Abstract: A copper alloy sheet comprises 0.4 to 2.5 wt % of Ni, 0.05 to 0.6 wt % of Si, 0.001 to 0.05 wt % of Mg, and the balance being Cu and inevitable impurities wherein an average grain size in the sheet is in the range of 3 to 20 &mgr;m and a size of an intermetallic compound precipitate of Ni and Si is in the range of 0.3 &mgr;m or below. If necessary, the sheet may further comprise one or more of 0.01 to 5 wt % of Zn, 0.01 to 0.3 wt % of Sn, 0.01 to 0.1 wt % of Mn, and 0.001 to 0.1 wt % of Cr. It is preferred that when an X-ray diffraction intensity from {200} plane in the surface of said sheet is taken as I{200}, an X-ray diffraction intensity from {311} plane is taken as I{311}, and an X-ray diffraction intensity from {220} plane is taken as I{220}, the following equation is satisfied [I{200}+I{311}]/I{220}≧0.

Abstract: A copper alloy for terminals of the Cu—Ni—Sn—P system or Cu—Ni—Sn—P—Zn system and that has a tensile strength of at least 500 N/mm2, a spring limit of at least 400 N/mm2, a stress relaxation of no more than 10%, a conductivity of at least 30% IACS and a bending workability in terms of a R/t ratio of no more than 2. The spring portion or the entire part of such terminals are produced from the copper alloy, and have an initial insertion/extraction force of 1.5 N to 30 N and a resistance of no more than 3 m&OHgr; at low voltage and low current as initial performance. The terminals experience not more than 20% stress relaxation.

Abstract: The present invention relates to copper-magnesium-phosphorous alloys. In a first embodiment, copper-magnesium-phosphorous alloys in accordance with the present invention consist essentially of magnesium in an amount from about 0.01 to about 0.25% by weight, phosphorous in an amount from about 0.01 to about 0.2% by weight, silver in an amount from about 0.001 to about 0.1% by weight, iron in an amount from about 0.01 to about 0.25% by weight, and the balance copper and inevitable impurities. Preferably, the magnesium to phosphorous ratio is greater than 1.0. In a second embodiment, copper-magnesium-phosphorous alloys in accordance with the present invention consist essentially of magnesium in an amount from about 0.01 to about 0.25% by weight, phosphorous in an amount from about 0.01 to about 0.2% by weight, optionally silver in an amount from about 0.001 to about 0.1% by weight, at least one element selected from the group consisting of nickel, cobalt, and mixtures thereof in an amount from about 0.

Abstract: A valve seat (2) is formed by build-up cladding by irradiating a laser beam on a copper alloy powder (4) provided in the rim of a port (3) formed in an engine cylinder head (1). The copper alloy powder (4) consists of copper (Cu), 6-9 wt % nickel (Ni), 1-5 wt % silicon (si), and 1-5 wt % of one of molybdenum (Mo), tungsten (W), tantalum (Ta), niobium (Nb) and vanadium (V). Due to this composition, the valve seat (2) has few microcracks and excellent abrasion resistance.

Abstract: A rolled copper foil for flexible printed circuits contains not more than 10 ppm by weight of oxygen and has a softening-temperature rise index T defined as T=0.60[Bi]+0.55[Pb]+0.60[Sb]+0.64 [Se]+1.36[S]+0.32[As]+0.09[Fe]+0.02[Ni]+0.76[Te]+0.48[Sn]+0.16[Ag]+1.24[P] (each symbol in the brackets representing the concentration in ppm by weight of the element) in the range of 4 to 34. The concentrations of the elements are in the ranges of[Bi]<5, [Pb]<10, [Sb]<5, [Se]<5, [S]<15, [As]<5, [Fe]<20, [Ni]<20, [Te]<5, [Sn]<20, [Ag]<50, and [P]<15 (each symbol in the brackets representing the concentration in ppm by weight of the element).

