Abstract: A method for manufacturing electret diaphragms is provided. First, a dielectric film is attached to a frame by an adhesive material and a fastening element grips the peripheral area of the dielectric film on the frame. Afterward, the dielectric film is subjected to a metal sputtering process to form a conductive material layer thereon. Finally, the dielectric film is subjected to a polarizing process thereby forming an electret diaphragm.

Abstract: A crystal device includes leading electrodes that are formed on a base substrate, and a bump for mounting a piezoelectric vibrating reed on the leading electrodes, and alignment marks for performing the positioning of the bump are formed on the base substrate separately from the leading electrodes.

Abstract: A method for adhering two layers of materials is described. An additional layer of material deposited on one of the layers is used. The additional layer of material is perforated and undercut by etching away one of the layers thereby generating anchor shaped holes. The other layer is then deposited on the additional layer filling the anchor shaped holes therefore, providing adhesion.

Abstract: Certain example embodiments of this invention relate to the use of graphene as a transparent conductive coating (TCC). In certain example embodiments, graphene thin films grown on large areas hetero-epitaxially, e.g., on a catalyst thin film, from a hydrocarbon gas (such as, for example, C2H2, CH4, or the like). The graphene thin films of certain example embodiments may be doped or undoped. In certain example embodiments, graphene thin films, once formed, may be lifted off of their carrier substrates and transferred to receiving substrates, e.g., for inclusion in an intermediate or final product. Graphene grown, lifted, and transferred in this way may exhibit low sheet resistances (e.g., less than 150 ohms/square and lower when doped) and high transmission values (e.g., at least in the visible and infrared spectra).

Abstract: A display device includes a substrate, a driving circuit, an E-paper display layer and a protective coating layer. The driving circuit is arranged on the substrate. The E-paper display layer is disposed on and driven by the driving circuit. The protective coating layer is coated on and in contact with the E-paper display layer. The protective coating layer can provide protection and better optical performance, and it is advantageous to the manufacturing method to overcome the problems such as bubbles and low light transmittance occurring in the conventional manufacturing method.

Abstract: In a manufacturing method of a printed circuit board, a rigid substrate having a rigid-board metal layer is provided, an open slot is formed on the rigid substrate, and a flexible substrate is installed in the open slot, and the flexible substrate and the rigid substrate are securely bonded, and an increased-layer circuit layer is formed after electric circuits are manufactured on the rigid-board and flexible-board metal layers, and stacked on the rigid substrate and on an adjacent block where the flexible substrate is coupled to the rigid substrate, and an electric circuit is manufactured, and the increased-layer circuit layer is provided for electrically connecting and conducting the rigid and flexible substrates to overcome the issue of alignment errors.

Abstract: A thermal conductivity substrate including a metal substrate, a metal layer, an insulating layer, a plurality of conductive structures, a first conductive layer and a second conductive layer is provided. The metal layer is disposed on the metal substrate and entirely covers the metal substrate. The insulating layer is disposed on the metal layer. The conductive structures are embedded in the insulating layer and connected to a portion of the metal layer. The first conductive layer is disposed on the insulating layer. The second conductive layer is disposed on the first conductive layer and the conductive structures. The second conductive layer is electrically connected to a portion of the metal layer through the conductive structures. The second conductive layer and the conductive structures are integrally formed.

Abstract: Provided is a wafer for LED mounting having a small difference in thermal expansion coefficient from an LED and having excellent heat conductivity, a method for manufacturing the wafer for LED mounting, and an LED-mounted structure manufactured by using the wafer for LED mounting. The wafer for LED mounting (6) is constituted of a metal infiltrated ceramic composite (61) and a protective layer (62) that is formed therearound. The metal infiltrated ceramic composite (61) preferably has a thin metal layer (63) on a surface thereof. The method for manufacturing the wafer is characterized by comprising filling at least one selected from the group consisted of porous ceramic bodies, ceramic powder compacts and ceramic powders into a tubular body made of metal or ceramic, then impregnating a metal into the void of at least one selected from the group consisted of porous ceramic bodies, ceramic powder compacts and ceramic powders, and thereafter performing a process.

Abstract: The present invention provides templating methods for replicating patterned metal films from a template substrate such as for use in plasmonic devices and metamaterials. Advantageously, the template substrate is reusable and can provide plural copies of the structure of the template substrate. Because high-quality substrates that are inherently smooth and flat are available, patterned metal films in accordance with the present invention can advantageously provide surfaces that replicate the surface characteristics of the template substrate both in the patterned regions and in the unpatterned regions.

