Organic Containing Patents (Class 156/326)
  • Publication number: 20080118713
    Abstract: The present invention discloses a polymeric resin-based veneer laminating system, associated article and method for producing, for maintaining a mating edge profile of top and edge applied laminates secured to a rigid substrate material, and without compromise to fit and finish in response to temperature and humidity variations existing between the materials. A first (typically PVA) adhesive is applied between the top laminate and associated top surface of the substratum according to a first application, a second adhesive (typically EVA) being applied to the adjoining side surface of the substratum and prior to application of the edgeband according to a further expedited heat and/or pressure application.
    Type: Application
    Filed: November 21, 2006
    Publication date: May 22, 2008
    Inventor: Robert Bordener
  • Publication number: 20070256783
    Abstract: An adhesive paste with rounded filler particles results in improved thermal properties. The resultant compound maintains excellent quality for bonding high density, microcircuit electronic components to substrates.
    Type: Application
    Filed: May 8, 2007
    Publication date: November 8, 2007
    Inventors: Raymond L. Dietz, Maciej Patelka
  • Patent number: 7220688
    Abstract: The invention is concerned with a fibrous web for making a shaped article reinforced with fibrous webbing by impregnating the web with a liquid resin and a hardener therefor, wherein said web comprises indicating means, which indicate the impregnation of the web with said liquid resin and said hardener.
    Type: Grant
    Filed: September 9, 2002
    Date of Patent: May 22, 2007
    Assignee: Lantor B.V.
    Inventors: Marinus J. F. Cox, Pieter Anjema
  • Patent number: 7214424
    Abstract: A heat-peelable adhesive sheet which shows small increase in the degree of contamination caused by a heat treatment for lowering an adhesive force is disclosed. The heat-peelable pressure sensitive adhesive sheet comprises a heat-expandable layer containing heat-expandable microspheres and expanding upon heating, and a non-heat expandable pressure-sensitive adhesive layer formed on at least one side thereof. The heat-peelable pressure-sensitive adhesive sheet can achieve the desired adhesive properties such as an excellent adhesive force before heating and also show a quick lowering of the adhesive force upon heating. Further, it shows small increase in the degree of contamination due to the treatment for lowering the adhesive force. Due to those characteristics, the heat-peelable pressure-sensitive adhesive sheet is practically applicable to, for example, the production of electronic parts made of thinner semiconductor wafers.
    Type: Grant
    Filed: April 17, 2002
    Date of Patent: May 8, 2007
    Assignee: Nitto Denko Corporation
    Inventors: Kazuyuki Kiuchi, Toshiyuki Oshima, Akihisa Murata, Yukio Arimitsu
  • Patent number: 7208105
    Abstract: There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.
    Type: Grant
    Filed: April 25, 2001
    Date of Patent: April 24, 2007
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Satoyuki Nomura, Tohru Fujinawa, Hiroshi Ono, Hoko Kanazawa, Masami Yusa
  • Patent number: 7166182
    Abstract: The invention is directed to methods and compositions for improving the adhesion properties and switching performance of an electrophoretic display. The methods and compositions comprise the use of a high dielectric polymer or oligomer and optionally a crosslinking agent.
    Type: Grant
    Filed: February 26, 2004
    Date of Patent: January 23, 2007
    Assignee: SiPix Imaging, Inc.
    Inventors: Cheri Pereira, Jack Hou, Rong-Chang Liang
  • Patent number: 7090920
    Abstract: A laminate, comprises a thermoplastic substrate, a conductive metal foil at least partially disposed on at least one side of the substrate, and an adhesive disposed between the substrate and the metal foil. The adhesive includes a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, a plasticizer, and a cure agent. The laminate finds particular utility in circuit board applications.
    Type: Grant
    Filed: January 7, 2005
    Date of Patent: August 15, 2006
    Assignee: General Electric Company
    Inventors: Michael J. Davis, James Estel Tracy, Geoffrey Henry Riding, Gary William Yeager
  • Patent number: 7071548
    Abstract: An article comprises a semiconductor substrate and a coating mixture on the semiconductor substrate. The coating mixture Is comprised of adhesion promoter and photopolymer. The adhesion promoter contains ?-amino propyltriethoxysilane in organic solution.
