Abstract: A method and apparatus for the bonding of one or more material layers to a display panel which yields a resulting bonded assembly which is transparent and substantially free of optical defects such as entrapped dirt and air bubbles. During the bonding process of the present disclosure, a moving dispensing probe, or needle, dispenses a liquid bonding material into an air gap between the surfaces to be bonded in a manner which continuously touches (wets) each surface simultaneously. By simultaneously wetting each surface, and by dispensing the liquid bonding material in a predetermined pattern between the surfaces, the introduction of entrapped dirt and the formation of air bubbles is prevented as the two mating surfaces are subsequently pressed together and the adhesive is cured.

Abstract: An imaging detector (214) includes a scintillator array (216) including a scintillator element (228) and a material (230) and a photosensor array (218) including a detector element (222) having a light sensitive region (224) and a non-sensitive region (226). The light sensitive region is separated from the scintillator element by a gap, the light sensitive region is in one-to-one mechanical alignment with the scintillator element, and the non-sensitive region is in mechanical alignment with the material. The detector further includes structure (234) that includes one or more material free channels. The structure is located between the non-sensitive region and the material and not between the light sensitive region and the scintillator element. An optical adhesive (232) is located in the gap, filling the entire gap, and mechanically and optically coupling the light sensitive region and the scintillator element.

Abstract: A method of forming on a substrate an adhesive region that includes an adhesive composition employs steps of: a) applying a dispersion of the adhesive composition in a solvent to an anilox roller on a flexographic press, said adhesive composition comprising an adhesive polymer; b) contacting the anilox roller with a flexographic plate to transfer a portion of the dispersion thereto, said flexographic plate comprising an adhesive application region having a shape substantially matching that of the adhesive region on the substrate; c) contacting the flexographic plate with the substrate to transfer the dispersion to the substrate; and d) drying the dispersion on the substrate to form the adhesive region.

Abstract: Multilayer articles comprise a thermoformable substrate, a base layer, and an optional transparent protective layer. Methods of making and using the paint film composites, and shaped articles made thereby, are also disclosed.

Abstract: A paste formation pattern for odd numbers on which dot groups are arranged in an island form and a paste formation pattern for even numbers on which dot groups are arranged at opposing positions to the dot groups on the paste formation pattern for odd numbers in an island form are set. Further, a paste discharge head is controlled such that the set paste formation pattern for odd numbers is formed on an adhesion surface of an odd-numbered sheet of paper and the discharge head is controlled such that the set paste formation pattern for even numbers is formed on an adhesion surface of an even-numbered sheet of paper.

Abstract: A resin mortar composition suitable for construction purposes is disclosed. The composition includes a resin component (A) curable with an aliphatic amine and a peroxide and a hardener component (H) with at least one peroxide (B) and at least one amine (C). At least one of the resin component (A) and the hardener component (H) contains at least one inorganic filler and the resin component (A) and the hardener component (H) or the resin composition (A) and the at least one peroxide (B) and the at least one amine (C) of the hardener component (H) are spatially separated from one another. The resin component (A) includes a compound (a) capable of undergoing a radical polymerization, a compound (b) capable of reacting with an amine, a transition metal compound (c), at least one inhibitor (d) to adjust the gel time and a bridging compound (e) having at least two reactive functionalities.

Abstract: An embodiment of manufacturing method of a flat-panel display device having a display panel and a transparent protector sheet; comprises: applying of adhesive resin onto the transparent protector sheet or the display panel to form dot patterns of applied adhesive resin; seizing the protector sheet and the display panel on upper and lower chucking parts; colliding of undermost tip of the applied resin onto the panel or the protector sheet at an approaching rate no more than a predetermined rate, preferably in a range of 0.01-0.5 mm/sec; and squeezing of the layer by moving the upper or lower chucking part at a rate no less than three times of the approaching rate at a time of the colliding, preferably in a range of 1-10 mm/sec.

Abstract: A panel, a panel assembly having an adhesive bond and a method of adhesively bonding the panel assembly. The panel assembly includes a first panel and a second panel and at least one main adhesive channel formed in at least one of the first and second panels. At least one branched adhesive channel in fluid communication with the at least one main adhesive channel and an adhesive for joining the first and second panels to form an adhesive bond therebetween. By such structure, the placement of an adhesive into the main adhesive channel and subsequent joining of the first and second panels, any excess adhesive flows into the branched adhesive channel to avoid an over-filling or under-filling situation in the main adhesive channel.

