Abstract: A thermoelectric device and methods thereof. The thermoelectric device includes nanowires, a contact layer, and a shunt. Each of the nanowires includes a first end and a second end. The contact layer electrically couples the nanowires through at least the first end of each of the nanowires. The shunt is electrically coupled to the contact layer. All of the nanowires are substantially parallel to each other. A first contact resistivity between the first end and the contact layer ranges from 10?13 ?-m2 to 10?7 ?-m2. A first work function between the first end and the contact layer is less than 0.8 electron volts. The contact layer is associated with a first thermal resistance ranging from 10?2 K/W to 1010 K/W.

Abstract: A thermoelectric conversion module includes an insulative substrate, a plurality of thermoelectric conversion material films disposed with a gap therebetween on a first surface of the insulative substrate and made of any one of an n-type thermoelectric conversion material and a p-type thermoelectric conversion material, a first electrode and a second electrode, formed away from each other on each of the thermoelectric conversion material films, a first thermal conduction member disposed on a side of the first surface of the insulative substrate and including a protruding portion in contact with the first, electrodes or the insulative substrate between the first electrodes, and a second thermal conduction member disposed on a side of a second surface of the insulative substrate and including a protruding portion in contact with the second surface of the insulative substrate at an area coinciding with the second electrodes.

Abstract: A thermoelectric device includes at least one first flow duct, at least one second flow duct, at least one first carrier layer associated with the at least one first flow duct and at least one second carrier layer associated with the at least one second flow duct, at least one intermediate space between the first carrier layer and the second carrier layer and a plurality of p and n-doped semiconductor elements disposed in the at least one intermediate space and electrically interconnected. A relative first thermal expansion of the first carrier layer and a relative second expansion of the second carrier layer are equal under operating conditions. Suitable materials are provided for the first and second carrier layers that promote the use of such thermoelectric devices in exhaust systems of a motor vehicle. A motor vehicle having thermoelectric devices and a method for manufacturing a thermoelectric device are also provided.

Abstract: A thermoelectric module includes a first and a second substrates, plural thermoelectric elements, plural first and second metal electrodes, plural first and second solder layers, and spacers. The thermoelectric elements are disposed between the first and second substrates, and each pair includes a P-type and an N-type thermoelectric elements. An N-type thermoelectric element is electrically connected to the other P-type thermoelectric element of the adjacent pair of thermoelectric element by the second metal electrode. The first metal electrodes and the lower end surfaces of the P/N type thermoelectric elements are jointed by the first solder layers. The second metal electrodes and the upper end surfaces of the P/N type thermoelectric elements are jointed by the second solder layers. The spacers are positioned at one of the first and second solder layers. The melting point of the spacer is higher than the liquidus temperatures of the first and second solder layers.

Abstract: A thermoelectric conversion material contains a mixed oxide containing Zn, Ga, and In. The thermoelectric conversion material is one in which the mixed oxide further contains Al. The thermoelectric conversion material is one in which the relative density of the mixed oxide is not less than 80%. The thermoelectric conversion material is one in which at least a part of a surface of the mixed oxide is coated with a film. A thermoelectric conversion module is provided with a plurality of n-type thermoelectric conversion materials, a plurality of p-type thermoelectric conversion materials, and a plurality of electrodes electrically serially connecting the p-type thermoelectric conversion materials with the n-type thermoelectric conversion materials in an alternate arrangement, and at least one material of the plurality of n-type thermoelectric conversion materials is the aforementioned thermoelectric conversion material.

Abstract: A thermoelectric module comprising a matrix comprising junctions having two N-type and P-type thermoelectric chips, said junctions being electrically connected to form an electric circuit. Flow of an electric current in the circuit heats one surface of the matrix by Peltier effect. Heating of one surface of the matrix makes an electric current flow by Seebeck effect. The module comprises a first group of junctions of two N-type and P-type thermoelectric chips exposed to a first operating temperature. A second group of junctions of two N-type and P-type thermoelectric chips is exposed to a second operating temperature. The second temperature is lower than the first temperature and the two groups of junctions are separated by a thermal insulator.