    Type: Grant
    Filed: October 30, 2003
    Date of Patent: July 4, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Albert Hua Jeans, Ping Mei
  • Patent number: 7037594
    Abstract: There is provided an electromagnetic wave shielding member which has see-through properties and electromagnetic wave shielding properties, is free from a change in color of an adhesive at the time of the formation of a mesh by etching, is improved in etchability, and can withstand etching at the time of the formation of the mesh. The electromagnetic wave shielding member according to the present invention comprises: a transparent film substrate; and a mesh consisting of a metal foil provided on the surface of the substrate through an adhesive, the adhesive comprising a styrene-maleic acid copolymer-modified polyesterpolyurethane and an aliphatic polyisocyanate.
    Type: Grant
    Filed: July 9, 2002
    Date of Patent: May 2, 2006
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroshi Kojima, Fumihiro Arakawa
  • Patent number: 7018490
    Abstract: A binder is applied to particles which are then combined with fibers to bind the particles to the fibers. The particles have functional sites for forming a hydrogen bond or a coordinate covalent bond. The fibers have hydrogen bonding functional sites. The binder comprises binder molecules, the binder molecules having at least one functional group that is capable of forming a hydrogen bond or a coordinate covalent bond with the particles, and at least one functional group that is capable of forming a hydrogen bond with the fibers. A substantial portion of the particles that are adhered to the fibers may be adhered in particulate form by hydrogen bonds or coordinate covalent bonds to the binder, and the binder in turn may be adhered to the fibers by hydrogen bonds. Fibers containing particles bound by this method are easily densified.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: March 28, 2006
    Assignee: Weyerhaeuser Company
    Inventors: Michael R. Hansen, Richard H. Young, Sr.
  • Patent number: 6998359
    Abstract: A multiple layer fiber reinforced material and method of constructing the same including the provision of a first layer of a roll lofted glass material. Optional variants include the pre-application of plywood, OSB or fiber reinforced cement board materials prior to the first glass layer. A layer of a rolled fiber reinforced material is applied over the rolled glass material, with or without backing board material, and at least a second layer of the roll lofted glass material is applied over the rolled fiber reinforced material. A layer of a second rolled glass material is applied over the subsequent layer of the first glass material and a urethane resin syrup is intermixed with said layers of glass material and the fiber reinforced material. An application of heat and pressure results in the formation of the reinforced material. A flexural, closed cell foam material may also be applied to provide acoustical insulating properties to the multi-layer fiber material.
    Type: Grant
    Filed: January 13, 2004
    Date of Patent: February 14, 2006
    Assignee: Mantex Corporation
    Inventor: Mel Bingenheimer
  • Patent number: 6962754
    Abstract: A structure made of a fluoropolymer layer and directly attached to one of its sides a tie layer based on a polyamide which results from the condensation of at least one diacid and at least one diamine of the following formula (1): in which R1 represents H or -Z1-NH2 and Z1 represents an alkyl, a cycloalkyl or an aryl having up to 15 carbon atoms and R2 represents H or -Z2-NH2 and Z2 represents an alkyl, a cycloalkyl or an aryl having up to 15 carbon atoms, it being possible for R1 and R2 to be identical or different. The tie resin may also be a copolymer having polyamide blocks and polyether blocks, the polyamide blocks resulting from condensation of at least one diacid and at least one diamine of formula (1). The invention also relates to a structure comprising a fluoropolymer layer, the tie layer and a substrate layer, respectively, as well as to a structure comprising a tie layer, respectively.
    Type: Grant
    Filed: June 19, 2002
    Date of Patent: November 8, 2005
    Assignee: ARKEMA
    Inventors: Philippe Bussi, Christophe Lacroix, David Silagy
  • Patent number: 6956098
    Abstract: The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electronics type applications.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: October 18, 2005
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: John Donald Summers, Richard Frederich Sutton, Jr., Brian Carl Auman
  • Patent number: 6918987
    Abstract: The disclosure is directed to a treatment composition comprising a halogen bearing compound, a volatile siloxane fluid and at least one solvent. In another aspect, there is disclosed a method for treatment of molded rubber articles by applying a treatment composition to a rubber article to form a treated surface, followed by applying an adhesive or a coating to at least a portion of the treated surface.
