Abstract: The invention relates to a device and method for cleaning, activating or pre-treating workpieces by blasting a carbon dioxide snow which is produced from pressurized CO2-containing fluids and at least one type of carrying compressed gas and is accelerated by means of a discharge nozzle (14), wherein a two-phase carbon dioxide mixture of a carbon dioxide gas and carbon dioxide particles is produced in an agglomeration chamber (8) by agglomerating and compressing carbon dioxide snow crystals which are radially added to the carrying gas in a multistage mixing chamber (10, 11, 12) comprising a central jet pipe (4), around which the carbon dioxide mixture circulates and which is used for supplying said carrying gas in such a manner that a high-energy turbulent gas flow for processing a workpiece is obtainable.

Abstract: In one embodiment, a surface treatment apparatus for a semiconductor substrate includes a holding unit, a first supply unit, a second supply unit, a third supply unit, a drying treatment unit, and a removal unit. The holding unit holds a semiconductor substrate with a surface having a convex pattern formed thereon. The first supply unit supplies a chemical solution to the surface of the semiconductor substrate, to perform cleaning and oxidation. The second supply unit supplies pure water to the surface of the semiconductor substrate, to rinse the semiconductor substrate. The third supply unit supplies a water repelling agent to the surface of the semiconductor substrate, to form a water repellent protective film on the surface of the convex pattern. The drying treatment unit dries the semiconductor substrate. The removal unit removes the water repellent protective film while making the convex pattern remain.

Abstract: After a water film is formed on a wafer front surface in a chamber, the water film is supplied sequentially with an oxidizing component of an oxidation gas, an organic acid component of an organic acid mist, an HF component of an HF gas, the organic acid mist, and the oxidizing component of the oxidation gas. As a result, the HF component and the organic acid component provide cleaning effect on the wafer surface, and a concentration of the cleaning components in the water film within a wafer surface can be even.

Abstract: Even when a substrate for treatment is joined with a supporting substrate having an outer shape larger than that of the substrate for treatment, with a photothermal conversion layer and an adhesive layer interposed, and the surface of the substrate for treatment on the side opposite this joined surface is treated, the occurrence of a defective external appearance on the treatment surface of the substrate for treatment is prevented. An adhesive layer 4 is formed on one surface of a substrate for treatment 3, a photothermal conversion layer 2 is formed on one surface of a supporting substrate 1 having a surface with an outer shape larger than that of the surface of the substrate for treatment, and the substrate for treatment 3 is bonded onto the surface of the photothermal conversion layer 2 with the adhesive layer 4 interposed, to obtain a layered member.

Abstract: A cleaning apparatus in which a cleaning process is simplified, a time required for the cleaning process is reduced and which has an excellent cleaning effect, and a high pressure cleaner for use therein are provided.

Abstract: A parts immersion system and method includes a trough through which a conveyor belt carries the parts. A chemical solution is introduced into the trough through an opening in the bottom of the trough, from above the trough, and/or from the sides of the trough. The parts on the conveyor belt in the trough have a tendency to retard liquid movement out of the open ends of the trough thereby allowing the chemical solution to accumulate in the trough resulting in a greater immersion of the parts in the chemical solution. A gate may be provided near one or both ends of the trough to further enhance the accumulation of the chemical solution in the trough. Flights may extend upwardly from the conveyor belt to further enhance liquid retention in the trough between the flights. Flexible seals at the ends of the flights may contact sidewalls of the trough. One or more vibrators may be provided to enhance drainage of the chemical solution from the parts as the parts exit the trough.

Abstract: A device that has a component within a process air circuit of a washer dryer or tumble dryer; a condensate water trough in which condensate water is collected that is formed in the process air circuit as a result of drying damp laundry; and a first lever arm rotatably fastened to a rinse tank above the component. The component is to be cleaned and the condensate water is conducted from the condensate water trough to the rinse tank. Further, the condensate water is dispensed from an outlet opening of the rinse tank to the component. The rinse tank has a closure to selectively open and close the outlet opening and an actuator to actuate the closure. Also, the closure has a sealing head that is connected to the first lever arm and that closes the outlet opening.

