Abstract: A method of laminating substrates includes preparing a first substrate and a second substrate, forming a self-assembled monolayer on one surface of the first substrate, the self-assembled monolayer includes a region A including an alkyl chain and a region B including an alkyl chain having a carbon number less than a carbon number of the alkyl chain of the region A, and laminating the first substrate and the second substrate by contacting the self-assembled monolayer with the second substrate.

Abstract: A basketball backboard assembly and a method of making the backboard assembly are disclosed. The assembly includes a backboard frame structure and an acrylic backboard which are bonded together with a suitable elastomeric adhesive, providing adequate adhesion and flexibility. The elastomeric adhesive has a bond gap in the range from 2 to 2.5 mm. The adhesive is catalyzed to provide control of the set time in the range from about 5 minutes to 1 hour. A plurality of bond gap spacers are located between the frame bonding surface and the backboard bonding surface to provide the bond gap.

Abstract: Disclosed are perfluoroethers and perfluoroether compositions useful in high temperature aerospace applications. The perfluoroethers can be adapted for use with various curing chemistries.

Abstract: The invention relates to a method for producing a fiber composite workpiece. In the method according to the invention, cross-linking silicone is used with the aid of a volatile diluent for infiltrating individual mats of a mat composite. A further object of the present invention is a device for performing the method according to the invention.

Abstract: A cover for a print bed for a three-dimensional object, and methods of manufacturing the same, are disclosed. The cover may include a polycarbonate substrate having a selectively textured upper surface and a double coated adhesive layer provided to adhere the polycarbonate substrate to a print bed.

Abstract: The invention relates to the use of an adhesive composition comprising at least one silyl-containing polymer, at least one compatible tackifying resin and at least one catalyst, to make a breathable self-adhesive article. The invention also relates to a breathable self-adhesive article comprising at least one breathable substrate coated with a breathable adhesive layer. The invention also relates to a pressure-sensitive adhesive composition.

Abstract: A moisture-curing two-component composition consisting of a component A containing at least one polyoxyalkylene, polyolefin and/or polyacrylate prepolymer having at least one hydrolysable silane group and at least one solid inert additive selected from hydrocarbons, polyesters or polyamides, a component B containing at least one crosslinking compound for the prepolymers, and auxiliary substances and additives in one or both components, the component A and the two-component composition each having hot-melt adhesive properties.

Abstract: A transparent pressure-sensitive adhesive product for optical use and its manufacturing method. The adhesive product has, upon affixing, stable peeling site selectivity between release sheets and both faces of a transparent pressure-sensitive adhesive product. The transparent pressure-sensitive adhesive product for optical use has an adhesive face (a) and an adhesive face (b) of dissimilar tackiness, and is formed of an addition reaction-type silicone gel. A relationship between an adhesive power (Ga) of the adhesive face (a) and an adhesive power (Gb) of the adhesive face (b) is Ga<Gb; the adhesive power (Ga) and the adhesive power (Gb) yield a ball number from 3 to 15 and a ball number difference from 2 to 12, in an inclined ball tack test (inclination angle 30 degrees) according to JIS Z0237.

Abstract: The present disclosure is concerned with improved curable adhesive compositions for anchoring elements in a structural body that exhibit low temperature versus standard temperature degree of cures that are at least 50% or higher. The compositions include, in a first portion, a reactive resin, an acetoacetoxy functional monomer and a silane monomer. By using phthalate-free constituents in the formulation, a further 10% increase in strength and durability of the resins at standard temperatures may be realized after curing at low temperatures. Improvements in the adhesive compositions that relate to increased shelf life are also presented.

Abstract: The specification discloses a composite adhesive tape, containing a thermally reflective and insulative adhesive tape layer; and a rigid adhesive tape layer. Also disclosed is a method of manufacturing a composite adhesive tape, containing the step of laminating a thermally reflective and insulative tape layer with a rigid adhesive tape layer. Further disclosed is a method of applying a flooring material, containing the steps of placing the composite adhesive tape as described herein on a surface; and positioning the flooring material on the tape.

Abstract: Prepolymers having more than one alkoxysilyl function per chain end reactive towards epoxide groups as a constituent of curable compositions, and their use for producing adhesive-bonding and coating compositions, which may also be foamable, and also polymeric materials produced therefrom.

Abstract: Embodiments of the present invention generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present invention provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components.

