Abstract: Closed system heat engines can be used to deliver useful electrical power by harvesting ambient energy in the environment. The present invention provides a means of harvesting these low temperature differences in to useful energy and provides while providing rectification and regulation features.

Abstract: A high efficiency thermo electric device comprising a multi nanolayer structure of alternating insulator and insulator/metal material that is irradiated across the plane of the layer structure with ionizing radiation. The ionizing radiation produces nanocrystals in the layered structure that increase the electrical conductivity and decrease the thermal conductivity thereby increasing the thermoelectric figure of merit. Figures of merit as high as 2.5 have been achieved using layers of co-deposited gold and silicon dioxide interspersed with layers of silicon dioxide. The gold to silicon dioxide ratio was 0.04. 5 MeV silicon ions were used to irradiate the structure. Other metals and insulators may be substituted. Other ionizing radiation sources may be used. The structure tolerates a wide range of metal to insulator ratio.

Abstract: A thermoelectric device (100, 342) that includes at least one thermoelectric couple (118, 304) that contains a thermoelectric junction (156) between two dissimilar materials (P, N) that allow exploitation of either the Seebeck effect or Peltier effect of the junction. The thermoelectric couple includes two thermoelements (120, 124, 324, 326) that extend between the hot side (104) and cold side (108) of the device. Each thermoelement has a thermally insulating region (128, 132) that insulates the hot side from the cold side and an electrical energy storage device (136, 138, 308, 310) that stores electrical energy. When operating in a Seebeck mode, each storage device may be periodically discharged by harvesting circuitry (200, 300) so as to harvest the energy stored therein. When operating in a Peltier mode, each storage device may be periodically charged by charging circuitry (900, 1000) so as to induce a temperature change at the thermoelectric junction.

Abstract: An apparatus includes a first thermally conductive body having a plurality of fingers and a second thermally conductive body having a plurality of fingers. The first and second bodies are configured such that the fingers of the first body are interdigitated with the fingers of the second body. Each of a plurality of thermoelectric modules has a first major surface and an opposing second major surface. The first major surface of each thermoelectric module is in thermal contact with one of the fingers of the first body, and the second major surface is in thermal contact with one of the fingers of the second body.

Abstract: A hybrid energy scavenger comprising a thermopile unit and photovoltaic cells is provided, wherein the hybrid energy scavenger may generate a good output power when operating in conditions of small temperature difference between a heat source and a heat sink, and/or either receiving the heat from a heat source with high thermal resistance or dissipating it into a heat sink with high thermal resistance such as a human body or a body of any other endotherm, or a fluid such as air, and wherein the photovoltaic cells are part of a heat dissipating structure for connection to the heat sink.

Abstract: A thermoelectric generation device is configured for mounting on cooling tubes of a heat exchanger of a computer room air conditioning unit in a data center. A first type of Seebeck material and a second type of Seebeck material are arranged in a matrix and connected in series. An electrically insulating, but thermally conducting plate is located on either side of the device. The device is mounted physically on cooling tubes of the heat exchanger and exposed on the other side to the warm air environment. As a result of the temperature difference a voltage is generated that may be used to power an electrical load connected thereto.

Abstract: Embodiments of the invention provide a thin film thermoelectric cooler. The cooler may have a high packing density that provides good cooling performance. The cooler may be formed by forming a first set of cooling elements, depositing a conformal insulating layer on the first set, then forming a second set of cooling elements between the first set of elements.

Abstract: Semiconductor integrated thermoelectric devices are provided, which are formed having high-density arrays of thermoelectric (TE) elements using semiconductor thin-film and VLSI (very large scale integration) fabrication processes. Thermoelectric devices can be either separately formed and bonded to semiconductor chips, or integrally formed within the non-active surface of semiconductor chips, for example.

Abstract: A compact, high-performance thermoelectric conversion module includes a laminate having a plurality of insulating layers, p-type thermoelectric semiconductors and n-type thermoelectric semiconductors formed by a technique for manufacturing a multilayer circuit board, particularly a technique for forming a via-conductor. Pairs of the p-type thermoelectric semiconductors and the n-type thermoelectric semiconductors are electrically connected to each other in series through p-n connection conductors to define thermoelectric conversion element pairs. The thermoelectric conversion element pairs are connected in series through, for example, series wiring conductors. The thermoelectric semiconductors each have a plurality of portions in which the peak temperatures of thermoelectric figures of merit are different from each other. These portions are distributed in the stacking direction of the laminate.