Abstract: In accordance with one aspect of the present invention is the metamorphic processing of a beryllium-copper alloy. The alloy is (i) thermodynamically treated for greater than about 10 hours at a temperature generally within a range of 900° to 1500° F., (ii) warm worked at greater than about 30% strain at a strain rate {acute over (&egr;)} greater than or equal to about (2.210×107)/exp[(2.873×104)/(T+459.4°)], where T is in ° F., at the temperature, (iii) annealed at a temperature between 1375° and 1500° F. for about 15 minutes to about 3 hours, (iv) water quenched, and (v) thermal hardened at a temperature generally within a range of about 480° and 660° F. Grain size is reduced with concomitant improvements in ultimate strength, toughness, total elongation, % reduction in area and ultrasonic inspectability.

Abstract: A leadframe of a single frame structure for supporting leads on IC chips. The leadframe is made of a high-strength, high-electroconductivity copper alloy. The copper alloy is produced by preparing an ingot of a copper alloy of 0.05-0.40 wt. % Fe, 0.05-0.40 wt. % Ni, 0.01-0.30 wt. % P, and optionally a total of 0.03-0.50 wt. % of either Sn or Zn or both and a total of 0.05-0.50 wt. % of at least one element of Ag, Co, B, Mn, Cr, Si, Ti and Zr, with the balance being Cu and incidental impurities, heating the ingot to 800 to 950.degree. C. and hot working the ingot to a reduction ratio of 50% or more, quenching the hot worked material from 600.degree. C. or above down to 300.degree. C. or below at a cooling rate of at least 1.degree. C./seconds, heat treating the quenched material at 380 to 520.degree. C. for 60-600 minutes without cold working, and subsequently carrying out cold working and heat treating at 450.degree. C.

Abstract: A corrosion-resistant copper material has a surface layer of a copper alloy containing 10-50 at % (i.e. % by atom) of silicon and of 10-1,000 .ANG. thick. It is produced simply by annealing a copper material containing 0.01-5 at % of silicon at 100-600.degree. C. in a hydrogen-containing gas. Because of its excellent resistance to surface corrosion due to heat and aging, the resulting copper material lends itself well to automotive and electrical applications requiring heat resistance, and is also suitable for use in electrical wire and in leadframes for semiconductor devices.

Abstract: A high temperature abrasion resistant copper alloy suitable for the material of an engine parts such as valve seats and valve guides. The copper alloy comprises aluminum in an amount ranging from 1.0 to 5.0% by weight; at least one selected from vanadium, niobium and tantalum in the group Va of the periodic table of elements, in an amount ranging from 0.1 to 5.0% by weight; and balance including copper and impurities. The copper alloy has a texture in which at least one kind of intermetallic compounds is dispersed, each intermetallic compound kind containing aluminum, at least one selected from elements of the group Va of the periodic table, and silicon.

Abstract: A hardenable copper alloy, suitable as a material for manufacturing casting rolls and casting wheels that are subjected to changing temperature stresses, is disclosed. The hardenable copper alloy comprises 1.0 to 2.6% nickel, 0.1 to 0.45% beryllium, and the remainder of copper, inclusive of impurities resulting from manufacturing and the customary processing additives, and has a Brinell hardness of at least 200 and an electric conductivity of over 38 m/.OMEGA. mm.sup.2.

Abstract: Bismuth bearing copper-nickel-manganese-zinc corrosion and gall resistant castable alloy, particularly for use in food processing machinery, with the following weight percentage range:Nickel=12-28Manganese=12-28Zinc=12-28Aluminum=0.5-2.00Bismuth=2-6Phosphorus=0-0.3Tin =0-1.5Iron=0-1.

Abstract: A higher order beryllium-nickel-copper alloy a process for making the same, and an article of manufacture comprising the alloy, the alloy being represented by the formula (0.15-0.5% Be) +(0.40-1.25% Ni)+(0-0.25% Sn)+[(0.06-1% Zr) and/or (0.06-1% Ti)], the balance copper, where the sum of % Zr and % Ti is generally within a range of 0.06% and 1%, the alloy being characterized by improved electrical conductivity, bend formability and stress relaxation resistance without sacrificing strength.