Abstract: Disclosed are a hybrid energy harvester and a portable device including the same. The hybrid energy harvester according to an exemplary embodiment of the present disclosure includes: a thermoelectric/piezoelectric element part that includes a thermoelectric element layer generating a voltage by a temperature difference, and a piezoelectric element layer generating a voltage by any one of vibration, pressure and force; an energy source selection part that selects a voltage generated in the thermoelectric element layer or the piezoelectric element layer; and a voltage controlling part that stores the voltage in an energy storage device by controlling the voltage selected in the energy source selection part.

Abstract: A thermoelectric conversion device includes a hot terminal substrate, a cold terminal substrate and a stacked structure. The stacked structure is disposed between the hot terminal substrate and the cold terminal substrate. The stacked structure includes thermoelectric conversion layers each including a thermoelectric couple layer, a first conductive layer and a second conductive layer, a first heat-conductive and electrically insulating structure and a second heat-conductive and electrically insulating structure. Each of the thermoelectric conversion layers is arranged in the stacked structure. The first conductive layer includes first conductive materials and is arranged on tops of P/N type thermoelectric conversion elements. The second conductive layer includes second conductive materials and is arranged on bottoms of the P/N type thermoelectric conversion elements. The first heat-conductive and electrically insulating structure is connected between two adjacent first conductive layers.

Abstract: The invention is directed to an energy efficient thermoelectric heat pump assembly. The thermoelectric heat pump assembly preferably comprises two to nine thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present invention further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. Preferably the transport or storage devices are configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.

Abstract: A thermoelectric conversion material includes a complex oxide containing Zn, Al, Ga, and B. The thermoelectric conversion material is one in which a ratio of a molar amount of B to a total molar amount of Zn, Al, Ga, and B is not less than 0.0001 and not more than 0.01. The thermoelectric conversion material is one in which the relative density of the complex oxide is not less than 95% The thermoelectric conversion material is one in which at least a part of a surface of the complex oxide is coated with a film. A thermoelectric conversion module is provided with a plurality of n-type thermoelectric conversion materials, a plurality of p-type thermoelectric conversion materials, and a plurality of electrodes electrically serially connecting the p-type thermoelectric conversion materials and the n-type thermoelectric conversion materials in an alternate arrangement, and at least one material of the plurality of n-type thermoelectric conversion materials is the aforementioned thermoelectric conversion material.

Abstract: A thermoelectric module having a plurality of p-n-couples, every two adjacent p-n-legs forming one p-n-couple. The p-n-legs are each manufactured from conductive materials. The p-n-legs of the plurality of p-n-couples are separated in an alternating sequence by an electrically insulating gap which creates a meandering current flow.

Abstract: A thermoelectric generator is described, which comprises at least one thermoelectric module between a hot side, which is connected to a heat source, and a cold side, which is connected to a heat sink, wherein a membrane rests against the cold side of the thermoelectric module, on which membrane a hydraulic pressure is exerted via a pressurized heat transfer fluid lying against the other side of the membrane, with which pressure the thermoelectric module is pressed against the hot side of the thermoelectric generator, and/or wherein a corresponding membrane rests against the hot side of the thermoelectric module.

Abstract: In a process for the production of a thermoelectric module, thermoelectric legs which are electrically contact-connected in series are coated so as to be covered with an electrically insulating solid material.

Abstract: A thermoelectric power generation apparatus includes a thermoelectric device having a first surface, an opposed second surface, and a first thermal energy storage unit operatively coupled to the first surface of the thermoelectric device setting the first surface at a first temperature. The thermoelectric power generation apparatus also includes a second thermal energy storage unit having a second temperature, the second thermal energy unit for setting the second surface of the thermoelectric device at an operative temperature in response to a temperature difference between the first temperature of the first surface and the second temperature of the second thermal energy storage unit. The thermoelectric device generates power in response to a temperature differential between the first temperature of the first surface and the operative temperature of the second surface.

