Abstract: A substrate processing apparatus according to the invention executes a substrate processing using a supercritical processing fluid. In a processing container, a first introduction port is formed in such a manner as to face space over a substrate in the processing space and a second introduction port is formed in such a manner as to face space under a support tray in the processing space. A first discharge port is formed in such a manner as to face space over the support tray and a second discharge port is formed in such a manner as to face the space under the support tray. The supercritical processing fluid having a higher temperature is supplied into the processing space through the first introduction port, and the supercritical processing fluid having a lower temperature is supplied into the processing space through the second introduction port.

Abstract: A substrate processing apparatus processes a surface of a substrate with a processing fluid and includes a support tray in which a concave part for housing the substrate is provided on an upper surface thereof; a storage container in which a cavity is formed, wherein the support tray may be stored in a horizontal posture in the cavity; and a fluid supply part supplying the processing fluid to the cavity, wherein the storage container has a flow path which receives the processing fluid and discharges the processing fluid in a horizontal direction into the cavity from a discharge port that opens on a side wall surface of the cavity and toward the cavity, and a lower end position of the discharge port in a vertical direction is the same as or higher than a position of the upper surface of the support tray stored in the cavity.

Abstract: A substrate processing method includes etching a substrate on which a silicon oxide film and a silicon nitride film are formed with a phosphoric acid processing liquid. In the etching, a silicon concentration in the phosphoric acid processing liquid is a first silicon concentration at which the silicon oxide film is etched, from a start time until a first time interval has elapsed.

Abstract: The present invention relates to a cleaning and sanitizing system for a dispensing installation that uses a single pump to pull in non-caustic, non-abrasive, and non-corrosive cleaning solution, which in turn draws in ambient air. The mixture of air and liquid is discharged into a cylindrical flow controller that discharges a flow of alternating liquid cylinders and air cylinders. The air cylinders eliminate the boundary layer and laminar sublayer, which in turn allows the liquid cylinders to apply a maximum shear force associated with the hydrodynamic entry region consistently cleaning the length of the beverage or product line with mechanical cleaning and sanitizing action, which is subsequently carried away within the liquid cylinder.

Abstract: A cleaning apparatus includes: a cleaning chamber that accommodates an object to be cleaned; a drying chamber connected to the cleaning chamber; a connecting member connecting a first opening provided in the cleaning chamber and a second opening provided in the drying chamber; a valve element positioned inside the cleaning chamber and facing the first opening; a valve seat facing the valve element; and an actuator that drives the valve element.

Abstract: Systems and methods for replacing coolant of an x-ray tube assembly having a closed cooling system include a service port that is operatively installed in the cooling system and a vacuum assisted service kit that is operatively coupled to the service port. Used coolant is drained from the x-ray tube assembly, and thereafter a vacuum is drawn on the x-ray tube assembly via the service kit. Replacement coolant within a vacuum tank of the service kit is degassed under a vacuum. The degassed replacement coolant is provided into the cooling system from the vacuum tank, preferably by pushing under pressure with an inert gas to prevent the introduction of any air into the replacement coolant. The replacement coolant may be pressurized in the cooling system with the inert gas. Thereafter, the service port is closed, and the service kit may be disconnected from the service port.

Abstract: Systems and methods for replacing coolant of an x-ray tube assembly having a closed cooling system include a service port that is operatively connected to a portion of the x-ray tube assembly and a vacuum assisted service kit that is operatively coupled to the service port. Used coolant is drained from the x-ray tube assembly, and thereafter a vacuum is drawn on the x-ray tube assembly via the service kit. Replacement coolant within a vacuum tank of the service kit is degassed under a vacuum. The degassed replacement coolant is provided into the cooling system from the vacuum tank, preferably by pushing under pressure with an inert gas to prevent the introduction of any air into the replacement coolant. The replacement coolant may be pressurized in the cooling system with the inert gas. Thereafter, the service kit may be disconnected from the service port.

Abstract: A substrate cleaning apparatus capable of removing particles that exist in minute recesses formed on a substrate surface is disclosed. The substrate cleaning apparatus includes a substrate holder configured to hold a substrate; and a two-fluid nozzle configured to deliver a two-fluid jet onto a surface of the substrate. The two-fluid nozzle includes a first jet nozzle configured to emit a first two-fluid jet and a second jet nozzle configured to emit a second two-fluid jet at a velocity higher than a velocity of the first two-fluid jet, and the second jet nozzle surrounds the first jet nozzle.

