Abstract: A cleaning flux contains as a solvent 60-98% by weight of one or both of an alkylene oxide-resorcinol copolymer and an ethylene oxide-propylene oxide condensation-added alkylene diamine. An addition amount of the alkylene oxide-resorcinol copolymer is within a range of 0-98% by weight and the addition amount of the ethylene oxide-propylene oxide condensation-added alkylene diamine is within the range of 0-98% by weight. The cleaning flux further includes one or both of an organic acid and a halogen compound. The addition amount of the organic acid is within the range of 0-18% by weight and the addition amount of the halogen compound is within the range of 0-4% by weight.

Abstract: A cored wire for hybrid laser cladding includes a hollow metal sheath and a core powder composition. The core powder can include, by weight percent: carbon from about 0.8% to about 1.2%, manganese from about 1% to about 1.4%, silicon from about 0.8% to about 1%, chromium from about 22% to about 30%, titanium from about 0.5% to about 2%, vanadium from about 0.5% to about 2%, boron from about 0.8% to about 1.2%, phosphorus from 0% to about 0.04%, and sulfur from 0% to about 0.03%, the balance of the core powder composition being substantially iron. Components and methods using the cored wire are also disclosed.

Abstract: A method of making a flux-coated binder includes treating metal binder slugs to have an adherent surface, adding a flux powder to the treated metal binder slugs, and distributing the flux powder on the adherent surface of the metal binder slugs.

Abstract: In some examples, a method including positioning a first ceramic or ceramic matrix composite (CMC) part and a second ceramic or CMC part adjacent to each other to define a joint between adjacent portions of the first ceramic or CMC part and the second ceramic or CMC part; and depositing an aqueous braze paste at least one of in the joint or adjacent the joint, wherein the aqueous braze paste comprises water, a water-soluble polymeric binder, and a silicon-based powder alloy.

Abstract: An adhesive composition comprising silver particles containing silver atoms and zinc particles containing metallic zinc, wherein the silver atom content is 90 mass % or greater and the zinc atom content is from 0.01 mass % to 0.6 mass %, with respect to the total transition metal atoms in the solid portion of the adhesive composition.

Abstract: A braze preform is provided that includes a filler metal and a luminescent material that covers at least a portion of the filler metal and that can luminesce when exposed to a black light. The luminescent material may include a luminescent ink and a solvent that are mixed together before being applied to filler metal. Presence of the braze preform may be determined using automated equipment by detecting luminescence of the braze preform with a sensor. A decision may be made on whether to advance a parts assembly for brazing based on the determination of presence or absence of the braze preform on such parts assembly.

Abstract: A pressure resistant and corrosion resistant copper alloy contains 73.0 mass % to 79.5 mass % of Cu and 2.5 mass % to 4.0 mass % of Si with a remainder composed of Zn and inevitable impurities, in which the content of Cu [Cu] mass % and the content of Si [Si] mass % have a relationship of 62.0?[Cu]?3.6×[Si]?67.5. In addition, the area fraction of the ? phase “?”%, the area fraction of a ? phase “?”%, the area fraction of a ? phase “?”%, the area fraction of the ? phase “?”%, and the area fraction of a ? phase “?”% satisfy 30?“?”?84, 15?“?”?68, “?”+“?”?92, 0.2?“?”/“?”?2, “?”?3, “?”?5, “?”+“?”?6, 0?“?”?7, and 0?“?”+“?”+“?”?8. Also disclosed is a method of manufacturing a brazed structure made of the above pressure resistant and corrosion resistant copper alloy.

Abstract: A method for forming a vehicular brake rotor involving loading a shaped metal substrate with a mixture of metal alloying components and ceramic particles in a dieheating the contents of the die while applying pressure to melt at least one of the metal components of the alloying mixture whereby to densify the contents of the die and form a ceramic particle-containing metal matrix composite coating on the metallic substrate; and cooling the resulting coated product.