Abstract: Heat transfer to refrigerate or heat uses a thermoelectric semiconductor structure including a P-type composite of dices of semiconductor material alloyed with P-type material forming spaced collector regions at junctions with a P-type conductive material for flux of electrical current and a N-type composite of dices of semiconductor material alloyed with N-type material forming spaced collector regions at junctions with a N-type conductive material for flux of electrical current. The thickness of each the dices is sufficient to form a PN junction. Electrically conductive buss bars form an electrical circuit between the dices of N-type conductivity and the dices of P-type conductivity. An electrically conductive buss bar forms an electrical circuit connection between the dices of N-type conductivity and the dices of P-type conductivity. An electrical potential is applied by terminals between the P-type composite and the N-type composite to induce a flux of heat concurrent with the flux of electrical current.

Abstract: Disclosed is an asymmetric thermoelectric module, which includes a plurality of first-type thermoelectric semiconductor elements, a plurality of second-type thermoelectric semiconductor elements, a plurality of pairs of assistant layers having different melting points and disposed on the upper and lower surfaces of the first-type and second-type thermoelectric semiconductor elements, and a pair of substrates.

Abstract: A method for making a thermoelectric microstructure includes: forming an insulating substrate; forming, on the substrate, a first assembly of conductor or semiconductor elements extending in parallel and in a first direction from first to second connection areas, and having a first Seebeck coefficient; forming, on the substrate, a second assembly of conductor or semiconductor elements electrically insulated from the first assembly and extending in parallel and in a second direction other than the first one, from the first to second connection areas, and having a second Seebeck coefficient other than the first one; providing, in the first and second connection areas, electric connection elements, each of which electrically connects at least one element of first and second assemblies; two conductor or semiconductor elements of a single assembly are separated in a predetermined direction by a predetermined average distance in the connection areas.

Abstract: Semiconductor integrated thermoelectric devices are provided, which are formed having high-density arrays of thermoelectric (TE) elements using semiconductor thin-film and VLSI (very large scale integration) fabrication processes. Thermoelectric devices can be either separately formed and bonded to semiconductor chips, or integrally formed within the non-active surface of semiconductor chips, for example.

Abstract: A thermoelectric transducer is provided, where a decrease in conversion efficiency due to uneven characteristics of semiconductors is resolved and a decrease in adhesion strength between each element unit and an electrode due to a heat expansion coefficient between the respective thermoelectric transducers. In addition, an improvement of electro thermal conversion efficiency is intended by modifying the structure of the single device. Single element unit (13), which are made off semiconductor of the same type constructed of sintered body cells each containing oxide of a metal element, an oxide of a rare-earth element, and manganese are arranged on a board (5, 12) of a thermoelectric transducer (10). Film-shaped thin-film electrodes are arranged on cooling and heating surfaces so to be integral with the sintered body cell. On these sides, lead wires (16) are connected to each other in series.

Abstract: A thermoelectric generator includes a plurality of thermoelectric devices, through which an exhaust gas of an internal combustion engine flows in succession. Each thermoelectric device forms at least one hot flow path for the exhaust gas and at least one cold flow path for a coolant. A plurality of p-doped and n-doped insulated semiconductor elements are connected in a targeted manner between the flow paths. At least part of the semiconductor elements in at least one of the thermoelectric devices are fixed to a flexible medium.

Abstract: In a thermoelectric module comprising a series of p and n type semiconductors connected in series by conductive contacts, the conductive contacts are in contact with a substrate of moderate to high thermal conductivity that is electrically insulated from the conductive contacts by a resistive surface layer comprising a ceramic material.

Abstract: A thermoelectric device contains at least one module having a first carrier layer and a second carrier layer, an interspace disposed between the first carrier layer and the second carrier layer, and an electrical insulation layer disposed on each of the first carrier layer and on the second carrier layer toward the interspace. The thermoelectric device further has a plurality of p and n-doped semiconductor elements, which are arranged alternately in the interspace between the insulation layers and are alternately electrically connected to one another.

Abstract: A method for converting heat to electricity by exploiting changes in spontaneous polarization that occur in electrically polarizable materials is described. The method uses an internally generated field to achieve poling during cycling. The internal poling field is produced by retaining residual free charges on the electrodes at the appropriate point of each cycle. The method obviates the need for applying a DC voltage during cycling and permits the use of the electrical energy that occurs during poling rather than an external poling voltage which detracts from the net energy produced per cycle. The method is not limited to a specific thermodynamic cycle and can be used with any thermodynamic cycle for converting heat to electricity by thermally cycling electrically polarizable materials. The electrical energy generated can be used in various applications or stored for later use. An apparatus for converting heat to electricity is also described.