Abstract: In a spin-chuck with plural collector levels, a separate exhaust controller is provided for each level. This permits selectively varying gas flow conditions among the collector levels, so that the ambient pressure at one level does not adversely affect device performance in an adjacent level.

Abstract: There is provided a liquid processing method for performing a liquid process on a front surface of a substrate by using a processing solution and then performing a rinse process on the front surface of the substrate by using a rinse solution having a temperature lower than a temperature of the processing solution. The liquid processing method includes performing an intermediate process between the liquid process and the rinse process, for adjusting a temperature of the front surface of the substrate to a temperature higher than the temperature of the rinse solution and lower than the temperature of the processing solution.

Abstract: A dishwasher includes a hot water inlet device for intake of hot water from an external hot water supply and a cold water inlet device for intake of cold water from an external cold water supply. A program control device controls a wash cycle of a selected dishwashing program for cleaning wash items. The program control device is constructed to operate in at least one of first and second operating modes, wherein the first operating mode includes activation of one wash program which, in at least one partial wash cycle of a wash cycle, draws hot water from the external hot water supply, and wherein the second operating mode includes activation of another wash program which, in at least one partial wash cycle of a wash cycle, exclusively draws cold water from the external cold water supply.

Abstract: A substrate treating apparatus including a support member configured to support a substrate container configured to surround an upper portion of the support member, a nozzle member including at least one nozzle, which is configured to spray a treating solution onto the substrate disposed on the support member, and a treating solution supply unit connected to the nozzle and configured to supply the treating solution to the nozzle through a main tube may be provided.

Abstract: A system and method is disclosed for cleaning an anilox roll and/or ink chamber of a converter. The system includes: a water supply (10a) adapted to supply water through an automatically controllable water supply valve (11a) to wash anilox roll and/or ink chamber; a cleaning solution supply (20a) adapted to supply a cleaning solution through an automatically controllable cleaning solution supply valve (21a) to clean the anilox roll and/or ink chamber; and a programmable controller (70) programmed to operate the automatically controllable valves (11a,21a) so as to deliver a timed sequence of water and cleaning solution to the cleaning part upon the occurrence of a cleaning cycle initiation condition.

Abstract: A device for feeding milk from a storage container (8) to a dispensing device (3), containing a feeding line (9), whose intake end (9a) is detachably connected to the storage container (8), and with a cleaning possibility for at least a portion of the exterior of the feeding line (9). In order to enhance a device of this type such that the cleaning is simplified, a cleaning mechanism (11) be provided for the exterior of the feeding line (9), which comprises a rinsing area (12) for holding the portion of the feeding line (9) that is to be cleaned. The rinsing area (12) contains a hot water intake opening, a steam intake opening, a cleaning agent intake opening, or cold water intake opening (17), and also a connection opening (14) for the detachable introduction of the portion to be cleaned.

Abstract: A substrate processing system which enables a minute piece of foreign matter attached to a substrate surface to be detected and are suitable for mass production of substrates. The substrate processing system has a substrate processing apparatus that carries out predetermined processing on a substrate. The substrate processing system comprises a substrate surface processing apparatus having a fluid supply unit that supplies onto a surface of the substrate a fluid containing an altering substance that alters a substance exposed at the surface of the substrate, and a substrate surface inspecting apparatus that inspects the surface of the substrate onto which the fluid has been supplied.

Abstract: A cleaning apparatus for a hose comprises: a wash basin comprising an intake manifold, an exhaust manifold, and a basin drain port; a fresh water reservoir connected to the wash basin via a fill valve; a sprayer fluidly connected to the exhaust manifold via a conduit and configured to spray liquid; a pump fluidly connected between the basin drain port and the intake manifold and configured to pump the liquid from the basin drain port to the intake manifold; a drain port fluidly connected to the pump via a drain valve; a blower fluidly connected to the intake manifold via a three-way valve and configured to blow air; an air intake port fluidly connected to the blower; and a controller configured to control the pump, the blower, the fill valve, and the drain valve.

