Exposure Of Work To Electrode Patents (Class 156/274.4)
  • Patent number: 7479202
    Abstract: Techniques for producing optical medium that can be read at substantially high speeds with greater stability and accuracy are disclosed. According to one aspect of the techniques, a bonding station is employed with what is referred to as a bubble-free bonding technique that may or may not be incorporated with an index bonding technique. The index bonding is provided to ensure that non-flatness of substrates is compensated when two substrates are bonded together so as to minimize possible dynamic imbalance of a disc. The bubble-free bonding technique is provided to generate an alternating electromagnetic field that eliminates bubbles from a type of glue used to bond two substrates, wherein a high voltage source is used to generate the alternating electromagnetic field of a predefine magnitude.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: January 20, 2009
    Assignees: Anwell Precision Technology (HK) Limited, Dongguan Anwell Digital Machinery Co., Ltd.
    Inventors: Kai Leung Fan, Ming Sang Yeung
  • Publication number: 20080047366
    Abstract: There is provided a method for producing a force sensor including: a force sensor chip; and an attenuator, in which the force sensor chip and the attenuator are joined at joint portions with a glass layer sandwiched therebetween. The method includes: a film forming step in which a glass film as the glass layer is formed on regions of the attenuator containing the joint portions or on regions of the force sensor chip containing the joint portions; and an anodic bonding step in which the force sensor chip and the attenuator are stacked as a stacked body in close contact with each other at the joint portions, and the glass film and the force sensor chip, or the glass film and the attenuator, are joined.
    Type: Application
    Filed: August 23, 2007
    Publication date: February 28, 2008
    Inventors: Nariaki Kuriyama, Jun Sasahara, Tadahiro Kubota, Daisuke Okamura, Takeshi Ohsato
  • Patent number: 7300536
    Abstract: A method is provided for attaching together a larger tube and a smaller tube in a T-shaped intersecting joint. A hole is formed in the larger tube with a flange surrounding the hole. A circumferential extending flange is formed on the outside of the smaller tube. Adhesive is placed on either the outside of the smaller tube or the inside of the flange of the larger tube. The smaller tube is inserted into the hole in the larger tube so that the adhesive is interposed between the inside of the flange of the larger tube and the outside of the smaller tube and the flange on the outside of the smaller tube comes into electrical conducting contact with the flange of the larger tube. Electrical current is applied to flow between the large tube and the small tube so that electrical resistance heating is obtained to cure the adhesive.
    Type: Grant
    Filed: May 9, 2006
    Date of Patent: November 27, 2007
    Assignee: GM Global Technology Operations, Inc.
    Inventors: Pei-Chung Wang, John D. Fickes, Charles J. Bruggemann, Sanjay M. Shah, Joseph M. Lendway, IV
  • Publication number: 20070137780
    Abstract: A method of fabricating a micro actuator is provided including a media stage having a media loading surface and a coil for driving the media stage, formed on the opposite surface of the media stage to the media loading surface. The method includes forming a groove on a first surface of a first substrate, forming a coil on a first surface of a second substrate, bonding the first surface of the first substrate to the first surface of the second substrate, and forming the media loading surface on a second surface of the second substrate, which is opposite the first surface of the second substrate.
    Type: Application
    Filed: November 13, 2006
    Publication date: June 21, 2007
    Inventors: Hong-sik Park, Seung-bum Hong, Jong-youp Shim
  • Patent number: 7220950
    Abstract: An RF welder is disclosed that has circuitry that automatically affects system impedance so that, throughout the welding or embossing cycle, a generator is capable of sending energy through die and fabric at a predetermined frequency and cabling is capable of dissipating a load that is less than a preselected amount.
    Type: Grant
    Filed: January 24, 2006
    Date of Patent: May 22, 2007
    Inventors: Mark Gruenspecht, Timothy Hopper
  • Patent number: 7115182
    Abstract: A method of bonding components comprising the following steps. At least a first ceramic component and a second ceramic component are provided. A first conductive layer is formed over the upper surface of the first ceramic component. An intermediate film is formed over the first conductive layer. A second conductive layer is formed over the lower surface of the second ceramic component. The second ceramic component is stacked over the first ceramic component wherein the second conductive layer on the second ceramic component opposes the intermediate film on the first component. The first and second ceramic components are anodically bonded together.