Abstract: A fireshield fastener hood and method of bonding a cover to a substrate therefor.

Abstract: A gunnable adhesive composition includes a silicone resin and an organopolysiloxane, or a reaction product thereof; as well as a filler and a solvent. The silicone resin and the organopolysiloxane are present in amounts to provide a resin/polymer ratio ranging from 58% to 64%. The gunnable adhesive composition may be applied to low surface energy substrates at ambient temperatures without primer or other surface treatment. The gunnable adhesive composition and adhesive product thereof are useful in weather barrier applications, such as building wraps.

Abstract: An assembly kit is provided for supplying a fixing agent to fix two objects. The kit comprises two storage receptacles. An aerobic adhesive is stored in one of the two storage receptacles. A hydrophilic material containing moisture is separately stored in the other of the two storage receptacles. The two storage receptacles are adapted to permit removal of the aerobic adhesive and the hydrophilic material from the receptacles for mixing together the fixing agent.

Abstract: The present invention relates to a B-stageable silicone adhesive having microencapsulation. The encapsulated B-stageable silicone adhesive allows lengthening the assembly time between applying the adhesive and lamination. Although exemplified with silicone adhesives, the inventive encapsulated adhesive concept has potentially broad applicability to other types of adhesives.

Abstract: Disclosed are perfluoroethers and perfluoroether compositions useful in high temperature aerospace applications. The perfluoroethers can be adapted for use with various curing chemistries.

Abstract: A hot melt adhesive composition including a) at least one thermoplastic silane grafted poly-?-olefin that is solid at 25° C.; and b) at least one reaction product of a polyisocyanate having an isocyanate-reactive silane, wherein the isocyanate-reactive silane includes exactly one group reactive to an isocyanate group, selected from a hydroxyl group, a mercapto group, and an amino group, and wherein the reaction product includes a molecular weight Mw of less than 1500 g/mol.

Abstract: The present invention relates to compositions based on silane-functional polymers that are suitable for the adhesive bonding, sealing and coating of porous substrates, more particularly of porous mineral substrates, and that even after water storage ensure effective adhesion of the composition to the substrate.

Abstract: Methods for bonding polymeric substrates to hydroxylated surfaces such as glass are disclosed. The polymeric substrates may be elastomeric substrates such as a natural or synthetic rubber. The method may comprise applying a compound comprising at least one alkoxy silane moiety and at least one moiety selected from a nitrosoaromatic or a nitrosoaromatic precursor to one of the substrates. The nitrosoaromatic moiety may be a nitrosobenzene. The nitrosoaromatic precursor may be a nitrosobenzene precursor, such as at least one of a quinone dioxime or a quinone oxime. Novel primers and compounds suitable for use in the bonding process are also disclosed.

Abstract: The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a hydrolytically-stable, thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×1011 ohm-cm or more.

Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Abstract: Methods for bonding a polymer surface (e.g., a fluoropolymer surface) to a substrate, including foam tape substrates, and articles produced thereby. The methods can include using a primer composition having an amidine catalyst in combination with an amino-substituted organosilane ester.

Abstract: A chemical two-component mortar compound including a resin component (A) that contains at least one radically curable, ethylenically unsaturated compound (a) as the curable component, and including a separately arranged so as to inhibit reaction curing component (B) that contains a curing agent for the resin of the resin component (A), with improved adhesion to the surface of partially cleaned and/or moist holes in mineral substrates, characterized by a content of 0.

Abstract: A transdermal delivery system is provided for the topical application of one or more active agents contained in one or more polymeric and/or adhesive carrier layers, proximate to a non-drug containing polymeric and/or adhesive coating that is applied to either the transdermal system's backing or release liner. The transdermal delivery device is manufactured to optimize drug loading while providing desirable adhesion to skin or mucosa as well as providing modulation of the drug delivery and profile.

Abstract: The disclosure relates to a method of making an electronic assembly with a reactive hot-melt adhesive composition that include an atmospheric curing prepolymer and optionally a thermoplastic component with a softening point of at least about 120° C., and the electronic assembly made therewith.

Abstract: The disclosure relates to one-component, dual-cure adhesive compositions that include a combination of moisture curable functionalities and radiation curable functionalities where the adhesive could include (1) a moisture-curable prepolymer and a radiation-curable component; or (2) a moisture curable radiation curable prepolymer including moisture curable functionalities and radiation curable functionalities, and optionally an additional moisture-curable prepolymer and/or an additional radiation-curable component. The disclosed adhesives can be used on substrates with electronic components to make electronic assemblies.

