Including Uncurable Lamina; E.g., Metal, Paper, Etc. Patents (Class 156/307.7)
  • Patent number: 8545663
    Abstract: In a process for manufacturing a semiconductor device comprising heating a wiring board on which a chip and an uncured adhesive layer are laminated for curing the adhesive layer, the improvement includes performing a statically pressurizing step before the adhesive layer is cured, in which step the wiring board on which the chip and the uncured adhesive layer are laminated is subjected to a static pressure greater than atmospheric pressure by not less than 0.05 MPa. According to the process, voids are easily eliminated irrespective of the design of the wiring board, and the adhesive is prevented from curling up on the chip.
    Type: Grant
    Filed: August 8, 2007
    Date of Patent: October 1, 2013
    Assignee: Lintec Corporation
    Inventors: Osamu Yamazaki, Isao Ichikawa, Naoya Saiki
  • Patent number: 8535475
    Abstract: In one embodiment, a method of attaching one substrate to another substrate includes supplying a first substrate having an indicium thereon from a first source, supplying a second substrate from a second source, wherein the supplying is accomplished in a continuous manner, and curing the substrates until the substrates are bonded thereto to form a product. The method disclosed herein allows a fabric to be integrally bonded to either an elastomeric composition or a urethane composition utilizing a continuous process. The product includes indicium that identifies or conveys information about the product.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: September 17, 2013
    Assignee: Griswold Corporation
    Inventors: Daniel P. Mahoney, David P. Natorski, John J. Tichy
  • Patent number: 8529716
    Abstract: Methods and systems for forming a frame, such as door and window frames, are provided. In some implementations, a method for forming a frame includes clamping the frame on a rotation device, the frame having a plurality of frame members and a plurality of corners defined by the plurality of frame members. The rotation device is for rotating the frame and providing a liquid material into each corner of the frame through injection holes formed in frame members. The liquid material sets to form a solid structural member bridging and connecting the frame members. The liquid is poured into the corner area with the corner at the bottom and the members diverging upwardly and outwardly therefrom and the liquid material has a viscosity so that it settles to form a level height into and across each frame member but does not leak from the butting surfaces of the members.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: September 10, 2013
    Assignee: Omniglass SCT Inc.
    Inventors: Bradley Jarrett Davies, Laurence William Davies
  • Publication number: 20130230708
    Abstract: An exemplary sheetlike insulation material precursor and an exemplary insulation material are disclosed that can feature a particularly high thermal conductivity. The insulation material precursor can be characterized in that a layer of resin on each of two outer sides of a core laminate of interconnected polyester nonwovens and a polyester film is at the B-stage and has a weight fraction of at least 5% of boron nitride.
    Type: Application
    Filed: April 17, 2013
    Publication date: September 5, 2013
    Applicant: ABB AG
    Inventors: Jörg NELGES, Jörg Bohnenberger
  • Publication number: 20130219611
    Abstract: A bathing vessel includes a base and at least one wall extending vertically from the base. The wall includes a multi-layer structure that includes a layer of acrylic material on a first layer of polyurethane material, a layer of acrylonitrile butadiene styrene (ABS) material between the layer of acrylic material and the first layer of polyurethane material, and a second layer of polyurethane material between the layer of ABS material and the first layer of polyurethane material. A wood-containing composite panel is chemically bonded to at least one of the first or second layers of polyurethane material.
    Type: Application
    Filed: September 2, 2011
    Publication date: August 29, 2013
    Inventors: Michael Glenn Geels, Jeffrey McKinley Boyd, Scott Kapelanski
  • Patent number: 8500938
    Abstract: The invention relates to a method for producing a flexi-rigid printed circuit board, at least one rigid zone (1, 17, 18) of a printed circuit board being connected via a layer of non-conducting material or a dielectric layer (13, 15) to at least one flexible zone (7) of the printed circuit board, the at least one rigid zone being connected to the flexible zone (7) of the printed circuit board, the rigid zone (1) of the printed circuit board then being cut through and a connection between the separate, rigid partial zones (17, 18) of the printed circuit board being established via the flexible zone (7) that is connected thereto. According to the invention, the connection between the at least one rigid zone (1, 17, 18) of the printed circuit board and the at least one flexible zone (7) of the printed circuit board is established by bonding prior to cutting the rigid zone.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: August 6, 2013
    Assignee: AT & S Austria Technologie & Systemtecknik Aktiengesellschaft
    Inventors: Johannes Stahr, Markus Leitgeb
  • Patent number: 8500931
    Abstract: There is provided a polymer fabric that accommodates movement at or adjacent one or more respective surfaces without compromising structural integrity of the or each surface when the polymer fabric is affixed thereon. There is further provided methods of manufacture and application of the polymer fabric. The polymer fabric finds use in applications requiring sealing, containment, protection and insulation.