    Type: Grant
    Filed: February 7, 2003
    Date of Patent: July 19, 2005
    Assignee: Lord Corporation
    Inventors: James R. Halladay, Monil S. Shah
  • Patent number: 6869497
    Abstract: A two-part adhesive systems exhibiting improved fixture and open times are disclosed. In one embodiment, the system includes (a) an adhesive part being a mixture formed from (I) an ethylenically unsaturated monomer, (II) a metal molybdate, (III) a metal salt of an ethylenically unsaturated carboxylic acid in an amount less than 3 weight percent, and (IV) an ethylenically unsaturated carboxylic acid, and (b) an activator part which includes a free radical generator. In another embodiment, the system includes the above-described adhesive part substantially free of a metal salt of an ethylenically unsaturated carboxylic acid. Curable adhesives and laminates prepared with the two-part system are also disclosed.
    Type: Grant
    Filed: April 9, 2004
    Date of Patent: March 22, 2005
    Assignee: Illinois Tool Works Inc.
    Inventors: Daniel Keith Doe, Donald Edmond Gosiewski
  • Patent number: 6869642
    Abstract: An improved, more durable heat conductive composition for transferring heat from a heat-dissipating component to a heat dissipater and method of producing the same. The composition preferably comprises a base consisting of paraffin and, optionally, paraffin and petrolatun having electrically-conductive particles suspended therein, which preferably include graphite diamond, or elemental metals such as silver. In the preferred embodiment, the composition further includes a resin polymer to increase durability. The composition is formulated to be solid in the range of normal room temperatures, but liquify once subjected to temperatures just below the range at which heat generating electronic semi conductor devices typically operate. The present invention further comprises processes for packaging the compositions of the present invention, as well as applying the heat conductive composition to an interface between a heat-dissipating component and a heat sink.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: March 22, 2005
    Inventors: Raymond G. Freuler, Gary E. Flynn, Robert A. Rauch
  • Patent number: 6852193
    Abstract: A composition including at least one anaerobically polymerizable compound; and at least one condensation product of an aldehyde and or ketone/with a polyol. The invention also provides a composition as described above which is in the form of a soft solid, for example, in the form of a stick. A two-part composition is provided, comprising a first part containing at least one polymerizable compound; and a second part containing at least one curing component for polymerizing the composition, wherein at least one of the first or second parts additionally comprises at least one gelling or solidifying agent. A kit is provided comprising the composition according to the invention which includes at least one primer component and at least one carrier solvent for the primer component, and a second composition which includes at least one anaerobically polymerizable compound and at least one condensation product of an aldehyde and or ketone/with a polyol.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: February 8, 2005
    Assignee: Loctite (R&D) Limited
    Inventors: Brendan J. Kneafsey, John Guthrie, Gerard Coughlan
  • Publication number: 20040250942
    Abstract: An article having (a) a layer of fabric having a first surface and a second surface made of polytetrafluoroethylene fibers; and (b) a first composite comprising (i) a porous PTFE film having interconnected passages and pathways and (ii) a fluoropolymer adhesive, wherein said fluoropolymer adhesive is at least partially contained in said passages and pathways of said PTFE film, said first composite disposed adjacent to said first surface of said fabric, wherein the article passes a Newark Flex test after 10,000 cycles. In another embodiment, the invention includes a second composite comprising (i) a porous PTFE film having interconnected passages and pathways and (ii) a fluoropolymer adhesive, wherein said fluoropolymer adhesive is at least partially contained in said passages and pathways of said PTFE film, said second composite disposed adjacent to said second surface of said fabric. The article of the present invention is preferably waterproof, fire retardant, and flexible.
    Type: Application
    Filed: June 21, 2004
    Publication date: December 16, 2004
    Inventors: Thomas Kelmartin, Suellen Lappe, William Greene, Thomas Wallace
  • Patent number: 6805764
    Abstract: Disclosed are composite structures prepared using a hemicellulose-based adhesive. In a preferred embodiment, a laminate composed of plural laminae which have been bonded to one another using a hemicellulose-based adhesive is provided. The laminate is useful as a separator or partition in a shipping vessel. Most preferably, the hemicellulose-based adhesive contains one or more bonding agents and water., the hemicellulose being present in an amount of at least 10% by dry basis weight of the bonding agents.