Abstract: An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 ?m, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.

Abstract: This invention relates to thermoplastic elastomers comprising at least one silicone ionomer. These thermoplastic elastomers may be reprocessed and/or recycled.

Abstract: The present invention relates to two-part moisture curing compositions useful for adhesive, sealing, potting and other applications. In particular, the present invention relates to two-part room temperature vulcanizing (RTV) compositions which include in one of the parts a moisture curing organic polymer which is substantially free or does not contain siloxane bonds in its backbone.

Abstract: A method for adhering glass including cleaning ceramic printed glass using a first solution containing dodecylbenzenesulfonic acid, p-toluenesulfonic acid, and a solvent, and cleaning the glass using a second solution containing an alkoxysilane compound. Thereafter, a glass primer is applied to the glass, an adhesive is applied, and the glass is adhered to an adherend. The first solution includes not less than 0.1 mass % and not more than 10 mass % of the dodecylbenzenesulfonic acid, and not less than 0.01 mass % and not more than 5 mass % of the p-toluenesulfonic acid, per 100 mass % of the solvent.

Abstract: A sealant composition having from about 0.1 to about 90 weight % of a polymer selected from the group consisting of butyls, acrylics, urethanes, polysulfides, and silicone modified polymers, and at least one C4 to C8 alkyl terephthalate.

Abstract: An airbag is disclosed that comprises a first fabric layer, a second fabric layer, and an adhesive. The first and second fabric layers are coated with silicone elastomer coatings. The adhesive is a heat-cured silicone adhesive, and forms a seam-bond between the first and second layers such that a bag-like structure is created.

Abstract: Disclosed are perfluoroethers and perfluoroether compositions useful in high temperature aerospace applications. The perfluoroethers can be adapted for use with various curing chemistries.

Abstract: The present disclosure generally relates to a shock absorption film for use with a mobile computing device. The shock absorption film includes, for example, a PET base layer; a TPU-based layer comprising a thermoplastic polyurethane (TPU) material; a release liner; a glue layer interposed between the base layer and the TPU layer; and a silicone-based adhesive layer interposed between the TPU layer and the release liner, the silicone-based adhesive layer contacting the TPU layer without an intervening layer between the silicone adhesive layer and the TPU layer.

Abstract: The invention relates to a method for manufacturing a microfluidic chip, wherein said method comprises the steps of: providing a plate combined with a layer of inorganic silica gel of formula: (HsiO3/2)2n where n is an integer, and providing a lid; chemically activating the layer of silica gel and the lid, in order to make the layer of gel and the lid hydrophilic; mechanically combining the layer of gel and the lid to form a chip, such that the layer of gel forms an intermediate layer between the plate and the lid; annealing the chip, such that the layer of silica gel transforms into an intermediate layer made up of a SiO2 matrix for rigidly securing the plate to the lid. The invention also relates to a related chip and plate.

Abstract: Moisture curable adhesives of high tensile shear strength contain an alkoxysilyl-terminated polymer and an alkoxy-functional silicone resin.

Abstract: The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled without negatively affecting the performance of the adhesive. The thermally reversible composition may also be used as a primer layer. The thermally reversible hot melt adhesive and primer are particularly well suited for end use applications such as packaging, graphic arts, construction, footwear, textiles, general assembly, automotive and consumer goods.

Abstract: Attachment methods for daylighting sheets and a resulting optical construction enable daylighting microstructures to be secured to a light incident surface, such as a glazing. Applying an adhesive to selected portions of the daylighting microstructures creates a transparent, optical adhesive surface that enables the daylighting microstructures to be oriented outward, facing the incident light, and effectively seals the microstructures against the glazing to prevent ingress of dust and contaminants that would degrade optical efficiency.

Abstract: A fastening composition for attaching two articles, comprising a mixture of an aerobic adhesive and a hydrophilic substance. A process for fixing an article to a substrate, includes the steps of initially preparing a fastening composition by mixing together a hydrophilic substance and an aerobic adhesive; applying a layer of the fastening composition to the article; and subsequently fixing the article to the substrate by pressing the layer of the fastening composition against the substrate. The aerobic adhesive in this layer hardens because of the moisture contained in the hydrophilic substance.