Abstract: An electronic device and a method for producing an electronic device are disclosed. In an embodiment the electronic device includes a first component and a second component and a sinter layer connecting the first component to the second component, the sinter layer comprising a first metal, wherein at least one of the components comprises at least one contact layer which is arranged in direct contact with the sinter layer, which comprises a second metal different from the first metal and which is free of gold.

Abstract: Brazing alloy wire formed from a composite comprising a sheath of at least one ductile first phase and a core comprising particles of a different composition to the sheath, in which: the sheath has an annealing temperature in degrees K the particles have a melting point at least 20% above the annealing temperature of the sheath the particles have a size distribution in which 25% by weight or less comprise particles less than 25 ?m in size the particles are discrete.

Abstract: A soldering flux of the present invention contains, as a base resin, an acrylic resin (A) having an acid value of 0 to 70, and an acrylic resin (B) having an acid value of 30 to 230. The acrylic resin (A) is obtained by polymerization of a monomer mixture containing alkyl(meth)acrylate having an alkyl group having carbon atoms of 12 to 23. The acrylic resin (B) is obtained by polymerization of a monomer mixture containing alkyl(meth)acrylate having an alkyl group having carbon atoms of 6 to 10. The acid value of the acrylic resin (B) is higher than the acid value of the acrylic resin (A), and a difference between these two resins is 15 or more.

Abstract: A brazing composition contains 1 part by mass or more and 10 parts by mass or less of Zn powder, 1 part by mass or more and 5 parts by mass or less of Si powder, 3 parts by mass or more and 10 parts by mass or less of K—Al—F flux, 1 part by mass or more and 3 parts by mass or less of (meth)acrylic resin, wherein the mass ratio (Zn/Si) of Zn powder relative to Si powder is 1 or more and 5 or less.

Abstract: Disclosed is a flux composition for use in brazing of an aluminum alloy material and includes a flux component [A] containing KAlF4; and a fluoride [B] containing an element other than Group 1 elements and Group 2 elements and containing no potassium (K). Also disclosed is a brazing sheet which includes an aluminum alloy core; a filler material lying on or over at least one side of the core; and a flux layer lying on or over one side of the filler material and including the flux composition.

Abstract: A soldering flux includes a base resin, an activator, and a solvent. The activator contains an acrylic resin having an acid value of not more than 50 mg KOH/g and represented by a general formula (1). A monomer weight ratio of a, b, and c is b/(a+b+c)?0.6, at least one of a and c may be 0, R1 is an alkyl group having a carbon number of 8 to 24, R2 is a substituent other than the R1 and may be one of substituents including a hydrogen atom, a methyl group, an alkyl group, an aryl group, and a hydroxyl group or a combination of a plurality of substituents, and R3, R4, and R5 are hydrogen atoms or methyl groups. The solvent contains a compound having a carboxyl group in a cyclohexyl skeleton and represented by a general formula (2).

Abstract: Aiming at providing a metal particle, an electro-conductive paste, a formed article, and a laminated article that are able to form a highly reliable and high-quality electric interconnect, an electro-conductive bonding portion, or a three-dimensional structure that is less likely to produce the Kirkendall void, this invention discloses a metal particle which include an outer shell and a core part, the outer shell including an intermetallic compound and covering the core part.

Abstract: Solder paste compositions and methods for applying solder paste. The solder paste includes lubricating additives to the flux to decrease friction and the changes of metal to metal contact between the surfaces of the solder balls and other surfaces that the solder balls come into contact with. The solder paste also includes solder balls of different average sizes, that improves the desirable liquid like properties of the granular paste while further reducing viscosity. As such, the solder paste is used in current screen printing solder paste application methods without the risk of clogging or agglomeration of solder paste particles on surfaces. The solder paste is also used in jetting or dispensing solder paste application methods without the risk of clogging or agglomeration within the cylinders/containers or apertures and nozzles that are used within such methods.

Abstract: Provided is a curable composition for an electronic component that can be quickly cured and furthermore can have increased storage stability. The curable composition for an electronic component according to the present invention contains an epoxy compound, an anionic curing agent, a flux, and a basic compound excluding the anionic curing agent.