Abstract: Apparatus, methods, and computer programs for cleaning opposed surfaces of a semiconductor wafer are presented. One apparatus includes first, second, and third valves, and one or more second drains. The first valves are coupled to a supply of rinsing solution and to first throughways that are coupled to an immersion tank above a region in the immersion tank, the region being defined by an area occupied by the substrate when the substrate is disposed vertically on a support within the immersion tank. The second valves are coupled to first drains and to second throughways that are coupled to the immersion tank below the region, and the third valves are coupled to a supply of cleaning solution and to third throughways that are coupled to the immersion tank below the region. Further, the second drains are coupled to fourth throughways that are coupled to the immersion tank above the region.

Abstract: A turbine engine cleaning system includes a source of cleaning fluid, a source of rinse fluid, a pump configured to deliver the cleaning fluid and rinse fluid under pressure, and a wash harness. The wash harness is connected in flow communication with a plurality of turbine engines. The wash harness is configured to direct cleaning fluid from the source of cleaning fluid and rinse fluid from the source of rinse fluid from the pump to the turbine engines in sequence.

Abstract: Systems and methods for oscillating exposure of a semiconductor workpiece to multiple chemistries are disclosed. A method in accordance with one embodiment includes sequentially exposing a portion of a semiconductor workpiece surface to a first chemistry having a first chemical composition and a second chemistry having a second chemical composition different than the first. Prior to rinsing the portion of the workpiece surface, the portion is sequentially exposed to the first and second chemistries again. The first and second chemistries are removed from the portion, and, after sequentially exposing the portion to each of the first and second chemistries at least twice, and removing the first and second chemistries, the portion is rinsed and dried.

Abstract: A cleaning apparatus for cleaning measuring probes (18) of a gas turbine engine (1). The invention further relates to a method for cleaning measuring probes (18) of an gas turbine engine (1). The apparatus comprises distribution means (30) comprising a plurality of supply means (31, 32, 33), each comprising connection means (33) arranged for connection to a probe (18), and each supply means (31, 32, 33) being arranged to, when connected to a probe (18), distribute pressurized cleaning liquid to said measuring probe (18), wherein a substantially simultaneous cleaning of probes connected to said distribution means (30) via said supply means (31, 32, 33) can be obtained.

Abstract: A dishwasher includes a hot water inlet device for intake of hot water from an external hot water supply and a cold water inlet device for intake of cold water from an external cold water supply. A program control device controls a wash cycle of a selected dishwashing program for cleaning wash items. The program control device is constructed to operate in at least one of first and second operating modes, wherein the first operating mode includes activation of one wash program which, in at least one partial wash cycle of a wash cycle, draws hot water from the external hot water supply, and wherein the second operating mode includes activation of another wash program which, in at least one partial wash cycle of a wash cycle, exclusively draws cold water from the external cold water supply.

Abstract: A processing system 1 comprises: a processing vessel 30 configured to accommodate an object to be processed W in a processing space 83; a process-fluid generating part 41 configured to generate a process fluid of a predetermined temperature; and a main duct 56 arranged between the process-fluid generating part 41 and the processing vessel 30, the main duct 56 being configured to guide the process fluid supplied from the process-fluid generating part 41. A process-fluid supply duct 171 is arranged on a downstream side of the main duct 56 via a switching valve 70, the process-fluid supply duct 171 being configured to introduce the process fluid into the processing space 83 of the processing vessel 30. A process-fluid bypass duct 172 is arranged on the downstream side of the main duct 56 via the switching valve 70, the process-fluid bypass duct 172 being configured to guide a process fluid, which is not introduced to the process-fluid supply duct 171, so as to bypass the processing space 83.

Abstract: There is provided a substrate treatment method for performing treatment by feeding a chemical liquid to a surface of a substrate, in which, before feeding the chemical liquid to a predetermined area of the substrate, a liquid substance having a resistivity lower than that of the chemical liquid is fed to the surface of the substrate so that the liquid substance wets at least the predetermined area, and then, the chemical liquid is fed to the predetermined area so that the treatment is performed on the substrate with the chemical liquid fed to the surface of the substrate.

Abstract: An exhaust foreline for purging fluids from a semiconductor fabrication chamber is described. The foreline may include a first, second and third ports independently coupled to the chamber. A semiconductor fabrication system is also described that includes a substrate chamber that has a first, second and third interface port. The system may also include a multi-port foreline that has a first, second and third port, where the first foreline port is coupled to the first interface port, the second foreline port is coupled to the second interface port, and the third foreline port is coupled to the third interface port. The system may further include an exhaust vacuum coupled to the multi-port foreline.

