Abstract: A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 ?m, a thickness of the dielectric welding film ranging from 10 to 2,000 ?m. The method uses the dielectric welding film.

Abstract: Apparatus and methods are disclosed for a safety door of an oven having glass therein with a plastic laminate. The safety door retains glass within the door in order to prevent glass from falling or being forced outside of the oven, which may cause injury.

Abstract: A method for controlling a contact angle between a glue and a surface of a substrate during manufacture of microchip packages is disclosed. The method includes applying a glue to a surface of a substrate, and placing an electrode in electrical connection with the glue. A potential difference is applied between the electrode and the substrate. The potential difference is applied across the glue and causes a contact angle between the glue and the surface of the substrate to be altered.

Abstract: Providing a method for manufacturing a package capable of achieving reliable anodic bonding between the bonding material and a base board wafer even when the bonding material having a large resistance value is used. Providing a method for manufacturing a package by anodically bonding a bonding material, which is fixed in advance to an inner surface of a lid board wafer made of an insulator, to an inner surface of a base board wafer made of an insulator, the method including an anodic bonding step where an auxiliary bonding material serving as an anode is disposed on an outer surface of the lid board wafer, a cathode is disposed on an outer surface of the base board wafer, and a voltage is applied between the auxiliary bonding material and the cathode, wherein the auxiliary bonding material is made of a material that causes an anodic bonding reaction between the auxiliary bonding material and the lid board wafer in the anodic bonding step.

Abstract: A composite foam product comprising a foam core surrounded by a gas-impermeable film. The gas-impermeable film retains the gas formed from the blowing agent so that the pressure inside the foam core is above ambient pressures.

Abstract: The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 ?m or greater but less than 10 ?m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

Abstract: Fabricating roll-good fuel cell material involves laminating first and second bonding material webs having spaced apart windows to first and second surfaces of a fuel cell membrane web. First and second active regions of the membrane web are positioned within the respective bonding material windows. Third and fourth gasket material webs having spaced apart windows are respectively laminated to the bonding material on the first and second membrane web surfaces. The bonding material windows align with the respective gasket material windows so that at least some of the bonding material extends within the respective gasket material windows. Fluid transport layer (FTL) material portions cut from fifth and sixth FTL material webs are laminated to the respective first and second active regions. The FTL material portions are positioned within respective gasket material windows and contact the bonding material extending within the respective gasket material windows.

Abstract: A method for producing laminated materials is taught, wherein materials are bonded by heating using radio frequency (RF) energy while simultaneously applying pressure. The process for laminating a single piece is generally completed in a matter of seconds, as opposed to the hour(s) required to produce a glass laminate using the current state-of-the-art technology.

Abstract: The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 ?m or greater but less than 10 ?m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

Abstract: The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 ?m or greater but less than 10 ?m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

Abstract: The present invention provides a percutaneous terminal having a substrate thereof flocked with fibers having bio-affinity, and thereby being able to adhere tightly to a living body, a medical instrument to be placed in the body, and a production method and a production apparatus of the percutaneous terminal and the medical instrument to be placed in the body. The percutaneous terminal according to the present invention is one which the surface of the substrate is flocked with bio-affinitive short fibers (e.g. hydroxyapatite complex particles), therefore the bio-affinitive short fibers are risen perpendicular to or substantially perpendicular to the surface of the substrate. As a result, an area of the bio-affinitive short fibers coating a unit area of the substrate of the percutaneous terminal to the unit area of the percutaneous terminal substrate is considerably elevated and, in its turn, the adhesiveness of the percutaneous terminal to biological tissues is improved.

Abstract: Adhesive compositions and methods of bonding and disbanding involve materials that include a polymer and an electrolyte, wherein the electrolyte provides sufficient ionic conductivity to enable a faradaic reaction at a bond formed between the composition and an electrically conductive surface, allowing the composition to disbond from the surface at room temperature. In some embodiments, the polymer component comprises or consists essentially of a thermoplastic polymer.