    Type: Grant
    Filed: June 15, 2004
    Date of Patent: October 3, 2006
    Assignee: Agency for Science, Technology and Research
    Inventors: Jun Wei, Stephen Chee Khuen Wong, Sharon Mui Ling Nai
  • Patent number: 7012232
    Abstract: An RF welder is disclosed that has circuitry that automatically affects system impedance so that, throughout the welding or embossing cycle, a generator is capable of sending energy through die and fabric at a predetermined frequency and cabling is capable of dissipating a load that is less than a preselected amount.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: March 14, 2006
    Inventors: Mark Gruenspecht, Timothy Hopper
  • Patent number: 6977025
    Abstract: The invention provides a method of forming a monolayer of substantive particles including the steps of applying to a substrate a curable composition having substantive particles contained therein, the substantive particles having a particle size on at least one dimension thereof of at least 1 micrometer and being in two or more groups of different sizes; exposing the substantive particle-containing curable composition to a source of energy suitable for effecting polymerization of the curable composition for a sufficient time to effect polymerization of a layer of the curable composition having a thickness of no more than 50% of the height of the largest substantive particles; and optionally, removing uncured curable composition. The invention also provides a method of forming a monolayer of substantive particles in a non-random array where the curable composition comprises a ferrofluid composition.
    Type: Grant
    Filed: March 17, 2003
    Date of Patent: December 20, 2005
    Assignee: Loctite (R&D) Limited
    Inventors: Ciaran Bernard McArdle, Rory Brian Barnes
  • Patent number: 6916391
    Abstract: A method of securing a sealing washer to one surface of a metal sheet while welding a head of a fastener to a second surface of a metal sheet, the method comprising: compressing the head onto the second surface of the sheet between a first electrode engaging the head and a second electrode engaging the first surface of the sheet, welding the head to the second surface of the sheet by electrical resistance welding to heat the first surface of the sheet proximate to the first electrode, urging a sealing washer into the heated first surface with the second electrode to heat the sealing washer and thereby bond the sealing washer to the first surface.
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: July 12, 2005
    Assignee: Van-Rob, Inc.
    Inventor: Jeffrey Liaw
  • Patent number: 6823693
    Abstract: A controller is used with an anodic bonding system that has a charge flowpath for supplying charge to bond materials together. The controller includes a switch and a circuit. The switch is configured to control a flow of the charge through the charge flowpath. The circuit is configured to monitor a rate of the flow, use the rate to determine an amount of the charge supplied for bonding, and based on the amount or rate, operate the switch to control the flow.
    Type: Grant
    Filed: March 6, 1998
    Date of Patent: November 30, 2004
    Assignee: Micron Technology, Inc.
    Inventors: James J. Hofmann, Glenn W. Piper
  • Patent number: 6810640
    Abstract: Methods of producing a laminated package with an opening which is sealed by a tear-off strip or a pouring element as well as a corresponding laminated package are described. To be able to produce a laminated package with such a closure inexpensively, the following steps are provided in the method punching out an opening in a packaging material, coating the packaging material at least in the area of the opening, creating a package sheathing from the coated packaging material, conveying the package sheathing to a filling machine or to an equipment unit from the filling machine, and attaching a tear-open strip to the opening in the package sheathing in the filling machine or in the equipment unit upstream from the filling machine.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: November 2, 2004
    Assignee: SIG Combibloc GmbH
    Inventors: Hans Bomer, Matthias Dammers
  • Patent number: 6800168
    Abstract: In a plate bonding system for bonding first and second substrate discs (or other plates) with adhesive, there are provided a first section for bringing the first and second substrate discs closer to each other with the interposition of adhesive, and a second section for producing an electric field in the interspace between the first and second substrate discs. The second section produces the field and thereby deforms the adhesive into a tapered shape to minimize the initial contact area and thereby prevent voids from being involved in the adhesive.
    Type: Grant
    Filed: May 21, 2002
    Date of Patent: October 5, 2004
    Assignee: Origin Electric Company, Limited
    Inventors: Koji Yamaguchi, Masahiro Nakamura, Masahiko Kotoyori, Shinichi Shinohara, Hideo Kobayashi
  • Patent number: 6793831
    Abstract: A method for fabricating devices in a pre-assembled state comprising forming plural laminae, registering the laminae, and bonding the laminae one to another is described. The plural laminae contain the substructures and structures of the device. The substructures are coupled to structures and other substructures by fixture bridges in the pre-assembled state. The substructures of the device are dissociated by eliminating the fixture bridges. The plural laminae are registered and bonded to form the device either before or after the fixture bridges are eliminated. The fixture bridges can be eliminated in a variety of ways, including vaporization by electrical current, chemical dissolution, or thermochemical dissociation. One method to selectively bond the laminae together is by microprojection welding. Microprojection welding comprises forming laminae with projections that extend from at least one planar surface of the lamina.