Abstract: The paste for diffusion layer formation used for formation of a GDL for a fuel cell contains a solvent, and conductive particles, a first surfactant having a first decomposition temperature and a second surfactant having a second decomposition temperature that is lower than the first decomposition temperature, all of which are dispersed in the solvent. The paste for diffusion layer formation contains a lower amount of the first surfactant than the second surfactant on a weight basis.

Abstract: Provided is a flux which can remove metal oxides to improve solder wettability and can fix the object to be soldered with flux residue. The flux contains thermosetting resin, and long-chain dibasic acid mixture including one or more species of first long-chain dibasic acid having an alkyl group in a side chain, the first long-chain dibasic acid being added as a hardening agent for hardening the thermosetting resin and an activator, and second long-chain dibasic acid having an alkyl group and an alkoxycarbonyl group in a side chain and having carbon number of 8 or more in a main chain between the carboxyl groups at opposite terminals. It is preferable that content of the thermosetting resin is 30% through 70% and content of the long-chain dibasic acid mixture is 20% through 60%.

Abstract: A flux for soldering includes a base resin, a solvent, and an activating agent. The base resin contains a rosin. An amount of the rosin to be incorporated is from 0% by weight to 30% by weight with respect to a total amount of the base resin. The activating agent includes a compound having a plurality of carboxyl groups on a cyclohexyl structure represented by a general formula (1). X is (a) one or more carboxyl groups, or (b) one or more carboxyl groups and at least one selected from a hydrogen atom, chloro group, bromo group, alkyl group, and cyclohexyl group. A position of the X is not limited. A number of the X is one or more. The X may have either one of the (a) and (b) alone, or a plurality of the (a) and (b) in combination.

Abstract: Provided is a method of manufacturing a solar cell module including: a step (A) of applying a conductive adhesive composition comprising conductive particles having metal, or the like; a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive adhesive composition interposed therebetween; a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in the step (C), laminating protection glass onto a light-receiving surface of the solar battery cell and a protection film onto a rear surface of the solar battery cell, and performing heating, in which a melting point of the metal in the conductive particles is or lower than the heating temperature in the step (C).

Abstract: The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.

Abstract: The present invention is directed to a soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.

Abstract: Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.

Abstract: An adhesive for a semiconductor, comprising an epoxy resin, a curing agent, and a compound having a group represented by the following formula (1): wherein R1 represents an electron-donating group.

Abstract: As electronic equipment has become smaller in size, printed circuit boards which cannot be subjected to cleaning have been developed, and a no-clean lead-free solder paste is becoming necessary. In order for a solder paste not to require cleaning, it is necessary that the color of the residue be transparent and that the residue be non-tacky. A maleated rosin, which is a rosin suited for no-clean paste, has a high acid value so it is not suitable for a flux for lead-free solder. As a means of suppressing a reaction between a flux containing a maleated rosin and a Sn—Ag—Cu based solder alloy powder, a Sn—Ag—Cu—Sb based solder alloy powder is used which adds 1-8 mass % of Sb to a Sn—Ag—Cu based solder alloy. As a result, it is possible to provide a solder paste which has the excellent effect that the solder paste does not easily undergo changes over time and has a long pot life.

Abstract: The invention relates to a method for cleaning the process gas in soldering installations and solder suction systems, in particular for reducing the abietic acid in the process gas, wherein the process gas to be cleaned is conducted through a cleaning system which contains one or more of the following compounds (cleaning compounds): a) carboxylic acids with reducing properties, namely oxalic acid, formic acid, citric acid and/or ascorbic acid: b) metal compounds of higher oxidation states, namely manganates, permanganates, chromates and/or dichromates; c) alcohols which can be convened into the carboxylic acids mentioned in a) by means of oxidation; d) basic lime compounds.

Abstract: Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.

Abstract: A semiconductor device structure and a manufacturing method are provided. The method includes forming a conductive pillar over a semiconductor substrate. The method also includes forming a solder layer over the conductive pillar. The method further includes forming a water-soluble flux over the solder layer. In addition, the method includes reflowing the solder layer to form a solder bump over the conductive pillar and form a sidewall protection layer over a sidewall of the conductive pillar during the solder layer is reflowed.