Abstract: The invention relates to a thermoelectric means (60) that can be woven or knitted, taking the form of an elongate body and having on its surface at least one converter for converting thermal energy into electrical energy. The invention also relates to a structure for converting a temperature difference over the thickness of the structure into electricity, which consists of an assembly formed by the interlacement of textile fibers (8), of said thermoelectric means (60) and of connection means (7).

Abstract: A method for manufacturing thermopile carrier chips comprises forming first type thermocouple legs and second type thermocouple legs on a first surface of a substrate and afterwards removing part of the substrate form a second surface opposite to the first surface, thereby forming a carrier frame from the substrate and at least partially releasing the thermocouple legs from the substrate, wherein the thermocouple legs are attached between parts of the carrier frame. First type thermocouple legs and second type thermocouple lets may be formed on the same substrate or on a separate substrate. In the latter approach both types of thermocouple legs may be optimised independently. The thermocouple legs may be self-supporting or they may be supported by a thin membrane layer. After mounting the thermopile carrier chips in a thermopile unit or in a thermoelectric generator, the sides of the carrier frame to which no thermocouple legs are attached are removed.

Abstract: A thermoelectric system includes a first plurality of thermoelectric elements and a second plurality of thermoelectric elements. The thermoelectric system further includes a plurality of heat transfer devices. Each heat transfer device has a first side in thermal communication with two or more thermoelectric elements of the first plurality of thermoelectric elements and a second side in thermal communication with one or more thermoelectric elements of the second plurality of thermoelectric elements, so as to form a stack of thermoelectric elements and heat transfer devices. The two or more thermoelectric elements of the first plurality of thermoelectric elements are in parallel electrical communication with one another, and the two or more thermoelectric elements of the first plurality of thermoelectric elements are in series electrical communication with the one or more thermoelectric elements of the second plurality of thermoelectric elements.

Abstract: A thermopile infrared sensor array, comprises a sensor chip with a number of thermopile sensor elements, made from a semiconductor substrate and corresponding electronic components. The sensor chip is mounted on a support circuit board and enclosed by a cap in which a lens is arranged. The aim is the production of a monolithic infrared sensor array with a high thermal resolution capacity with a small chip size and which may be economically produced. The aim is achieved by arranging a thin membrane made from non-conducting material on the semiconductor substrate of the sensor chip on which the thermopile sensor elements are located in an array. Under each thermopile sensor element, the back side of the membrane is uncovered in a honeycomb pattern by etching and the electronic components are arranged in the boundary region of the sensor chip. An individual pre-amplifier with a subsequent low-pass filter may be provided for each column and each row of sensor elements.

Abstract: A thermoelectric system includes a first thermoelectric element including a first plurality of segments in electrical communication with one another. The thermoelectric system further includes a second thermoelectric element including a second plurality of segments in electrical communication with one another. The thermoelectric system further includes a heat transfer device including at least a first portion and a second portion. The first portion is sandwiched between the first thermoelectric element and the second thermoelectric element. The second portion projects away from the first portion and configured to be in thermal communication with a working medium.

Abstract: There are described thermoelectric elements that are manufactured by using a porous matrix or a porous substrate. The matrix consists of an electrically insulating material having sufficient thermal and chemical resistance as well as the lowest possible thermal conductivity, and is provided in predetermined regions with different thermoelectric materials, so that continuous conductors are formed in the matrix. These are electrically connected to one another to form thermocouples, which in turn are electrically interconnected with one another to form the thermoelectric element.

Abstract: A thermoelectric effects materials based energy transduction device, for selectively providing conversions between electrical and thermal energies having interleaved n-type conductivity material layers having thermoelectric effects properties and a first plurality of p-type conductivity material layers each having thermoelectric effects properties. There is a first plurality of passageway structures each being thermally conductive and each having passageways therethrough extending between two sides thereof with such a passageway structure from this first plurality thereof positioned between members of each overlapped pair of succeeding layers.

Abstract: A system is provided. The system includes a thermoelectric device that includes first and second thermally conductive substrates and first and second thermoelements disposed between the first and second thermally conductive substrates, wherein the first thermoelement, or the second thermoelement, or both the first and second thermoelements comprises a thermally insulating and electrically conducting tunneling element having a tunneling gap.