    Type: Grant
    Filed: October 27, 2009
    Date of Patent: August 6, 2013
    Assignee: Peerless Industrial Systems Pty Ltd.
    Inventor: Nick Subotsch
  • Publication number: 20130180769
    Abstract: A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and a fibrous base material and wherein the glass substrate layer accounts for from 10 to 70% by volume relative to the entire laminate body. A laminate plate containing at least one cured resin layer of the resin composition and at least one glass substrate layer, wherein the glass substrate layer accounts for from 10 to 70% by volume relative to the entire laminate plate. A printed wiring board having the laminate plate and a wiring provided on the surface thereof. A method for producing the laminate plate, which comprises forming a fiber-containing cured resin layer on the surface of a glass substrate.
    Type: Application
    Filed: September 21, 2012
    Publication date: July 18, 2013
    Applicant: Hitachi Chemical Company, Ltd.
    Inventor: Hitachi Chemical Company, Ltd.
  • Publication number: 20130180765
    Abstract: A laminate body containing one or more resin composition layers and two or more glass substrate layers, wherein at least one layer of those resin composition layers is between glass substrate layers, and is a fiber-containing resin composition layer of a composition that contains a thermosetting resin and a fibrous base material. A laminate plate containing one or more cured resin layers and two or more glass substrate layers, wherein at least one layer of those cured resin layers is between glass substrate layers, and is a fiber-containing cured resin layer of the fiber-containing resin composition. A printed wiring board having the above-mentioned laminate plate and a wiring provided on the surface thereof. A method for producing the laminate plate.
    Type: Application
    Filed: September 21, 2012
    Publication date: July 18, 2013
    Applicant: Hitachi Chemical Company, Ltd.
    Inventor: Hitachi Chemical Company, Ltd.
  • Patent number: 8486212
    Abstract: An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a conductive adhesive agent having conductive particles and a low minimum melt viscosity where a thin electronic component having a thickness smaller than or equal to 200 ?m is mounted on a wiring board. In the mounting apparatus, an anisotropic conductive adhesive film having the minimum melt viscosity lower than or equal to 1.0×103 Pa·s is placed on a wiring board placed on a base, and an IC chip having a thickness smaller than or equal to 200 ?m is placed on the anisotropic conductive adhesive film. In the mounting apparatus, the IC chip is pressurized by a thermocompression bonding head having a compression bonding portion made of elastomer having a rubber hardness lower than or equal to 60, so that the IC chip is bonded onto the wiring board by thermocompression.
    Type: Grant
    Filed: November 13, 2008
    Date of Patent: July 16, 2013
    Assignee: Dexerials Corporation
    Inventor: Kazunori Hamazaki
  • Publication number: 20130130038
    Abstract: The invention relates to products and/or methods and/or systems of epoxy foils for the protection and/or sealing of material as wood, metal, steel, stone, concrete, glass etc. for houses, buildings, cars, ships, boats, bridges, roads, floors, ceilings, walls, textiles, paper, airplanes etc. The reactivity and/or the elasticity of epoxy foils are adjustable and are applicable directly or indirectly for the protection and/or sealing of all materials such as wood, concrete, glass, metal, plastic etc. The epoxy foils are universal in use, self fixing, self cleanable, highly durable, very economical, safer, and less harmful to the environment.
    Type: Application
    Filed: September 20, 2010
    Publication date: May 23, 2013
    Inventor: Jacob Woudsma
  • Patent number: 8430983
    Abstract: A method of manufacturing a roofing shingle includes applying an asphalt coating to a substrate to define an asphalt coated sheet, the asphalt coated sheet including a headlap portion and a tab portion. Reinforcement material is applied from a spool to the asphalt coated sheet, wherein the reinforcement material is wound in a waywind pattern on the spool. The reinforcement material is then secured to the headlap portion of the asphalt coated sheet.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: April 30, 2013
    Assignee: Owens Corning Intellectual Capital, LLC
    Inventors: Donn Vermilion, Stephanie A. Rinne, Michael S. Ugorek, John Scowden, Barry M. Lewis, D. Greg Hendershot, Russell L. Ault, James S. Belt
  • Publication number: 20130099058
    Abstract: An aircraft wing cover (10) comprising an integrally stiffened sandwich panel including first and second skins (11, 12) sandwiching a core layer (13), wherein at least one of the skins has a plurality of spanwise extending integral regions of increased thickness (18) accommodated by corresponding regions (19) of decreased thickness in the core. Also, a method of fabricating an aircraft wing cover, and a method of designing an aircraft wing.