Abstract: Metallized multi-component polymeric assemblies are formed by methods provided, including injection molding a first resin to form a first sub-component comprising a metal-platable polymer and injection molding second and third colored resins via a multi-shot injection molding process to form second sub-component having a second and third polymer. Select regions corresponding to the metal-platable polymer surface are metallized. The second and third polymers preferably have distinct colors from one another. The first and second sub-components are assembled and coupled together to form a decorative polymeric component assembly that is visible to an external environment.

Abstract: A method of forming a fluid separation filter for use in a fluid separation device includes aligning a series of fluid separation or drying fibers (102) and fixing them together using a self-adhesive and electrically conductive tape (116) or by weaving copper threads between them. The connected fibers then form a mat and a strip of potting sealant (112) may be added, if required, along the top and bottom of the fibers. The mat may then be rolled to form a bundle of fibers.

Abstract: A method of preparing conductive gaskets on a chassis includes steps as follows. A chassis is provided. An elastomer is pasted on an inner surface of the chassis. A conductive film is formed to cover both the inner surface of the chassis and the elastomer. The chassis with conductive gaskets, and a method of assembling an electric device including the same are also provided in the invention.

Abstract: A smooth electrode is provided. The smooth electrode includes at least one metal layer having thickness greater than about 1 micron; wherein an average surface roughness of the smooth electrode is less than about 10 nm.

Abstract: A manufacturing method of a circuit board. First, an electrode mold having a conductive circuit pattern is made, and then a conductive circuit metal layer is formed by means of electroplating on the electrode mold. The conductive circuit metal layer is transferred and joined with the dielectric layer to constitute a basic circuit board. After the conductive circuit metal layer is transferred to the dielectric layer, the electrode mold can be reused for electroplating, so that the conductive circuit metal layer may be formed again for the next basic circuit board. The manufacturing method provided herein may significantly reduce the manufacturing time and raising the product yields of the circuit board, and has the advantages of lower cost and environmental friendly.

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

Abstract: A method for producing a catalyst-layer-supporting substrate includes a lamination step of forming a laminate of metal catalyst layers and mixture layers on a substrate by repeating a first step and a second step plural times alternatively; and an acid treatment step of subjecting the laminate to an acid treatment, wherein the first step is a step of sputtering or depositing the metal catalyst layer that comprises a catalyst, and the second step is a step of sputtering or depositing the mixture layer of carbon and metal, the metal of the mixture layer including at least one element M selected from the group consisting of Sn, Al, Cu and Zn.

Abstract: A graphene-based saturable absorber device suitable for use in a ring-cavity fiber laser or a linear-cavity fiber laser is disclosed. The saturable absorber device includes an optical element and a graphene-based saturable absorber material supported by the optical element and comprising at least one of graphene, a graphene derivative and functionalized graphene. An examplary optical element is an optical fiber having an end facet that supports the saturable absorber material. Various forms of the graphene-based saturable absorber materials and methods of forming same are also disclosed.

Abstract: According to one embodiment, a camera module is disclosed. The module includes a semiconductor substrate having a first main surface and a second main surface facing the first main surface. An imaging region is provided on the first main surface. A penetrative electrode penetrates through the semiconductor substrate between the first main surface and the second main surface. An adhesive layer is provided on the first main surface, the adhesive layer being located outside the imaging region. And a lens member is directly bonded to the adhesive layer, the lens member seals the imaging region and houses an imaging lens therein.

Abstract: There are provided an electrochemical capacitor and a method for manufacturing the same. The electrochemical capacitor according to the present invention includes: a plurality of first and second electrodes disposed to be opposite to each other; a separator disposed between the first and second electrodes; wherein at least one of the plurality of first electrodes is made of an electrode material doped with lithium ions and a lithium layer having the dendrite is formed on the surface of the electrode material.

Abstract: Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element.

Abstract: Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.

Abstract: Exemplary embodiments provide materials, systems and methods for ink jet printhead, wherein a low-adhesion coating can be applied to at least one surface portion of an ink chamber within the printhead to reduce or eliminate actuator membrane damage during ink freeze/thaw cycles.