Abstract: A thermoelectric device includes a plurality of n-type thermoelectric elements and a plurality of p-type thermoelectric elements. These thermoelectric elements each have multiple end surfaces that are substantially parallel to each other, and include terminals attached to the end surfaces. The thermoelectric elements also include a support structure with an external surface covered by multiple layers of a thermoelectric material and a flexible substrate. The thermoelectric device also includes a plurality of conductive members which electrically interconnect the thermoelectric elements.

Abstract: A system in accordance with the invention includes a power converter for converting a thermally generated voltage where the power converter includes a low-voltage direct current to direct current voltage converter (DC-DC converter) and a high-efficiency DC-DC converter coupled with the low-voltage DC-DC converter. The system also includes a charge storage circuit coupled with the low-voltage DC-DC converter and the high-efficiency DC-DC converter for storing converted electrical energy and a programmable controller circuit. The programmable controller circuit is coupled with the high-efficiency DC-DC converter, the low-voltage DC-DC converter, and the charge storage circuit such that the controller circuit substantially controls operation of the system when the voltage potential of the converted electrical energy stored by the charge storage circuit is greater than a brown out voltage of the controller.

Abstract: A thermoelectric conversion device and a manufacture method for the thermoelectric conversion device are provided. The manufacture method includes a joining process for respectively joining heat exchanging members to thermoelectric-element pairs of an thermoelectric element module, an immersion process for immersing the thermoelectric element module and the heat exchanging members in an immersion sink where an melted insulating material is provided, and a baking process for baking an assembly of the thermoelectric element module and the heat exchanging members where the insulating material has been applied in the immersion process so that an insulating film is formed. Thus, an electrical insulation can be provided while a heat-exchanging capacity and an air-blowing capacity are maintained.

Abstract: Described herein is a portable storage device that stores a hydrogen fuel source. The storage device includes a bladder that contains the hydrogen fuel source and conforms to the volume of the hydrogen fuel source. A housing provides mechanical protection for the bladder. The storage device also includes a connector that interfaces with a mating connector to permit transfer of the fuel source between the bladder and a device that includes the mating connector. The device may be a portable electronics device such as a laptop computer. Refillable hydrogen fuel source storage devices and systems are also described. Hot swappable fuel storage systems described herein allow a portable hydrogen fuel source storage device to be removed from a fuel processor or electronics device it provides the hydrogen fuel source to, without shutting down the receiving device or without compromising hydrogen fuel source provision.

Abstract: A high efficiency thermo electric device comprising a multi nanolayer structure of alternating insulator and insulator/metal material that is irradiated across the plane of the layer structure with ionizing radiation. The ionizing radiation produces nanocrystals in the layered structure that increase the electrical conductivity and decrease the thermal conductivity thereby increasing the thermoelectric figure of merit. Figures of merit as high as 2.5 have been achieved using layers of co-deposited gold and silicon dioxide interspersed with layers of silicon dioxide. The gold to silicon dioxide ratio was 0.04. 5 MeV silicon ions were used to irradiate the structure. Other metals and insulators may be substituted. Other ionizing radiation sources may be used. The structure tolerates a wide range of metal to insulator ratio.

Abstract: There is provided a thermoelectric conversion module comprising a first insulated substrate, a plurality of columnar p-type and n-type semiconductor thermoelectric transducers alternately arranged on the first insulated substrate, a second insulated substrate arranged so as to face the first insulation with interposition of the semiconductor thermoelectric transducers, first electrodes arranged between the first insulated substrate and the respective semiconductor thermoelectric transducers, and second electrodes arranged between the second insulated substrate and the respective semiconductor thermoelectric transducers, the first and second electrodes electrically connecting the p-type and n-type semiconductor thermoelectric transducers in series, and a glass film coated on the exposed surface of each first electrode at the first insulated substrate side and on a part of the exposed surfaces of the p-type and n-type semiconductor thermoelectric transducers directed from the first electrode to the second elect

Abstract: A radiation detector, a method for manufacturing a radiation detector, and a sensor module having a radiation detector. The radiation detector may include a thermopile chip having a diaphragm, a first cavity formed underneath the diaphragm, a thermopile structure formed on the diaphragm and an absorber layer applied to the thermopile structure, a cover chip, which has a second cavity on its bottom and is attached to the thermopile chip in such a way that the diaphragm having the thermopile structure and the absorber layer is located between the first cavity and the second cavity and, a filter plate attached to the cover chip via an adhesive layer of a defined layer thickness for transmitting infrared radiation of a defined wavelength range. Spacer means, for example, spacers may be provided for the defined layer thickness.