    Type: Application
    Filed: January 14, 2011
    Publication date: April 25, 2013
    Inventors: Christopher Payne, Peter Griggs, Antony C. Peacock, Raymond Bullock, Glenn Watson
  • Patent number: 8419888
    Abstract: An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a non-conductive adhesive agent having a low minimum melt viscosity and having no conductive particle where a thin electronic component having a thickness smaller than or equal to 200 ?m is mounted on a wiring board. In the mounting apparatus, a non-conductive adhesive film having the minimum melt viscosity lower than or equal to 1.0×103 Pa·s is placed on a wiring board placed on a base, and an IC chip having a thickness smaller than or equal to 200 ?m is placed on the non-conductive adhesive film. In the mounting apparatus, the IC chip is pressurized by a thermocompression bonding head having a compression bonding portion made of elastomer having a rubber hardness lower than or equal to 60, so that the IC chip is bonded onto the wiring board by thermocompression.
    Type: Grant
    Filed: November 13, 2008
    Date of Patent: April 16, 2013
    Assignee: Dexerials Corporation
    Inventor: Kazunori Hamazaki
  • Patent number: 8419872
    Abstract: A cold applied adhesive that includes a blend of polyurethane pre-polymer, petroleum liquid and additive. The weight percent of petroleum liquid in the blend is less than 50 weight percent. The weight percent of polyurethane pre-polymer in the blend is less than 50 weight percent.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: April 16, 2013
    Assignee: Garland Indutries, Inc.
    Inventor: Jason Smith
  • Patent number: 8388792
    Abstract: The invention relates to a nonstick material for use during removal of a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least on further, substantially planar material layer (9). According to the invention, the nonstick material (8) has a different polarity than the adjoining, substantially planar material layers (2, 9). The invention also relates to a method for removing a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least one further, substantially planar material layer (9), to a multilayer structure which consists of at least two substantially planar material layers (2, 9) to be interconnected, and to a use of the same, especially in a multilayer printed circuit board.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: March 5, 2013
    Assignee: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Gerald Weidinger, Günther Weichslberger, Markus Leitgeb, Johannes Stahr
  • Patent number: 8377244
    Abstract: A method of fabricating a panel (1) comprising a core (10) made of honeycomb material provided with a plurality of cells (13) and encased by top and bottom outer walls (20, 30), which method comprises, during a preparation stage (P1): fabricating the top outer wall (20); fabricating the bottom outer wall (30); fabricating said core (10), and perforating one internal orifice (11) per fastener element (50) in said core (10) so as to provide a space (12) for receiving said fastener element (50); and then coating at least one layer of a film of an intumescent adhesive (60) on a connection side wall (51) of said fastener element (50) that is to be connected to said core (10). After performing an assembly stage on a bench (70), the assembly comprising the top outer wall (20), the core (10) provided with said fastener element (50), and the bottom outer wall (30) is polymerized in order to obtain said panel (1) provided with said fastener element (50).
    Type: Grant
    Filed: February 22, 2011
    Date of Patent: February 19, 2013
    Assignee: Eurocopter
    Inventor: Joseph Mairou
  • Publication number: 20130029549
    Abstract: A method for fabricating and processing a flexible substrate is provided, which mainly includes: providing at least one first medium of a flexible material; providing at least one second medium of a thermoplastic plastic material; binding the first medium and the second medium to form a sheet; and curing the sheet into a plate of a predetermined shape by hot pressing. In addition, the plate is subjected to secondary processing to form a secondary composite medium of another predetermined shape. Thereby, a predetermined shape of the plate is achieved by primary processing, and is in turn changed by secondary processing.
    Type: Application
    Filed: July 27, 2011
    Publication date: January 31, 2013
    Applicant: Shanghai Yi Hsin Industry Co., Ltd.
    Inventors: Cheng Chien Hsu, Meng Chien Hsu
  • Patent number: 8361261
    Abstract: A method of assembling a secondary containment liner includes providing at least a pair of uncoated, impermeable sheet components. Respective substrate elements are secured to corresponding edges of the sheet components such that the substrate elements overlap the corresponding edges of the respective sheet components. The substrate elements are themselves overlapped and an impermeable coating is applied to the overlapping substrate elements to sealably bond the adjoining sheet components to one another and thereby define an assembled liner.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: January 29, 2013
    Inventor: Peter A. Van Fossen
  • Patent number: 8357443
    Abstract: Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity.
    Type: Grant
    Filed: September 1, 2009
    Date of Patent: January 22, 2013
    Assignee: Ajinomoto Co., Inc.
