Oleaginous Patents (Class 148/25)
  • Patent number: 5120374
    Abstract: A brazing paste gel has a composition of 1-4 wt. % hydroxypropylcellulose, 40-80 wt. % 1,2-propanediol, 18-58 wt. % 2-propanol. Alternatively, the composition may be 1-4 wt. % hydroxypropylcellulose, 20-70 wt. % 1,2-propanediol, 26-76 wt. % water.
    Type: Grant
    Filed: May 11, 1990
    Date of Patent: June 9, 1992
    Assignee: The Morgan Crucible Company plc
    Inventor: Howard Mizuhara
  • Patent number: 5116433
    Abstract: A solder paste is formulated by combining a solder paste vehicle, a resin, and solder alloy particles. The solder paste vehicle is made by combining mono and polyfunctional alcoholic solvents with a fluxing agent. The solder particles are first reacted with a formate ion produced by formic acid, formaldehyde, paraformaldehyde, or mixtures thereof, in order to create a metal-formate complex that functions as an oxygen scavenger on the surface of the solder alloy particles.
    Type: Grant
    Filed: October 31, 1990
    Date of Patent: May 26, 1992
    Assignee: Motorola, Inc.
    Inventors: James L. Davis, Fadia Nounou, Anthony B. Suppelsa, Robert W. Pennisi
  • Patent number: 5116432
    Abstract: A soft soldering flux based on organic carboxylic acids is particularly suitable for the production of electronic and electrical components. Its reduced solids content (e.g. 6%) makes it specially suited to SMT manufacturing and in-circuit tests. To this end, alkylfluorinated alcohols of formula Rf--CH.sub.2 --CH.sub.2 --OH, alicyclic and aromatic mono-, di-, or polycarboxylic acids with at least one carbon ring or their derivatives are introduced, using aliphatic mono-, di, poly-, keto- or hydroxy carboxylic acids and quaternary ammonium salts.
    Type: Grant
    Filed: June 14, 1990
    Date of Patent: May 26, 1992
    Inventor: Rudolf A. Kerner
  • Patent number: 5094701
    Abstract: This invention is a residue-free cleaning process for removing metal-containing contaminants from a surface of a substrate of the type used in manufacturing semi-conductor devices. The process comprises contacting the substrate with an effective amount of a cleaning agent comprising a .beta.-diketone or .beta.-ketoimine dispersed in an atmosphere capable of oxidizing the metal-contaminants at a temperature sufficient to form volatile metal-ligand complexes on the surface of the substrate. The volatile metal-ligand complexes are sublimed from the surface of the substrate leaving essentially no residue.
    Type: Grant
    Filed: April 1, 1991
    Date of Patent: March 10, 1992
    Assignee: Air Products and Chemicals, Inc.
    Inventors: John A. T. Norman, John C. Ivankovits, David A. Roberts, David A. Bohling
  • Patent number: 5092943
    Abstract: Solder pastes having vehicles including blends of low boiling point alcohols and relatively high boiling point alcohols are described which leave residues which may be cleaned using only water are described. The low boiling point alcohols have a boiling point range of between about 65.degree. and about 150.degree. C. whereas the high boiling point alcohols have a boiling point in rhe range of about 150.degree. to about 270.degree. C. The solder pastes also use water-soluble organic acids as fluxing agents such as compounds of the formula: ##STR1## where R is an electron withdrawing group such as fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. Other suitable formic-acid fluxing agents include, but are not limited to, adipic acid, polyacrylic acid, methacrylic acid and polymethacrylic acid. The compounds clean oxides from the printed circuit boards (PCBs) under assembly and then volatilze leaving a residue to be cleaned away. The cleaning step involves rinsing with water.
    Type: Grant
    Filed: September 17, 1990
    Date of Patent: March 3, 1992
    Assignee: Motorola, Inc.
    Inventors: James L. Davis, Robert W. Pennisi, Fadia Nounou, Bobby D. Landreth, Robert J. Mulligan
  • Patent number: 5091335
    Abstract: III-V films are grown on large automatically perfect terraces of III-V substrates which have a different lattice constant, with temperature and Group II and V arrival rates chosen to give a Group III element stable surface. The growth is pulsed to inhibit Group III metal accumulation to low temperature, and to permit the film to relax to equilibrium. The method of the invention 1) minimizes starting step density on sample surface; 2) deposits InAs and GaAs using an interrupted growth mode (0.25 to 2 mono-layers at a time); 3) maintains the instantaneous surface stoichiometry during growth (As-stable for GaAs, In-stable for InAs); and 4) uses time-resolved RHEED to achieve aspects (1)-14 (3).