Abstract: An adhesive composition according to the present invention contains a polymerizable group-containing siloxane compound, a polymerization initiator and an ultraviolet-absorbing blowing agent. This adhesive composition enables quick bonding of substrates etc. by light irradiation or by heating such that the bonded substrates can secure adhesion and heat resistance to withstand grinding etc. and, when no longer needed to be bonded, can be easily separated from each other by ultraviolet light irradiation and is thus suitable for use as an adhesive composition for manufacturing of semiconductor devices (particularly for manufacturing of semiconductor devices with through-silicon vias).

Abstract: A method for gluing components is provided, forming an adhesive layer which is capable of functioning, at least in a temperature range of ?100° C. to ?160° C., wherein the adhesive layer is obtained from a curable reactive resin system. The reactive resin system includes an epoxy resin component and polymer particles dispersed in the epoxy resin component, the dispersed polymer particles furthermore including addition-crosslinked silicone elastomer. Also provided is the use of a reactive resin system for gluing piezoelectric ceramics and/or permanent magnets including rare earth elements and a component configuration including a piezoelectric ceramic, an impedance matching layer and an adhesive layer in contact with the piezoelectric ceramic and the impedance matching layer.

Abstract: A silane-functional polyester of formula (I): wherein Y is an n-valent residue of a polyester P which is solid at room temperature and terminated by hydroxy groups, after removal of n hydroxy groups; R1 is a linear or branched, monovalent carbon residue having 1 to 12 carbon atoms, optionally having one or more C—C multiple bonds and/or having optionally cycloaliphatic and/or aromatic portions; R2 is an acyl residue or a linear or branched, monovalent hydrocarbon residue having 1 to 12 carbon atoms, optionally having one or more C—C multiple bonds and/or having optionally cycloaliphatic and/or aromatic portions; R3 is a linear or branched, divalent hydrocarbon residue having 1 to 12 carbon atoms, optionally having cyclic and/or aromatic portions, and optionally having one or more heteroatoms; the index a has a value of 0, 1 or 2; and the index n has a value of 1 to 3.

Abstract: Temporary adhesive compositions used to adhesively bond a substrate to be abraded or polished onto a substrate are themselves abradable or polishable, and contain a non-reinforcing filler or particulate silicone resin in a curable organopolysiloxane composition, and have defined physical characteristics in addition to being thermally stable.

Abstract: The invention relates to a crosslinkable one-component lamination adhesive containing a) 25 to 80 wt % of polyester prepolymers, polyether prepolymers, and/or polyurethane prepolymers that comprise at least two crosslinkable silane groups, b) 75 to 20 wt % organic solvent having a boiling point of up to 130° C., c) 0 to 15 wt % additives, the prepolymer having a molecular weight from 2000 to 30,000 g/mol, wherein the viscosity of the adhesive is between 50 and 20,000 mPas (per DIN ISO 2555) measured at 15 to 45° C., and the crosslinked adhesive has a glass transition temperature from ?10 to 30° C.

Abstract: Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.

Abstract: A projectile-resistant transparent laminate comprising a rigid laminate subassembly having a strike side surface opposing a direction of an anticipated threat, and includes first and second rigid transparent lamina bonded together with a transparent, ether-based thermoplastic elastomer layer interposed therebetween, where the thermoplastic elastomer layer further includes a transparent polyurethane having an ultra-high modulus of elasticity. The projectile-resistant laminate also includes an energy absorbing subassembly including a transparent, quasi-thermoset layer cast from an aliphatic urethane bonded to the rigid laminate subassembly.

Abstract: There are provided non-aqueous adhesive compositions comprising a) a styrene-containing polymer, b) modifying agent, and c) a solvent system comprising i) a volatile siloxane compound, and ii) a second compound selected from acetone, methyl acetate, tert-butyl acetate, para-chlorobenzotrifluoride, and combinations thereof. Bonded articles and methods of bonding articles using these compositions are also provided.

Abstract: A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.

Abstract: A method for producing a component includes a) providing at least two preforms each made of a carbon composite material, b) joining the at least two preforms at least at one respective connecting surface to form a composite, in which a joining compound is introduced between the joining surfaces of the preforms and then cured and the joining compound contains silicon carbide and at least one polymer adhesive, and c) siliconizing the composite to form the component. A component, such as an optical component produced thereby, is also provided.