Abstract: A substrate processing apparatus of the present invention is to apply processing using a processing liquid to a substrate. The substrate processing apparatus includes a first-side plate disposed oppositely to a first surface of the substrate with a distance and provided with plural discharge ports and suction ports in a surface opposing the first surface, a first-side processing liquid supply mechanism that supplies a processing liquid to the discharge ports in the first-side plate, and a first-side suction mechanism that sucks insides of the suction ports in the first-side plate.

Abstract: A fluid dispensing system for a residential dishwasher comprises a fluid reservoir that can hold liquid gel dish detergent in bulk quantities, preferably comprising the contents of at least one bottle of detergent as sold at retail, which is disposed inside a door of the dishwasher. The reservoir is filled with detergent from the inside of the door, to facilitate clean-up if any product is accidentally spilled. As a result, the dishwasher is made easier and more convenient to use, by reducing the repetitive step of loading detergent and allowing “peace of mind” delegation of the dishwashing task. Metered doses of the fluid may be dispensed. In addition to dish detergent, liquid rinse aids may also be dispensed using the disclosed system.

Abstract: After a rinse process on a wafer W is performed by feeding pure water to the surface of the wafer W at a predetermined flow rate while rotating the wafer W in an approximately horizontal state, a feed amount of the pure water to the wafer W is reduced, and a pure-water feed point is moved outward from the center of the wafer W. In this manner, the wafer W is subjected to a spin dry process while forming a liquid film in a substantially outer region of the pure-water feed point.

Abstract: Provided is a substrate processing apparatus wherein, even if a trouble occurs, it is bound to continue a process for the substrate without stopping the substrate processing apparatus entirely. The substrate processing apparatus according to the present disclosure includes first and second substrate conveying devices configured to convey wafers, and first and second processing blocks provided on the right and left sides of the substrate conveying device and having processing unit arrays each configured to perform the same process. Processing unit arrays on one side and processing unit arrays on the other side are respectively connected to a processing liquid supply system commonly provided with them. And, when any one of substrate conveying devices, processing liquid supply systems has a problem, the process for the wafer can be performed in the processing unit array to which the substrate conveying device and the processing liquid supply system under normal operation belong.

Abstract: The invention is a dual functioning system for de-scaling or blowing down an electrically powered steam boiler. The steam boilers are generally used for sterilizing equipment and other items commonly used by health care professionals. The system includes a microprocessor controlled module, which is interfaced with the sterilizer controlled module, to measure the frequency and duration of the cleaning or blow down cycles. Typically, a cleaning cycle involves the use of an acid, such as phosphoric acid, to facilitate chemical removal of scale which is mineral deposits resulting from the use of hard water in the boiler. In the blow down cycle, the scale is removed by simple mechanical means without the use of a phosphoric acid cleaning solution. Various pumps and valves are utilized so that cleaning or blow down may be accomplished without having to disassemble or modify any input or drain lines.

Abstract: In a substrate cleaning method for cleaning a backside of a substrate on a surface of which a predetermined processing is performed, a two phase substance contacts the backside of the substrate, and a flow of the substance is generated near the backside of the substrate under a specified pressure. The two phase substance is a gas containing aerosol or a supercritical substance, and the specified pressure is higher than or equal to 133 Pa (1 Torr). Further, in the substrate cleaning method, a high-energy light may be irradiated on the backside of the substrate.

Abstract: The present disclosure generally relates to a fluid mixer, a system for mixing fluids utilizing the fluid mixer, and a method of mixing fluids using the fluid mixer or the system for mixing fluids, and more specifically, to a compact static mixing device with no moving parts and capable of mixing any fluid, such as air, nitrogen gas, water, oil, polluted water, and the like. A first pressurized, incoming fluid is accelerated locally by a section reduction, is split into streams, and then is released into a second fluid found in a closed volume or an open volume after a period of stabilization. The directed and controlled first fluid slides along an insert up to directional and angled fins at a vortex creator where suction forces from a self-initiating vortex in an internal cavity draws in at least part of the first fluid to fuel the vortex.