    Type: Grant
    Filed: August 5, 1999
    Date of Patent: September 21, 2004
    Assignee: State of Oregon acting by and through the State Board of Higher Education on behalf of Oregon State University
    Inventors: Brian Kevin Paul, Richard Budd Peterson, Tyson Jedd Terhaar
  • Patent number: 6784407
    Abstract: A desk top sealer includes three compartments for housing a solenoid assembly, a power supply and a circuit board, respectively. A source of air flow flows into an initial compartment and is channeled through apertures in brackets forming the two remaining compartments for cooling purposes and is exhausted from each compartment through a base. The circuit board, upon actuation, provides RF energy to a fixed ceramic/metal jaw to heat and weld plastic tubing clamped to the fixed jaw by a movable jaw at ground potential. The movable jaw is guided during translation by a pair of rods extending from a face plate, which rods also prevent rotation of the movable jaw about its axis of translation to maintain the movable jaw in alignment with the fixed jaw. The movable jaw is relatively massive to serve as a heat sink for the heat of the tubing being welded and includes a substantial surface area to dissipate to the ambient environment any heat buildup that may occur.
    Type: Grant
    Filed: February 27, 2003
    Date of Patent: August 31, 2004
    Assignee: Engineering & Research Associates, Inc.
    Inventors: Douglas F. Wright, Leonard T. Williams, Tulsie P. Summer
  • Patent number: 6663743
    Abstract: A container capable of containing components of a mixture in chambers separated by a peelable seal constructed from a multi-layer film. The multi-layer film has at least one layer of a RF-responsive material and an interior layer of non-RF responsive material. When the layers are subjected to RF energy, the RF-responsive layer heats the interior layers resulting in a bond in the form of a peelable seal between the interior layers. The peelable seal is capable of withstanding external pressures to the container, such as from dropping the container. The seal may be selectively opened to allow mixture of components contained therein.
    Type: Grant
    Filed: June 18, 1998
    Date of Patent: December 16, 2003
    Assignee: Baxter International Inc.
    Inventors: Michael Becker, Jim Chase, Christopher Papa, Jeff Jones
  • Patent number: 6620271
    Abstract: A die system for use in formation of a welded flashing, comprising a body portion comprised of a conducting material, the body portion having a first end and a second end; an indent portion at the first end of said body portion adapted to accept a portion of the flashing during welding; and where the portion of the flashing accepted in the indent portion of the body portion is folded away from an operational connection between the first end of the body portion and a welder during welding.
    Type: Grant
    Filed: July 9, 2001
    Date of Patent: September 16, 2003
    Inventors: Steven R. Mayle, Robert L. Mayle
  • Patent number: 6616781
    Abstract: A die system for use in formation of a welded flashing, comprising a body portion comprised of a conducting material, the body portion having a first end and a second end; an indent portion at the first end of said body portion adapted to accept a portion of the flashing during welding; and where the portion of the flashing accepted in the indent portion of the body portion is folded away from an operational connection between the first end of the body portion and a welder during welding.
    Type: Grant
    Filed: July 9, 2001
    Date of Patent: September 9, 2003
    Inventors: Steven R. Mayle, Robert L. Mayle
  • Patent number: 6584684
    Abstract: A module or assembly is formed by interposing a polymer between a carrier and a semiconductor device to be secured to the carrier. The polymer has ionized metallic particles suspended in it. Before setting or curing the polymer, the module is exposed to an electric field which induces migration of the metallic particles to the opposing pads of the carrier and semiconductor device. Such migration ultimately forms metal dendrites extending between mating pad pairs. The dendrites establish a metallurgical bond and conductive paths between the carrier and the overlying semiconductor device. When the polymer is subsequently set, the carrier and device are not only adhered to each other, but the dendrite connections are fixed and structurally reinforced to provide the needed electrically conductive paths.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: July 1, 2003
    Assignee: International Business Machines
    Inventors: Peter J. Brofman, Anson J. Call, Jeffrey T. Coffin, Kathleen A. Stalter
  • Patent number: 6554945
    Abstract: A workpiece is passed at high speed through an electrostatic flocking chamber provided with an inlet opening and an outlet opening, a distance between which openings is increased to realize optimum flocking conditions for the workpiece being electrostatically flocked. In order to conduct an electrostatic flocking operation of the workpiece by having the workpiece traveled at high speed between the inlet opening and the outlet opening, a pair of electrodes are disposed parallel to a passage of the electrostatic flocking chamber, which passage is increased in length to permit the workpiece to pass through the passage at high speed. A high voltage is applied to a first one of the electrodes, while a low voltage lower than the high voltage is applied to a second one of the electrodes, wherein the first and the second electrode are disposed in the inlet opening's side and the outlet opening's side, respectively.