Abstract: A copper alloy material excellent in the resistance to corrosion caused by lubricating oils containing sulfur-based additives. The alloy comprises from over 5 to 50% Ni, 0.1-2% Ag and the balance consisting substantially of Cu, and optionally contains at least one member selected among (1) up to 20% Sn, up to 0.5% P, up to 5% Al, up to 1% Si, up to 5% Mn, up to 30% Zn, up to 10% Fe and/or up to 1% Sb, (2) up to 30% in total of Pb and/or Bi, (3) up to 30% in total of graphite MoS.sub.2. WS.sub.2 and/or BN, (4) up to 20% in total of Al.sub.2 O.sub.3, SiC, SiO.sub.2. Fe.sub.3 P, AlN, Si.sub.3 N.sub.4, TiC, WC, BN, NiB and/or FeB, and (5) 0.001-1% S.

Abstract: A copper alloy having an improved corrosion resistance in an alcohol-containing medium, which consists essentially of 0.5 to 8 weight percent tin and/or nickel alone or in combination, 0.02 to 0.15 weight percent zirconium, and remainder weight percent copper. The zirconium is dispersed in the copper alloy as precipitates. The copper alloy is suitable for a commutator material used in a DC motor having an improved abrasive resistance.

Abstract: A wear-resistant copper-based alloy includes 10.0 to 30.0% by weight Ni, 2.0 to 15.0% by weight Fe, 2.0 to 15.0% by weight Co, 0.5 to 5.0% by weight Si, 1.0 to 10.0% by weight Cr, 2.0 to 15.0% by weight at least one first optional element selected from the group consisting of Mo, Ti, Zr, Nb and V, at least one second optional element selected from the group consisting of C and O, and the balance of Cu and inevitable impurities. A carbon content "X" and an oxygen content "Y" satisfy the following relationships; namely: 0.ltoreq."X".ltoreq.0.5, 0.ltoreq."Y".ltoreq.0.05, and "Y".gtoreq.(-0.8)("X")+0.04. The wear-resistant copper-based alloy enables to improve the toughness of weld bead, and to inhibit weld bead from cracking effectively in the solidifying process of a building-up operation.

Abstract: In the present invention, in order to minimize the amount of deformation due to heat treatment, the content of Be is lowered than the conventional ones, and the decrease in strength accompanied by decreasing Be, is compensated by dissolving strengthening of Si and Al, and precipitation strengthening of intermetallic compounds NiBe and CoBe. Further, by precipitating such intermetallic compounds, workability and heat resistance are also improved simultaneously and aging treatment conditions are also made flexible. Thus, according to the present invention, a beryllium-copper alloy having excellent strength, workability and heat resistance, can be provided economically, and particularly as for aging materials, users' burden can be markedly decreased.

Abstract: The invention relates to a method of manufacturing a copper-nickel-silicon alloy with a composition Cu (balance), Ni 1.5-5.5%, Si 0.2-1.05, Fe 0-0.5% and Mg 0-0.1% (all in percent by weight), and use of the alloy for pressure-englazable casings. The method permits an alloy with a very high elastic limit with very good conductivity and good cold reformability and differs from the conventional method of manufacturing such alloys by heating to about 950.degree. C. and fairly rapid cooling after a preceding cold rolling operation. An improvement in the properties can be achieved by ageing of the alloy at 300.degree. C. to 600.degree. C. for several hours.