    Type: Grant
    Filed: March 30, 1990
    Date of Patent: February 25, 1992
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Frank J. Grunthaner, John K. Liu, Bruce R. Hancock
  • Patent number: 5074928
    Abstract: A water-soluble soldering flux having good solderability, removability with water, and insulation resistance comprises, as activators, a combination of tartaric acid and a hydrohalide salt of mono-, di-, or tri-ethanolamine.
    Type: Grant
    Filed: November 23, 1990
    Date of Patent: December 24, 1991
    Assignees: Nippondenso Co., Ltd., Senju Metal Industry Co., Ltd.
    Inventors: Masaki Sanji, Toshihiko Taguchi, Tomohiko Iino, Kouichi Ootuka
  • Patent number: 5069730
    Abstract: A water soluble solder paste, which does not adversely impact the surface insulation resistance (SIR) of a circuit board, is comprised of powdered solder, a water soluble flux (containing an activator within a water soluble vehicle), a hydrophobic surfactant preferentially absorbed over the water soluble vehicle, and a solvent within which the surfactant and flux are dissolved. The hydrophobic surfactant is chosen to be preferentially absorbed by the circuit board surface over the water soluble flux vehicle to prevent the vehicle, which is hydrophilic from becoming trapped in the board surface, thereby adversely affecting the board SIR.
    Type: Grant
    Filed: January 28, 1991
    Date of Patent: December 3, 1991
    Assignee: AT&T Bell Laboratories
    Inventors: Courtney V. Dodd, John R. Morris, Gregory C. Munie
  • Patent number: 5064482
    Abstract: A paste vehicle for use in a metal bearing solder paste composition having a heat-polymerizable binder is provided. This vehicle can be non-aqueous, inorganic salt-free and dispersed in a non-aqueous, organic liquid, and may be incorporated with a flux into a solder paste composition capable of utilizing an average particle size finer than 100 mesh. This paste has excellent anti-slump properties, requires no cleanup to remove residual solder reflow, and permits smaller more controlled joints to be formed.
    Type: Grant
    Filed: November 8, 1990
    Date of Patent: November 12, 1991
    Assignee: SCM Metal Products, Inc.
    Inventors: Joel Goobich, Thomas Cronin, III
  • Patent number: 5064481
    Abstract: Fluxing compositions are described containing as fluxing agents compounds of the formula: ##STR1## where R is an electron withdrawing group. In one embodiment, R is selected from the group consisting of fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. The compound cleans oxides from the printed circuit boards (PCBs) under assembly and then volatilize with little or no need for a cleaning step, or cleaning only with water or formic acid. Very little or no undesired residue remains. Such acid fluxing agents can be used mixed with typical solder formulations, such as lead/tin solder pastes, or applied topically to solders, such as solder balls; both techniques permit the assembly of PCBs more easily with high quality bonds, and with little or no residue. Malic acid is a preferred organic acid fluxing agent.
    Type: Grant
    Filed: May 17, 1990
    Date of Patent: November 12, 1991
    Assignee: Motorola, Inc.
    Inventors: James L. Davis, Robert W. Pennisi, Fadia Nounou, Bobby D. Landreth
  • Patent number: 5062902
    Abstract: A residue-free fluxing process wherein the active fluxing agent comprises a .beta.-diketone or .beta.-ketoimine ligand. Such ligands react with surface metal oxides on workpieces to be soldered to form volatile metal-ligand complexes as reaction products which are sublimed from the surface leaving essentially no residue on the workpieces. The fluxing agents can be utilized in gas-phase processes wherein the workpieces are contacted with an effective amount of one or more ligands which are dispersed in a carrier gas or solvent or by incorporating the ligands into an alloy-vehicle mixture for use as conventional creams or pastes. The invention eliminates the need for post-reflow cleaning using solvents since no flux residue remains on the workpieces to be soldered following volitilization of the metal-ligand complex.
    Type: Grant
    Filed: December 27, 1990
    Date of Patent: November 5, 1991
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Thomas L. Ellison, David A. Roberts, John C. Ivankovits, John A. T. Norman
  • Patent number: 5045127
    Abstract: Improved soldering paste for the surface mounting of electronic components comprises a novel fluxing agent selected from quaternary ammonium hydroxides and mixtures thereof. Use of these agents as fluxes eliminates the problem of ionic residues on circuit boards and permits the boards to be washed with water to remove any non-ionic residues.