Abstract: A method of bonding a thermoplastic component to a carpeted component is provided. The method includes providing a base component, a thermoplastic component and a fibrous carpet or mat between the components. The carpet has a large number of cavities. The carpet is made of a thermoplastic material adapted to bond to the thermoplastic component in response to heat at the interface between the thermoplastic component and the carpet. The method also includes heating the thermoplastic component and the carpet at the interface between the thermoplastic component and the carpet for a period of time to soften the carpet. The method finally includes pressing the components and the softened carpet together under a pressure to cause the softened carpet to flow and at least partially fill the cavities. The carpet at the interface is transformed into a solid bonding layer to bond the components together to create a finished structure.

Abstract: Methods for liquid adhesive lamination for precision adhesive control are provided. Precision liquid adhesive control can be obtained by first patterning liquid adhesive in a thin pre-coat layer on a substrate. A second adhesive layer can then be patterned on top of the pre-coat layer. When the second substrate is pressed onto the first substrate, the second substrate first comes into contact with the second adhesive layer. The adhesive can then be spread uniformly across the two substrates without forming voids. Alternatively, a single liquid adhesive layer can be formed in a three dimensional gradient pattern.

Abstract: An LED module structure and a light fixture provided with the structure includes a heat releasing casing; an LED package having an LED chip mounted on a base material, a material having both heat conductance and electric insulation property placed between the heat releasing casing and the LED package upon fitting of the LED package to the heat releasing casing, and a plastic fluid or adhesive agent having particles with high heat conductivity. The material has a groove with outside smaller than an outside dimension of the LED package. The groove receives excess plastic fluid or excess adhesive agent on a surface to which the LED package is firmly attached.

Abstract: An image-lens-combination is disclosed having an image bearing sheet, a translucent or transparent acrylic lens, and a layer of cured cyanoacrylate adhesive disposed between the image bearing sheet and the acrylic lens and bonding them to each other. The cyanoacrylate adhesive in its uncured state has a viscosity of at least about 25 centipoise.

Abstract: An attachment member including an integral adhesive channel and a method of adhering an attachment member to a substrate includes adhering the member to the substrate using a first adhesive attached to the member to form a gap between the substrate and a bonding surface of the member defined by a perimeter edge. The first adhesive may be a pressure sensitive adhesive. The member defines a channel including a first opening configured to receive a second adhesive, which may be a flowable adhesive. The channel includes a second opening in fluid communication with the bonding surface. After adhering the member to the substrate with the first adhesive, the flowable adhesive is dispensed through the channel and into the gap such that the dispensed flowable adhesive is contained in the gap within the perimeter edge of the bonding surface. The flowable adhesive forms a bond between the substrate and the member.

Abstract: A display device according to the present disclosure includes a display panel to output an image thereon, a functional panel attached onto the display panel by use of an adhesive, a supporting member disposed on one side of the display panel, and having a partial area disposed between the display panel and the functional panel to maintain a uniform gap between the display panel and the functional panel, and at least one adhesive introduction space formed on the supporting member such that an adhesive is introduced therein, the adhesive filled between the display panel and the functional panel.

Abstract: A spacer wafer for a wafer stack includes a spacer body with a first surface and a second surface, and is intended to be sandwiched between a first wafer and a second wafer. That is, the spacer is to keep a first wafer placed against the first surface and a second wafer placed against the second surface at a constant distance from each other. The spacer provides openings arranged such that functional elements of the first wafer and of the second wafer can be aligned with the openings. The spacer is formed from a forming tool by means of a shape replication process and is preferably made of a material hardened by curing. At least one of the first and second surface includes edges separating the surface from the openings, and the thickness of the spacer wafer at the edges exceeds the thickness of the spacer wafer at surface locations around the edges.

Abstract: A sensing device and a method of attaching the sensing device to a target object is disclosed. The substrate of the sensing device has one or more bonding material vias that allows the bonding material used to attach the substrate to the target object to flow from one side of the substrate to the other side of the substrate. The bonding material forms rivets to secure the substrate to the target object and to secure the layers of the substrate to each other.

Abstract: A panel includes a fiberglass substrate encapsulating an aesthetic material. The fiberglass substrate and the aesthetic material are both impregnated with resin to form the solid-core of the panel. The solid-core panel can be manufactured by arranging multiple layers of a fiberglass material between multiple plates, interleaving aesthetic material between at least two of the layers of fiberglass material, applying resin to the multiple layers of fiberglass material and the aesthetic material, and then allowing the combination of the resin, multiple layers of fiberglass material, and the aesthetic material to cure between the plates, forming a solid-core panel encapsulating the aesthetic material.