Abstract: A washing-agent dispenser for a household washing machine having a main casing, defining at least a container for a washing agent, and a member for closing the container. The closing member includes a substantially rigid body made of a first material, associated to which there are sealing means, made at least in part with a second substantially elastic or soft material. Associated to the rigid body of the closing member there are at least partially elastic or yielding complements, which are functionally distinct from the sealing means and are able to undergo deformation in the course of the use of the closing member. The complements are made at least in part of an elastic, soft, or yielding material, in particular of a synthetic type, which can be overmoulded directly on the rigid body of the closing member. Preferably, a plurality of complements is formed in a single component, which can include also said sealing means.

Abstract: A cleaning apparatus includes a cleaning tank (2) which stores a process liquid used for cleaning a target object (W), a target object holding mechanism (4) which holds the target object (W) in the cleaning tank (2), and a process liquid supply mechanism (3) which supplies the process liquid to the cleaning tank (2). The target object (W) is immersed in the process liquid in the cleaning tank (2), and is cleaned while letting the process liquid overflow from the cleaning tank (2), thereby cleaning the target object (W). The cleaning apparatus further includes a cover (10) which covers a liquid surface in the cleaning tank (2), a support member (15a, 15b) which supports the cover (10), and a follow-up mechanism (14a, 14b) which moves the cover (10) such that the cover (10) follows the liquid surface while the cover (10) is supported by the support member (15a, 15b).

Abstract: An upper processing head includes a topside module defined to apply a cleaning material to a top surface of a substrate and then expose the substrate to a topside rinsing meniscus. The topside module is defined to flow a rinsing material through the topside rinsing meniscus in a substantially uni-directional manner towards the cleaning material and opposite a direction of movement of the substrate. A lower processing head includes a bottomside module defined to apply a bottomside rinsing meniscus to the substrate so as to balance a force applied to the substrate by the topside rinsing meniscus. The bottomside module is defined to provide a drain channel for collecting and draining the cleaning material dispensed from the upper processing head when the substrate is not present between the upper and lower processing heads. The upper and lower processing heads can include multiple instantiations of the topside and bottomside modules, respectively.

Abstract: A surface treatment method of a metal member according to an embodiment of the invention includes removing an oily substance on the metal member by using gas-liquid two fluids that are obtained by boiling heated and pressured water under ordinary pressure. A surface treatment device of a metal member for removing an oily substance on the metal member includes self-generation two fluids production means for producing gas-liquid two fluids by boiling heated and pressured water under ordinary pressure, and a surface treatment room carrying out a surface treatment by bringing the self-generation two fluids into contact with the metal member.

Abstract: The present invention presents a cleaning technology in a used paper recycling apparatus capable of assuring a stable used paper recycling operation all the time, by removing and cleaning securely the used paper pulp remaining in the parts of the apparatus components of a used paper recycling apparatus of furniture size. The cleaning method of the cleaning system includes a white water cleaning process of circulating white water dewatered and collected in the paper making unit for manufacturing regenerated paper from used paper pulp in a pulp making unit and a pulp concentration adjusting unit of apparatus components for composing the used paper recycling apparatus by a white water cleaning unit, and cleaning the pulp making unit and the pulp concentration adjusting unit, and clean water cleaning processes of cleaning the paper making unit by clean water by a clean water cleaning unit.

Abstract: An etching residue removal method includes a cleaning sequence. Preferably, the cleaning sequence has a first washing processing, first drying processing, stripper processing, rinsing processing, second washing processing and second drying processing. In the first washing processing, an insulation film and metal lines thereon are washed by pure water. In the first drying processing, the insulation film and metal lines are dried in a nitrogen atmosphere at room temperature, for example. In the stripper processing, the etching residue on the insulation film and metal lines are stripped by amine stripper, for example. In the rinsing processing, the insulation film and metal lines are rinsed with an IPA rinse solution, for example. In the second washing processing, the insulation film and metal lines are washed with pure water. In the second drying processing, the insulation film and metal lines are dried in the nitrogen atmosphere at room temperature, for example.