Abstract: A method of the present invention comprises: preparing the first substrate comprising a surface with a first recess and a second recess of which a bottom comprises a first electrode; immersing the first substrate into a electrolyte solution; inserting a second electrode into the electrolyte solution; injecting a bubble into the electrolyte solution with applying a voltage between the first and the second electrodes to dispose the bubble onto only the first recess; dispersing the first microstructure into the electrolyte solution to dispose it onto the first recess; injecting the bubble into the electrolyte solution to dispose the bubble onto the second recess; and dispersing the second microstructure into the electrolyte solution to dispose it onto the second recess.

Abstract: An assembly including a substrate, a metal wiring layer on the substrate, the metal wiring layer having an opening therein, a thermosetting resin layer on at least a portion of the substrate overlapping the opening of the metal wiring layer, and a device on the resin layer, the device positioned over the opening of the metal wiring layer and bonded to the substrate via the resin layer.

Abstract: The present invention discloses a method of fabricating non-metal substrate having steps of (a) providing a non-metal board having two opposite first and second surfaces; (b) drilling at least one second through hole through the non-metal board; (c) electroplating copper on outsides of non-metal board and an inside of each of at least one second through hole to form copper films outside of the non-metal board and at least one solid copper pole in corresponding to the at lest one second through hole; and (d) patterning the copper films to form line pattern. The non-metal substrate has high thermal conductivity and the solid copper poles therein are integrated with the line pattern formed outside thereof, so the connection strength among the die pad, solid copper poles and heat conduction pad is good.

Abstract: A bipolar plate assembly for a fuel cell is provided. The bipolar plate assembly includes a cathode plate disposed adjacent an anode plate, the cathode and anode plates formed having a first thickness of a low contact resistance, high corrosion resistance material by a deposition process. The first and second unipolar plates are formed on a removable substrate, and a first perimeter of the first unipolar plate is welded to a second perimeter of the second unipolar plate to form a hermetically sealed coolant flow path. A method for forming the bipolar plate assembly is also described.

Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. Two insulating layers are formed on the two metal layers. Two including upper and bottom conductive layers are formed on the two insulating layers. Then, the two insulating layers and the two conductive layers are laminated so that the two metal layers bonded to each other are embedded between the two insulating layers. A part of the two insulating layers and a part of the two conductive layers are removed to form a plurality of blind holes exposing the two metal layers. A conductive material is formed in the blind holes and on the remained two conductive layers. The sealed area of the two metal layers is separated to form two separated circuit substrates.

Abstract: Provided are a plastic microfluid control device having a multi-step microchannel and a method of manufacturing the same. The device includes a lower substrate, and a fluid channel substrate contacting the lower substrate and having a multi-step microchannel having at least two depths in a side coupling to the lower substrate. Thus, the device can precisely control the fluid flow by controlling capillary force in a depth direction of the channel by controlling the fluid using the multi-step microchannel having various channel depths. A multi-step micropattern is formed by repeating photolithography and transferred, thereby easily forming the multi-step microchannel having an even surface and a precisely controlled height.

Abstract: In order to produce stress-reduced reflective optical elements (1) for an operating wave length in the soft X-ray and extreme ultraviolet wavelength range, in particular for use in EUV lithography, it is proposed to apply, between substrate (2) and a multilayer system (4) optimized for high reflectivity at the operating wavelength, a stress-reducing multilayer system (6) with the aid of particle-forming particles having an energy of 40 eV or more, preferably 90 eV or more. Resulting reflective optical elements are distinguished by low surface roughness, a low number of periods in the stress-reducing multilayer system and also high ? values of the stress-reducing multilayer system.

Abstract: The present invention relates to the production of an adaptive deformable mirror for compensation of defects of a wavefront.

Abstract: A mesh sheet of the present invention is a mesh sheet in which a metal mesh comprising fine bands is laminated on a surface of a base substrate, the mesh sheet being used and adhered along a surface of an arbitrary member having a curved surface portion. The metal mesh has a part in which the fine band positioned between connection points of the fine bands which are adjacent to each other is a curved line so as to absorb stress relative to deformation to be placed along the curved surface portion with a large curvature without destructing the metal mesh.

Abstract: The invention relates to a method for integrating an electronic component into a printed circuit board, said method comprising the following steps: a layer of a printed circuit board is used to support the electronic component (4); holes (3) corresponding to the contacts (6) of the electronic component (4) are formed in the layer (1); an adhesive (5) is applied to the layer (1) supporting the electronic component (4); the electronic component (4) is fixed to the layer (1) with the contacts (6) oriented towards the layer (1) and the holes (3); adhesive (5) possibly in the region of the holes or perforations (3) is removed, especially by the application of a laser beam (9); and an electroconductive layer (10) is formed for contacting the contacts (6) of the electronic component (4) on the surface of the layer (1), facing away from the component (4).