Abstract: A method is provided for attaching together a larger tube and a smaller tube in a T-shaped intersecting joint. A hole is formed in the larger tube with a flange surrounding the hole. A circumferential extending flange is formed on the outside of the smaller tube. Adhesive is placed on either the outside of the smaller tube or the inside of the flange of the larger tube. The smaller tube is inserted into the hole in the larger tube so that the adhesive is interposed between the inside of the flange of the larger tube and the outside of the smaller tube and the flange on the outside of the smaller tube comes into electrical conducting contact with the flange of the larger tube. Electrical current is applied to flow between the large tube and the small tube so that electrical resistance heating is obtained to cure the adhesive.

Abstract: A process by which high frequency printed wiring board construction can be fabricated using smooth copper surfaces. A conductive, thin film polymer is plated on smooth copper surfaces of a core lamination. The polymer can be selected from a group of materials consisting of polypyrrole, polyaniline, polythiophene, and combinations thereof. The conductive polymer promotes adhesion between the resin polymer of the laminate and the smooth copper surfaces.

Abstract: The present invention provides a water repellant, water resistant, stain resistant fabric that feels like fabric rather than plastic. The fabric of the present invention is prepared by treating a fabric with at least one treatment composition comprising from about 5 weight percent to about 20 weight percent of fluorochemical(s), which is then backed with at least one polymeric film to provide a water repellant, water resistant, stain resistant fabric.

Abstract: We combine superplastic forming (SPF) with adhesive bonding (AB) to produce quality multisheet sandwich panel structures, especially those using a superplastic aluminum alloy, such as Al 2004, Al 8090, or Al 1570. We produce the parts with improved energy efficiency and at lower cost. We heat the multisheet pack having an adhesive, preferably a polyimide, between the core sheets and the face sheets to its superplastic forming range. Then, we superplastically form the pack to define adhesive bonds between the sheets in the core and between the core and the face sheets with the flowing adhesive. Finally, we cool the formed pack below the superplastic range to set the adhesive.

Abstract: The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).

Abstract: Adhering apparatus for plate shaped matter includes absorbing-and-holding means 10, 20 serving also as electrodes for absorbing and holding respectively first optical disc substrate 1 and second optical disc substrate 2, optical disc substrate moving means 40 for moving second optical disc substrate 2 to be approached to first optical disc substrate, distance detecting means 50 for detecting the distance between optical disc substrates, velocity controlling means 60 for controlling a relative velocity of the second plate shaped matter to the first plate shaped matter and controlling the plate shaped matter moving means in such a manner that the relative velocity immediately after and at a time point at which the adhesive applied onto the first plate shaped matter is brought in contact with the second plate shaped matter is slower than that immediately before the adhesive applied onto the first plate shaped matter is brought in contact with the second plate shaped matter; and voltage application means 71 for a

Abstract: In a film lamination apparatus and method, there is no one-side contact of a pressing roller that presses a film to be laminated. The film is laminated using a rotatable pressing roller having a heater incorporated therein. The pressing roller is pressed onto the film placed on a semiconductor substrate while generating heat by the heater inside the pressing roller. The pressing roller is rolled on the film so as to laminate the film on the semiconductor substrate by partially heating the film by the pressing roller while moving the pressing roller.

Abstract: A method of making a flangeless seam for a disposable article including the following steps: A first member of the disposable article is provided. An electromagnetic field responsive member is provided on the first member. The first member is folded about the electromagnetic field responsive member providing opposing first proximal and first distal portions of the first member, the electromagnetic field responsive member being disposed at least partially between the opposing first proximal and first distal portions. A second member of the disposable article is provided in a folded configuration juxtaposed at least a portion of the first member to form a laminate including the first member and the second member. An electromagnetic field is applied across at least a portion of the laminate to heat the electromagnetic field responsive member to a temperature which joins at least a portion of the first member and at least a portion of the second member.

Abstract: In a method for making a hybrid leaf spring, at least one layer of composite material is molded onto a primary leaf using a mold with an interior cavity having a curvature for receiving the primary leaf at a depressed camber relative to its initial camber. The depressed camber is between unloaded and curb load cambers of the hybrid leaf spring. The primary leaf and the layer of composite material are positioned in the mold adjacent to one another and with a layer of adhesive therebetween. The layer of adhesive is cured for bonding together the primary leaf and the layer of composite material at the depressed camber so as to generally eliminate bond line shear stress when the camber of the hybrid leaf spring is at the curb height.