Abstract: Disclosed is a substrate processing apparatus, a substrate processing method and a computer-readable medium capable of recovering an extended amount of discharged solution from a processing unit thereby reducing the amount of deionized water for the processing and the cost. The substrate processing apparatus includes, inter alia, a first and second discharge solution lines each connected to a downstream side of a discharge unit, and the discharged solution from each of the first and second discharge solution lines is independently delivered to the processing solution supply unit as a recovered solution. Also, the substrate processing apparatus includes a converting unit that converts flow of the discharged solution from the discharge unit either to the first discharge solution line or to the second discharge solution line. The processing solution supply unit selectively delivers the recovered solution from the first and second discharge solution lines to the processing unit.

Abstract: Apparatus and method for dispensing a gas using a gas source coupled in selective flow relationship with a gas manifold. The gas manifold includes flow circuitry for discharging gas to a gas-using zone, and the gas source includes a pressure-regulated gas source vessel containing the gas at superatmospheric pressure. The pressure-regulated gas source vessel can be arranged with a pressure regulator at or within the vessel and a flow control valve coupled in flow relationship to the vessel, so that gas dispensed from the vessel flows through the regulator prior to flow through the flow control valve, and into the gas manifold. The apparatus and method permit an enhancement of the safety of storage and dispensing of toxic or otherwise hazardous gases used in semiconductor processes.

Abstract: A dishwasher includes a tub, a steam generator for generating steam, a water supply passage for supplying washing water to the steam generator, a release valve having a steam passage along which the steam generated by the steam generator is supplied to the tub, and a condensed water passage connected to the water supply passage to allow water condensed by the steam to fall to the water supply passage.

Abstract: An endoscope reprocessor having a water supply disinfection filter and a method for self-disinfection of the filter employ a pair of connectors to switch from a normal operating mode into a self-disinfection mode in which circulating germicidal fluid within the reprocessor flows through the filter, while the water supply remains connected to the system and isolated from the circulating fluid.

Abstract: A component recovery system, configured to refurbish components, includes a fluid feed tank, a refurbishment compartment having a fluid delivery element, a waste tank, fluid lines connecting the fluid feed tank to the fluid delivery element and the refurbishment compartment to the waste tank, and pumps for delivering fluid through the fluid lines. The component recovery system removes field contaminants, coatings and bonding compounds from components.

Abstract: Apparatus and method for dispensing a gas using a gas source coupled in selective flow relationship with a gas manifold. The gas manifold includes flow circuitry for discharging gas to a gas-using zone, and the gas source includes a pressure-regulated gas source vessel containing the gas at superatmospheric pressure. The pressure-regulated gas source vessel can be arranged with a pressure regulator at or within the vessel and a flow control valve coupled in flow relationship to the vessel, so that gas dispensed from the vessel flows through the regulator prior to flow through the flow control valve, and into the gas manifold. The apparatus and method permit an enhancement of the safety of storage and dispensing of toxic or otherwise hazardous gases used in semiconductor processes.

Abstract: Provided is an apparatus for controlling a washing flow of a dishwasher that can perform an upper washing, a lower washing, an alternate washing of upper and lower sides, and a concurrent washing of upper and lower sides for effective washing.

Abstract: A mixing valve assembly 42 is communicated with a dedicated tank 51D, storing therein a compatibilizer D, via an inlet valve 43 and is also communicated with dedicated tanks 51A-51C via three injection valves, the tanks storing therein auxiliaries A-C respectively. A chemical formulation is prepared by selectively injecting any one(s) of four chemical agents into the mixing valve assembly 42 by way of on-off control of the inlet valve 43 and the injection valves and blending together the injected chemical agents. Then, the chemical formulation is pumped into SCF by a high-pressure pump 45 such that the SCF and the chemical formulation are mixed together to form a process fluid. Thus, the number of components of a high-pressure portion can be reduced to achieve a cost reduction of an apparatus. Furthermore, a pipe line for pumping the chemical agents is simplified.

Abstract: An automatic dishwasher having multiple spray nozzles located in the corner of a utensil rack in which case the wash liquid is sequentially sprayed from the corner spray nozzles.