Abstract: A wearing article capable of suppressing the occurrence of a loss of materials and an increase of the cost of facilities and a method of manufacturing the same are provided. A wearing article includes a waist portion (3) formed in a ring shape capable of continuously surrounding the waist of the wearer and using one of openings as a waist opening (9), and a crotch portion (4) joined to the waist portion (3) across an opening on the opposite side to the waist opening (9) so that the crotch portion (4) and the waist portion (3) define a pair of leg openings (10) for the wearer to put through his legs individually. Shirring is formed in the crotch portion (4) so as to shorten the distance between the mutually opposing inner surfaces of the waist portion (3) connected to each other by the crotch portion (4).

Abstract: A disclosed method for manufacturing a display device with optical/electronic structures according to the present invention comprises: a first step for forming the optical/electronic structures on the primary side of a release film onto which an adhesive is applied, a second step for attaching the primary side of the release film to a substrate or a film, and a third step for removing only the release film from the substrate or film while the optical/electronic structures are attached thereto. According to the invention, the optical/electronic structures are transferred and attached to the substrate or film of the display device after firstly being attached to the release film.

Abstract: Reactive hotmelt adhesives based on copolyamide can be used in hybrid components. These hybrid components find application in, for example, vehicle construction and aircraft construction.

Abstract: An electrohydrodynamic fluid accelerator includes an emitter electrode and leading surfaces of a collector electrode that are substantially exposed to ion bombardment. Heat transfer surfaces downstream of the emitter electrode along a fluid flow path include a first portion not substantially exposed to the ion bombardment that is conditioned with a first ozone reducing material. The leading surfaces of the collector electrode are not conditioned with the first ozone reducing material, but may include a different surface conditioning. The downstream heat transfer surfaces and the leading surfaces can be separately formed and joined to form the unitary structure or can be integrally formed. The electrohydrodynamic fluid accelerator can be used in a thermal management assembly of an electronic device with a heat dissipating device thermally coupled to the conditioned heat transfer surfaces.

Abstract: Multilayered articles comprise (E) optionally at least one decor layer, (F) at least one substrate comprising cellulose fibers, (G) at least one metal-containing layer prepared by a process comprising the steps of (c) printing covering layer (D) with a printing formulation comprising at least one metal powder, (d) providing with at least one item generating or consuming electric current, (e) depositing at least one further metal, (H) optionally at least one covering layer.

Abstract: An optical waveguide device includes a wiring substrate, an optical waveguide bonded on the wiring substrate and having a light path conversion inclined surface on both ends, and a light path conversion mirror formed to contact the light path conversion inclined surface of the optical waveguide and formed of a light reflective resin layer or a metal paste layer. In case the light reflective resin layer is used as the light path conversion mirror, the light reflective resin layer may be formed partially only on the side of the light path conversion inclined surface, or may be formed on the whole of the wiring substrate to coat the optical waveguide.

Abstract: One embodiment is a method for manufacturing a stacked oxide material, including the steps of forming a first oxide component over a base component, causing crystal growth which proceeds from a surface toward an inside of the first oxide component by first heat treatment to form a first oxide crystal component at least partly in contact with the base component, forming a second oxide component over the first oxide crystal component; and causing crystal growth by second heat treatment using the first oxide crystal component as a seed to form a second oxide crystal component.

Abstract: One embodiment is a method for manufacturing a stacked oxide material, including the steps of forming an oxide component over a base component; forming a first oxide crystal component which grows from a surface toward an inside of the oxide component by heat treatment, and leaving an amorphous component just above a surface of the base component; and stacking a second oxide crystal component over the first oxide crystal component. In particular, the first oxide crystal component and the second oxide crystal component have common c-axes. Same-axis (axial) growth in the case of homo-crystal growth or hetero-crystal growth is caused.

Abstract: There is provided a method of manufacturing a liquid discharge head having a substrate including energy generating elements, and a discharge port member which is provided with discharge ports and is joined to the substrate, thereby forming liquid flow paths communicating with the discharge ports. The method performs in this order: preparing a conductive base on which a first insulating resist and a second insulating resist for forming the discharge ports are stacked in this order; performing plating using the first resist and the second resist as masks, and forming a first plated layer; removing the second resist; performing plating on the base using the first resist as a mask, thereby forming a second plated layer so as to cover the first plated layer; removing the base and the first resist, thereby forming the discharge port member; and joining together the substrate and the discharge port member.