Abstract: Multilayer articles comprising a thermoformable substrate, a base layer and an optional transparent protective layer. Methods of making and paint film composites, and shaped articles made thereby, are also disclosed.

Abstract: A method includes providing a first sheet and a second sheet, wherein at least one of the first or second sheet has a portion that is transparent; forming a first groove in a first surface of the first sheet adjacent to an edge of the first sheet; applying an adhesive material to an area of the first surface of the first sheet at least partially along a length of the first groove between the first groove and the adjacent edge of the first sheet; and pressing the second sheet against the first surface of the first sheet to adhere the second sheet to the first sheet. The first groove is arranged so as to substantially prevent the adhesive material from spreading past the first groove when the second sheet is pressed against the first sheet.

Abstract: An opto-electronic apparatus comprises a substrate for supporting a plurality of components forming an opto-electronic assembly and an optical component attached to the substrate with an adhesive material, such as a solder or epoxy. The optical component is formed to include a plurality of bond slots disposed in parallel across at least a portion of the bottom surface of the optical component, the plurality of bond slots providing a path for a liquid adhesive material and improving the ability to displace the liquid adhesive material as the component is pressed into the surface of the substrate during the attachment process.

Abstract: An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a conductive adhesive agent having conductive particles and a low minimum melt viscosity where a thin electronic component having a thickness smaller than or equal to 200 ?m is mounted on a wiring board. In the mounting apparatus, an anisotropic conductive adhesive film having the minimum melt viscosity lower than or equal to 1.0×103 Pa·s is placed on a wiring board placed on a base, and an IC chip having a thickness smaller than or equal to 200 ?m is placed on the anisotropic conductive adhesive film. In the mounting apparatus, the IC chip is pressurized by a thermocompression bonding head having a compression bonding portion made of elastomer having a rubber hardness lower than or equal to 60, so that the IC chip is bonded onto the wiring board by thermocompression.

Abstract: The invention relates to a method for making the wall of a heat-insulated fluid-confinement tank, such as for a liquefied gas, that is integrated in the carrier structure (50) of a ship, wherein a prefabricated substantially rectangular block (25) is assembled on top of a flexible mat strip (35), the assembling of said block comprising the following steps: applying two longitudinal parallel strips of glue (26, 26?) on the lower surface of said block (25), said strips (26, 26?) being separated by a glue-free central longitudinal space (28); gluing said glued block (25) on a flexible mat strip (35) by pressing said glued block (25) on said flexible mat strip (35) so that after gluing, said longitudinal central space (28) is at least partially filled with glue, thus defining a substantially continuous glue layer on the lower surface of the block (25), said substantially continuous glue layer reinforcing the gluing of said flexible mat strip (35) in order to ensure tightness.

Abstract: A heat sink is thermally coupled to a component with a thermal filler and an intermediate layer applied between the heat sink and the component. The intermediate layer is formed with apertures and the heat sink is pressed against the component with a given force in order for the thermal filler to penetrate the apertures of the intermediate layer.

Abstract: A method of assembling a part for a motor vehicle is shown. The method comprises the steps of providing at least one of the parts with a first adhesive for bonding with the other part, the first adhesive being activated under the effect of a first predetermined condition, providing at least one of the parts with a second adhesive for bonding with the other part, the second adhesive being different from the first adhesive and suitable for activating under the effect of a second predetermined condition different from the first predetermined condition. The parts are then assembled together by the first adhesive by exposing the parts to the first predetermined condition in such a manner as to define a mutual relative position of the parts in the assembled part, and in the absence of the second predetermined condition, and the assembled-together parts are exposed to the second predetermined condition.

Abstract: An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a non-conductive adhesive agent having a low minimum melt viscosity and having no conductive particle where a thin electronic component having a thickness smaller than or equal to 200 ?m is mounted on a wiring board. In the mounting apparatus, a non-conductive adhesive film having the minimum melt viscosity lower than or equal to 1.0×103 Pa·s is placed on a wiring board placed on a base, and an IC chip having a thickness smaller than or equal to 200 ?m is placed on the non-conductive adhesive film. In the mounting apparatus, the IC chip is pressurized by a thermocompression bonding head having a compression bonding portion made of elastomer having a rubber hardness lower than or equal to 60, so that the IC chip is bonded onto the wiring board by thermocompression.