Abstract: A vehicle mounted patching system for patching potholes and the like and incorporating method and apparatus for removing and flushing asphalt emulsion from the feed lines of the patcher which completely recycles the cleaning agent used to flush the feed lines, as well as eliminating any external discharge of potentially toxic materials.

Abstract: A processing apparatus includes a processing bath having a liquid injection port in the bottom thereof, a rectifier plate located between the bottom of the processing bath and a position at which an object to be processed is positioned, and a distribution portion extending between the rectifier plate and the liquid injection port and over the liquid injection port. The distribution portion includes an opposing portion opposing the liquid injection port, a surrounding portion surrounding a space between the opposing portion and the liquid injection port, and a guard portion or extended portion extending outwardly from the bottom end of the surrounding portion.

Abstract: A method for processing a substrate is provided which includes applying fluid onto a surface of the substrate from a portion of a plurality of inlets and removing at least the fluid from the surface of the substrate where the removing being processed as the fluid is applied to the surface. The applying the fluid and the removing the fluid forms a segment of a fluid meniscus on the surface of the substrate.

Abstract: Provided are a method for treating a process solution and an apparatus for treating a substrate using the same. The apparatus includes a treating bath, a circulating line, a bypass line, and a filter. A process solution for a substrate is provided in the treating bath. The circulating line is connected to the treating bath, and the process solution circulates through the circulating line. The bypass line branches from a first position of the circulating line and couples at a second position of the circulating line. The filter is installed in a position of the circulating line between the first position and the second position.

Abstract: A system for microbially deactivating items. The system includes a circulation system for circulating a microbial decontamination fluid through a deactivation chamber that forms a part of the circulation system. A container for holding items to be deactivated is provided. The container has a sealable cavity in which the items to be deactivated may be placed, and at least one valve element that is movable between an open and a closed position to regulate fluid flow into the cavity. An actuator in the deactivation chamber is operable to move the valve element to an open position when the container is disposed within the deactivation chamber, wherein the cavity within the container is in fluid communication with the circulation system when the valve element is in the open position.

Abstract: An etching gas control system is provided. The system includes a gas injector, a gas supply pipe, a Flow Ratio Controller (FRC), and a gas supply unit. The gas injector is installed in a chamber and supplies gas inside the chamber. The gas injector includes a top injector installed at a top of the chamber and a side injector installed at a side of the chamber. The gas supply pipe connects and supplies gas to the gas injector. The FRC connects to the gas supply pipe and controls supply of gas. The gas supply unit supplies gas to the FRC.

Abstract: The present invention relates to vacuum processing systems in which process gases are introduced in a process chamber and are exhausted through a vacuum processing system exhaust path. Deposits made by the exhausted gases in one or more dry vacuum pumps are removed by introducing hydrofluoric acid upstream of the dry pump while the processing chamber is idle. The hydrofluoric acid is introduced upstream of the dry pump through a nozzle in the foreline or at the inlet to the dry pump.

Abstract: The device forms a flow of a back-side gas over a back-side surface of the end portion of the wafer undergoing a cleaning process executed by radiating an electromagnetic wave such as an ultraviolet ray onto the end portion of the wafer. During the cleaning process, a flow of front-side gas directed along a direction matching the direction of the back-side gas is also formed over the front-side surface of the end portion of the wafer. The flow velocity of the back-side gas is set higher than the flow velocity of the front-side gas. As a result, a descending gas current is created to flow from the wafer front side toward the wafer back side at a gap between the wafer end portion and a partitioning plate, which makes it possible to reliably prevent an active species formed on the back side of the wafer end portion from reaching over to the wafer front side.

Abstract: A spray fill device for delivering water to a washing machine is provided. The spray fill device includes a body defining an inlet, an outlet port, a mounting port, and a plurality of outlet apertures in flow communication with the inlet. The spray fill device also includes a first valve coupled to the inlet, the valve configured to control a flow rate of water into the inlet. The spray fill device also includes a pressure relief mechanism coupled to the mounting port, the pressure relief mechanism inhibiting flow through the outlet port when a pressure within the body is less than a predetermined pressure.