Abstract: A waste heat reclamation device absorbs waste heat from a heat generating object. A thermocouple loop is used to convert thermal energy into electrical energy which may be utilized to provide electrical power to an electronic device that is the heat generating object. The invention increases the efficiency of electronic devices such as computer processing units.

Abstract: The present invention provides an energy converting device, which includes: a base substrate; and a plurality of thermoelectric element structures which are sequentially stacked on the base substrate and electrically interconnected in parallel to one another.

Abstract: Certain example embodiments provide techniques for improving the output of hybrid systems comprising photovoltaic (PV) and thermoelectric (TE) modules in conjunction with super-insulating, yet optically transmissive, vacuum insulated glass (VIG) unit technologies. More particularly, certain example embodiments relate to hybrid systems including hydrogenated microcrystalline silicon (mc-Si), hydrogenated amorphous silicon (a-Si), bulk hetero junction solar cell, and/or the like, that may be used together with a TE generator, that achieves high operational PV and TE efficiencies under ambient conditions. In that regard, certain example embodiments effectively partition the solar spectrum in order to yield an increased conversion efficiency of a PV-TE hybrid system with a solar cell operating at ambient temperature.

Abstract: A thermoelectric module includes: thermoelectric semiconductor elements; printed metal conductors for interconnecting the semiconductor elements; and at least one base support for the printed conductors, the base support including a metal matrix composite.

Abstract: A thermoelectric conversion module includes a pair of heat transfer plates, p-type semiconductor blocks and n-type semiconductor blocks arranged between the heat transfer plates, and terminal electrodes formed respectively on inner surfaces of the heat transfer plates and connecting the semiconductor blocks in series. The heat transfer plates include holes reaching from an outer surface to the terminal electrodes, and grooves each formed between the terminal electrodes and communicating between the adjacent holes. If a disconnection occurs, for example, a pin of a tester is brought into contact with the terminal electrode via the hole to specify a disconnected portion, and the terminal electrodes are electrically connected by injecting conductive paste into the holes in the disconnected portion as well as the groove.

Abstract: A thermoelectric conversion module is provided with a p-type thermoelectric conversion element and an n-type thermoelectric conversion element; a support frame having a through hole with the p-type thermoelectric conversion element therein and a through hole with the n-type thermoelectric conversion element therein; and an electrode electrically connecting the p-type thermoelectric conversion element with the n-type thermoelectric conversion element; at least one element of the p-type thermoelectric conversion element and the n-type thermoelectric conversion element has a shape having a vertex and/or an edge; the at least one element has been secured to the support frame by an adhesive adhering to a region of the surface of the at least one element except for the vertex and the edge and to the support frame.

Abstract: (Problem) To make a thermoelectric conversion module block with a plurality of connected thermoelectric conversion modules easy to handle and easy to connect the thermoelectric conversion modules to one another, operate stably for long periods of time. (Solution to problem) A thermoelectric conversion module is provided with a substrate 2, and a plurality of thermoelectric conversion elements 3, 4 electrically connected in series to one another on the substrate 2.

Abstract: A thermoelectric system includes a first plurality of thermoelectric elements and a second plurality of thermoelectric elements. The thermoelectric system further includes a plurality of heat transfer devices. Each heat transfer device has a first side in thermal communication with two or more thermoelectric elements of the first plurality of thermoelectric elements and a second side in thermal communication with one or more thermoelectric elements of the second plurality of thermoelectric elements, so as to form a stack of thermoelectric elements and heat transfer devices. The two or more thermoelectric elements of the first plurality of thermoelectric elements are in parallel electrical communication with one another, and the two or more thermoelectric elements of the first plurality of thermoelectric elements are in series electrical communication with the one or more thermoelectric elements of the second plurality of thermoelectric elements.