    Type: Grant
    Filed: May 24, 2001
    Date of Patent: October 19, 2004
    Assignee: Grain Processing Corporation
    Inventors: J. Steve Taylor, Roger E. McPherson
  • Publication number: 20040182512
    Abstract: The invention relates to a pressure sensitive adhesive composition containing an acrylic polymer having a weight average molecular weight of 300,000 or higher and produced copolymerizing: a C1-14 alkyl (meth)acrylate; 0.2 to 1.
    Type: Application
    Filed: October 31, 2003
    Publication date: September 23, 2004
    Applicant: Toyo Ink Mfg. Co., Ltd.
    Inventor: Masayoshi Matsumoto
  • Patent number: 6787244
    Abstract: The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).
    Type: Grant
    Filed: July 30, 2002
    Date of Patent: September 7, 2004
    Assignee: Infineon Technologies AG
    Inventors: Recai Sezi, Andreas Walter
  • Patent number: 6734268
    Abstract: The invention provides bonding compositions and reactive two-part bonding compositions that are useful, for example, in bonding low surface energy substrates (e.g., polyethylene, polypropylene and polytetrafluoroethylene). Bonding compositions of the invention include an organoborane, a polymerizable monomer, and a metal salt which modifies the cure kinetics of the bonding composition to provide a favorable balance of long bonding composition worklife and fast rate of strength build.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: May 11, 2004
    Assignee: 3M Innovative Properties Company
    Inventor: Dean M. Moren
  • Patent number: 6730385
    Abstract: A laminate, which is in the form of an O-ring, a square ring, a rubber roll, a diaphragm, a rubber hose, a rubber tube or a vial stopper, comprising a layer of a perfluororubber, a layer of other rubber and an adhesive layer containing a polyfunctional compound which adheres the rubber layers by vulcanization is produced by coating a polyfunctional compound on a surface of at least one of the perfluororubber layer or the other rubber layer, laminating the layers with the coated surface facing the other layer, and vulcanizing the layers to adhere them. Thereby, the adhesion strength between the layer of perfluororubber and the layer of the other rubber is improved.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: May 4, 2004
    Assignee: Daikin Industries, Ltd.
    Inventors: Hiroyuki Tanaka, Shoji Kawachi, Masanori Yamashita, Yoshihiro Shirai, Yutaka Ueta
  • Publication number: 20040007322
    Abstract: Improved label adhesives are provided through the use of selected mixtures of styrenic di- and tri-block copolymers, which have a reduced elastic behavior under die cutting conditions.
    Type: Application
    Filed: May 28, 2003
    Publication date: January 15, 2004
    Inventors: Jacques B Lechat, Kenneth Lewtas, Roger R Delme, Oliver J Georjon, Gerhard Marin, Michael O Myers, Francois-Xavier Gibert
  • Publication number: 20040003892
    Abstract: An adhesive composition that includes a) an emulsion that includes a multi-stage polymer that includes a first stage polymer having a Tg from −20° C. to 90° C. and including from about 0.5% by weight to about 3% by weight latent crosslinking monomer based on the first stage monomer weight, and a second stage polymer having a Tg from 40° C. to 140° C., the second stage polymer being different from the first stage polymer, b) formaldehyde-based crosslinking agent, and c) catalyst, the composition being capable of passing the DIN EN 204 Test Method.
    Type: Application
    Filed: July 8, 2002
    Publication date: January 8, 2004
    Inventors: Nicholas C. Lehman, Scott W. Rhein, John T. Anderson
  • Publication number: 20040003893
    Abstract: An adhesive composition that includes a) an emulsion that includes a multistage polymer that includes a first stage polymer having a Tg from −20° C. to 90° C. and including from about 0.5% by weight to about 3% by weight latent crosslinking monomer based on the first stage monomer weight, and a second stage polymer having a Tg from 40° C. to 140° C., the second stage polymer being different from the first stage polymer, b) formaldehyde-based crosslinking agent, and c) catalyst, the composition being capable of passing the DIN EN 204 Test Method.