    Type: Grant
    Filed: June 4, 1990
    Date of Patent: September 3, 1991
    Assignee: Quantum Materials, Inc.
    Inventors: Stephen M. Dershem, Richard R. Weaver
  • Patent number: 5041169
    Abstract: A flux composition comprising at least one benzoate or substituted benzoate of phenol or of a substituted phenol, such as cresyl benzoate or 2,6-dimethylphenyl benzoate, a solvent for the benzoate, and a flux-activating agent, the benzoate being present in an amount not more than its limit of solubility in the solvent.
    Type: Grant
    Filed: January 8, 1990
    Date of Patent: August 20, 1991
    Assignee: Cookson Group plc
    Inventors: Malcolm R. Oddy, Alison M. Wagland
  • Patent number: 5011546
    Abstract: Solder flux compositions and pastes made therefrom, consisting essentially of solder metal powder, an amount of non-corrosive water soluble flux, said water soluble flux comprising a mixture of 2 non-corrosive water-soluble components, one of which is a non-halogenated amine, preferably triethanolamine and the other of which is an organic moiety with a polar group, preferably GAFAC RE-610.
    Type: Grant
    Filed: April 12, 1990
    Date of Patent: April 30, 1991
    Assignee: International Business Machines Corporation
    Inventors: Janice D. Frazier, Robert L. Jackson, Richard A. Reich
  • Patent number: 5004509
    Abstract: A low residue soldering flux contains a non-subliming dibasic acid mixture of by weight about 15-30% succinic acid, 40-63% glutaric acid and 10-30% adipic acid, e.g., in a volatilizable organic solvent, formed as a rosin-containing or rosin-free flux. The dibasic acid mixture is capable of volatilizing during heat soldering to leave a soldered product (e.g., an electronic circuit board) essentially free from corrosion-promoting ionic residue. This eliminates the need for a residue-removing washing step.
    Type: Grant
    Filed: May 4, 1990
    Date of Patent: April 2, 1991
    Assignee: Delco Electronics Corporation
    Inventor: Samuel V. Bristol
  • Patent number: 4995921
    Abstract: Solder paste vehicles using blends of monofunctional and polyfunctional alcohols are described. The blend may have a major portion of a low viscosity, monofunctional alcohol solvent and a minor portion of a high viscosity polyfunctional alcohol thickener. The monohydric solvent has a room temperature viscosity of at least 3 centipoise and from about 3 to 18 carbon atoms and may include such materials as 2-butanol, 1-hexanol, 1-heptanol, 1-octanol, 1-nonanol, 1-dodecanol, 2-ethoxyethanol, 2-(2-ethoxyethoxy)ethanol, 2-(2-butoxyethoxy)ethanol, n-hexadecanol, n-octadecanol, benzyl alcohol and mixtures thereof. The polyalcohol has a room temperature viscosity of between about 26 to about 1500 cp and includes compounds such as 1,2-ethanediol; 1,2-propanediol; 1,3-propanediol; 1,2-butanediol; 1,3-butanediol; 1,4-butanediol; 1,2-pentanediol; 1,5-pentanediol; 2,4-pentanediol; 2,5-hexane-diol; glycerol; 1,2,4-butanetriol; 2,2'-(ethylenedioxy)diethanol; 1,12-dodecane-diol; 1,16-hexanedecanediol and mixtures thereof.
    Type: Grant
    Filed: May 11, 1990
    Date of Patent: February 26, 1991
    Assignee: Motorola, Inc.
    Inventors: James L. Davis, Robert W. Pennisi, Fadia Nounou, Bobby D. Landreth
  • Patent number: 4994119
    Abstract: A water soluble soldering flux is shown which includes gum arabic, modified polysaccharides and other natural resins as the carrier, an organic activator and water. The carrier provides a tacky, yet fluid medium capable of holding precisely aligned electrical components during solder reflow and allows aqueous removal of the flux after reflow. The flux composition can be used to solder precisely aligned integrated circuit chips onto a circuit board.