Abstract: A soft spray nozzle discharging a cleaning mist is vertically directed and fixed to an arm. A rinse nozzle discharging rinsing deionized water for suppressing obstruction is vertically fixed to the arm at a prescribed distance from the soft spray nozzle. During cleaning, it follows that both nozzles discharge detergents while keeping relative layout relation. Therefore, the discharged cleaning mist and rinsing deionized water do not interfere with each other before reaching the substrate but the used detergents are entirely horizontally splashed and recovered in a cup. Thus, the cleaning mist is prevented from scattering and adhering to the periphery.

Abstract: Apparatus and method for dispensing a gas using a gas source coupled in selective flow relationship with a gas manifold. The gas manifold includes flow circuitry for discharging gas to a gas-using zone, and the gas source includes a pressure-regulated gas source vessel containing the gas at superatmospheric pressure. The pressure-regulated gas source vessel can be arranged with a pressure regulator at or within the vessel and a flow control valve coupled in flow relationship to the vessel, so that gas dispensed from the vessel flows through the regulator prior to flow through the flow control valve, and into the gas manifold. The apparatus and method permit an enhancement of the safety of storage and dispensing of toxic or otherwise hazardous gases used in semiconductor processes.

Abstract: A soft spray nozzle discharging a cleaning mist is vertically directed and fixed to an arm. A rinse nozzle discharging rinsing deionized water for suppressing obstruction is vertically fixed to the arm at a prescribed distance from the soft spray nozzle. During cleaning, it follows that both nozzles discharge detergents while keeping relative layout relation. Therefore, the discharged cleaning mist and rinsing deionized water do not interfere with each other before reaching the substrate but the used detergents are entirely horizontally splashed and recovered in a cup. Thus, the cleaning mist is prevented from scattering and adhering to the periphery.

Abstract: A circuit board processing system includes a wash tank configured to contain cleaning fluid, and a positioning subsystem configured to immerse a set of circuit boards into the wash tank. The system further includes a flow control subsystem having (i) a first set of nozzles disposed within the wash tank, (ii) a second set of nozzles disposed within the wash tank, and (iii) a controller. The controller is configured to direct the cleaning fluid through the first set of nozzles to provide a flow of the cleaning fluid in a first direction relative to the set of circuit boards. The controller is further configured to direct the cleaning fluid through a second set of nozzles to provide a flow of the cleaning fluid in a second direction relative to the set of circuit boards after providing the flow of the cleaning fluid in the first direction.

Abstract: A bracket is provided for mounting an object to a tub of a dishwasher. The bracket is mounted on the annulus edge of the pump opening in the bottom of the tub adjacent the pump seal ring. No other fasteners are used to secure the bracket to the tub. The bracket is mounted on the tub before the pump is installed. In one embodiment a thermostat is pivotally mounted on the bracket so as to maintain substantially flush engagement with the tub. In a second embodiment, a wire harness extends through a loop of the bracket for support adjacent the tub.

Abstract: When the hatch of a substrate washing chamber 5 is opened to receive a substrate, certain valves are closed, and a valve is opened, supply CO2 to purge the substrate washing chamber 5 to and exclude air. When the hatch is closed, another valve is opened to vent substrate washing chamber 5 so that the CO2 expels any gas and unwanted air from the substrate washing chamber 5 and the conduits. Thereafter, super critical CO2 is used to wash the substrate and clean the circulation line. The flow of supercritical CO2 is sent to the substrate washing chamber 5. After flowing through the circulation line, including a circulation channel 11, it passes through a bypass channel 12 to a decompressor 7. Any chemicals or organic substances left in the circulation line are continuously sent to a separation/recover bath 8 together with the flow.

Abstract: A system for equalizing pressure in a washing chamber in response to changes in pressure inside washing chamber. Gate elements are operable between open and closed positions to regulate pressure conditions inside the washing chamber.

Abstract: When the hatch of a substrate washing chamber 5 is opened to receive a substrate, certain valves are closed, and one valve is opened, to supply CO2 to purge the substrate washing chamber 5 to and exclude air. When the hatch is closed, another valve is opened to vent substrate washing chamber 5 so that the CO2 expels any gas and unwanted air from the substrate washing chamber 5 and the conduits. Thereafter, supercritical CO2 is used to wash the substrate and clean the circulation line. The flow of supercritical CO2 is sent to the substrate washing chamber 5. After flowing through the circulation line, including a circulation channel 11, it passes through a bypass channel 12 to a decompressor 7. Any chemicals or organic substances left in the circulation line are continuously sent to separation/recovery bath 8 together with the flow.