    Type: Application
    Filed: September 26, 2002
    Publication date: January 8, 2004
    Inventors: Nicholas C. Lehman, Scott W. Rhein, John T. Anderson
  • Patent number: 6670442
    Abstract: Hot melt adhesives are prepared using thermoplastic polyamides derived from polymerized fatty acid components. The adhesives are particularly useful for bonding nonpolar substrates such as poly-&agr;-olefins.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: December 30, 2003
    Assignee: Henkel Kommanditgesellschaft auf Aktien
    Inventors: Angela Rossini, Francesco Meda
  • Patent number: 6669953
    Abstract: Cross-linked block copolymers are disclosed which have drug retention properties, comprising hard and soft segments, with cross-linking between the soft segments. The block copolymers can be based upon (meth)acrylic monomers, and some possess adhesive properties.
    Type: Grant
    Filed: May 8, 2000
    Date of Patent: December 30, 2003
    Assignee: Strakan Limited
    Inventor: Fumio Kamiyama
  • Patent number: 6666947
    Abstract: A method for producing an inkjet printhead element comprises providing a thinfilm die and a barrier layer thereon, wherein the barrier layer comprises a thermoplastic component and a thermoset component. The barrier layer is heated such that the barrier layer becomes tacky. The orifice plate is aligned to the barrier layer and is brought into contact with the barrier layer. Here, the orifice plate is held in place on the barrier layer by the tackiness of the barrier layer. Finally, the assembly of the thin film die, the barrier layer and the orifice plate is subjected to a stake and bake process to attach the orifice plate permanently to the barrier layer and, hence, to the thin film die.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: December 23, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kok Leong Lim, Seng Thye Raymond Go
  • Patent number: 6652705
    Abstract: An improved, more durable heat conductive composition for transferring heat from a heat-dissipating component to a heat dissipater and method of producing the same. The composition preferably comprises a base consisting of paraffin having particles of graphite suspended therein. In the preferred embodiment, the composition further includes a polymer to increase durability. The composition is formulated to be solid in the range of normal room temperatures, but liquify once subjected to temperatures just below the range at which heat generating electronic semi conductor devices typically operate. The present invention further comprises processes for transferring heat from a heat-dissipating component to a heat dissipater, which comprises applying the heat conductive composition to an interface between a heat-dissipating component and a heat sink.
    Type: Grant
    Filed: May 18, 2000
    Date of Patent: November 25, 2003
    Assignee: Power Devices, Inc.
    Inventors: Raymond G. Freuler, Gary E. Flynn, Robert A. Rauch
  • Patent number: 6652970
    Abstract: The present invention is directed toward compositions that are chemically different after application to a substrate as compared to the composition prior to its application. A method of the invention comprises a method of transitioning a crosslinked polymer composition from a first chemical state to a second chemical state. Advantageously, compositions of the invention are relatively stable after transformation to their altered, or second, chemical state.
    Type: Grant
    Filed: July 7, 2000
    Date of Patent: November 25, 2003
    Assignee: 3M Innovative Properties Company
    Inventors: Albert I. Everaerts, Charles M. Leir, Roger A. Mader, Peter A. Stark
  • Publication number: 20030178138
    Abstract: The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): 1
    Type: Application
    Filed: January 16, 2003
    Publication date: September 25, 2003
    Inventors: Isao Tsukagoshi, Yasushi Gotou, Masami Yusa, Yasuo Miyadera
  • Patent number: 6622428
    Abstract: A method of containing organic debris such as leaves in piles or layers is disclosed. The method comprises the utilization of a chemical composition for coating the generally upward facing leaves in order to bond them together into larger sections. Once the separate leaves are bonded together by the coating, the larger sections provide a protective covering that keeps the wind from disturbing the pile or layer. Further, in some instances the coating may include a biological agent that facilitates the decomposition of the organic debris. In other instances the coating may also include a fertilizer that would be beneficial if the organic debris was used as mulch spread around plants. Also disclosed are methods for applying coating using a distributing device.