    Inventors: Hirohisa Narahashi, Shigeo Nakamura, Tadahiko Yokota
  • Patent number: 8323447
    Abstract: A process for the manufacturing of a decorative laminate, which laminate comprises an upper decorative and abrasion resistant thermosetting laminate layer and a carrying core. The upper side of the core is provided with the abrasion resistant thermosetting laminate while the lower side of the core is provided with a balance layer. This balance layer has the purpose of preventing warping of said decorative laminate while at the same time having the purpose of acoustic dampening. The balance layer comprises a layer of a polymer. The balance layer and the thermosetting laminate are joined with said core by means of pressing. Said carrying core further is provided with a dampening foil of an elastomer arranged between the upper side of the core and the abrasion resistant thermosetting laminate. The elastomer and thermosetting laminate are joined with each other and with the core by means of pressing. The achieved laminate is then cut into panels and provided with edges intended for joining.
    Type: Grant
    Filed: November 28, 2003
    Date of Patent: December 4, 2012
    Assignee: Pergo (Europe) AB
    Inventors: Martin Broberg, Jorgen Nissen, Bengt Ruuth, Johan Iveberg, Hakan Zander, Ake Sjoberg
  • Publication number: 20120301194
    Abstract: Disclosed are a heating fixing belt and a fixing device by which good long-term durability is achieved, and a process for forming the heating fixing belt. The heating fixing belt comprises a resistance heating layer formed of a resin in which at least a conductive substance is dispersed, a parting layer laminated on the resistance heating layer and a pair of electrodes for supplying electric power to the resistance heating layer, which are respectively stacked and provided on both end portions of the resistance heating layer in such a manner that at least parts thereof come into contact with the resistance heating layer, wherein the electrodes are each composed of a metal mesh sheet. In the heating fixing belt, the metal mesh sheet forming the electrode preferably has an aperture ratio of 10 to 60.
    Type: Application
    Filed: May 21, 2012
    Publication date: November 29, 2012
    Applicant: KONICA MINOLTA BUSINESS TECHNOLOGIES, INC.
    Inventors: Susumu SUDO, Tetsuo SANO, Eiichi YOSHIDA, Izumi MUKOYAMA
  • Patent number: 8303751
    Abstract: A fiber reinforced panel is manufactured to include an integral vent screen. Holes are made in each of first and second sheets of fiber and the holes register with each other when the sheets are stacked within a mold. A screen material is placed between the first and second sheets so that a part of the screen material that registers with the holes in the first sheet and second sheet is exposed. Filler inserts are inserted into the holes of the first and second sheets to mask the screen. A resin is provided and cured to bond together the first and second sheets and the screen. Thus, the screen remains exposed after the first and second sheets and screen have been bonded together by the resin, thereby forming a fiber reinforced panel having an integrally molded vent screen therein.
    Type: Grant
    Filed: August 30, 2010
    Date of Patent: November 6, 2012
    Assignee: GM Global Technology Operations LLC
    Inventors: Gerald J. Gomes, Paul E. Krajewski
  • Patent number: 8298673
    Abstract: A vibration-damping reinforcement composition contains 30 to 300 parts by weight of butyl rubber, 30 to 300 parts by weight of acrylonitrile-butadiene rubber, 100 parts by weight of epoxy resin, and 0.5 to 30 parts by weight of an epoxy resin curing agent.
    Type: Grant
    Filed: December 26, 2008
    Date of Patent: October 30, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Mitsuo Matsumoto, Yasuhiko Kawaguchi
  • Patent number: 8298363
    Abstract: A manufacturing method of a solar module according the embodiment includes a step A of disposing one of the wiring members 11 on the light receiving surface of one solar cell of n solar cells, with a thermosetting resin adhesive 12 interposed therebetween, the wiring member being to be connected to a solar cell adjacently located on one side of the one solar cell, and disposing another one of the wiring members 11 on the back surface of the one solar cell with the resin adhesive 12 interposed therebetween, the wiring member 11 being to be connected to a solar cell 10 adjacently located on the other side of the one solar cell; a step B of bonding the wiring members 11 to the one solar cell by heating the resin adhesive 12 at a temperature higher than a softening temperature of the resin adhesive 12 but lower than a hardening temperature of the resin adhesive 12; a step C of bonding the wiring members 11 to all the n solar cells by repeating the step A and the step B alternately; and a step D of hardening the r
    Type: Grant
    Filed: June 25, 2008
    Date of Patent: October 30, 2012
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Haruhisa Hashimoto, Yukihiro Yoshimine, Yasufumi Tsunomura
  • Patent number: 8277596
    Abstract: A ceiling tile and a method of manufacture, wherein the ceiling tile has contrasting colors of texturized woven yarn and a coating, respectively, wherein individual colors of the yarn and coating are at different depths of surface texture, wherein color contrasts accentuate the surface texture depths to be viewed, and provide a desirable, unpredictable randomness of pattern of the color contrasts.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: October 2, 2012
    Assignee: Certainteed Ceiling Corporation
    Inventors: Mitul D. Zaveri, James Matthew Benti
  • Patent number: 8262840
    Abstract: A composite material structure includes a first fiber layer, a second fiber layer, a resin layer between the first fiber layer and the second fiber layer and a plurality of chopped fibers provided in the resin layer.