    Type: Grant
    Filed: May 9, 1990
    Date of Patent: February 19, 1991
    Assignee: International Business Machines Corporation
    Inventors: Barbara L. Gutierrez, Janet Sickler
  • Patent number: 4988395
    Abstract: A water-soluble soldering flux and paste solder using the flux are disclosed, the flux comprising, as a main fluxing agent, a resinous reaction product of at least one carboxyl-containing compound having 8 or less carbon atoms, selected from the group consisting of monocarboxylic acids, polycarboxylic acids, and hydroxy-carboxylic acids with tris-(2,3-epoxypropyl)-isocyanurate.
    Type: Grant
    Filed: January 30, 1990
    Date of Patent: January 29, 1991
    Assignees: Senju Metal Industry Co., Ltd., Nissan Chemical Industries Ltd.
    Inventors: Toshihiko Taguchi, Shozo Asano, Ken'ichi Osawa, Hiroo Nagai, Hisao Ikeda
  • Patent number: 4981526
    Abstract: A composition for brazing aluminum or aluminum alloy characterized in that said composition contains aluminum alloy powder for brazing and thermoplastic acryl-based resin binder which is so volatile as to volatilize before being carbonized at a brazing temperature and said resin binder of 0.1 to 50 parts is used for aluminum alloy powder of 100 parts. When this technological idea was applied to brazing with a brazing material of aluminum alloy powder such as, for example, Al-Si, a preferable result of brazing could be obtained.
    Type: Grant
    Filed: November 22, 1989
    Date of Patent: January 1, 1991
    Assignee: Mitsubishi Aluminum Co., Ltd.
    Inventors: Hajime Kudo, Hitoshi Saito, Ken Toma
  • Patent number: 4963401
    Abstract: A method and composition for protecting and enhancing the solderability of a metallic surface. A mixture which includes a chosen protective material and a dicarboxylic acid fluxing agent is applied to the metallic surface to form a protective film or coating which also enhances the solderability of the metallic surface. The mixture is applied to the metallic surface as a solution having a solvent carrier which evaporates to leave the film. The film is heat activated at soldering temperatures to release the fluxing agent.
    Type: Grant
    Filed: April 11, 1989
    Date of Patent: October 16, 1990
    Assignee: Hughes Aircraft Company
    Inventor: Alfred F. Kaspaul
  • Patent number: 4948032
    Abstract: Disclosed in a fluxing agent comprising 45% to 55% by weight of peanut oil and 45% to 55% by weight of water-white rosin.
    Type: Grant
    Filed: November 21, 1988
    Date of Patent: August 14, 1990
    Assignee: Atmel Corporation
    Inventors: Thomas J. Dunaway, Richard K. Spielberger, Lori A. Dicks
  • Patent number: 4940498
    Abstract: In order to avoid the undesirable formation of flux residues when soldering electronic components, as in the production of printed circuit assemblies, there is used, as the solvent for a non-corrosive flux material, a mixture composed of a major proportion by weight of a monohydric alcohol and a minor proportion by weight of a water-immiscible polyalkylene glycol dialkyl or diaryl ether.
    Type: Grant
    Filed: August 14, 1989
    Date of Patent: July 10, 1990
    Assignee: Multicore Solders Limited
    Inventor: Wallace Rubin
  • Patent number: 4921550
    Abstract: A solder paste mixture for soldering surface mount devices to a circuit board using a reflow soldering process which utilizes a vapor phase furnace. The solder paste mixture has a metallic content which is 63% tin and 37% lead. The metallic content of the paste consists of 150 micron particles of 100% tin and 150 micron particles of an alloy of 10% tin and 90% lead. Included in the process of soldering components to the circuit board is the step of prebaking the circuit board with solder paste and components in their proper place on the board.
    Type: Grant
    Filed: July 21, 1989
    Date of Patent: May 1, 1990
    Assignee: Texas Instruments Incorporated
    Inventor: Neil R. McLellan
  • Patent number: 4919730
    Abstract: A brazing paste consists of a liquid vehicle containing finely dispersed brazing alloy powder therein. The liquid vehicle consists of hydroxylpropylcellulose and 1,2-propanediol.
    Type: Grant
    Filed: July 21, 1989
    Date of Patent: April 24, 1990
    Assignee: GTE Products Corporation
    Inventor: Howard Mizuhara
  • Patent number: 4919731
    Abstract: The present invention provides an electronic component part with terminal pins very closely and very strongly bonded to a high thermal conductivity ceramics circuit board and a method for simply and continuously manufacturing electronic component parts, with a high operability, each with terminal pins bonded to a high thermal conductivity ceramics circuit board. According to the present invention, an electronic component part is provided in which terminal pins are bonded to a high thermal conductivity ceramics circuit board by a brazing metal, containing at least one kind of Group IVa elements.