    Type: Grant
    Filed: February 14, 2001
    Date of Patent: September 23, 2003
    Inventors: Locke White, II, Keith John Jones
  • Patent number: 6613184
    Abstract: The electrical properties of the bond formed between a metal substrate and an electrically conductive adhesive is improved, especially in high humidity conditions, by applying to the metal substrate an organic coupling agent prior to application of the electrically-conductive adhesive thereto.
    Type: Grant
    Filed: May 12, 1997
    Date of Patent: September 2, 2003
    Assignee: International Business Machines Corporation
    Inventors: Frank Daniel Egitto, Paul Eugene Logan, Luis Jesus Matienzo
  • Patent number: 6607631
    Abstract: A polymerizable monomer adhesive composition includes a 1,1-disubstituted ethylene monomer and at least one slip additive, where the slip additive causes a polymer film formed from the monomer to have a lower coefficient of friction than in an absence of the slip additive. The slip additive can be selected from, inter alia, fluorinated monomers or polymers, fluorinated additives, siloxane-containing monomers or polymers, siloxane-containing additives, fluorinated siloxanes, and long chain fatty acid esters. The slip additive can also form a second phase in a resultant polymer film, where the second phase is soluble in the monomer but is insoluble or substantially insoluble in the polymer.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: August 19, 2003
    Assignee: Closure Medical Corporation
    Inventors: Ibraheem T. Badejo, Wendy Y. Su, Keith R. D'Alessio, Jerry Jonn, Julian A. Quintero, Michelle Knotts, Timothy P. Hickey, Lawrence H. Mainwaring, Upvan Narang
  • Patent number: 6607834
    Abstract: Polyester-containing multilayer biaxially-oriented polypropylene films are provided. According to the invention, a two- or three-layer polyester-containing cap layer is bonded to a monoaxially oriented polypropylene core, followed by orientation of the resulting composite in a direction transverse to the direction of orientation of the core layer. At least one tie layer is interposed between the core and the polyester. Advantageously, the polyester contains silicone fluid as a processing aid.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: August 19, 2003
    Assignee: Applied Extrusion Technologies, Inc.
    Inventors: Alan M. Davis, John H. Lawrence, Tung-Yao Weng
  • Patent number: 6605174
    Abstract: A method for producing a printed image having a region that is foil printed comprising: printing at least one region of the image with a toner; printing the region of the image to be foil printed with a foiling adhesive that sticks to a foil on a printing foil, which adhesive has a melting temperature lower than the melting temperature of the toner, and pressing the printing foil to the image and heating the printing foil to a temperature greater than the melting temperature of the foiling adhesive and less than the melting temperature of the toner.
    Type: Grant
    Filed: August 2, 2001
    Date of Patent: August 12, 2003
    Assignee: Hewlett-Packard Indigo B.V.
    Inventors: Benzion Landa, Ishaiau Lior, Itzhak Ashkenazi, Peretz Ben Avraham
  • Patent number: 6602611
    Abstract: The invention relates to a multi-layer composite plates and to a method for producing multi-layer composite plates. Said multi-layer composite plates are comprised of two outer metallic slabs which serve as top and base plates and which are joined to a deformable connecting material located therebetween. The top and base plates are joined to the connecting material by means of a foaming adhesive which fills the cavities remaining in the composite. The cavities remaining in the composite are completely or partially filled by the adhesive. According to the method for producing multi-layer composite plates, adhesive is introduced between the layers to be joined, and the adhesive is subjected to a thermal treatment. The adhesive is completely or partially hardened during the thermal treatment. In the case of the partially hardened adhesive, the adhesive is completely hardened during an additional thermal treatment only after the multi-layer composite plate is reshaped.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: August 5, 2003
    Assignee: DaimlerChrysler AG
    Inventors: Reiner Kopp, Arndt Gerick, Klaus Lempe-Nauer, Peter Winkler
  • Publication number: 20030141014
    Abstract: There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.