Abstract: A method of preparing a vehicle panel assembly for attaching the panel to a vehicle is disclosed which provides a “ready-to-install” panel assembly. The panel assembly includes first and second spaced sides, with the bead of heat activated adhesive provided on the second side of the panel. The panel and bead are heated preferably by applying shortwave and longwave infrared radiation, with the shortwave infrared radiation being applied to an adhesive free side of the panel to heat the panel and, thereby, indirectly heat the bead of the heat activated adhesive. The longwave infrared radiation is applied to the adhesive side of the panel to directly heat the bead and thereby activate the adhesive. The ready-to-install adhesive may be applied on or adjacent to a gasket, such as a polyvinyl chloride (PVC) molding, a urethane molding, or the like.

Abstract: A tetrafluoroethylene-ethylene copolymer (ETFE) film, wherein polar groups are present on the surface of the film after a surface treatment, and the surface roughness Ra is at most the surface roughness Ra of the surface of an untreated film; an ETFE film, wherein polar groups are present on the surface of the film after a surface treatment, and the amount of a weak boundary layer is at most one time of the amount of a weak boundary layer on the surface of an untreated film; a laminate employing such a film having an extremely excellent bonding strength; and a process for producing it with a mass production property.

Abstract: A satisfactory bonding is implemented at low cost. In a step, a resin layer is formed on a bonding surface side of a silicon wafer on which portion are formed electro-thermal transducers. In a later step, the silicon wafer and another silicon wafer are aligned and fixed temporarily, then the atmosphere is set at a pressure of 10−3 mbar or lower and the temperature is set at 300° C. or higher, and voltage is applied across the both wafers while pressure is applied to the wafers. When the value of an electric current flowing across the wafers has reached a level of a certain current value or lower, the application of the voltage is stopped and the atmosphere is opened to the atmospheric pressure while reducing the temperature.

Abstract: We have developed a method of anodic bonding which directs cations to a location within a bonding structure which is away from critical bonding surfaces. This prevents the formation of compounds comprising the cations at the critical bonding surfaces. The anodic bonding electrode contacts are made in a manner which concentrates the cations and compounds thereof in a portion of the bonded structure which can be removed, or cleaned to remove the compounds from the structure. A device formed from the bonded structure contains minimal, if any, of the cation-comprising compounds which weaken bond strength within the structure. In the alternative, the cations and compounds thereof are directed to a portion of the bonding structure which does not affect the function of a device which includes the bonded structure.

Abstract: In a method for making a hybrid leaf spring at least one layer of composite material is provided and a metal primary leaf. The layer of composite material and metal primary leaf are positioned adjacent one another in a mold having an interior cavity defined by at least one cavity wall. A layer of adhesive material is located between and in engagement with the layer of composite material and the metal primary leaf. The adhesive is cured by controllably heating the metal primary leaf so that energy in the form of heat is conducted therefrom into the adhesive layer bonding said metal primary leaf and layer of composite material together.

Abstract: We have developed a method of anodic bonding which directs cations to a location within a bonding structure which is away from critical bonding surfaces. This prevents the formation of compounds comprising the cations at the critical bonding surfaces. The anodic bonding electrode contacts are made in a manner which concentrates the cations and compounds thereof in a portion of the bonded structure which can be removed, or cleaned to remove the compounds from the structure. A device formed from the bonded structure contains minimal, if any, of the cation-comprising compounds which weaken bond strength within the structure. In the alternative, the cations and compounds thereof are directed to a portion of the bonding structure which does not affect the function of a device which includes the bonded structure.

Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

Abstract: A polymeric adhesive tape including a first polymeric adhesive layer which is a heat activated film and a second polymeric adhesive layer which is a heat activated film is disclosed. The tape is designed for use in the fabrication of articles wherein the polymeric adhesive tape secures a first member to a support surface. A method for bonding adjacent sheets to a substrate is also disclosed. In accordance with the disclosed method, a substrate is prepared for application of a first sheet and a second sheet, a polymeric adhesive tape is positioned on the substrate at a position along which the seam between the first sheet and the second sheet will be located, the first sheet and the second sheet are laid on the substrate such that the seam between the first sheet and the second sheet lies along the polymeric adhesive tape, and the adhesive tape is heated along the seam to bond the substrate, adhesive tape, first laminate and second laminate.