and pumped through the nozzle to provide a recirculating cleaning/rinsing system.

Abstract: A coke removal system removes coke deposits from the walls of a high temperature passage in which hydrocarbon fuel is present. The system includes a carbon-steam gasification catalyst and a water source. The carbon-steam gasification catalyst is applied to the walls of the high temperature passage. The water reacts with the coke deposits on the walls of the high temperature passage to remove the coke deposits from the walls of the high temperature passage by carbon-steam gasification in the presence of the carbon-steam gasification catalyst.

Abstract: A method for containing at least a portion of radioisotopes, radionuclides, heavy metal or combination thereof contaminating a substrate wherein a containment composition is applied to the substrate. The ingredients within the containment composition interact with the contaminants on the surface of the substrate until the containment composition has polymerized to a water insoluble form containing at least a portion of the contaminates enmeshed therein. The dried composition is removed from the contaminated surface removing with the composition at least a portion of the contaminate.

Abstract: The present invention relates to a process of cleaning a hard surface, said process comprising the step of applying a liquid hard surface cleaner composition onto said hard surface in the form of a spray, wherein said composition comprises a hydrophobically modified nonionic polyol.

Abstract: A corrosion resistant substrate is provided having a Cr(VI) free corrosion resistant two layer coating. The substrate is substantially comprised of aluminum, an aluminum alloy, magnesium or a magnesium alloy. A first wet chemical deposited inorganic passivation layer is directly positioned on the substrate and a second organic modified polysiloxane layer is directly positioned on the passivation layer.

Abstract: A description is given of an alkanol-free alkoxylate of the general formula (I) CnH2n+1O(A)x(B)yR??(I) where R is C1-6 alkyl or benzyl A is ethyleneoxy B is C3-6 alkyleneoxy or mixtures thereof, it being possible for groups A and B to be in random distribution, in alternation or in the form of two or more blocks in any order, n is an integer in the range from 4 to 8 x is a number in the range from 0 to 25 y is a number in the range from 0 to 10 and x+y is at least 3.

Abstract: A method of removing metal scale from surfaces that includes contacting the surfaces with a first aqueous solution of a chelating agent, allowing the chelating agent to dissolve the metal scale, acidifying the solution to form a precipitant of the chelating agent and a precipitant of the metal from the metal scale, isolating the precipitant of the chelating agent and the precipitant of the metal from the first solution, selectively dissolving the precipitated chelating agent in a second aqueous solution, and removing the precipitated metal from the second solution is disclosed.

Abstract: The present invention provides a method for removing niobium-rich second-phase-particle (SPP) deposits from zirconium-niobium alloy components. The method comprises washing a freshly pickled and rinsed zirconium-niobium alloy component with an acidified oxalic acid or ammonium oxalate washing solution. The method of the present invention results in a rapid, efficient and complete removal of surface SPP deposits from the zirconium-niobium alloy component without pitting, leaving behind a clean, shiny surface without the need to use water blasting or mechanical wiping operations.

Abstract: A method has been disclosed which cleans a semiconductor substrate using a cleaning liquid produced by mixing bubbles of a gas into an acid solution in which the gas has been dissolved to the saturated concentration and which brings the zeta potentials of the semiconductor substrate and adsorbed particles into the negative region by the introduction of an interfacial active agent. Alternatively, a semiconductor substrate is cleaned using a cleaning liquid produced by mixing bubbles of a gas into an alkaline solution in which the gas has been dissolved to the saturated concentration and whose pH is 9 or more.

Abstract: A method for cleaning a photomask includes cleaning the photomask with a chemical cleaner, introducing a solution to the photomask, the solution is configured to react with residuals generated from the chemical cleaner to form insoluble precipitates, and rinsing the photomask with a fluid to remove the insoluble precipitates from the photomask.

Abstract: A surface treatment process for a metal article includes the following steps. Firstly, a metal article, made of at least one of copper and an alloy thereof, is provided. Secondly, a surface of the metal article is degreased. Thirdly, the surface of the metal article is activated in an acid solution. Finally, the surface of the metal article is deactivated by submersion in an antioxidant agent.

Abstract: The invention relates to an aqueous solution consisting essentially of: (a) hydrogen peroxide; (b) at least one compound selected from the group consisting of complexing agents based on phosphonic acids, salts and degradation products thereof in an amount from about 10 to about 60 wt % based on the amount of hydrogen peroxide; (c) water; and (d) components other than (a) through (c) in an amount from 0 up to about 10 wt % based on the amount of hydrogen peroxide The invention further concerns a soil oxygenation or micronutrient composition comprising hydrogen peroxide, a process for its preparation, and a process for the oxygenation of soil.

Abstract: Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce defects when employed as a rinse solution either during or after the development of the CMP processing. Also disclosed is a method for reducing the number of defects on a plurality of post-CMP processed substrates employing the process solution of the present invention.

Abstract: A cleaning agent for metal parts (e.g., steel articles) includes sodium hydroxide in an approximate amount of 15 wt % (percent by weight) to 25 wt %, sodium tripolyphosphate in an approximate amount of 6 wt % to 9 wt %, sodium metasilicate in an approximate amount of 48 wt % to 51 wt %, sodium dodecyl benzene sulfonate in an approximate amount of 2 wt % to 5 wt %, sodium carbonate in an approximate amount of 8 wt % to 11 wt %, and alkylphenol polyoxyethylene ether in an approximate amount of 1 wt % to 4 wt %.

Abstract: Alkoxylates of the formula (I) C5H11CH(C3H7)CH2O(A)n(CH2CH2O)mH??(I) where A is propyleneoxy, buteneoxy or penteneoxy, n is a number in the range from 1 to 8, m is a number in the range from 2 to 20, are used as emulsifier, foam regulator and as wetting agent for hard surfaces.