    Type: Application
    Filed: October 25, 2002
    Publication date: July 31, 2003
    Inventors: Nomura Satoyuki, Tohru Fujinawa, Hiroshi Ono, Hoko Kanazawa, Masami Yusa
  • Patent number: 6596103
    Abstract: A binder is applied to particles which are then combined with fibers to bind the particles to the fibers. The particles have functional sites for forming a hydrogen bond or a coordinate covalent bond. The fibers have hydrogen bonding functional sites. The binder comprises binder molecules, the binder molecules having at least one functional group that is capable of forming a hydrogen bond or a coordinate covalent bond with the particles, and at least one functional group that is capable of forming a hydrogen bond with the fibers. A substantial portion of the particles that are adhered to the fibers may be adhered in particulate form by hydrogen bonds or coordinate covalent bonds to the binder, and the binder in turn may be adhered to the fibers by hydrogen bonds. Fibers containing particles bound by this method are easily densified.
    Type: Grant
    Filed: November 1, 2000
    Date of Patent: July 22, 2003
    Assignee: Weyerhaeuser Company
    Inventors: Michael R. Hansen, Richard H. Young, Sr.
  • Patent number: 6592999
    Abstract: The present invention provides an improved multi-layer composite of two or more polymeric layers at least one of which is formed from a thermosetting composition. The composite includes at least a first polymeric layer formed on a substrate and a second polymeric layer over the first polymeric layer, wherein in the absence of a boron-containing compound, the first and second polymeric layers have poor interlayer adhesion. The improvement resides in the inclusion of at least one boron-containing compound in one or both of the first and second polymeric layers in an amount sufficient to improve the interlayer adhesion between the first and second polymeric layers. Also provided is an improved curable coating composition used to form a multi-layer composite coating of two or more cured coating layers, at least one of which is formed from the thermosetting composition. Related methods and coated substrates are also provided.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: July 15, 2003
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Lawrence G. Anderson, John W. Burgman, Karen A. Morow, Richard J. Sadvary, Shiryn Tyebjee, Dennis A. Simpson, Thomas R. Hockswender
  • Patent number: 6589381
    Abstract: In one embodiment, the present invention relates to a method of increasing resin dust resistance of metal foil comprising contacting the metal foil with an inert silane, titanate or zirconate compound to form a resin dust resistant film having a thickness from about 0.001 microns to about 1 micron on a surface of the metal foil. In another embodiment, the present invention relates to a method of treating metal foil comprising contacting a first side of the metal foil with a hydrocarbylsilane solution to form a resin dust resistant film on a surface of the metal foil, the hydrocarbylsilane solution comprising from about 0.01% to about 10% v/v of a hydrocarbylsilane; and laminating a second side of the metal foil to a prepreg.
    Type: Grant
    Filed: April 10, 2001
    Date of Patent: July 8, 2003
    Assignee: Gould Electronics, Inc.
    Inventors: Charles A. Poutasse, Michael A. Centanni
  • Patent number: 6586496
    Abstract: A photo-curable resin composition for sealing material, which is superior in the photo-curing performance and in the prompt curing property and is better in the adhesive property, in the resistance to moisture permeation and in the heat resistance, the photo-curable resin composition comprising (A) a compound having oxetane ring, (B) a photoinitiator for cationic polymerization and (C) a silane coupling agent, wherein the composition has a viscosity in the range from 0.01 to 300 Pa.s at 25° C.
    Type: Grant
    Filed: March 23, 2001
    Date of Patent: July 1, 2003
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yasushi Takamatsu, Kei Nagata, Masahiro Ota, Yasushi Mizuta, Yoshio Kikuta
  • Patent number: 6585849
    Abstract: A method of making a liquid crystal display, including the steps of providing a substrate; providing a first electrode over the substrate; coating the first electrode with aqueous dispersed material which when dried provides a protective dielectric layer over the first electrode; coating the dielectric layer with liquid crystal bearing material and drying such liquid crystal bearing material, providing a second substrate having a second electrode, coating the second electrode with a dielectric adhesive layer; and laminating the coated second electrode to the liquid crystal bearing material by means of the dielectric adhesive material.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: July 1, 2003
    Assignee: Eastman Kodak Company
    Inventors: Thomas M. Smith, Stanley W. Stephenson, John I. Kilburn, John W. Boettcher
  • Patent number: 6569279
    Abstract: A method for bonding composite wood products comprises using a PMDI adhesive modified with a polar compound such as a lower alkylene carbonate or triacetin with a combination of conductive thermal heat and radio frequency energy. Propylene carbonate is a preferred modifier. Press temperatures and pressing times may be significantly reduced from those using either unmodified PMDI adhesives or the modified adhesives without radio frequency energy. Laminated veneer products 38 mm in thickness can be pressed at 110°-120° C. in as little as 7 minutes using radio frequency energy at a level of about 32 kw/m2.