Abstract: A substrate processing system 1 comprises: a processing tank 3 for processing substrates W with a processing liquid; a drying unit 6 disposed above the processing tank 3; and a carrying mechanism 8 for carrying the substrates W between the processing tank 3 and the drying unit 6. A processing gas supply line 21 for supplying a processing gas into the drying unit 6 and inert gas supply lines 24 and 25 for supplying an inert gas into the drying unit 6 are connected to the drying unit 6. A first discharge line for discharging an atmosphere purged from the drying unit 6 and a second discharge line 27 for forcibly exhausting the drying unit 6 are connected to the drying unit 6.

Abstract: Disclosed herein is a method and treatment system for rapid cleaning and protecting of automotive cooling systems containing controlled atmosphere brazed aluminum heat exchangers. The method and treatment system can optionally include a conditioning (passivating) step. The treatment system can comprise three different parts: (1) cleaner or cleaning solution; (2) conditioner or conditioning solution; and (3) compatible CAB aluminum protective heat transfer fluid.

Abstract: An etching/cleaning apparatus is provided, which makes it possible to effectively remove an unnecessary material or materials existing on a semiconductor wafer without damaging the device area with good controllability. The apparatus comprises (a) a rotating means for holding a semiconductor wafer and for rotating the wafer in a horizontal plane; the wafer having a device area and a surface peripheral area on its surface; the surface peripheral area being located outside the device area; and (b) an edge nozzle for emitting an etching/cleaning liquid toward a surface peripheral area of the wafer. The etching/cleaning liquid emitted from the edge nozzle selectively removes an unnecessary material existing in the surface peripheral area.

Abstract: The present invention relates to a dishwasher. A dishwasher includes a washing tub in which dishes are placed, a steam generator that generates steam and a nozzle part in which a flow direction of the steam is diverted at least one time to allow the steam exhausted to the washing tub.

Abstract: An apparatus for processing substrate includes a spin chuck, a first nozzle and a second nozzle. The spin chuck fixes and spins the substrate on which a photoresist layer is formed. The first nozzle is disposed over the spin chuck and provides a treatment liquid on the substrate so as to remove the photoresist layer. The second nozzle is disposed over the spin chuck and provides a mist including deionized water or hydrogen peroxide on the substrate to make contact with the treatment liquid so as to increase a temperature of the treatment liquid. Therefore, efficiency of removing the photoresist layer may be improved.

Abstract: A substrate (W) is processed with the use of a process liquid such as a deionized water. Then, a first fluid which is more volatile than the process liquid is supplied to an upper surface of the substrate (W) from a fluid nozzle (12) to form a liquid film. Next, a second fluid which is more volatile than the process liquid is supplied to the upper surface of the substrate (W) from the fluid nozzle (12), while the wafer (W) is being rotated. During this supply operation, a supply position (Sf) of the second fluid to the substrate (W) is moved radially outward from a rotational center (Po) of the substrate (W). As a result, it is possible to prevent the generation of particles on the substrate (W) after it is dried by using the first and second fluids.

Abstract: Apparatus, methods and systems for physically confining a liquid medium applied over a semiconductor wafer include a first and a second chemical head that are disposed to cover at least a portion of a top and an underside surface of the semiconductor wafer. Each of the first and the second chemical heads include an angled inlet conduit at a leading edge of the respective chemical heads to deliver liquid chemistry into a pocket of meniscus in a single phase. The pocket of meniscus is defined over the portion of the top and underside surface of the semiconductor wafer covered by the chemical heads and is configured to receive and contain the liquid chemistry applied to the surface of the semiconductor wafer as a meniscus. A step is formed at a leading edge of the first and second chemical heads along an outer periphery of the pocket of meniscus to substantially confine the meniscus of the liquid chemistry within the pocket of meniscus.