    Type: Grant
    Filed: August 10, 2000
    Date of Patent: April 29, 2003
    Assignees: Mesac Corporation, Sumitomo Corporation
    Inventor: Masaaki Abe
  • Publication number: 20030066600
    Abstract: A method of preparing a cured laminate employing electron beam radiation is provided. The cured laminate is prepared from an uncured laminate including a prepolymer composition containing oligomer, tackifying resin, and optionally, monomer. Also provided are a prepolymer composition and an article including the cured laminate prepared by the method of this invention. The method is useful for preparing cured laminates such as flexible laminates for food packaging.
    Type: Application
    Filed: April 30, 2002
    Publication date: April 10, 2003
    Inventors: Thomas Frederick Kauffman, David William Whitman
  • Publication number: 20030062118
    Abstract: A method and apparatus for forming laminate composite structures. At least two laminae, each containing electrically conductive reinforcing fibers, are placed upon each other in contacting relationship to form a generally layered structure. The layered structure may be subjected to heat to conductively transfer heat through the layered structure and thereby improve the surface contact between the two laminae. The layered structure is volumetrically heated by inductively transferring energy to the electrically conductive reinforcing fibers. The heated, layered structure is consolidated, such as by applying pressure and reducing the temperature of the layered structure. The consolidated structure is then quenched by rapidly cooling the consolidated structure in a directionally controlled manner about a midplane thereof.
    Type: Application
    Filed: September 24, 2002
    Publication date: April 3, 2003
    Inventors: Jack K. Gerhard, Eric J. Lynam, Mark R. Shaffer, Shridhar Yariagadda, Nicholas B. Shevchenko, Bruce K. Fink, Dirk Heider, John J. Tierney, John W. Gillespie
  • Publication number: 20020170664
    Abstract: Disclosed is a method for manufacturing a pipe having double layers, which enables the adhesion between a metal pipe layer and a synthetic resin pipe layer of the pipe to be stably maintained even when external environment changes. In the method, a synthetic resin pipe having a double layer-structure is formed, and the synthetic resin pipe is inserted into a metal pipe. Then, the metal pipe is heated to make an adhesive resin of the synthetic resin pipe be heated up to a softening temperature of the synthetic resin pipe, and air between an inner surface of the metal pipe and an outer surface of the synthetic resin pipe is exhausted, so as to make a space between the inner surface of the metal pipe and the outer surface of the synthetic resin pipe be vacuum. In result, the metal pipe and the synthetic resin pipe are bonded together.
    Type: Application
    Filed: April 29, 2002
    Publication date: November 21, 2002
    Inventor: Jejin Ryu
  • Patent number: 6475326
    Abstract: We have developed a method of anodic bonding which directs cations to a location within a bonding structure which is away from critical bonding surfaces. This prevents the formation of compounds comprising the cations at the critical bonding surfaces. The anodic bonding electrode contacts are made in a manner which concentrates the cations and compounds thereof in a portion of the bonded structure which can be removed, or cleaned to remove the compounds from the structure. A device formed from the bonded structure contains minimal, if any, of the cation-comprising compounds which weaken bond strength within the structure. In the alternative, the cations and compounds thereof are directed to a portion of the bonding structure which does not affect the function of a device which includes the bonded structure.
    Type: Grant
    Filed: December 13, 2000
    Date of Patent: November 5, 2002
    Assignee: Applied Materials, Inc.