Abstract: A copper-zinc alloy for semi-finished products and articles which are highly loaded and subjected to extreme wear especially synchronizing rings. The alloy possesses a composition of 40 to 65% Cu, 8 to 25% Ni, 2.5 to 5% Si, 0 to 3% Al, 0 to 3% Fe, 0 to 2% Mn and 0 to 2% Pb, with the balance being zinc and unavoidable impurities. The Ni:Si ratio is about 3 to 5:1, and the structure consists of at least 75% .beta.-phase, with the balance .alpha.-phase, in the absence of a .gamma.-phase. Nickel silicides occur predominantly as a round intermetallic phase. The alloy provides quite substantially higher levels of resistance to wear.

Abstract: The present invention aims to provide a metal mold for glass, which needs not apply any swab in molding of glass, enabling no-swabbing glass forming. The alloy for the mold comprises by weight Cu: 10 to 80%, Al: 4 to 11%, Cr: 3 to 16%, Ni: 2 to 36%, and at least one rare earth element: 0.02 to 2.08 with the balance consisting of Fe and further comprises at least one member selected from the group consisting of Ti: Al %.times.0.5 to 2, V: Al %.times.0.2 to 1, Zr: Al %.times.0.1 to 0.3, and Nb: Al %.times.0.1 to 0.3. The alloy is gradually cooled from the solidification initiation temperature to 500.degree. C. at a cooling rate of 10.degree. C./min. The surface of the mold is coated with an Al-containing coating or roughened to an average roughness of 0.3 to 5 .mu.m. A solid lubricating film is provided in a fitting portion of the mold, or alternatively a self-lubricating solid is embedded in the fitting portion of the mold.

Abstract: At least quaternary alloys form metallic glass upon cooling below the glass transition temperature at a rate less than 10.sup.3 K/s. Such alloys comprise titanium from 19 to 41 atomic percent, an early transition metal (ETM) from 4 to 21 atomic percent and copper plus a late transition metal (LTM) from 49 to 64 atomic percent. The ETM comprises zirconium and/or hafnium. The LTM comprises cobalt and/or nickel. The composition is further constrained such that the product of the copper plus LTM times the atomic proportion of LTM relative to the copper is from 2 to 14. The atomic percentage of ETM is less than 10 when the atomic percentage of titanium is as high as 41, and may be as large as 21 when the atomic percentage of titanium is as low as 24. Furthermore, when the total of copper and LTM are low, the amount of LTM present must be further limited. Another group of glass forming alloys has the formula(ETM.sub.1-x Ti.sub.x).sub.a Cu.sub.b (Ni.sub.1-y Co.sub.y).sub.cwherein x is from 0.1 to 0.3, y.cndot.

Abstract: There are disclosed processing methods to improve the properties of copper base alloys containing chromium and zirconium. One method of processing results in a copper alloy having high strength and high electrical conductivity. A second method of processing results in a copper alloy with even higher strength and a minimal reduction in electrical conductivity. While a third method of processing results in a copper alloy having improved bend formability.

Abstract: A copper-nickel based alloy, having reduced break-out during casting and reduced cracking during processing in solid state, which consists essentially of 3.1 to 25 wt. % of Ni, 0.1 to 1.5 wt. % of Mn, 0.0001 to 0.0093 wt. % of B, 0.01 to 0.7 wt. % of Si, and from 3 to 10 wt. % of Sn and the remainder being Cu and unavoidable elements.

Abstract: A copper-based alloy, viz. a dezincification-resistant brass, excels in various properties such as resistance to dezincification, hot forgeability and machinability and, therefore, tolerates use particularly in the atmosphere of a corrosive aqueous solution. The brass of one species has a composition of 59.0 to 62.0 wt % of Cu, 0.5 to 4.5 wt % of Pb, 0.05 to 0.25 wt % of P, 0.5 to 2.0 wt % of Sn, 0.05 to 0.30 wt % of Ni, with or without 0.02 to 0.15 wt % of Ti, and the balance of Zn and unavoidable impurities. The brass of another species has a composition of 61.0 to 63.0 wt % of Cu, 2.0 to 4.5 wt % of Pb, 0.05 to 0.25 wt % of P, 0.05 to 0.30 wt % of Ni, with or without 0.02 to 0.15 wt % of Ti, and the balance of Zn and unavoidable impurities.