Abstract: TiO2 based scrubbing granules, and methods of making and using such TiO2 based scrubbing granules are described. TiO2-based scrubbing granules include granulated TiO2 and about 0.5% to about 20% dry weight inorganic salt binder. Other TiO2 based scrubbing granules include unsintered granulated TiO2 and about 0.5% to about 20% dry weight inorganic salt binder. Inorganic salt binder include sodium aluminate. Methods of making TiO2 based scrubbing granules include i) combining TiO2 particles with inorganic salt binder to form TiO2-binder mixture comprising from about 0.5% to about 20% dry weight binder; ii) granulating the TiO2-binder mixture; and drying the granulated TiO2-binder mixture to form TiO2-based scrubbing granules.

Abstract: The invention described herein pertains generally to boric acid free flux composition in which boric acid and/or borax is substituted with a molar equivalent amount of potassium tetraborate tetrahydrate. In some embodiments, a phthalocyanine pigment is used to effect a color change at activation temperature.

Abstract: The present invention relates to organic acid- or latent organic acid-functionalized polymer-coated metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.

Abstract: A method of forming a steel part is provided. The method includes the steps of coating a first steel plate to obtain a first precoat upon the first steel plate so as to define a first base, a first intermetallic alloy layer on the first base and a first metal alloy layer on the first intermetallic alloy layer. On a first face of the first steel plate the first metal alloy layer is removed in a first area of the first steel plate, while at least part of the first intermetallic alloy layer in the first area remains. A second steel plate is coated to obtain a second precoat upon the second steel plate so as to define a second base, a second intermetallic alloy layer on the second base and a second metal alloy layer on the second intermetallic alloy layer. On a second face of the second steel plate, the second metal alloy layer is removed in a second area of the second metal plate, while at least part of the second intermetallic alloy layer in the second area remains.

Abstract: A flux coating composition may include a composition paste including an elastomer solution mixed with a flux powder or a flux paste. When the composition is heated during a brazing operation, the composition yields no metal oxides and ?50 ppm of carbon, ash, fumes, smoke, or other by-product contaminants. The flux may include a binder with an acrylic resin and a plurality of synthetic rubber compounds.

Abstract: An electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a placement area provided with a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; applying flux to at least one of the first electrodes adjacent to at least one reinforcement position set on a peripheral portion of the placement area; dispensing a thermosetting resin onto the reinforcement position, and at least partially coating the first electrode adjacent to the reinforcement position, with the thermosetting resin; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes, and thus bringing the thermosetting resin into contact with a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon.

Abstract: Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from polybutadiene (meth)acrylate compounds and polybutadiene (meth)acrylate compounds, and a hydrogenated dimer acid.

Abstract: The present invention is directed to flux compositions. One composition comprises an activator, a medium-viscosity solvent being a polymer, and a high-viscosity solvent being a copolymer containing first monomers and second monomers. Another composition comprises an activator, and a high-viscosity solvent comprising a copolymer containing first monomers and second monomers. Another composition comprises an activator of 6-12 percent by weight of glutaric acid, pimelic acid, tartaric acid, or mixtures thereof, and a medium-viscosity solvent of 88-94 percent by weight comprising a polymer with hydroxyl end groups. Another composition comprises an activator in a liquid state comprising poly(ethylene glycol)-diacid, and a medium-viscosity solvent comprising a polymer with hydroxyl end groups.

Abstract: Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.

Abstract: The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at ?40° C. to 150° C. as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn—Ag—Bi—In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at ?40° C. to 150° C. is obtained.

Abstract: The invention described herein generally pertains to a system and method for detecting a moisture with a flux used in a welding process. A sensor is employed with a flux source that supplies a welding operation or process in which the sensor detects a moisture level with a flux within the flux source. A monitor component is configured to receive or aggregate data from the sensor, wherein the data relates to the moisture level associated with a flux supply or a portion of flux.

Abstract: Described herein are stable aqueous stannous ion containing compositions and methods of preparing and using the same.