Abstract: An apparatus and system is presented for partially compensating the cold junction of a thermocouple system using low cost semi-compensated conductors of system components accommodating various thermocouple types. The thermocouple system, comprises a thermocouple portion comprising two thermocouple types, each type composed of two different thermoelectric materials joined to form a hot junction, a semi-compensation portion comprising two substantially similar conductor pairs, each composed of a different material, wherein one conductor of each pair is composed of a material different than the thermoelectric materials of the respective thermocouple type of the thermocouple portion.

Abstract: A thermopile structure containing improved heat sinks for thermocouples in the detectors is described. The heat sinks are provided without additional processing. The heat sinks are added by using “dummy traces” to the polysilicon mask. The “dummy traces” act as heat sinks to transfer of thermal energy from the narrow metallic traces used in the thermocouple. The “dummy traces” are not electrically connected to the thermopile, therefore they do not affect the electrical resistance of the thermopile. Also, the “dummy trace” does not add significant mass to the thermopile/membrane system; therefore they do not adversely affect the thermal conductance of the system.

Abstract: Disclosed is a foil segment for a thermoelectric generator comprising a top plate disposed in spaced relation above a bottom plate. An array of the foil segments is perpendicularly disposed in side-by-side arrangement between and in thermal contact with the bottom and top plates. Each foil segment comprises a substrate having a thickness of about 7.5-50 microns, opposing front and back substrate surfaces and a series of spaced alternating n-type and p-type thermoelectric legs disposed in parallel arrangement on the front substrate surface. Each of the n-type and p-type legs is formed of a bismuth telluride-based thermoelectric material having a thickness of about 5-100 microns, a width of about 10-100 microns and a length of about 100-500 microns. The alternating n-type and p-type thermoelectric legs are electrically connected in series and thermally connected in parallel such that a temperature differential between the bottom and top plates results in the generation of power.

Abstract: A thermoelectric module with a simple structure with less breakage by thermal stress is provided. For this purpose, the thermoelectric module includes p-type and n-type thermoelectric elements (13, 14) which are alternately placed, and outer electrodes (15) and inner electrodes (16), which are alternately placed between the thermoelectric elements (13, 14), and at least part of at least either one of the outer electrode (15) or the inner electrode (16) has a shape approximately along an object which exchanges heat with the electrodes (15, 16). The inner electrodes (16) surround an object which exchanges heat with the electrodes (15, 16).

Abstract: A thermoelectric generator comprising a plurality of semi-conductor elements of type n an type p alternatingly disposed and connected at the ends thereof to form a plurality of thermocouples on two opposite faces of the generator, said elements being thin polycrystalline semi-conductor ceramic layers deposited on a microporous support by means of serigraphy and fixed to said support by sintering.

Abstract: A method for the correction of the output signal of an infra red radiation multiple element sensor comprises the steps of determining and storing a parameter of a sensor element of the sensor and of generating a corrected signal of the sensor element in accordance with the stored parameter, where the storage of the parameter takes place in a memory supplied by the manufacturer and where prior to the correction being carried out, the parameter is transmitted to a correction device which is separate from the sensor. A sensor has several sensor elements (11a to 11i) which generate an output signal and a memory (14) provided on the sensor for the storage of at least one parameter of at least one sensor element.

Abstract: A micropatterned thermosensor, e.g., an infrared sensor, includes a supporting body and at least one thermocouple arranged thereon. The thermocouple also has a first material and a second material, which together form, at least in a pointwise manner, at least one thermal contact. Furthermore, it is provided that the first and/or the second material are configured at least regionally in the form of a meander-shaped or undulating-type circuit trace and extend on the supporting body. In addition, a micropatterned thermosensor having such patterned circuit traces, in which the first material is platinum or aluminum, and the second material is doped or undoped polysilicon-germanium.

Abstract: An apparatus and system is presented for partially compensating the cold junction of a thermocouple system using low cost semi-compensated conductors of system components accommodating various thermocouple types. The thermocouple system, comprises a thermocouple portion comprising two thermocouple types, each type composed of two different thermoelectric materials joined to form a hot junction, a semi-compensation portion comprising two substantially similar conductor pairs, each composed of a different material, wherein one conductor of each pair is composed of a material different than the thermoelectric materials of the respective thermocouple type of the thermocouple portion.