    Type: Grant
    Filed: May 1, 2000
    Date of Patent: May 27, 2003
    Assignee: Weyerhaeuser Company
    Inventors: David W. Park, Richard E. Wagner, Ronald C. Wilderman
  • Patent number: 6562172
    Abstract: A method for decorating a vitreous substrate with a radiation curable ink composition, comprising applying an ink composition comprised of an N-vinyl lactam to the glass in a predetermined design, the ink being operable when cured to bond to the vitreous substrate, curing the ink on the vitreous substrate by exposing it to the radiation by which it is curable, thereby bonding the ink composition to the substrate; and a method for decorating a vitreous substrate with hot stamping foil comprising applying an ink composition comprised of an N-vinyl lactam to the glass in a predetermined design, the ink being operable when cured to bond to the vitreous substrate, curing the ink on the vitreous substrate by exposing it to the radiation by which it is curable, thereby bonding the ink composition to the substrate, pressing a sheet of hot stamping foil against the substrate with a die heated to a temperature sufficient to cause a portion of the hot stamping foil to adhere to the heated, cured, ink design but not to t
    Type: Grant
    Filed: August 17, 1998
    Date of Patent: May 13, 2003
    Assignee: Deco Patents, Inc.
    Inventors: Melvin Edwin Kamen, Ming Hu
  • Patent number: 6558765
    Abstract: A fiber reinforced composite wood board is designed particularly for use in the flooring of truck trailers which experience adverse operating conditions such as from heavy loads of lift trucks on the top side and water spray during rainy periods on the bottom side. The composite wood board comprises an edge-glued laminated wood member composed of wood segments with end joints. The wood member is underlaid with a thin layer of fiber reinforced plastic. The top surface of the composite wood board is the same as that of the laminated wood. The fiber reinforced plastic underlay is composed of glass and/or carbon fibers embedded in a polymeric resin such as epoxy, phenolic, vinyl ester, polyester, polypropylene or polyamide resin. Further, the fiber reinforced plastic underlay is substantially bonded to the wood member with a reactive hotmelt adhesive.
    Type: Grant
    Filed: December 7, 2000
    Date of Patent: May 6, 2003
    Assignee: Havco Wood Products L.L.C.
    Inventor: Gopalkrishna Padmanabhan
  • Patent number: 6554948
    Abstract: A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, a benzotriazole with an electron withdrawing group in the 1-position which electron withdrawing group is a stronger electron withdrawer than a hydrogen group, and optionally, a source of adhesion enhancing species selected from the group consisting of molybdates, tungstates, tantalates, niobates, vanadates, isopoly or heteropoly acids of molybdenum, tungsten, tantalum, niobium, vanadium, and combinations of any of the foregoing in order to increase the adhesion of polymeric materials to the metal surface.
    Type: Grant
    Filed: August 22, 2000
    Date of Patent: April 29, 2003
    Inventor: Donald Ferrier
  • Publication number: 20030062124
    Abstract: The present invention relates to a liquid composition for the cold preparation of laminate composite materials so as to confer to them, without preliminary sanding or abrasion, a surface state favorable to adhesive bonding with polyurethane type adhesives comprising
    Type: Application
    Filed: August 27, 2001
    Publication date: April 3, 2003
    Inventors: Stephane Fouquay, Jean-Pierre Lallier, Michel Miskovic
  • Patent number: 6531209
    Abstract: A suspension adhesive comprised of a matrix material and a particulate filler material is useful for bonding, sealing, repairing, and modifying ceramic, glass, and powdered metal components in a light source. A method for making the suspension adhesive includes the selection of a filler material and a volume percentage of the filler material. Additionally, a matrix material is selected and the filler material is dispersed throughout the matrix material. The suspension adhesive is used to bond and seal components to form, for example, an arc tube for a light source.
    Type: Grant
    Filed: December 1, 2000
    Date of Patent: March 11, 2003
    Assignee: General Electric Company
    Inventors: Daniel Polis, Vishal Gauri