Abstract: An energy conversion device may include at least one hot source chamber (255, 355) configured to receive a hot fluid, at least one cold source chamber (275, 375) configured to receive a coolant, and a plurality of thermoelectric elements (272, 273, 773) in thermal communication with the at least one hot source chamber (255, 355) and at least one cold source chamber (275, 375), the thermoelectric elements being configured to create an electric potential when exposed to a temperature gradient. The at least one hot source chamber (255, 355) can be configured to perform catalytic conversion of the hot fluid received therein. The at least one hot source chamber (255, 355) and the at least one cold source chamber (275, 375) may be formed from a material having a relatively low coefficient of thermal expansion.

Abstract: A set of electrical connector pins for a thermocouple includes two materially similar conductor pairs, each conductor pair having conductors composed of a different material, and carried by an electrically insulating connector housing. The different materials of the conductor pairs provide a partial compensation to the thermocouple EMF developed between the hot junction and the cold junction when engaged thereto for the different type thermocouples. The conductors of each pair are operable to engage with two thermoelement conductors that form a thermocouple of differing types. The thermocouples provide a hot junction electrical interconnection therebetween at one end and are coupled to a cold junction at another end.

Abstract: A thermoelectric device includes at least a first metal foil having a first material thickness, a second metal foil having a second material thickness, an interspace between the first metal foil and the second metal foil, an electrical insulation coating on the first metal foil and the second metal foil towards the interspace and a multiplicity of first semiconductor components and second semiconductor components, which are fixed and electrically connected to one another on the insulation coating in the interspace. A thermoelectric apparatus having a multiplicity of thermoelectric devices and a motor vehicle having a thermoelectric apparatus, are also provided.

Abstract: The subject invention pertains to thermoelectric power generation. According to certain embodiments, a stack of silicon-micromachined chips can be connected to form a cylindrical heat exchanger that enables a large, uniform temperature difference across a radially-oriented thermopile. Each layer in the stack can comprise two thermally-isolated concentric silicon rings connected by a polyimide membrane that supports patterned thermoelectric thin films. The polyimide membrane can be formed by selectively etching away the supporting silicon, resulting in thermally-isolated inner and outer rings. In operation, hot gas can flow through a finned central channel, and an external cross flow can enhance heat transfer to ambient to keep the outer surfaces cool. The resulting temperature gradient across the thermopile generates a voltage potential across the open ends due to the Seebeck effect.

Abstract: A thermoelectric device (100, 220) includes a plurality of conductor portions (120-124) including a first angled side portion (134) and a second angled side portion (135). The thermoelectric device (100, 220) also includes a plurality of conductor members (170-174) including a first angled side section (181) and a second angled side section (182). A plurality of P-type thermoelectric members (210-213) interconnect corresponding ones of the first angled side portions (134) with the first angled side sections (181). A plurality of N-type thermoelectric members (200-204) interconnect corresponding ones of the second angled side portions (135) with the second angled side sections (182). Electric flow through the plurality of conductor portions (120-124) and the plurality of conductor members (170-174) passes along a first predefined curvilinear path and a heat flux passes along a second predefined curvilinear path.

Abstract: According to one embodiment, a thermoelectric device is provided with thermoelectric elements and formed of a material capable of exhibiting the thermoelectric effect and a first electrode located at end portions of the thermoelectric elements. The first electrode includes an electrode member, a soaking member having electrical conductivity, located between the electrode member and the thermoelectric elements, and including facing portions facing the thermoelectric elements and folded portions folded back at peripheral edges of the facing portions so as to lie on the opposite side to the thermoelectric elements, and an elastic member located on the opposite side of the facing portions to the thermoelectric elements, at least a part of the peripheral edge of the elastic member being held between the folded portions and the facing portions of the soaking member.

Abstract: A thermoelectric module and method of manufacture thereof, capable of preventing short-circuits between electrodes due to solder without causing increases in size or cost. A thermoelectric module is configured with lower electrodes formed on the inside surface of a lower substrate, placed in opposition to an upper substrate, on the inside surface of which are formed upper electrodes; the end faces of thermoelectric elements are soldered to the lower electrodes and upper electrodes. Each of the electrodes is configured from three layers, which are a copper layer, a nickel layer formed on one face of the copper layer, and a gold layer formed on one face of the nickel layer; a visor portion, protruding outward, is formed in the nickel layer, so that when positioning the thermoelectric elements above the electrodes and soldering the electrodes to the thermoelectric elements, the flowing of solder 18a from the side portions of electrodes to the insulating substrate is prevented.