Abstract: A thermocouple produced by removing insulation from a distal end of each of at least first and second thermocouple conductors, forming a thermocouple junction at the distal ends of the at least first and second thermocouple conductors, placing the thermocouple junction into the heat shrinkable polymer material by sliding a second end of the tube of heat shrinkable polymer material over the thermocouple junction and sealing the thermocouple junction by heating and melting the polymer material.

Abstract: An improved gas pilot control apparatus with an improved thermopile construction comprised of a consolidated thermocouple and thermopile capable of providing multiple EMF signals to operate a gas valve, transmitter/receiver and other components when positioned relative to a pilot flame. The improved thermopile requires a pilot flame of typically 500 BTU/hr to generate the EMF milli voltage required by modern gas valves to maintain reliable, rapid and safe operation of the appliance. The improved thermopile is electrically connected to an electromagnetic valve that controls the flow of gas from the source of supply to the pilot and main burner. The thermopiles are electrically connected to electromagnetic valves and to a transmitter/receiver that remotely control the flow of gas to the main burner.

Abstract: A thermal detection device having hot and cold regions, first and second thermocouples disposed across the hot and cold regions each with terminals at the cold region, a thermal absorber disposed at the hot region and in thermal communication with the first and second thermocouples, and a base header having a support surface and a non-support surface. A portion of the support surface opposes a portion of the cold region, and a portion of the non-support surface opposes a portion of the hot region. The second thermocouple has a polarity opposite to the polarity of the first thermocouple.

Abstract: A combined thermocouple and thermopile capable of producing multiple EMF signals. The combined thermocouple and thermopile construction is particularly adapted for use as an electric generator capable of producing multiple EMF signals and able to respond faster to changes to the presence or absence of a pilot or gas burner flame. The conductors of the thermopile are comprised of dissimilar metals joined at each end to form hot and cold thermocouple junctions. The thermopile may provide multiple EMF signals when a third wire lead is affixed to a cold junction between either end of the array. The array of thermocouples is formed in a circle and enclosed in a metal sleeve or jacket.

Abstract: A sensor includes a detector for detecting physical quantity, a membrane, and a stress relaxation area. A stress is expected to concentrate in the stress relaxation area in a case of manufacturing process of the sensor or a case of operating the sensor. The detector is disposed on the membrane except for the stress relaxation area.

Abstract: A thermopile on an electrically insulating substrate. A pattern is arranged on this substrate of parts which consist of a first conductive material, to which a second conductive material is applied, and parts which consist only of the first conductive material. The second material is better electrically conducting than the first and, connected as thermopile, can thereby generate a certain thermo-voltage. The second material is applied to the first, starting from a layer of the first material on the substrate, by etching stripes therein via the so-called “blind-hole etching” technique and applying the second material in these stripes.

Abstract: A solar energy converter includes: a light-concentrating instrument; an electron emitter in an insulated vacuum vessel, emitting electrons in a vacuum as a temperature rises by sunlight; an electron accelerator within the light-concentrating instrument; a cathode on a surface of the electron emitter opposite to a surface which is irradiated by sunlight, and electrically connected with the electron emitter; an electric field supplier having a positive terminal and a negative terminal; and an electron collector in the vacuum vessel, collecting the emitted electrons flying from the electron emitter toward the electron accelerator; wherein the electron accelerator is connected with the positive terminal and the cathode is connected with the negative terminal to generate an electric field, and the electron collector is used as a negative generator electrode and the cathode is used as a positive generator electrode in which the collected electrons migrate to the electron emitter to generate electricity.

Abstract: A thermopile structure containing improved heat sinks for thermocouples in the detectors is described. The heat sinks are provided without additional processing. The heat sinks are added by using “dummy traces” to the polysilicon mask. The “dummy traces” act as heat sinks to transfer of thermal energy from the narrow metallic traces used in the thermocouple. The “dummy traces” are not electrically connected to the thermopile, therefore they do not affect the electrical resistance of the thermopile. Also, the “dummy trace” does not add significant mass to the thermopile/membrane system; therefore they do not adversely affect the thermal conductance of the system.

Abstract: A method and structure for a semiconductor structure that includes a substrate having at least one integrated circuit heat generating structure is disclosed. The invention has at least one integrated circuit cooling device on the substrate adjacent the heat generating structure. The cooling device is adapted to remove heat from the heat generating structure. The cooling device includes a cold region and a hot region. The cold region is positioned adjacent the heat generating structure. The cooling device has one of a silicon germanium super lattice structure. The cooling device also has a plurality of cooling devices that surround the heat generating structure. The cooling device includes a thermoelectric cooler.