    Type: Grant
    Filed: February 10, 1989
    Date of Patent: April 24, 1990
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kiyoshi Iyogi, Takaaki Yasumoto, Toshirou Yanazawa, Nobuo Iwase, Masako Nakahashi, Hiromitsu Takeda
  • Patent number: 4895606
    Abstract: A soldering flux composition comprising a water-soluble oil-in-water emulsion paste in turn comprising(a) an oil, type material(b) an emulsifier,(c) water, and(d) a fluxing agent comprising an inorganic or organic halogen compound capable of removing oxide from a metal surface to be soldered.
    Type: Grant
    Filed: February 23, 1989
    Date of Patent: January 23, 1990
    Inventor: Ashraf Jafri
  • Patent number: 4872928
    Abstract: A water-soluble solder paste consisting essentially of solder powder, water-soluble organic activator and polyethylene glycol vehicle.
    Type: Grant
    Filed: June 7, 1988
    Date of Patent: October 10, 1989
    Assignee: Johnson Matthey Inc.
    Inventor: Wayne Jacobs
  • Patent number: 4789411
    Abstract: A conductive copper paste composition is adapted to yield a highly conductive film receptive to solders without pretreatment. This conductive paste comprises a copper metal powder, a resin component including a thermosetting resin, and an assortment of additives. In use, the paste is applied to an insulation substrate to a predetermined circuit pattern and cured in situ. Soldering can then be performed directly on the cured circuit. This contributes not only to the conductivity of the circuit but dispenses with the activation treatment and electroless plating or electroplating that have heretofore been essential prior to soldering. The invention, therefore, results in a substantial curtailment of production process and a proportional economic advantage. In addition, this conductive paste can be used in such applications as electrode and through-hole connections, formation of electromagnetic and electrostatic shield layers, and so on in the manufacture and assembly of electronic components and circuits.
    Type: Grant
    Filed: March 24, 1987
    Date of Patent: December 6, 1988
    Assignee: Tatsuta Electric Wire and Cable Co., Ltd.
    Inventors: Kazumasa Eguchi, Fumio Nakatani, Shinichi Wakita, Hisatoshi Murakami, Tsunehiko Terada
  • Patent number: 4762573
    Abstract: A fluxing agent for soldering, e.g. of electronic components, characterized by consisting of a solution comprising 1-15, preferably 2-12% by weight of nonionic surface active agent and/or another substance with similar capacity to form liquid crystals in the fluxing agent film, 1-80, preferably 1-10% by weight of water, and volatile solvent, preferably at least 70% by weight, and minor quantities of activators which are capable of reacting with impurities on the surfaces subjected to soldering, such as halides and carboxylic acids, and preferably with a weight ratio of nonionic surface active agent to water of 1:8 to 5:1 and especially 0.5:1 to 2:1, and a process for soldering using said fluxing agent.
    Type: Grant
    Filed: March 18, 1986
    Date of Patent: August 9, 1988
    Assignee: Ytkemiska Institutet
    Inventor: Arne Biverstedt
  • Patent number: 4738732
    Abstract: A soldering flux, method for fluxing pieces, and method for joining pieces, wherein hydrofluoric acid or an evaporative organic acid is mixed with an evaporative organic solvent to form the flux. Neither precleaning nor postcleaning of the pieces being joined is necessary. The flux evaporates completely upon heating, leaving no corrosive residue or other product on the surface of the piece. The portion of the piece to be bonded is dipped into the flux and immediately tinned, before soldering.
    Type: Grant
    Filed: February 4, 1987
    Date of Patent: April 19, 1988
    Assignee: Hughes Aircraft Co.
    Inventors: Edward A. Anderson, Ernesto S. Sandi, James C. Cammarata
  • Patent number: 4701224
    Abstract: A water soluble solder flux particularly suitable for use as a fusing fluid in condensation soldering operations has been developed. The invention involves the use of such flux in condensation soldering as well as the flux, per se. The novel flux comprises a water soluble flux vehicle comprising a resinated polyethylene oxide (polyene), together with at least one flux activator selected from a water soluble organic acid activator and a water soluble halide containing activator, and a solvent which is water soluble.