    Type: Grant
    Filed: January 19, 2011
    Date of Patent: September 11, 2012
    Assignee: The Boeing Company
    Inventors: Michael Joseph Pepka, Steven George Lemery
  • Patent number: 8262823
    Abstract: A lightweight, structurally strong skin panel having one or more transparent areas forming see-through windows, and a method of making same. A pre-impregnated resin tape comprised of a plurality of fibers impressed into a resin is provided. A metal sheet is provided. The pre-impregnated resin tape and the metal sheet are layered onto a molding tool such that the metal sheet and the pre-impregnated resin tape are aligned one atop the other. The tool, metal sheet, and pre-impregnated resin tape are heated such that the resin flows and at least partially covers the metal sheet and the fibers. The resin and fibers are substantially transparent to form a see-through window portion in the skin panel. The transparent window skin panel eliminates the bulky and heavy frame structure traditionally employed on aircraft, and which has heretofore limited the size of aircraft windows.
    Type: Grant
    Filed: September 4, 2003
    Date of Patent: September 11, 2012
    Assignee: The Boeing Company
    Inventor: Paul S Nordman
  • Patent number: 8257542
    Abstract: A stack of 50 layers of a first pitch-base carbon fiber sheet is formed, two sets of stack each having two second pitch-base carbon fiber sheets stacked therein are fabricated. At this time, the second carbon fiber sheets have a thermal expansion coefficient larger than that of the first carbon fiber sheet. Next, the stack of the first carbon fiber sheet is then held between two sets of stack of the second carbon fiber sheets. The stack of the first and second carbon fiber sheets are then impregnated with an epoxy-base resin composition and the resin is solidified. As a result a prepreg composed of the first and second carbon fiber sheets and the resin component composed of the epoxy-base resin composition is obtained. Thereafter, interconnections and the like are then formed on the prepreg, to thereby complete a multilevel interconnection board.
    Type: Grant
    Filed: October 9, 2009
    Date of Patent: September 4, 2012
    Assignee: Fujitsu Limited
    Inventors: Keishiro Okamoto, Mamoru Kurashina, Tomoyuki Abe
  • Patent number: 8257538
    Abstract: A device transfer method and a display apparatus are provided. A device transfer method and a display apparatus are provided by or in which, in transferring devices arranged on a substrate onto another substrate, it is possible to easily strip the substrate after the transfer of the devices, to lower the possibility of damaging of the substrate, and to additionally transfer devices onto the same substrate after the transfer of the devices. A plurality of devices arranged on a temporary holding substrate are embedded into and held in a pressure sensitive adhesive layer formed on a transfer substrate, and the devices are stripped from the temporary holding substrate. Other devices are further additionally embedded into the pressure sensitive adhesive layer before hardening the pressure sensitive adhesive layer, whereby the devices can be arranged on a transfer substrate having a large area.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: September 4, 2012
    Assignee: Sony Corporation
    Inventors: Masato Doi, Katsuhiro Tomoda, Toshihiko Watanabe, Toyoharu Oohata
  • Publication number: 20120219777
    Abstract: Ultrathin copper clad laminates including a fabric sheet material layer having a first planar surface, a second planar surface and an original thickness of from about 10 to about 30 microns and at least one copper foil sheet that is adhered to a planar surface of the fabric sheet material by a cured resin wherein the base laminate has a thickness of from about 1.0 to about 1.75 mils.
    Type: Application
    Filed: February 24, 2012
    Publication date: August 30, 2012
    Applicant: ISOLA USA CORP.
    Inventors: Johann R. Schumacher, Steven M. Schultz, Stanley E. Wilson, Tarun Amla
  • Patent number: 8241446
    Abstract: Methods of making a single ply protective covering and of installing such a covering are disclosed. The method of making includes (a) providing a single ply thermoplastic roofing membrane, and (b) coating the single ply thermoplastic roofing membrane on its bottom surface with a 1-50 mil layer of a pressure sensitive adhesive mixture consisting essentially of polyisobutylene and at least one polymer comprising conjugated diene monomers. The method of installing includes (a) providing a single ply thermoplastic roofing membrane, (b) cutting the single ply thermoplastic roofing membrane to a selected size, (c) positioning the single ply thermoplastic roofing membrane on a portion of a roof, and (d) bonding the membrane to the roof.