Abstract: A copper based alloy for use as a material for electrical and electronic parts has a chemical composition by weight, of 0.5 to 3% Ni, 0.1 to 0.9% Sn, 0.08 to 0.8% Si, 0.1 to 3 Zn, 0.007 to 0.25% Fe, 0.001 to 0.2% P, 0.001 to 0.2% Mg, 0.0001 to 0.001% C, and if required, further containing 0.001 to 0.3% at least one element of Cr and Zr, and the balance being Cu and inevitable impurities. The obtained copper alloy is excellent in electric conductivity, solder-exfoliation resistance when bent, high-temperature creep strength, and migration resistance, while being superior in hot workability and blankability to the conventional copper based alloy.

Abstract: A copper based casting alloy in which lead is replaced by 0.1 to 7 wt % bismuth and 0.1 to 2 wt % mischmetal or its rare earth equivalent is used to improve the distribution of bismuth in the alloy. The alloy is further defined by additions of tin, zinc, nickel, manganese, silicon, aluminum, iron and/or antimony.

Abstract: A high temperature abrasion resistant copper alloy suitable for the material of engine parts such as valve seats and valve guides. The copper alloy comprising aluminum in an amount ranging from 1.0 to 15.0% by weight; at least one element selected from the group consisting of vanadium, niobium and tantalum in the group Va of the periodic table of elements, in an amount ranging from 0.1 to 5.0% by weight; and balance containing copper and impurities. The copper alloy has a structure in which at least one of intermetallic compounds is dispersed. each intermetallic compound contains at least one metal selected from the group consisting of aluminum and copper and at least one element selected from the group consisting of elements of the group Va of the periodic table. This copper alloy exhibits also high oxidation resistance and corrosion resistance at high temperatures.

Abstract: A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.

Abstract: An alloy composition used in the manufacture of extension cables, comprises by weight 25.00% to 35.00% of nickel, 0.10% to 1.00% of manganese, 0.10% to 1.75% of cobalt, less than 0.25% of iron, and the balance being of copper. A thermoelement, of a thermocouple extension cable, manufactured from this composition exhibits a resistivity of approximately 240 ohms per circular mil foot. Hence, the loop resistivity of the cable, where the other thermoelement is made from copper, is generally less than 310 ohms per circular mil foot and the calibration accuracy of the cable from 0.degree. to 100.degree. C. is within .+-.2.5.degree. C.

Abstract: A copper alloy contains beryillium ranging from 0.2 to 0.7% in weight, nickel ranging from 0.1% to 2% in weight, and the balance copper and incidental impurities. Preferably, the incidental impurities include sulfur. A first preferable additional substance includes cobalt, zirconium or iron. A second preferable substance includes tin or zinc. A lead frame with a fine lead pattern is formed from a sheet of the copper alloy without burr, thereby improving the production yield of the lead frame.

Abstract: The invention relates to low-nickel copper alloys to be used as brazing filler metals, which alloys also contain phosphorus, tin and possibly small amounts of manganese. The alloys are produced by means of atomization methods. Their advantages are low liquidus temperature and narrow mushy zone, high joint strength and good corosion properties. The alloys are cadmium free and economical in price and they are mainly used for brazing copper and its alloys.

Abstract: An alloy, in particular for the manufacture of spectacle frames, and a spectacle wire or a spectacle frame and connecting wires for electronic component parts manufactured using the alloy of the invention. In order to obtain good mechanical characteristics, for example, of the spectacle frame at low expense, the invention provides the following alloy which, in percentage by weight, is composed as follows: 63-78% copper, 3-7% nickel, 1-3% iron, 0.01-0.20% phosphorus, the remainder being zinc.