    Type: Grant
    Filed: April 21, 1986
    Date of Patent: October 20, 1987
    Assignee: American Telephone and Telegraph Company, AT&T Bell Laboratories
    Inventor: Frank M. Zado
  • Patent number: 4662952
    Abstract: A welding flux binder and welding flux comprising the reaction product of a hydrolyzed and polymerized organometallic compound selected from the group consisting of metal alkoxides including tetraalkylorthosilicate, tetraalkylorthotitanate, tetraalkylorthozirconate and trialkylaluminate, metal esters, and metal oxalates. The organometallic compound is hydrolyzed and then polymerized to form a gel glass phase. Alkali and alkaline earth salts are added to stabilize and reduce the viscosity of the gel. The resulting welding flux binder and flux are non-hygroscopic and have a high fired strength.
    Type: Grant
    Filed: September 17, 1985
    Date of Patent: May 5, 1987
    Assignee: Massachusetts Institute of Technology
    Inventors: Eric A. Barringer, Thomas W. Eagar
  • Patent number: 4657589
    Abstract: A solder composition containing a small amount of gold added to the solder metal, to avoid cracking of solder joints in electronic circuits, particularly densely packed microelectronic circuits, during thermal cycling. The solder composition comprises 85 to 90% of total solder metal and 10 to 15% of a vehicle for the solder metal, the solder metal containing about 0.2 to about 3% of particulate gold, by weight of the solder metal.
    Type: Grant
    Filed: February 3, 1986
    Date of Patent: April 14, 1987
    Assignee: McDonnell Douglas Corporation
    Inventor: Felix Barajas
  • Patent number: 4619715
    Abstract: There is provided an inorganic salt-free, anhydrous, noncorrosive powdered solder metal paste and vehicle therefor which vehicle is characterized by the presence therein of a nonaqueous resinous binder and a nonaqueous organic liquid composition having a surface tension or surface energy of from 43 to 65 dynes/cm. and higher at 20.degree. C. When powdered solder metal or powdered solder metal alloy is distributed in such a vehicle in an amount sufficient to form a paste, a deposit will not undergo hot slump at elevated temperatures. The pastes and vehicles are free of inorganic metal salts.
    Type: Grant
    Filed: December 9, 1985
    Date of Patent: October 28, 1986
    Assignee: SCM Corporation
    Inventor: Jennie S. Hwang
  • Patent number: 4568395
    Abstract: An improved activator system for a precleaner is formulated by combining either a carboxyl substituted pyridine or a carboxylamine substituted pyridine with a polyprotic acid. The preferred precleaner activator system combines nicotinic acid and phosphoric acid. An improved activator system for a soldering flux is formulated by combining an alkylamine with either a hydroxyl containing organic acid or a small molecular weight keto acid. The preferred flux activator system combines tetrahydrofurfurylamine and hydroxyacetic acid. A method for preparing and soldering metal surface using the precleaner and flux is carried out at relatively low temperatures and relatively short times.
    Type: Grant
    Filed: May 10, 1985
    Date of Patent: February 4, 1986
    Inventor: Abdol R. Nabhani
  • Patent number: 4563224
    Abstract: A heat-recoverable soldering device comprises a heat-recoverable member having a fusible solder insert and associated with the solder insert, a solder flux composition which undergoes a visible color change at a critical temperature. Solderable substrates are positioned within the device and heated until a critical temperature has been reached as indicated by a color change in the flux. The critical temperature depends on the material of the particular heat-recoverable member and the solder used. It is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Novel flux compositions and their use in soldering are also disclosed.
    Type: Grant
    Filed: December 19, 1984
    Date of Patent: January 7, 1986
    Assignee: Raychem Corporation
    Inventors: Tamar G. Gen, Edward A. Cydzik
  • Patent number: 4557767
    Abstract: There is provided an inorganic salt-free, anhydrous, noncorrosive powdered solder metal paste and vehicle therefor which vehicle is characterized by the presence therein of a flux and a nonaqueous organic liquid having a surface tension or surface energy of from 43 to 65 dynes/cm. and higher at 20.degree. C. When powdered solder metal or powdered solder metal alloy is distributed in such a vehicle in an amount sufficient to form a paste, a deposit will not undergo hot slump at elevated temperatures. The pastes and vehicles are free of inorganic metal salts.