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: August 14, 2012
    Assignee: Building Materials Investment Corporation
    Inventors: Michael P. Naipawer, III, Anthony Ruffine
  • Publication number: 20120193015
    Abstract: Disclosed herein is a method for bonding dissimilar materials using an elastic adhesive to permit the bond to withstand variations in temperature and pressure. The use of elastic adhesive accommodates previous problems associated with large differences in thermal expansion coefficient between dissimilar materials, and provides a thermally and chemically stable materials combination that withstands large thermal shock loads, such as may be experienced in a space environment. Also disclosed herein is a method for attaching a coating to a structure. In particular applications, the coating may be (1) specular (greater than 98% specularity); or (2) RF reflective for use in applications including but not limited to high frequency satellite communications.
    Type: Application
    Filed: April 18, 2007
    Publication date: August 2, 2012
    Applicant: NASA Headquarters
    Inventors: Kenneth N. Segal, James M. Lohr, Russell Rowles, Wanda Peters, Robert Kiwak
  • Patent number: 8231971
    Abstract: The invention relates to an anti-fog coating for a surface of a substrate comprising: a first polymer layer resulting from covalently bonding a polyanhydride polymer to said surface; and a second polymer layer resulting from covalently bonding a polymer selected from the group consisting of polyvinyl alcohol, partially hydrolyzed polyester, polyether and cellulose derivative; said surface having nucleophilic groups. A substrate having an anti-fog coating, as well as a process for preparing said anti-fog coating to the surface of a substrate is also provided.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: July 31, 2012
    Assignee: Université Laval
    Inventors: Gaétan Laroche, Diego Mantovani, Pascale Chevalier
  • Publication number: 20120160411
    Abstract: A method for integrating metallic components into composite materials comprising curing layers of dry composite fibres (2) in a tool (3) in conjunction with at least one metallic element (1), which is the metallic element (1) that is placed for the curing process in the exact position in which a final part (5) is intended to be placed, and the layers of dry composite fibres (2) are placed around the metallic element (1) and the final part (5) is obtained with at least one metallic element (1) completely integrated into a composite material (6). The method is preferably used to integrate a bushing into a composite material. The bushing to be used can have a special surface, depending on the loads that the final parts must bear.
    Type: Application
    Filed: December 23, 2011
    Publication date: June 28, 2012
    Applicant: AIRBUS OPERATIONS S.L.
    Inventor: Cesar SERRANO VELAZ
  • Patent number: 8187716
    Abstract: Aqueous adhesion promoter compositions include at least one aminosilane and/or aminosiloxane and also at least one mercaptosilane. The adhesion promoter compositions are suitable more particularly as primers or adhesion-promoter undercoats for adhesives and sealants. They are especially suitable for the adhesive bonding of vehicle glazing. Exceptionally high adhesion has been found more particularly with glazing featuring applied silver prints.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: May 29, 2012
    Assignee: Sika Technology AG
    Inventors: Jolanda Sutter, Wolf-Rudiger Huck
  • Patent number: 8187518
    Abstract: While releasing property between a resin layer and an imprinting mold is given by using a metal thin film layer, a method for manufacturing a substrate advantageous for forming a conductive layer by plating and a substrate manufactured by the method are provided. According to one aspect of the present invention, a method for manufacturing a substrate by imprinting, the method comprising: laminating a metal thin film layer on top of a resin layer; pressurizing the resin layer and the metal thin film layer by an imprinting mold which comprises a side having a pattern in correspondence with a wiring pattern; curing a resin which forms the resin layer; and removing the imprinting mold from the resin layer and the metal thin film layer, may be presented.