Abstract: A novel method of producing sub-nanometer grade surface finishing substrates comprises the following steps of: producing a mother substrate which has ultra fine finished surface; a sacrificial layer being employed on a top of this layer being used to facilitate the depletion of finished product with this mother substrate; after finishing the sacrificial layer, a vacuum tool being used to deposit a thin layer on the top of sacrificial layer, wherein this sacrificial layer is remained as a surface of a finished product. To further increase a thickness of the thin layer, vacuum tool or an electroplating method are employed. After reaching a predetermined thickness, the fine surface finishing layer will be bonded with a bulk substrate; bonding of these two objects being done by vacuum bonding with elevated temperature and pressure; and therefore, a fixture is used.

Abstract: Disclosed is a method to manufacture an electrode. The metal oxide of different sizes (or metal oxide secondary particle of similar size) is formed on a transparent substrate by electrophoresis deposition. Subsequently, the metal oxide layer is compressed and dipped in dye to complete an electrode applied in a solar cell. Furthermore, the step of dipping the metal oxide in dye can be earlier than the electrophoresis deposition, thereby reducing the dipping period and dipping temperature.

Abstract: A printed circuit board according to an aspect of the invention may include: a board portion having an electrode portion provided on a surface thereof; a solder resist layer provided on the surface of the board portion and having an opening therein to expose the electrode portion to the outside; and a bump layer having the same diameter as the opening and providing an electrical connection with an external chip component.

Abstract: Processes for producing a metalized textile surface for one or more articles needing or generating electric current. The process comprises (A) applying a formulation comprising at least one metal powder (a) as a component to a textile surface in a patterned or uniform manner; (B) fixing the one or more articles needing or generating electric current in at least two locations of the textile surface where the formulation was applied in step (A); and (C) depositing a further metal on the textile surface. The formulation may comprise a metal powder, a binder, an emulsifier and, if appropriate, a rheology modifier.

Abstract: A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut extending in the thickness direction from a second surface side, located opposite the first surface side, to a certain part of the support plate; a step of forming a continuous electrode on the second surface and on a peripheral surface located inside the cut groove, of each of the chips by sputtering, for example; and a step of detaching the chips from the support plate. An electrode on the first surface of the substrate may be formed prior to the temporary bonding step, and the electrode formed on the peripheral surface may be connected to the electrode on the first surface.

Abstract: A manufacturing method of a circuit board is disclosed. The manufacturing method of a circuit board in accordance with the present invention includes forming a separation layer on a carrier, stacking an adhesion layer which is coupled to the carrier and covers the separation layer, forming a circuit layer on the adhesion layer, forming a circuit board unit by cutting the separation layer, the adhesion layer and the circuit layer such that the separation layer is separated from the carrier, and forming a stiffener by processing the separation layer of the circuit board unit. The manufacturing method of a circuit board in accordance with the present invention can reduce the cost and time for forming the stiffener by forming the stiffener together in the manufacturing process of the circuit board.

Abstract: Certain example embodiments of this invention relate to electrochromic (EC) devices, assemblies incorporating electrochromic devices, and/or methods of making the same. More particularly, certain example embodiments of this invention relate to improved EC materials, EC device stacks, high-volume manufacturing (HVM) compatible process integration schemes, and/or high-throughput low cost deposition sources, equipment, and factories.

Abstract: A precious metal thin-film laminate (PMTL) (10) that is presented in terms of a structure and as a process for producing various embodiments of the structure. The PMTL (10) is comprised of three basic elements: a substrate (12) having an upper surface (14) and a lower surface (16), a selectable quantity of a precious metal (18) such as gold (20) that is deposited onto the upper surface (14) or onto the lower surface (16) of the substrate (12), and a protective layer (22) that is applied over the precious metal (18). Preferably, the PMTL (10) also includes indicia (24) and a PMTL authenticating device (26). The PMTL (10) can be utilized as material for collectible art, traded, and purchased and sold by individuals and/or commercial enterprises.

Abstract: A method of manufacturing a metal clad laminate, the method including: forming a barrier layer over one side of a metal layer by performing plating; forming a metal foil over one side of the barrier layer by performing plating; and attaching an insulator to one side of the metal foil. In a further embodiment, the method of manufacturing a metal clad laminate, the method including: attaching a metal foil to one or either side of an insulator; and forming a barrier layer over the metal foil by way of electroplating.