    Type: Grant
    Filed: September 11, 1984
    Date of Patent: December 10, 1985
    Assignee: SCM Corporation
    Inventor: Jennie S. Hwang
  • Patent number: 4557768
    Abstract: A welding flux binder is provided which comprises an alkali-alkaline earth silicate hydrolyzed and polymerized from tetraalkylorthosilicate, Si(OR).sub.4, wherein R is --CH.sub.3, --C.sub.2 H.sub.5, or --C.sub.3 H.sub.7, and alkali and alkaline earth salts. The reaction product of the tetraalkylorthosilicate and metal salts, M.sub.2 O.M'O.SiO.sub.2, where M is potassium, sodium or lithium, and M' is magnesium, calcium or barium, has several advantages as a welding flux binder. For example, it is not hygroscopic and can be prepared at low temperatures since the alkali ions lower the melting point for viscous sintering of the gel phase. Because of the low temperature processing, a wide variety of solid additives with low thermal stability, such as some metals, carbonates, and fluorides, can be incorporated into the flux. Other dopants may also be readily incorporated into the binder during the gel phase.
    Type: Grant
    Filed: November 19, 1984
    Date of Patent: December 10, 1985
    Assignee: Massachusetts Institute of Technology
    Inventors: Eric A. Barringer, Thomas W. Eagar
  • Patent number: 4541876
    Abstract: There is provided a nonaqueous powdered metal paste composition and a vehicle therefor, characterized by resistance to slumping upon heating to the fusion point of the metal, fusion point being above 500.degree. C., including the powdered metal, and an organic material having a surface tension of from 43 to 65 or higher dynes/cm. at 20.degree. C.
    Type: Grant
    Filed: September 11, 1984
    Date of Patent: September 17, 1985
    Assignee: SCM Corporation
    Inventor: Jennie S. Hwang
  • Patent number: 4533404
    Abstract: The soldering flux of this invention containing a chemical reaction product precipitated when at least one member selected from normally liquid brominated aliphatic hydrocarbons is mixed with at least one member selected from the group consisting of normally liquid amino group-containing aromatic hydrocarbons and normally liquid amino group-containing aliphatic hydrocarbons can not only solder stainless steel or nickel-chromium alloys whose soldering has heretofore been thought impossible, but also does not corrode the soldered metallic material after soldering, has a higher electric insulation resistivity necessary for the soldered areas of parts of electronic and electric devices and appliances, markedly reduces defects due to poor soldering, and can secure a high reliability of soldered joints as compared with conventional fluxes.
    Type: Grant
    Filed: May 25, 1984
    Date of Patent: August 6, 1985
    Assignee: Nihon Almit Kabushiki Kaisha
    Inventor: Masayuki Hasegawa
  • Patent number: 4495007
    Abstract: A solder flux comprises rosin, an activator, an optional surfactant and the dimer of linoleic acid.
    Type: Grant
    Filed: March 12, 1984
    Date of Patent: January 22, 1985
    Assignee: AT&T Technologies, Inc.
    Inventor: Frank M. Zado
  • Patent number: 4493738
    Abstract: A thermoplastic brazing alloy composition contains a particulate brazing alloy and a flux dispersed in a petroleum wax to form a solid suspension at room temperatures. Preferred petroleum waxes are paraffin wax and microcrystalline wax. On application to a workpiece and heating to brazing temperatures, the wax melts and leaves the brazing site and then volatilizes without leaving any carbonaceous residue and without causing any bubbling or blistering. The use of petroleum waxes is particularly useful when the flux contains a reactive material such as fluoroborate, a silicofluoride or an aluminofluoride.
    Type: Grant
    Filed: February 28, 1983
    Date of Patent: January 15, 1985
    Assignee: Johnson Matthey PLC
    Inventors: Owen N. Collier, Gordon L. Selman
  • Patent number: 4478650
    Abstract: A rosin free, water soluble solder flux suitable for use as a fusing fluid in high temperature solder operations has been developed. The novel flux comprises a high molecular weight amine activator, at least one other activator selected from a water soluble organic acid activator and an inorganic acid activator, and a solvent mixture. The acid activators are present in an amount which essentially neutralizes the amine.
    Type: Grant
    Filed: October 19, 1983
    Date of Patent: October 23, 1984
    Assignee: AT&T Technologies, Inc.
    Inventor: Frank M. Zado
  • Patent number: 4475959
    Abstract: Organic vehicle systems are described which are used in brazing alloy pastes. A principal feature of the systems is used of non-aqueous solvents to avoid reactions with alloy constituents.