Abstract: The flow field plates in a bipolar plate assembly for a fuel cell can be both bonded and sealed appropriately using microencapsulated adhesives. This offers several advantages over using other adhesives which may have limited pot life and/or require lengthy curing periods at elevated temperature during which time the plates must be stably positioned and under compression.

Abstract: A bonding method between at least two substrates comprises deposition of at least one drop of liquid adhesive on one of the two substrates and bringing the two substrates into contact causing spreading of the liquid adhesive followed by formation of a solidified adhesive layer between the two substrates. One of the two substrates is further provided, at the surface thereof, with at least one salient rim in which at least one slit is formed, designed to remove the excess liquid adhesive when the two substrates are brought into contact. Finally, the volume of liquid adhesive deposited on one of the two substrates is greater than the volume of the bonding space delineated by said rim between the contacted substrates, and the deposited drop of liquid adhesive presents a strictly greater height than the height of the rim. A defect-free solidified adhesive layer of calibrated thickness can thus be obtained.

Abstract: The invention relates to a deformable mirror comprising a deformable membrane (2) having a reflecting face (3) and being mounted on a support provided with at least one actuator designed to deform said membrane (2), said actuator comprising at least one movable member (7) fixed to the membrane (2) via an adhesive joint (8) and having a main body (11) located away from the adhesive joint (8), said body being extended by an active part (12) that penetrates said adhesive joint (8) partly or completely in such a way that the adhesive spreads over the concealed face (4), parallel to the reflecting face (3), and adheres at least partly to the side wall (14) of said active part (12), this part (12) forming a tip (32) limiting the bonding footprint on said reflecting face (3). Deformable mirror for adaptive optics.

Abstract: A method of improving thermal cycling reliability for a hybrid circuit structure requires providing at least two circuit layers, aligning two of the circuit layers vertically such that their respective circuit elements have a precise and well-defined spatial relationship, and providing an adhesive material which wicks into a portion of the space between the aligned layers so as to mitigate damage to the structure and/or interconnections that might otherwise occur due to thermal contraction mismatch between the layers. The adhesive material is required to have an associated viscosity such that, when provided under predetermined conditions, the adhesive stops wicking before reaching, and possibly degrading the performance of, the circuit elements.

Abstract: Provided is a method of manufacturing a liquid ejecting head, the method including forming a piezoelectric element having a width in a reference direction longer than a width in an orthogonal direction orthogonal to the reference direction on a first substrate, and adhering a second substrate to a surface of the first substrate opposed to the piezoelectric element at a temperature lower than a normal temperature, wherein, in the adhering of the second substrate, the second substrate is adhered such that the first direction of the second substrate is adjusted to the reference direction, using a first thermal expansion coefficient in a first direction on an adhesion surface with the first substrate, the first thermal expansion coefficient is less than a second thermal expansion coefficient in a second direction orthogonal to the first direction and the first thermal expansion coefficient is less than a thermal expansion coefficient of the first substrate.

Abstract: Methods for liquid adhesive lamination for precision adhesive control are provided. Precision liquid adhesive control can be obtained by first patterning liquid adhesive in a thin pre-coat layer on a substrate. A second adhesive layer can then be patterned on top of the pre-coat layer. When the second substrate is pressed onto the first substrate, the second substrate first comes into contact with the second adhesive layer. The adhesive can then be spread uniformly across the two substrates without forming voids. Alternatively, a single liquid adhesive layer can be formed in a three dimensional gradient pattern.

Abstract: An air filter cartridge is provided including an air filter media construction having a first, outlet end, flow face and an opposite, second, inlet end, flow face. The filter media construction includes fluted media secured to a facing media sheet. The filter media is closed to flow of unfiltered air completely therethrough. A centerboard is provided. The centerboard has a media portion embedded within the media construction. The centerboard has first and second opposite sides. The media portion that is embedded within the media defines an aperture arrangement extending completely through the centerboard from the first side to the second side. An adhering sealant secures the centerboard to the media construction. At least some adhering sealant extends through the aperture arrangement.

Abstract: According to the method, drops of an adhesive material are deposited on one of the plates, with the drops being spaced from one another. A grid having a predefined thickness lower than that of the drops is applied to the plate receiving the drops. A perpendicular and uniform pressure is applied to at least one of the plates, so that the drops spread and come into contact with the opposing sides of the two plates. The spacing of the drops is defined so that after spreading under the pressure applied, air is not trapped between the drops.