Abstract: An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.

Abstract: An imprint lithography apparatus including a service station.

Abstract: The exposure apparatus of the present invention includes a cleaning nozzle that discharges a cleaning liquid or a rinsing liquid so as to clean a member that forms a space between a end surface of the projection optical system and a surface of the substrate stage facing the end surface and clean a member that is present in the space, a cleaning liquid supply unit configured to supply the cleaning liquid to the cleaning nozzle, a rinsing liquid supply unit configured to supply the rinsing liquid to the cleaning nozzle, and a control unit configured to control the supply from the cleaning liquid supply unit and the rinsing liquid supply unit. The control unit carries out control such that the rinsing liquid is supplied successively with the discharge of the cleaning liquid before and after the discharge of the cleaning liquid from the cleaning nozzle.

Abstract: An apparatus for etching a substrate includes (a) a nozzle system including at least one nozzle through which acid solution containing at least hydrofluoric acid is sprayed onto the substrate, (b) a mover which moves at least one of the nozzle system and the substrate relative to the other in a predetermined direction in such a condition that the substrate and the nozzle system face each other, (c) a filter system which filters off particles out of the acid solution having been sprayed onto the substrate, and (d) a circulation system which circulates the acid solution having been sprayed onto the substrate, to the filter system, and further, to the nozzle system from the filter system.

Abstract: A developer nozzle is moved from a periphery of a wafer toward the central portion while an exposed substrate held at a spin chuck is being rotated about a vertical axis and while a developing solution is being discharged from the developer nozzle, and this way the developing solution is supplied to the surface of the wafer, the developer nozzle having a slit-like ejection port whose longitudinal direction is oriented to the direction perpendicular to the radial direction of the wafer. The movement speed of the nozzle is higher than a case where a nozzle with a small-diameter circular nozzle is used, and this enables a development time to be reduced. Further, the thickness of a developing solution on a substrate can be reduced, so that the developing solution can be saved.

Abstract: After a water film is formed on a wafer front surface in a chamber, the water film is supplied sequentially with an oxidizing component of an oxidation gas, an organic acid component of an organic acid mist, an HF component of an HF gas, the organic acid mist, and the oxidizing component of the oxidation gas. As a result, the HF component and the organic acid component provide cleaning effect on the wafer surface, and a concentration of the cleaning components in the water film within a wafer surface can be even.

Abstract: In a substrate cleaning method and a substrate cleaning method according to the present invention, a brush 3 is brought into contact with a substrate W while rotating the same, and a cleaning position Sb of the brush 3 is moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. A process fluid formed of liquid droplets and a gas is sprayed by a two-fluid nozzle 5 onto the substrate W, and a cleaning position Sn of the two-fluid nozzle 5 is moved relative to the substrate W from a center part of the substrate W toward a peripheral part thereof. During the movement of the cleaning position Sb of the brush 3 from the center part of the substrate W toward the peripheral part thereof, the cleaning position Sb of the two-fluid nozzle is positioned nearer to a center P0 than the cleaning position Sb of the brush 3. Since contaminations of the brush are prevented from adhering again to the wafer, it can be avoided that the wafer W is contaminated.

Abstract: A substrate treating apparatus includes a substrate support unit with a chuck on which a substrate is loaded; a bottom chamber having an open top and configured to surround the circumference of the chuck; a top chamber configured to open or close the top of the bottom chamber such that the substrate is dried while the top chamber is sealed from the outside; and a direct injection nozzle member installed at the top chamber to inject fluid directly to the substrate while the top of the bottom chamber is closed. According to the substrate treating apparatus, drying efficiency of an entire substrate is enhanced, external contaminants are blocked, and generation of an oxide layer is suppressed.