    Type: Grant
    Filed: July 13, 1983
    Date of Patent: October 9, 1984
    Assignee: GTE Products Corporation
    Inventors: Anthony Liang, Ronald W. Cox
  • Patent number: 4460414
    Abstract: An essentially nonaqueous, water-rinsible, readily fusible vehicle for paste of powdered solder is comprised of a dispersion of flux consisting essentially of alkali metal hydroxide in liquid polyol and water soluble, normally solid synthetic wax.
    Type: Grant
    Filed: October 31, 1983
    Date of Patent: July 17, 1984
    Assignee: SCM Corporation
    Inventor: Jennie S. Hwang
  • Patent number: 4441924
    Abstract: Solder baths for use in the electronics industry are formed by converting into a molten condition a soft solder material in the form of an extruded bar of soft solder alloy having one or more cores composed of (I) esters of polyhydric alcohols of molecular weight of at least 300, (II) ester derivatives of rosin or modified rosin, (III) hydrocarbon resins, and/or (IV) polymeric waxes, so that the resulting solder bath is provided with a layer of anti-oxidant material derived from the cores which assists in preventing formation of oxide impurity on the surface of the molten solder bath and which may also act as a solder flux, thereby obviating the conventional necessity of applying a separate antioxidant material to the surface of the bath and of using a separate solder flux.
    Type: Grant
    Filed: July 8, 1983
    Date of Patent: April 10, 1984
    Assignee: Multicore Solders Limited
    Inventor: Gordon F. Arbib
  • Patent number: 4441938
    Abstract: A soldering flux comprising of rosin, certain acetic acid derivatives, ionic fluorocarbon surfactant, and organic diluent.
    Type: Grant
    Filed: March 29, 1983
    Date of Patent: April 10, 1984
    Assignee: International Business Machines Corporation
    Inventors: Richard M. Poliak, Dennis L. Rivenburgh, Carlos J. Sambucetti
  • Patent number: 4439250
    Abstract: An improved solder/braze-stop composition is impervious to splattered or flowed solder/braze material, is easily coated without streaking, is easily removed and leaves no contaminant residue. The improved solder/braze-stop composition comprises by weight:40-57% Al.sub.2 O.sub.3 powder;27-43% Methyl Isobutyl Ketone; and12-22% of a vehicle comprising by weight:15-20% Ethyl Cellulose;75-80% 2- (2-Butoxyethoxy) Ethyl Acetate; and,5-10% Oleoyl Sarcosine.
    Type: Grant
    Filed: June 9, 1983
    Date of Patent: March 27, 1984
    Assignee: International Business Machines Corporation
    Inventors: Shankar C. Acharya, Thomas C. Prizzia, Olha Rutigliano
  • Patent number: 4431465
    Abstract: An improved brazing alloy paste comprises a brazing alloy powder mixed with a ductile metal spacer powder comprised of spherical particles with a predetermined diameter limit and having a higher melting temperature than that of the alloy, both powders being suspended in a gel-like substance. This composite paste produces a brazed joint having a gap with a controlled width and the ductile metal absorbs stresses developed between dissimilar brazed parts as when a tungsten carbide tool bit and the supporting steel shank cool after they are brazed together. The quantity of spherical spacer powder in the mixture is limited to 1-8% by weight of the mixture, preferably 5%, in order to prevent stacking of the spheres and to insure a gap spacing determined by the diameter of the spheres.
    Type: Grant
    Filed: August 2, 1982
    Date of Patent: February 14, 1984
    Assignee: GTE Products Corporation
    Inventors: Howard Mizuhara, Surya Pattanaik
  • Patent number: RE32309
    Abstract: There is provided an inorganic salt-free, anhydrous, noncorrosive powdered solder metal paste and vehicle therefor which vehicle is characterized by the presence therein of a flux and a nonaqueous organic liquid having a surface tension or surface energy of from 43 to 65 dynes/cm. and higher at 20.degree.C. When powdered solder metal or powdered solder metal alloy is distributed in such a vehicle in an amount sufficient to form a paste, a deposit will not undergo hot slump at elevated temperatures. The pastes and vehicles are free of inorganic metal salts.
    Type: Grant
    Filed: January 27, 1986
    Date of Patent: December 16, 1986
    Assignee: SCM Corporation
    Inventor: Jennie S. Hwang