    Type: Grant
    Filed: March 5, 2007
    Date of Patent: May 29, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Choon-Keun Lee, Myeong-Ho Hong, Seung-Heon Han, Senug-Hyun Ra
  • Patent number: 8187702
    Abstract: A decorative laminate is provided and includes a core with at least one epoxy resin impregnated fiberboard sheet. The decorative laminate also includes at least one decorative layer provided adjacent to the core. A method of forming a decorative laminate is also provided.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: May 29, 2012
    Assignee: The Diller Corporation
    Inventors: Kevin Francis O'Brien, Frederic Auguste Taillan
  • Patent number: 8172978
    Abstract: The invention concerns a method for manufacturing a radio frequency identification device (RFID), the device featuring an antenna and a chip (12) connected to the antenna, the method including the following steps: printing an antenna (12) having contacts (17 and 19) on a support (20) made of paper or synthetic paper, placing adhesive dielectric material between the contacts of the antenna, positioning an integrated circuit module (10) on the support, the module featuring groups of contacts (17, 18) and the chip (12) connected to groups of contacts inside an encapsulation (14) of the module, so that the groups of contacts of the module are opposite the contacts of the antenna, placing a thermoplastic layer (22) and a paper or synthetic paper layer (24) on the support, the two layers (22 and 24) being provided with a recess (21, 23) at the location of encapsulation (14) of the module (10), laminating together the three layers, the antenna support layer (20), the thermoplastic layer (22) and the paper or synt
    Type: Grant
    Filed: October 13, 2008
    Date of Patent: May 8, 2012
    Assignee: Ask S.A.
    Inventors: Christophe Halope, Olivier Mazabaud
  • Patent number: 8168032
    Abstract: A method of forming a roofing product can include providing a ceramic base material having an open structure. The method can also include filling the open structure of the ceramic base material with a bituminous material, wherein the bituminous material has no greater than approximately 5 weight % of abrasive particles. The method can further include applying a recycled roofing material adjacent to the ceramic base material after filling the open structure of the ceramic base material with the bituminous material. In a particular embodiment, an open structure of the ceramic base material is filled with a bituminous material that has no greater than approximately 2 weight % of abrasive particles or 0.1 weight % metal content. The recycled roofing material can be applied along one or both sides of the ceramic base material. The bituminous material may have a characteristic particle size that is smaller than a characteristic particle size of the recycled roofing material.
    Type: Grant
    Filed: November 16, 2009
    Date of Patent: May 1, 2012
    Assignee: Certainteed Corporation
    Inventors: Husnu M. Kalkanoglu, Gregory F. Jacobs, Paul A. Benensky
  • Patent number: 8163121
    Abstract: A resin impregnated overlay sheet is laid atop a wood veneer to create a concrete form. At a pre-press station, pressure is applied to a veneer assembly having an overlay sheet laid atop it. Thereafter, the pressed overlaid assembly is transferred for final hot pressing. The pre-pressing of the overlay sheet onto the wood veneer ensures the static adherence of the overlay sheet to the veneer prior to final hot pressing.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: April 24, 2012
    Assignee: Roy O. Martin Lumber Co.
    Inventors: Jeremy Burford, Todd Burton, Stanley Flenniken
  • Publication number: 20120070599
    Abstract: Medical dilatation balloons comprise a polymer that has the attribute of memory, and/or is crosslinked to impart memory. Such balloons exhibit a reduced tendency to overinflate at high inflation pressures. Furthermore, such balloons when shrunk radially by the application of heat while restraining axial shrinkage, exhibit customizable linear or non-linear compliance curves and lower crosslinking profile relative to the same balloon when unshrunk. Also disclosed is an expansive element within a tube whose outer diameter is equal to the outer diameter of the tube from which it was made. In addition, disclosed are (a) processes for preparing crosslinkable polymers, (b) joining crosslinked balloons to catheter systems, (c) forming shrunk balloon elements, and (d) forming an expansive element within a tube whose outer diameter is equal to the outer diameter of the tube from which it was made.
    Type: Application
    Filed: September 12, 2011
    Publication date: March 22, 2012
    Inventor: Alan M. Zamore
  • Patent number: 8133337
    Abstract: A mold core with a plurality of tension springs is placed in a mold box such that the top of the mold core is even with the top of the mold box when the plurality of tension springs have no tension. Block mix including a substantial amount of compressible material is poured into the mold and lightly vibrated. A movable bottom plate then moves downward at the same time as the mold core is moved downward a first distance to stretch the plurality of tension springs. After the mold core is moved downward the first distance, the movement of the mold core stops while the movement of the movable plate continues downward, thereby ejecting the partial block element from the mold. Block elements are cured, then glued together to form a complete block. One or both of the exterior surfaces of the block may have a wooden attachment layer attached.
    Type: Grant
    Filed: December 31, 2009
    Date of Patent: March 13, 2012
    Assignee: Pacific Coast Building Products, Inc.
    Inventors: Brandon J. Dardanis, Jess A. Dardanis, Kenneth M. Switzer, James A. Peeders
  • Publication number: 20120045606
    Abstract: A composite structure comprises stacked sets of laminated fiber reinforced resin plies and metal sheets. Edges of the resin plies and metal sheets are interleaved to form a composite-to-metal joint connecting the resin plies with the metal sheets.