Abstract: A computer with thermoelectric conversion uses a thermoelectric conversion module that connects between a heat generating device and a low temperature device to fully utilize the redundant heat generated by the computer. The thermoelectric conversion module converts heat to power based on a temperature difference between the heat generating device and the low temperature device. The power generated by the thermoelectric conversion module is then delivered to a load that can be activated by the power.

Abstract: Provided is a thermoelectric module including electrodes and P-type and N-type semiconductors formed on a substrate by a printing method. The thermoelectric module includes upper and lower substrates (110 and 120) formed of ceramic or aluminum and forming upper and lower surfaces of the thermoelectric module; electrodes (130) disposed on surfaces of the upper and lower substrates (110 and 120), the electrodes being formed of an electrically conductive material for transmitting electric power; a plurality of P-type and N-type semiconductors (140 and 150) spaced between the electrodes (130), the P-type and N-type semiconductors (140 and 150) being forming by sintering a paste mixture of thermoelectric powder and an organic solvent, wherein the electrodes (130) and the P-type and N-type semiconductors (140 and 150) are formed by a printing method. With this configuration, thin thermoelectric module having various sizes and shapes can be provided.

Abstract: Method and apparatus for improved thermal isolation for thermoelectric devices are disclosed. In one embodiment, a thermoelectric device includes a first substrate portion having a first p-type conductive portion electrically coupled to a first n-type conductive portion, and a second substrate portion having a second p-type conductive portion and a second n-type conductive portion, the second substrate portion being positioned proximate to the first substrate portion such that the first and second p-type conductive portions are approximately aligned and the first and second n-type conductive portions are approximately aligned, wherein the first and second p-type conductive portions are spaced apart to form a first gap, and the first and second n-type conductive portions are spaced apart to form a second gap.

Abstract: A method for manufacturing thermopile carrier chips comprises forming first type thermocouple legs and second type thermocouple legs on a first surface of a substrate and afterwards removing part of the substrate form a second surface opposite to the first surface, thereby forming a carrier frame from the substrate and at least partially releasing the thermocouple legs from the substrate, wherein the thermocouple legs are attached between parts of the carrier frame. First type thermocouple legs and second type thermocouple legs may be formed on the same substrate or on a separate substrate. In the latter approach both types of thermocouple legs may be optimised independently. The thermocouple legs may be self-supporting or they may be supported by a thin membrane layer. After mounting the thermopile carrier chips in a thermopile unit or in a thermoelectric generator, the sides of the carrier frame to which no thermocouple legs are attached are removed.

Abstract: A thermoelectric conversion module includes a tubular element unit having a plurality of ring-like thermoelectric elements coaxially arranged with air as an insulator sandwiched inbetween. The ring-like thermoelectric element is covered approximately entirely with electrodes at its outer circumference surface and inner circumference surface, respectively, and generates electricity by temperature difference between the outer circumference surface and the inner circumference surface. A lead wire electrically connects the electrode covered on the outer circumference surface of one ring-like thermoelectric element among the plurality of ring-like thermoelectric elements to the electrode covered on the inner circumference surface of another ring-like thermoelectric element adjacent to the one ring-like thermoelectric element.

Abstract: Disclosed are embodiments of methods and systems for wireless data transmission by magnetic induction. In one embodiment, a network of magnetic induction units is provided. The units may be configured to transmit a data signal by modulation of a time-varying magnetic field. One or more units may also be configured to receive a data signal received from another magnetic induction unit. In one specific implementation, a network of underground magnetic induction units is provided, each having a sensor connected thereto. Each of the units, or a subset of the units, may be configured to transmit its sensed data to an adjacent or nearby unit, which, in turn, may retransmit the original data, along with additional appended data, to another adjacent unit. The network data may thereby be relayed in a multi-hop fashion until it reaches a desired destination.