Abstract: A substrate processing apparatus and a substrate processing method are capable of restraining or preventing the generation of streaky particles on a substrate surface by excellent removal of a rinsing liquid therefrom. The substrate processing apparatus has a substrate inclining mechanism for inclining a substrate held by a substrate holding mechanism. After a rinsing liquid has been supplied onto a substrate to form a liquid mass, the substrate is inclined at a small angle by the substrate inclining mechanism. Then, the liquid mass is downwardly moved without being fragmented and then falls down without leaving minute droplets on the substrate top. Thereafter, the substrate is returned to a horizontal posture and then dried.

Abstract: An apparatus for cleaning substrates includes a substrate support that is configured to support a plurality of substrates horizontally as spaced regularly one above the other, a rotating device for rotating the substrate support and a liquid supply system for dispensing cleaning liquid onto the substrates. The substrate support has a base plate and support rods extending upright on the base plate. The support rods include fixed rods and at least one movable rod. The movable rods is movable between an open position to provide a passage that allows the substrates to be placed between the support rods, and a closed position at which the substrates are held by and between the support rods. Once the substrates are supported in this way, the substrates are rotated. Then, the cleaning liquid, such as a chemical solution(s) followed by a rinsing liquid, is dispensed onto all of the substrates as the substrates are being rotated.

Abstract: Disclosed is a utility washer that may be electrically controlled to clean articles. The utility washer may include a housing having an interior that may include nozzles and a rack supported by rails, where the nozzles may include top nozzles and bottom nozzles. The utility washer further may include a door connected to the housing, where the door may include a removable exterior panel and a hose behind the removable exterior panel. The hose may be connected to a hose attachment at one end and may be configured to draw up liquid into the hose from an open second end. The utility washer further may include control switches attached to the door having settings for water temperature, water/steam force, wash/cleaning level, position of articles within the utility washer, and drying.

Abstract: Proposed is a packing machine (1), in particular a roller or deep drawing machine, tray sealing machine or the like with components which have to be cleaned regularly, in which machine the cleaning of the components to be cleaned is improved. This object is achieved in that the packing machine (1) comprises a fluid supply unit (16) for providing at least one cleaning fluid.

Abstract: A method and apparatus for efficiently exhausting harmful vapors and fumes from a substrate processing chamber is described. The processing chamber includes a lower volume configured as a liquid atmosphere, and an upper volume configured as a gaseous atmosphere to at least partially contain vapors or fumes above the liquid. The apparatus includes a lid member configured to seal the processing chamber and a lid assembly adapted to provide processing liquids while exhausting the vapors or fumes from the processing chamber. Switchable valves and/or a variable source of negative pressure may be coupled to the lid assembly to provide a controlled exhaust. A method of preventing or minimizing the escape of fumes or vapors is also described.

Abstract: Apparatus to clean silicon electrode assembly surfaces which controls or eliminates possible chemical attack of electrode assembly bonding materials, and eliminates direct handling contact with the parts to be cleaned during acid treatment, spray rinse, blow dry, bake and bagging. Aspects of the apparatus include a kit including an electrode carrier to hold an electrode assembly, a treatment stand to allow access to the electrode assembly, a spider plate to clamp the electrode assembly in the electrode carrier, a nitrogen purge plate to supply nitrogen gas to the backside of the electrode assembly during acid cleaning of the electrode, a water rinse plate to supply water to the electrode face, a blow dry plate to supply nitrogen to dry the electrode assembly and a bake stand to support the electrode assembly during a bake before placing the clean electrode assembly in a bag.

Abstract: An endoscope cleaning/disinfecting apparatus of the present invention includes a cleaning tub, a chemical solution tank for storing a germicide, a chemical solution collection pipe, a chemical solution pipe, a feed pipe, a germicide bottle tray which can be drawn from the body of the cleaning/disinfecting apparatus, and a control unit for performing control to prepare the germicide by mixing a basis, a buffering agent, and a diluent. The germicide bottle tray includes a storage part which stores at least a first bottle body out of the first bottle body for storing the basis or a second bottle body for storing the buffering agent, and a detection portion for outputting a detection signal in a state in which the bottle body is stored in the storage part. The control unit performs control based on the detection signal outputted from the detection portion to prepare the germicide.