Abstract: A wear-resistant copper-base alloy having superior self-lubricity includes, by weight %,Ni: 10.0 to 30.0%;Si: 0.5 to 3%;Co: 2.0 to 15.0%;at least one metal selected from the group consisting of Mo, W, Nb and V:2.0 to 15.0%; andthe balance being Cu and unavoidable impurities, and having a structure in which hard phase grains containing 5 vol% or more of silicide of at least one metal selected from the group consisting of Mo, W, Nb and V are uniformly dispersed in an amount of 10 to 60 vol% in a copper-rich matrix, to which 2.0 to 15.0% of Fe and/or 1.0 to 10.0% of Cr may be further added.

Abstract: A copper based alloy, which when employed in a marine environment with a cathodic protection system or when galvanically coupled to a dissimilar metal, is resistant to hydrogen embrittlement, copper being present in an amount of about 70% to 80% by weight, and the alloy having in addition, (by weight):______________________________________ nickel 13.5% to 20.0% aluminium 1.4% to 2.0% manganese 3.4% to 9.3% iron 0.5% to 1.5% chromium 0.3% to 1.0% niobium 0.5% to 1.0% ______________________________________and wherein the constituent elements are so controlled that:A Cu/(Mn+Ni) is less than 4.9 in terms of weight %;B Cu/(Mn+Ni) is greater than 3 in terms of weight %;C Al+Nb is at least 2.1 in terms of weight %; andD Ni/(Al+Nb) is at least 6.0 in terms of weight %.

Abstract: A metal liner for a shaped charge device having a ductile metal matrix and a discrete second phase is provided. The allow composition is selected so the second phase is molten when the liner is accelerated following detonation. The molten phase reduces the tensile strength of the matrix so that the liner slug is pulverized on striking a well casing. The slug does not penetrate the hole perforated in the well casing by the liner jet and oil flow into the well bore is not impeded. The liner is formed by directly casting the desired alloy to the desired shape.

Abstract: The invention provides a process for the manufacture of copper alloys having improved processability. The alloys are melted and atomized into droplets which are spray cast into a coherent deposit. The spray cast alloys are characterized by a finer dispersion of intermetallic than is possible by conventional casting. The alloys are capable of being cold rolled to a reduction of up to 70%. The spray cast alloys exhibit good electrical conductivity and a high yield strength. They are particularly suited for electrical spring contacts.

Abstract: A dispersion strengthened Cu (copper)-base alloy for a wear-resistant overlay formed on a metal substrate consists essentially of, by weight %,Ni: 5 to 30%;B: 0.5 to 3%;Si: 1 to 5%;Fe: 4 to 30%;Sn: 3 to 15% and/or An: 3 to 30%; andthe remainder being Cu and unavoidable impurities, and has a structure in which particles of boride and silicide of the Fe-Ni system are dispersed in a Cu-base matrix, and Cu-base primary crystals contain Sn and/or Zn in a solid solution state. If necessary, 0.1 to 5% of Al, 0.1 to 5% of Ti, and/or 1 to 10% of Mn may be added. 0.02 to 2% of C, and 0.1 to 10% of Cr and/or 0.3 to 5% of Ti may be further added. Instead of or along with Sn and/or Zn, 2 to 20% of Pb can be used, and nonsoluble Pb particles are uniformly dispersed between Cu-base .alpha. phase dendrites and serve as a solid lubricant.

Abstract: A monolithic female connector made of a copper-base alloy consisting essentially of 7-15 wt % Ni, 1.0-2.0 wt % Al, no more than 0.0050 wt % 0.sub.2, and the balance of Cu and incidental impurities is highly useful as an electrical connector element of low signal current used in automobiles, because it is made of the alloy having improved bendability while satisfying high electrical conductivity and spring limit.