Abstract: A photochromic structure includes a plastic support of optical grade with good light transparency, having at least one face with an adhesive layer impregnated with a solution of a solvent with photochromes, having a flexible host matrix for the photochromes, which is mounted by adhesion onto another support. A structure with a uniform flexible photochromic matrix, which has rapid transition times, notably a rapid relaxation time, is thus obtained. The structure is mountable, and advantageously repositionable. It is produced via a process using roll-milling combined with a system for dispensing the solvated solution of photochromes upstream of the rolls, via which a support strip of an adhesive is entrained by the rolls, and the adhesive is gradually impregnated and then laminated on another support.

Abstract: A display device includes a display panel having a first substrate a second substrate facing the first substrate, and a translucent panel attached, via an adhesive layer, to a surface of the second substrate opposite a surface facing the first substrate. The first substrate includes a terminal region which does not face the second substrate and in which a plurality of terminals are provided. A circuit component is mounted on the terminals in the terminal region. At least part of the circuit component is covered by the adhesive layer extending from between the second substrate and the translucent panel to the terminal region.

Abstract: The invention discloses a rigid panel adhesion method including a smearing step and a pressing step. The smearing step smears glue on a surface of a first rigid panel to form a glue layer. The glue layer has a single contact portion being in one-dimensional form of a dot or line. The glue layer has a coverage ratio of no less than 50% over the surface of the first rigid panel. The pressing step touches the contact portion of the glue layer with a second rigid panel, and slowly presses the first and second rigid panels together to discharge gases between the first and second rigid panels, thereby adhering the first and second rigid panels to each other.

Abstract: A method of manufacturing a vehicle. A set of vehicle body structure components is assembled with interlocking mating features.

Abstract: An easy to use epoxy-mount base plate assembly has components of a two-part epoxy adhesive pre-dispensed on the assembly's base plate in a plurality of alternating segments and prepackaged with a protective adhesive cover that keeps each epoxy component segment separated from one another until ready for use. To attach the base plate of the assembly to a surface, the adhesive cover is removed exposing the epoxy segments. The base plate is then pressed against a mounting surface and twisted thus mixing the epoxy components and initiating a curing process for the epoxy.

Abstract: An expansion repair coupling for interconnecting two facing ends of a cut pipe comprises a tubular body, a spigot slidably and rotatably received therein and a locking mechanism to selectively lock or unlock the rotation of the tubular body relative to the spigot. An end of the spigot extends outward from the tubular body to receive a coupling that connects to one end of the cut pipe. A radially enlarged section on the spigot has a sealing mechanism that sealably engages an interior surface of the tubular body. The locking mechanism, engaged by collapsing the spigot into the tubular body or disengaged by extending the spigot therefrom, facilitates a push and twist connection at both ends of the pipe to wipe the adhesive disposed therebetween and obtain a better seal. Preferably, the locking mechanism comprises a socket having spigot engaging members that cooperatively engage socket engaging members on the spigot.

Abstract: To provide a transparent laminate having a pair of transparent substrates integrated via an adhesive layer, in which the adhesive layer has good tear resistance and good adhesion to the transparent substrates and has excellent transparency. In a first atmosphere, a sealed space having a curable resin composition 14 accommodated between a pair of transparent substrates 10a and 10b, is formed, and then the curable resin composition 14 is cured in a state where the outside of the sealed space is made to be a second atmosphere having a pressure higher than the first atmosphere. As the above curable resin composition, a curable resin composition comprising a urethane oligomer (a) having from 1.8 to 4 curable functional groups on average which are either or both of an acryloyloxy group and a methacryloyloxy group, per molecule, and a hydroxyalkyl methacrylate (b) having a C3-8 hydroxyalkyl group having 1 or 2 hydroxy groups, is used.

Abstract: A via hole forming method and a multilayered board manufacturing method improve manufacturing yield by reducing the required processes. The via hole forming method includes a first step of forming a toner image by attaching toner particles, containing a conductive material and having a protruding portion, onto the surface of a first photosensitive member so that the protruding portion is directed to the outside; and a second step of opposing the surface of the first photosensitive member to one principal surface of a green sheet containing an insulating material and transferring the toner image to the one principal surface of the green sheet so that the protruding portions of the toner particles protrude into the green sheet so as to reach the other principal surface of the green sheet and the toner particles are buried in the green sheet. The via holes are formed using an electrophotographic printing method.