    Inventor: Harald S. Gross
  • Publication number: 20020133905
    Abstract: A tear-resistant flexible hinge structure is placed between a pair of substantially rigid panels so as to permit the panels to be hinged one with respect to the other, where the flexible hinge is formed from a plastics material such as polyvinyl chloride. The hinge structure is formed under heat and pressure so as to comprise at least three parallel rows of alternating flat and raised portions, in staggered relationship. This causes a structure whereby any rip or tear which starts in the formed flexible hinge cannot continue because it will encounter a discontinuity in the configuration and thickness of the material, which precludes further propagation of the rip or tear. Typically, after the hinge structure has been formed, it is configured in a semi-circular cross section, re-heated and cooled, so as to set and have a memory in its closed configuration as opposed to the originally pre-formed flat, open configuration.
    Type: Application
    Filed: March 20, 2001
    Publication date: September 26, 2002
    Inventors: Brian Abramson, Steven Ferguson
  • Publication number: 20020134515
    Abstract: In a plate bonding system for bonding first and second substrate discs (or other plates) with adhesive, there are provided a first section for bringing the first and second substrate discs closer to each other with the interposition of adhesive, and a second section for producing an electric field in the interspace between the first and second substrate discs. The second section produces the field and thereby deforms the adhesive into a tapered shape to minimize the initial contact area and thereby prevent voids from being involved in the adhesive.
    Type: Application
    Filed: May 21, 2002
    Publication date: September 26, 2002
    Applicant: Origin Electric Company, Limited
    Inventors: Koji Yamaguchi, Masahiro Nakamura, Masahiko Kotoyori, Shinichi Shinohara, Hideo Kobayashi
  • Publication number: 20020117250
    Abstract: A method of making a vehicle windshield. First and second flat glass sheets are bent together into a shape desired for the windshield. The bent sheets are separated, and an interlayer (e.g., PVB) positioned therebetween. After the sheets have been heat laminated to one another via the interlayer, the convex tin side of the outer sheet is ion beam milled to shave off a portion thereof. Then, a diamond-like carbon (DLC) inclusive coating is deposited using an ion beam(s) on the milled convex shaped surface of the laminate to produce a windshield. In certain optional embodiments, the windshield may be hydrophobic in nature.
    Type: Application
    Filed: February 27, 2001
    Publication date: August 29, 2002
    Inventor: Vijayen S. Veerasamy
  • Patent number: 6413350
    Abstract: A method of fitting pull-off tabs (2), made of heat-seal material, to strip packaging material (4) having a number of through openings (3) and covered, on the opposite side to that to which the tabs (2) are fitted, with at least a first and a second lamination layer (10, 11, 12, 9) made respectively of heat-seal material and electrically conducting material and covering the openings (3); the method including the step of joining each tab (2) to the packaging material (4) at a respective opening (3) by simultaneously performing hot-plate sealing and induction sealing operations. (FIG.
    Type: Grant
    Filed: April 10, 2000
    Date of Patent: July 2, 2002
    Assignee: Tetra Laval Holdings & Finance S.A.
    Inventor: Alessandro Boschi
  • Patent number: 6402876
    Abstract: The present invention provides a number of interrelated methods for the production of random and ordered arrays of particles and recesses, as well as films containing such arrays and recesses. The present invention also relates to the random and ordered arrays of particles and films prepared therefrom. The ordered arrays are obtained by the use of ferrofluid compositions which may be curable, solidifiable or non-curing/non-solidifiable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between leads or pads.
    Type: Grant
    Filed: February 29, 2000
    Date of Patent: June 11, 2002
    Assignee: Loctite (R&D) Ireland
    Inventors: Ciaran B. McArdle, Joseph Burke, Edward K. Welch, II
  • Patent number: 6395123
    Abstract: A metal substrate is treated with a plurality of rotating brushes and a slurry of particulate material such that the treated surface is capable of absorbing incident infrared laser radiation. The substrate is itself capable of being visibly imaged by selective writing with an infrared laser. The substrate is coated with an ablatable coating which is transparent to the imaging infrared laser radiation. Selective exposure to infrared laser radiation ablates this coating in the laser exposed areas as a result of the absorption of infrared radiation by the substrate. The substrate can be anodized after rotary brush graining and still retain its ability to be imaged and ablate a coating. The coated article can be imaged in a computer-to-plate infrared laser imaging device. Depending on the specific coating and substrate selection, the imaged article can be used in a conventional lithographic printing process or in a dryographic printing process.