Abstract: A lead-free solder composition including about 90% to about 99% by weight of a lead-free tin solder based on the total weight of the lead-free solder composition and about 1% to about 10% by weight of a polyhedral oligomeric silsesquioxane based on the total weight of the lead-free solder composition.

Abstract: A rosin composition includes a gum rosin, an emulsifier, and a randomizing additive. The rosin composition may be applied to circuit cards for protection of the circuit card during storage. The rosin composition is solderable and is also easily removed for the soldering of components.

Abstract: The present disclosure provides compositions and methods for forming three-dimensional structures atop substrates. These structures may be formed and processed so as to braze together two substrates. The structures may be controllably formed in three dimensions so as to accommodate virtually any substrate geometry or configuration. The structures may also be disposed so as to maintain spacing between two surfaces.

Abstract: Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from polybutadiene (meth)acrylate compounds and polybutadiene (meth)acrylate compounds, and a hydrogenated dimer acid.

Abstract: The purpose is, in mounting a semiconductor device onto a substrate, to make it easy to identify the remaining amount of an auxiliary joining agent, to stabilize the dispensing amount of the auxiliary joining agent, and to prevent a shortage of the auxiliary joining agent. Also for the purpose of efficient maintenance of a mounting machine, provided is an auxiliary joining agent adapted to aid joining of metals and prepared by dissolving a colorant in a solvent having a reducing property of removing an oxide film on a metal surface. The auxiliary joining agent is produced by a method including a step of mixing a solvent having a reducing property of removing an oxide film on a metal surface, and a colorant having a property of dissolving in the solvent.

Abstract: A flux for soldering includes a base resin, a solvent, and an activating agent. The base resin contains a rosin. An amount of the rosin to be incorporated is from 0% by weight to 30% by weight with respect to a total amount of the base resin. The activating agent includes a compound having a plurality of carboxyl groups on a cyclohexyl structure represented by a general formula (1). X is (a) one or more carboxyl groups, or (b) one or more carboxyl groups and at least one selected from a hydrogen atom, chloro group, bromo group, alkyl group, and cyclohexyl group. A position of the X is not limited. A number of the X is one or more. The X may have either one of the (a) and (b) alone, or a plurality of the (a) and (b) in combination.

Abstract: A soldering flux includes a base resin, an activator, and a solvent. The activator contains an acrylic resin having an acid value of not more than 50 mg KOH/g and represented by a general formula (1). A monomer weight ratio of a, b, and c is b/(a+b+c)?0.6, at least one of a and c may be 0, R1 is an alkyl group having a carbon number of 8 to 24, R2 is a substituent other than the R1 and may be one of substituents including a hydrogen atom, a methyl group, an alkyl group, an aryl group, and a hydroxyl group or a combination of a plurality of substituents, and R3, R4, and R5 are hydrogen atoms or methyl groups. The solvent contains a compound having a carboxyl group in a cyclohexyl skeleton and represented by a general formula (2).

Abstract: The object of the present invention is to provide a soldering-flux-oriented novel base resin that enhances the fluidity of a soldering flux and both the visco-stability and adhesion of a solder paste, while improving the color tone and anti-crack property of the flux residue. The present invention is directed to a base resin for a soldering flux, the base resin comprising a rosin (A) containing at least 15 wt % of a pimarane-type resin acid (a-1), at least 1 wt % of a labdane-type resin acid (a-2), and at least 50 wt % of an abietane-type resin acid that has no conjugated double bond (a-3).

Abstract: A fine particulate flux, an aqueous flux preparation comprising this flux, a method for the manufacture of a coated part of aluminum, aluminum alloys, steel, copper or titanium using such flux, and a method for brazing parts of aluminum or aluminum alloys to parts of aluminum, aluminum alloys, steel, copper or titanium using such flux. The flux can be obtained by sieving, or it can be obtained by removing solids, e.g., in a cyclone, from the drying gases obtained when wet fluxes are dried, especially after their manufacture. Fine particulate flux increases the viscosity of flux preparations comprising the flux dispersed in water or an aqueous or liquid organic carrier.