Abstract: Herein disclosed is a dispersion strengthened copper-base alloy having an excellent wear resistance, which alloy contains 5 to 30% (in weight) of nickel, 1 to 5% of silicon, 0.5 to 3% of boron and 4 to 30% of iron, the remainder being copper and unavoidable impurities, and having a structure in which hard particles composed chiefly of a silicide of iron-nickel system are dispersed in a copper-base matrix. The copper-base alloy is suitably cladded (or deposited) locally on a metallic base. The alloy may contain at least one of 0.1 to 5% of aluminum, 0.1 to 5% of Ti and 1 to 10% of Mn, if necessary, in addition to the above specified components. If necessary, 0.02 to 2% of carbon and 0.5 to 10% of chromium and/or 0.3 to 5% of titanium may be further added. Then, the structure is modified such that both the particles composed chiefly of the iron-nickel silicide and carbide particles are coexistently dispersed in the copper-base matrix.

Abstract: The present invention relates to a process for maintaining the fine grain size of and providing excellent bend formability, hot ductility and strength properties to a copper-nickel-manganese alloy to be exposed to elevated temperatures. The process of the present invention includes a final cold working step during which the material to be fabricated into a desired article and/or exposed to the elevated temperatures has its thickness reduced by about 4% to about 30%, preferably from about 5% to about 25%. The alloys described herein have particular utility in brazed articles or assemblies.

Abstract: The present invention relates to a sound-deadening and vibration-absorbing .beta.'- martensite type aluminum-bronze alloy and provides a Cu-Al alloy containing Al in an amount of 8 to 14% by weight and having a .beta.'-martensite type structure at a normal temperature or a sound-deadening and vibration-absorbing .beta.'-martensite type aluminum-bronze alloy having superior characteristics as vibration- and sound-insulation materials, containing Al in an amout of 8 to 14% by weight and at least one member selected from the group consisting of Fe, Ni, Mn and B as a second ingredient in an amount of 4% by weight or less, and having a .beta.'-martensite type structure at a normal temperature.

Abstract: A process for producing beryllium-copper alloys is disclosed, which comprises the steps of obtaining a cast ingot by melting an alloy essentially consisting of from 0.05 to 2.0% by weight of Be, form 0.1 to 10.0% by weight of at least one kind of Co and Ni, and the balance being substantially Cu, subjecting the thus obtained cast ingot to a solution treatment at a temperature range from 800.degree. to 1,000.degree. C., cold working, annealing at a temperature range from 750.degree. to 950.degree. C. being lower than the solution treating temperature, and then an age hardening treatment. The alloy may further contain from 0.05 to 4.0% by weight of at least one kind of Si, Al, Mg, Zr, Sn, and Cr in a total amount. By this producing process, the beryllium-copper alloys having higher strength and formability can be otained due to uniform and fine dispersion of solid-unsolved precipitate.

Abstract: A copper alloy is disclosed, which contains 0.1 to 3.0 wt % of Ni, 0.1 to 1.0 wt % of Ti, the ratio of Ni to Ti being 4.ltoreq.Ni/Ti thereby, 0.1 to 6.0 wt % of Sn, and 0.005 to 3.0 wt % in total of one or more elements selected from the group consisting of Zn, Mn, Mg, Ca, RE, B, Sb, Te, Si, Co, Fe, Zr, Ag, Mm and Al, and consists of the remainder of Cu and the inevitable impurities. The method for the manufacture of the alloy is characterized in that, after copper alloy ingot was maintained and homogenized for 0.5 to 15 hours at 750.degree. to 960.degree. C. prior to rolling, the hot rolling is carried out starting from a temperature of 700.degree. to 880.degree. C. and the cooling is made immediately after the end of rolling.

Abstract: A group of alloys exhibiting good corrosion resistance and with properties suitable for fabricating dental prostheses consist essentially of copper, nickel and tantalum. Copper and nickel comprise the major components, while tantalum is present in lesser quantities. Lithium and/or Ce, Si metal may be added in small amounts as a deoxidant. Minor amounts of elements such as aluminum, gallium, indium, silicon, titanium and cerium can be added to modify the physical properties of the alloys.