Abstract: A radiation sensor which includes a thermopile for detecting radiant energy. The thermopile and a support rim for the thermopile are fabricated as an integrated unit to form a support chip. The support chip is mated to a mating chip so that the thermopile is positioned in an inner cavity region of the radiation sensor. The sensor has a window which permits the transmission of radiant energy into the enclosure such that the radiant energy impinges upon a central absorber region of the thermopile.

Abstract: The solar energy converter comprises an electron emitter and an electron collector. They are provided separate from each other in a vacuum vessel. Solar energy in a wide range of sunlight spectrum can be efficiently converted into electric energy by moving electrons from the electron emitter to the electron collector.

Abstract: A thermocouple produced by removing insulation from a distal end of each of at least first and second thermocouple conductors, forming a thermocouple junction at the distal ends of the at least first and second thermocouple conductors, placing the thermocouple junction into the heat shrinkable polymer material by sliding a second end of the tube of heat shrinkable polymer material over the thermocouple junction and sealing the thermocouple junction by heating and melting the polymer material.

Abstract: A method and apparatus for maintaining a viewing window of a detector substantially clean includes enclosing the detector within a housing, and moving a target surface relative to the viewing window to create an airflow adjacent the viewing window. The housing can include an aperture through which the viewing window of the sensor views the target surface. Motion of the target surface creates an airflow velocity adjacent the viewing window for maintaining the viewing window substantially clean. To increase the accuracy of the detector, a high emissivity area is provided on an outside surface of the housing which faces the target surface.

Abstract: An infrared sensor including an absorber for absorbing incident infrared power to produce a signal representing the temperature of a target object, a frame supporting a membrane which carries the absorber, the frame including a plurality of reflecting surfaces disposed about the circumference of an opening over which the membrane spans for reflecting incident infrared power toward the absorber. By concentrating incident infrared power through reflection, the temperature difference between the absorber and the surrounding frame is increased, thereby producing an increased electrical output from the sensor.

Abstract: A thermoelectric module with a simple structure with less breakage by thermal stress is provided. For this purpose, the thermoelectric module includes p-type and n-type thermoelectric elements (13, 14) which are alternately placed, and outer electrodes (15) and inner electrodes (16), which are alternately placed between the thermoelectric elements (13, 14), and at least part of at least either one of the outer electrode (15) or the inner electrode (16) has a shape approximately along an object which exchanges heat with the electrodes (15, 16). The inner electrodes (16) surround an object which exchanges heat with the electrodes (15, 16).

Abstract: An infrared sensor is provided with a thermopile formed with a plurality of thermocouples connected to each other. The thermopile includes hot junctions, cold junctions, and thermoelectric patterns. The thermoelectric patterns are made of thermoelectric materials differing from each other. The hot junctions and the cold junctions are made of a bonding material which differs from the thermoelectric materials. A temperature-compensation resistor film is formed at a corner of the surface of a substrate on which the thermopile is formed, the temperature-compensation resistor film being made of the same material as the bonding material used for the hot junctions and the cold junctions.

Abstract: A thermoelectric module is basically constituted in a double-stage structure for arranging thermoelectric elements between insulating substrates, one of which has at least a pair of recesses and prescribed patterns of conduction layers. Herein, terminal conduction layers are formed inside of recesses, which reliably ensure electrical conduction between conduction layers formed on surfaces of the insulating substrate. In manufacture, cutting areas are defined on an insulating material plate, in which through holes are formed at prescribed positions on boundaries between cutting areas or at corners of cutting areas, wherein conduction layers are formed in prescribed patterns, and terminal conduction layers are formed inside of through holes and are interconnected with conduction layers selectively formed in proximity to through holes.

Abstract: An infrared sensing element of the present invention includes a base including a thin film portion and a thick wall portion arranged around the thin film portion, and a thermopile including a plurality of thermocouples connected in series so that cold junctions are located on the thick wall portion and hot junctions are located on the thin film portion, wherein a thermosensitive portion is provided in contact with the thick wall portion so that a reference temperature with high accuracy can be used for determining temperature based on output from the thermopile. A PN junction formed on a semiconductor substrate serves as the thermosensitive portion, and it is used to provide for a compact infrared sensing element with high performance at low cost.