Abstract: A thermoelectric conversion device and a manufacture method thereof are provided. The manufacture method includes an electrode board stamping process, an insulating frame molding process, a punching process, an element fixing process, a bending process and an insulating frame integrating process. Band-shaped plate members which function as heat radiating fins and heat absorbing fins and are integrated with insulating frame members are respectively folded-back in such a manner that the folding-back directions of the band-shaped plate members are alternately reverse to each other in the longitudinal direction of the band-shaped plate member. The insulating frame members are joined to each other to be arranged substantially in line, to construct an insulating frame unit. Thus, the component number and the assembly labor can be reduced, while the manufacture quality and the product quality can be improved.

Abstract: A thermoelectric conversion device includes a hot terminal substrate, a cold terminal substrate and a stacked structure. The stacked structure is disposed between the hot terminal substrate and the cold terminal substrate. The stacked structure includes thermoelectric conversion layers each including a thermoelectric couple layer, a first conductive layer and a second conductive layer, a first heat-conductive and electrically insulating structure and a second heat-conductive and electrically insulating structure. Each of the thermoelectric conversion layers is arranged in the stacked structure. The first conductive layer includes first conductive materials and is arranged on tops of P/N type thermoelectric conversion elements. The second conductive layer includes second conductive materials and is arranged on bottoms of the P/N type thermoelectric conversion elements. The first heat-conductive and electrically insulating structure is connected between two adjacent first conductive layers.

Abstract: A thermoelectric module is provided that includes a first thermally conductive plate with a first array of thermoelectric elements coupled to it. The first array of thermoelectric elements includes a first plurality of thermoelectric elements. The thermoelectric module also includes a second thermally conductive plate coupled to the first array of thermoelectric elements, and a second array of thermoelectric elements coupled to the second plate. The second array of thermoelectric elements includes a second plurality of thermoelectric elements. A third thermally conductive plate is coupled to the second array of thermoelectric elements. The thermoelectric module also includes a portion of each thermoelectric element of the first and second pluralities of thermoelectric elements being coplanar with at least a portion of every other thermoelectric element of the first and second pluralities of thermoelectric elements.

Abstract: A thermoelectric device including a first substrate, a plurality of conductive vias, a second substrate, a thermoelectric couple module, a first insulation layer, and a second insulation layer is provided. The first substrate has a first surface and a second surface opposite to each other. The conductive vias running through the first substrate respectively connect the first and the second surface. The second substrate faces the second surface of the first substrate. The thermoelectric couple module including a plurality of thermoelectric couples connected with each other in series is disposed between the first and the second substrate and coupled to the conductive vias. The first insulation layer is disposed between the thermoelectric couple module and the first substrate. The second insulation layer is disposed between the thermoelectric couple module and the second substrate.

Abstract: The present invention provides an indium-doped Co4Sb12 skutterudite composition in which some Co on the cubic lattice structure may be replaced with one or more members of the group consisting of Fe, Ni, Ru, Rh, Pd, Ir and Pt; some Sb on the planar rings may be replaced by one or more members of the group consisting of Si, Ga, Ge and Sn; and a second dopant atom is selected from a member of the group consisting of Ca, Sc, Zn, Sr, Y, Pd, Ag, Cd, Ba, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu. The composition is useful as a thermoelectric material. In preferred embodiments, the composition has a figure of merit greater than 1.0. The present invention also provides a process for the production of the composition, and thermoelectric devices using the composition.

Abstract: A thermopile sensor for detecting infrared radiation arriving in an axial entering direction. The thermopile sensor comprises a metal housing that has a base section and a mantle section, a cavity between said mantle section and said base section, an opening in said mantle section opposite said base section for entering of said infrared radiation, thermopile chip on a top surface of the base section, electrical connectors connected to said thermopile chip(s) and which extending through said metal, and a radiation transparent window. Said thermopile sensor is a miniature sensor construction, in which said cavity has an inner dimension adapted for at least one thermopile chip. Said base section has an outer base dimension and a base thickness forming the first part of a thermal mass, and said mantle section extends with a length from said base section and has a wall thickness around said opening forming a second part of said thermal mass, which surrounds said thermopile chip.