    Type: Grant
    Filed: April 5, 1999
    Date of Patent: May 28, 2002
    Inventors: Howard A. Fromson, William J. Rozell, Robert F. Gracia
  • Patent number: 6368436
    Abstract: A method of manufacturing a surface for the transfer of a viscous liquid product including photochemically grafting onto a surface in distinct zones at least one of anti-adherent hydrophilic monomers, anti-adherent hydrophobic monomers, anti-adherent hydrophilic oligomers, anti-adherent hydrophobic oligomers, and combinations of them, conferring upon the surface a heterogeneousness of structure improving the quality of the transfer of the viscous liquid product.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: April 9, 2002
    Assignee: Rollins S.A.
    Inventors: Christine Canet, Jerzy Kuczyinski, GĂ©rard Rich
  • Patent number: 6359273
    Abstract: A method of preheating a polymer plate by dielectric heating by applying a radio frequency voltage to a laminate in the direction of its lamination through electrodes; a method of producing a laminate, comprising dielectric heating a polymer plate by applying a radio frequency voltage to a laminate in the direction of its lamination through electrodes in a state where the laminate is housed in an annular container encompassing the surfaces of the laminates, and pressing the laminate in the direction of its lamination at least after completion of the application of the radio frequency voltage; and an apparatus for producing the laminate.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: March 19, 2002
    Assignee: Nitta Corporation
    Inventors: Kiyoshi Ogawa, Takahiko Yoshida, Michiaki Inui, Mikiya Shimizu, Yasuji Yamamoto, Yuichi Sugizaki, Tsuneo Nagata
  • Patent number: 6355123
    Abstract: A roll-over airbag 10 having an upper fabric panel 15 and a lower fabric panel 20 perimetrically bonded to the upper fabric panel 15. This perimetric joint is reinforced with a lap joint 30 defining a reinforced interior seal. The height and/or thickness of the roll-over airbag 10 can be limited by either selecting a configuration that is self limiting or by limiting the displacement of the upper and lower fabric panels 15 and 20 from one another during expansion of the roll-over airbag 10 by at least one tether member 40 disposed within roll-over airbag 10. Further, a method for producing a flat joint seam in a roll-over airbag in which the lap joint is sealed flat and steps are taken to prevent the upper and lower portions of the lap joint from adhering to one another.
    Type: Grant
    Filed: September 24, 1999
    Date of Patent: March 12, 2002
    Assignee: Methode Electronics, Inc.
    Inventors: Robert A. Baker, Robert S. Baker
  • Patent number: 6328841
    Abstract: In a method of connecting a first and a second silicon wafer, the first silicon wafer is first provided with a polyimide layer on a main surface thereof. Subsequently, a plasma-induced reaction between the polyimide layer and water is performed. A plasma-induced reaction is also performed between a main surface of the second silicon wafer and chlorine. The main surface of the second silicon wafer is then subjected to a treatment with hydrolyzed triethoxysilylpropanamine. Following this, the surfaces of the two silicon wafers, which have been subjected to the plasma-induced reactions, are joined together so as connect the silicon wafers permanently.
    Type: Grant
    Filed: November 5, 1999
    Date of Patent: December 11, 2001
    Assignee: Fraunhofer-Gesellschaft zur Foerderungdder Angewandten Forschung, e.V.
    Inventors: Armin Klumpp, Christof Landesberger
  • Publication number: 20010042945
    Abstract: A method and apparatus for making insignias with a raised design is capable of providing more aesthetic appearance to the insignias thus made. A base material consisting of a base sheet and a surface sheet overlaying the base sheet is prepared for making into an insignia. The base material is coating with a surface coating of decorative material. A bottom mold and an upper mold are used to press the base material to form raised design of patterns. The bottom and upper molds are coupled to a composite heating device including high-frequency induction and electric heating means for applying both high-frequency induction heat and electric heat to the base material while the upper molding is being pressed against the bottom mold. The upper mold is formed with a plurality of edge-defining blades for cutting an edge for the insignia, a plurality of pattern-defining blades for forming a pre-designed pattern on the insignia.