Abstract: A dishwasher having at least one door defining at least part of a washing area when the door is closed. The dishwasher has at least one supply housing supported by the door, and the supply housing is sized to hold an amount of liquid dish washing supply which is sufficient for a plurality of wash cycles. The dishwasher also has at least one dispenser supported by the door, and the dispenser has an outlet positioned on the door. Also, the dishwasher has an indicator operable to indicate how much of the liquid dish washing supply remains in the supply housing.

Abstract: A produce cleaning machine provides baskets for holding large and small produce items and water sprayers for directing water jets onto the produce from above and below. One basket is motorized to rotate to more evenly clean the produce, while a further basket can be rolled in and out of the machine to make loading and unloading easier. The force of the spray is adjustable and the rotational speed of the motor is as well to provide for special handling of the produce. Rotation after cleaning is used to help dry the produce, and ultraviolet emission is used to sanitize the produce.

Abstract: A method and apparatus provide for automatically cleaning and decontaminating medical instruments. The method comprising the steps of: a) placing the medical instruments into a container after their use in a medical procedure; b) closing the container to seal the instruments inside whereby to prevent personnel contact with the instruments and any contaminants which might be thereon; c) inserting the sealed container into a washer/decontaminator and sealing the washer/decontaminator; d) the washer/decontaminator automatically opening the container and applying a washing fluid thereto to wash the instruments within the container; and e) the washer/decontaminator automatically applying a disinfectant to the container to disinfect the instruments whereby to allow safe handling thereof by personnel.

Abstract: A water vapor cleaning system includes a vapor-producing chamber in communication with a water source, e.g. a hot water line, of an existing plumbing system. The vapor-producing device includes a vapor exit. The cleaning system includes a nozzle having an inlet, an outlet, and a valve selectively allowing or denying fluid communication between the inlet and outlet. The nozzle includes an actuator for selection between allowing or denying fluid communication. The nozzle is connected to the vapor-producing chamber with tubing. The nozzle also includes a vacuum device for suctioning items or blowing air through the tubing. A selector switch on the nozzle facilitates selection between steaming, vacuuming, blowing, soaping, and rinsing modes. A set of nozzle accessories are included for cleaning various types of surfaces.

Abstract: A system for chemically decontaminating radioactive material.

Abstract: A wafer W is held in a horizontal attitude within an airtight container 41 by a vacuum chuck 42 such that small gaps are formed between the wafer W and the inner surfaces of the airtight container 41. A cleaning liquid is supplied toward the center portion of a front surface of the wafer W through a fluid supply port 40 which is an end of a fluid supply path 5, and is discharged through a fluid discharge portion 44 arranged in the bottom portion of the airtight container 41 in a form of a groove running along a circle having its center located on the center axis of the wafer W. The cleaning liquid flows and spreads from the center portion of the wafer W toward the peripheral portion while removing particles adhered to the wafer W, and is discharged through the fluid discharge portion 44. This arrangement allows the particles to be uniformly and reliably removed without rotating the wafer W. The entire cleaning apparatus 4 has a small size.

Abstract: An apparatus for removing a photoresist from a substrate which includes a stripping bath chamber, a conveying unit conveying a substrate containing a photoresist through the stripping bath chamber, a photoresist stripper material supplying unit positioned to dispense the photoresist stripper material to the substrate while the substrate is disposed in the stripping bath chamber, an antifoaming agent supplying unit disposed in the stripping bath chamber dispensing an antifoaming agent toward the photoresist stripper material in the stripping bath chamber, an antifoaming agent storing unit communicating with the antifoaming agent supplying unit supplying the antifoaming agent thereto, and a stripper storing unit operatively connected to the stripper supplying unit supplying stored photoresist stripper material thereto.

Abstract: An endoscope reprocessor having a water supply disinfection filter and a method for self-disinfection of the filter employ a pair of connectors to switch from a normal operating mode into a self-disinfection mode in which circulating germicidal fluid within the reprocessor flows through the filter, while the water supply remains connected to the system and isolated from the circulating fluid.