    Type: Application
    Filed: August 17, 2010
    Publication date: February 23, 2012
    Inventors: KENNETH HARLAN GRIESS, Gary E. Georgeson
  • Patent number: 8114243
    Abstract: A mounting method is provided using a thermocompression head which can mount an electric component in a short time with high connection reliability. The method is provided for mounting an electric component on a wiring board by using a thermocompression head having an elastic pressure bonding member composed of an elastomer on a heatable metal head main body. In the method, after arranging an adhesive agent on a mounting region on the wiring board, an electric component is arranged on a mounting region, and the electric component is bonded on the wiring board by thermocompression by using the thermocompression head. At the time of performing thermocompression bonding, while pressing a top region of the electric component by a metal portion of the head main body, and adhesive in the vicinity of a side portion region of the electric component is pressed by a taper section of the elastic adhesive member.
    Type: Grant
    Filed: July 18, 2007
    Date of Patent: February 14, 2012
    Assignees: Sony Corporation, Sony Chemical & Information Device Corporation
    Inventors: Kazutaka Furuta, Masaki Taniguchi
  • Publication number: 20120018611
    Abstract: A bonding structure of a vibration isolation target is disclosed. The structure includes: a base; a vibration isolation target mounted to the base; and a vibration isolator bonds together the base and the vibration isolation target. A lift-up portion is formed on one of the base and the vibration isolation target, and is lift-upped from the one toward the other of the base and the vibration isolation target. The lift-up portion has an apex surface located at an apex of the lift-up portion. The vibration isolator is on the apex surface.
    Type: Application
    Filed: July 20, 2011
    Publication date: January 26, 2012
    Applicant: DENSO CORPORATION
    Inventors: Itaru Ishii, Tameharu Ohta, Takeshi Shinoda, Keisuke Nakano
  • Patent number: 8101038
    Abstract: The invention discloses double-sided metal clad laminates and fabrication methods thereof. A plurality of polyamic acid coatings is co-extruded on a first metal foil and heat imidization to provide a multilayer polyimide film. A second metal foil is hot pressed on the multilayer polyimide film, thus providing a double-sided metal clad laminate. The polyamic acid coatings include a first, a second, and a third polyamic acid coating with surface tensions of S1, S2, and S3, respectively, satisfying relations of S1>S2>S3, wherein the first polyamic acid coating is the coating directly applied on the first metal foil.
    Type: Grant
    Filed: March 15, 2009
    Date of Patent: January 24, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Charng-Shing Lu, Shu-Chu Shih, Jinn-Shing King, Shur-Fen Liu
  • Publication number: 20110315486
    Abstract: Disclosed is a rubber composition containing 100 parts by weight of a rubber blend comprising 99-85 by weight % of chloroprene rubber and 1-15 by weight % of chlorinated polyethylene rubber, (A) 10 to 30 parts by weight of a polyether ester-based plasticizer having a molecular weight of 450 to 650, or (B) 10 to 30 parts by weight of both of a polyether ester-based plasticizer having a molecular weight of 450 to 900 and an ester-based plasticizer having a molecular weight 350 to 500, and 3 to 10 parts by weight of two or more aromatic amine-based antioxidants. The rubber composition can simultaneously satisfy requirements for use as, for example, an automobile grease cup material, that is, heat resistance, ozone resistance, cold resistance, and adhesion to metal or resin.
    Type: Application
    Filed: March 2, 2010
    Publication date: December 29, 2011
    Applicant: NOK CORPORATION
    Inventors: Hideto Komurasaki, Yoshifumi Kojima
  • Publication number: 20110278395
    Abstract: A structural component includes a fiber composite material structure having an outer surface and an electrically conductive metal profile disposed on the outer surface of the fiber composite material structure. The metal profile provides provide improved electrical conductivity of the structural component and component protection.
    Type: Application
    Filed: May 12, 2011
    Publication date: November 17, 2011
    Applicant: AIRBUS OPERATIONS GMBH
    Inventors: Jens Telgkamp, Wolfgang Schulze, Thomas Kruse
  • Publication number: 20110273646
    Abstract: A protective film to a polarizer including a cellulose acylate and satisfying the following requirement (1) or (2): (1): The surface of the film has a pH of from 3.0 to 4.5. (2): The surface of the film has a pH of more than 4.5 and at most 6.0, and the film has a moisture permeability of at least 2800 g/m2·day.
    Type: Application
    Filed: April 26, 2011
    Publication date: November 10, 2011
    Applicant: FUJIFILM Corporation
    Inventors: Nobutaka Fukagawa, Yu Naito, Masato Nagura, Yoshio Ishii