Abstract: The invention relates to a method of bonding two members together utilizing a stack of solid film adhesive and a layer of solid film adhesive, both disposed between the members. A pressure-applying device may be utilized to apply low pressure to force the members together. The pressure may force the stack to compress and expand in varying directions in order to substantially remove air-bubbles between the layer and one of the members. A heating device may be utilized to change the layer and the stack into liquid states in order to bond the members together with a void-free bond-line.

Abstract: The present invention relates to a hemmed panel and a method for fabricating a hemmed panel. The hemmed panel includes an inner panel, an outer panel, and an adhesive. The inner panel is provided with a first face, a second face, and an edge that defines a plurality of cutouts. The outer panel is provided with a first face, a second face, and a border flange. The border flange of the outer panel is hemmed over the edge and the first face of the inner panel to form a hemmed portion on the outer panel. The adhesive bonds the first face of the inner panel to the second face of the outer panel, bonds the hemmed portion of the outer panel to the first face of the inner panel, and is located in the plurality of cutouts.

Abstract: A seal agent D and liquid crystal C are clamped to a lower substrate 6, a pair of the lower substrate 7 and an upper substrate 7 are laminated with the seal agent D and the liquid crystal C interposed therebetween, and at least one of the pair of substrates is a roll-shaped long flexible resin film. When the substrates are laminated, the lower substrate 6 on one hand is aligned to the upper substrate 7 on the other hand in every arbitrary length. With this arrangement, productivity can be improved as well as a positional dislocation due to accumulation of positioning errors can be prevented.

Abstract: In a method for manufacturing a display including a light-transmissive substrate bonded onto a display surface of a display body, a bonding surface of the display body and a bonding surface of the light-transmissive substrate are set in a mutually opposed manner across compression-deformable clearance regulation members. The compression-deformable clearance regulation members are provided between the display body and the light-transmissive substrate. An adhesive, previously applied to one terminal edge of a bonding surface, is spread between the bonding surfaces of both the display body and the light-transmissive substrate. This is done by pressing the light-transmissive substrate against the display body starting from one terminal edge towards an other terminal edge thereof and by gradually decreasing a clearance between the bonding surfaces by serially compression-deforming the clearance regulation member from the one terminal edge towards the other terminal edge.

Abstract: A multilayer mounting mat operatively adapted for use in mounting a pollution control element in a pollution control device comprises a first layer, a second layer, and an adhesive sandwiched therebetween so as to bond together a major surface of the first layer to a major surface of the second layer, the adhesive comprising at least one of inorganic colloidal particles having an average diameter less than about 300 nm and an inorganic water-soluble salt.

Abstract: A manufacturing method of the present invention is a manufacturing method of a display device with a functional film that is adhered to a principal plane of a display panel provided with a display part. A first resin layer is formed outside the display part on the principal plane to surround the display part, a communication part which allows an inner area surrounded by the first resin layer and an outer area outside of the first resin layer to communicate with each other in an in-plane direction of the principal plane is formed, the inner area is coated with a second resin, the functional film is superimposed on the principal plane, and the second resin is pressed and spread throughout the inner area and the communication part by pressing the functional film.

Abstract: Disclosed are a method for manufacturing a crank for a bicycle by bonding structural members to each other with an adhesive comprising; a step for applying the adhesive in a line-like or dot-like form in correspondence with an intervention region of the adhesive; a step for disposing a fabric in correspondence with the intervention region of the adhesive; a step for expanding the adhesive applied in a line-like or dot-like form in the fabric; and a step for bonding the structural members to each other with the adhesive expanded in the fabric, and a crank for a bicycle manufactured by the method. When the crank for a bicycle is manufactured by bonding the structural members to each other with the adhesive, the adhesive can be applied easily at a high accuracy and a good repeatability, variations of application condition and amount of used adhesive can be suppressed, and variation in quality can be suppressed.

Abstract: The invention relates to a method of bonding two members together utilizing a stack of solid film adhesive and a layer of solid film adhesive, both disposed between the members. A pressure-applying device may be utilized to apply low pressure to force the members together. The pressure may force the stack to compress and expand in varying directions in order to substantially remove air-bubbles between the layer and one of the members. A heating device may be utilized to change the layer and the stack into liquid states in order to bond the members together with a void-free bond-line.

Abstract: Methods and systems for reinforcing the periphery of a semiconductor wafer bonded to a carrier are disclosed. In one embodiment, additional adhesive is applied to the semiconductor wafer prior to bonding. The additional adhesive seeps into a crevice between the carrier and wafer and provides reinforcement. In another embodiment, adhesive is applied to the crevice by a dispenser after the wafer is bonded to the glass carrier.