Abstract: The present invention relates to a copper base alloy consisting essentially of from about 3.5% to about 6.0% aluminum, from about 0.1% to about 3.0% nickel, from about 0.03% to about 1.0% magnesium and the balance essentially copper. The alloys of the present invention have been found to be cost effective and easily processable. They have also been found to have particular utility in electronic and electrical applications such as electrical connectors.

Abstract: An excellent material for lead frames is provided which is economical and easily punched out to produce lead frames without bending or breakage, and has both superior tensile strength and high electrical conductivity, as well as splendid heat dissipation properties and good soldering properties.

Abstract: Reactive metal-precious metal ductile alloys containing controlled amounts of Cu and Ni and mixtures thereof are suitable for brazing ceramics, other non-metallic and metallic materials.

Abstract: A predominately beta phase copper base alloy which is adapted for forming in a semi-solid slurry condition. The alloy has a microstructure comprising discrete particles within a lower melting point matrix and consists essentially of from about 9% to about 10.5% by weight aluminum, at least about 10% by weight nickel and the balance essentially copper. In accordance with an alternative embodiment the nickel can be replaced on a one for one basis by iron within certain limits. The alloys are processed by chill casting with a cooling rate throughout the section of the casting comprising at least about 10.degree. C./sec. The alloys as-cast or when reheated to a semi-solid exhibit a microstructure suitable for press forging.

Abstract: The invention contemplates a thermomechanical process applicable to beryllium copper alloys consisting essentially of about 0.2 wt % to about 0.7 wt % beryllium; from about 1.0 wt % to about 3.5 wt % nickel and cobalt in the aggregate, where nickel comprises at least about 1.0 wt %; up to about 1.0 wt % zirconium; up to about 0.005 wt % lead; up to about 0.1 wt % magnesium; up to about 1.5 wt % silver; up to about 0.5 wt % incidental impurities including lead; and the balance essentially copper; which process comprises solution annealing said alloy at a temperature of at least about 90% of the incipient melting point of the alloy expressed in degrees Fahrenheit, cold working the solution treated alloy to reduce the section thickness thereof at least about 60% or much more, and then aging the alloy to produce therein an improved combination of properties including strength, ductility, formability and conductivity.

Abstract: There is provided a copper alloy which comprises 1.0 to 3.5 wt. % of Ni, 0.2 to 0.9 wt. % of Si, 0.02 to 1.0 wt. % of Mn, 0.1 to 5.0 wt. % of Zn, 0.1 to 2.0 wt. % of Sn, and 0.001 to 0.01 wt. % of Mg, and 0.001 to 0.01 wt. % of one or more members selected from Cr, Ti, and Zr, with the remainder being substantially Cu. The copper alloy is suitable for lead frames for semiconductors and is also suitable for terminals and connectors. The copper alloy is produced by a process which comprises starting cooling from a temperature above 600.degree. C. at a rate of 5.degree. C. per second or higher after hot rolling of an ingot of said copper alloy, performing annealing at a temperature of 400.degree. to 600.degree. C. for 5 minutes to 4 hours after cold working, performing refining finish rolling, and performing annealing at a temperature of 400.degree. to 600.degree. C. for a short time of 5 to 60 seconds.

Abstract: A spring material for electric and electronic parts having a high modulus of elasticity and good electrical conductivity. The material is made by melting Cu, Ni, Ti or mother alloy thereof and Cu--P as deoxidizer at a temperature between a melting point and 1,400.degree. C. to obtain a molten alloy consisting of 0.5.about.2.0% by weight of Ni, 0.1.about.1.0% by weight of Ti, less than 0.2% by weight of P and the remainder being Cu; casting the molten alloy into a metal mold to obtain an ingot; subjecting the ingot to hot (or warm) working, cold working and annealing; and finally rolling the annealed sheet above 50% and annealing it at low temperature with air cooling to obtain a formed product having a stable structure.