    Type: Application
    Filed: November 2, 1998
    Publication date: November 22, 2001
    Inventor: SZE TSANG WU
  • Patent number: 6309582
    Abstract: A method and apparatus for making insignias with a raised design is capable of providing more aesthetic appearance to the insignias thus made. A base material consisting of a base sheet and a surface sheet overlaying the base sheet is prepared for making into an insignia. The base material is coating with a surface coating of decorative material. A bottom mold and an upper mold are used to press the base material to form raised design of patterns. The bottom and upper molds are coupled to a composite heating device including high-frequency induction and electric heating means for applying both high-frequency induction heat and electric heat to the base material while the upper molding is being pressed against the bottom mold. The upper mold is formed with a plurality of edge-defining blades for cutting an edge for the insignia, a plurality of pattern-defining blades for forming a pre-designed pattern on the insignia.
    Type: Grant
    Filed: November 2, 1998
    Date of Patent: October 30, 2001
    Inventor: Sze Tsang Wu
  • Patent number: 6305083
    Abstract: A housing (1) of an apparatus has a plastics wall portion (2) provided with a plastics panel (4). To make a reliable and visually acceptable connection of the panel (4) to the wall portion (2), the panel is fixed to the wall portion by means of an induction welding process. In this way the connection is resistant to chemical compounds like lotions. Therefore a metal element (8) of electric conducting material having the shape of a closed loop wire is inserted between the wall portion (2) and the panel (4) and subsequently an electromagnetic field is applied in close proximity to the element. Preferably such panel (4) can be used to cover an opening (11) in the wall portion (2) for a display (10) and/or a switch (15) function. To make the housing watertight the element (8) between the panel (4) and the wall portion (2) should surround the opening (3,11).
    Type: Grant
    Filed: October 21, 1999
    Date of Patent: October 23, 2001
    Assignee: U.S. Philips Corporation
    Inventors: Martinus M. Rijken, Matthijs J. Meijer
  • Publication number: 20010030019
    Abstract: An anisotropically electroconductive connecting material, which is disposed between a connection terminal on a first substrate and a connection terminal on a second substrate and joins the substrates together by thermocompression bonding while maintaining electroconductive connection therebetween, includes electroconductive particles dispersed in an insulating adhesive, wherein the modulus of elasticity of the electroconductive particles at the compression bonding temperature is 200% or less of the modulus of elasticity of the first substrate at the compression bonding temperature.
    Type: Application
    Filed: March 8, 2001
    Publication date: October 18, 2001
    Applicant: SONY CHEMICALS CORP.
    Inventor: Masao Saitoh
  • Publication number: 20010030015
    Abstract: A mounting method for mounting an electroconductive sheet on a developer seal member for sealing a developer discharging opening provided in a developer accommodating container for accommodating a l, developer, wherein the electroconductive sheet is provided with an adhesive material on one of the surfaces thereof and a separation sheet on the one of the surface, the separation sheet being larger than the one of the surfaces of the separation sheet, the method includes an attraction step of contacting an attraction tool to the other surface of the electroconductive sheet, the attraction tool being effective to suck air to attract the electroconductive sheet thereon; an exposure step of separating the separation sheet from the electroconductive sheet while the electroconductive sheet is kept attracted by the attraction tool, so that surface of the electroconductive sheet provided with the adhesive material is exposed; and a bonding step of bonding, after the exposure step, the surface of the electroconductive
    Type: Application
    Filed: February 8, 2001
    Publication date: October 18, 2001
    Inventors: Kazuo Chadani, Masatoshi Kato, Toshiaki Nagashima
  • Patent number: 6294046
    Abstract: To provide a heat-sealing apparatus capable of: achieving a complete sealing property by causing a liquid or dirt having entered small irregularities in a tube inner face to flow out of a sealed zone together with a molten resin; and a heat seal with no crack caused by the molten resin having flowed into container and with an excellent compression strength. A heat-sealing apparatus for forming a packaging material 1 made of a laminate including a synthetic resin layer into a tubular-shape of a container, and transversely heat-sealing a tubular packaging material container filled with fluid by using a sealing jaw 3 having a high-frequency coil 2 with a ridge 11 on its flat pressing face and a jaw 5 opposing to it, wherein a first groove 16 is disposed on at least one pressing face of the high-frequency coil 2, capable of forming a synthetic resin bulge adjacent to the outer side of a zone to be sealed on a container's interior side.
    Type: Grant
    Filed: August 10, 1999
    Date of Patent: September 25, 2001
    Assignee: Shikoku Kakoki Co., Ltd.
    Inventors: Satoshi Kume, Hiroshi Katayama, Michio Ueda