Abstract: Epoxy adhesive compositions containing a rubber-modified epoxy resin contain a bisphenol. The bisphenol can be pre-reacted with the rubber-modified epoxy resin to advance the resin. The adhesives are resistant to thermal degradation as can occur in so-called “overbake” conditions, in which the adhesive is heated to high temperatures for prolonged periods of time. In addition, expanded microballoons are included in epoxy structural adhesives to promote a desired fracture mode.

Abstract: A design and fabrication technique whereby a coping cap and/or transition can be supplied with mitered corner sections and other transitional components which utilize the identical prefinished or bare sheet metal material(s) without any reliance on exposed mechanical fasteners, welding, soldering, or post-applied paints. This is essentially accomplished by joining the pre-finished sheet material(s) together using a mesh screen and adhesive on the underside (non-exposed) face of the sheet material(s).

Abstract: A BioMEMS microelectromechanical apparatus and for fabricating the same is disclosed. A substrate is provided with at least one signal conduit formed on the substrate. A sacrificial layer of sacrificial material may be deposited on the signal conduit and optionally patterned to remove sacrificial material from outside the packaging covered area. A bonding layer may be deposited on at least a portion of the signal conduit and on the sacrificial layer when included. The bonding layer may be planarized and patterned to form one or more cap bonding pads and define a packaging covered area. A cap may be bonded on the cap bonding pad to define a capped area and so that the signal conduit extends from outside the capped area to inside the capped area. Additionally, a test material such as a fluid may be provided within the capped area.

Abstract: A method for adhesively bonding a metallic substrate and a component together includes treating the metallic substrate to form an oxide layer thereon, treating the oxide layer with a conversion coating solution to form a bond promoter coating on the oxide layer, and depositing an adhesive material on the bond promoter coating to bond the component and the metallic substrate together.

Abstract: New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.

Abstract: A method for fabricating a Fresnel lens or other lens having a structured surface such as refractive and/or diffractive bi-focal or other multi-focal lenses includes press-coating the structured surface with a low or very low refractive index coating material. The coating is sufficient thick to adequately cover the structured surface so that a smooth coating surface with good optical properties is obtained, for example in the case of a Fresnel structure a thickness greater than 1.5 times and less than 5 times the Fresnel structure height, and is cured in situ. A film, e.g., of PET, PC or PU or a film stack, e.g. a TAC/PVA/TAC film stack is prepared and a heat melting adhesive is applied to the side of the film or film stack to be contacted with the coated structured surface of the lens blank. The film or film stack is then laminated to the cured coating.

Abstract: A paint composition, in particular an anti-corrosive paint, for rare earth permanent magnets, has an epoxy resin mixture, a curing accelerator, an epoxy-functional adhesion promoter based on silane and a solvent. Due to the paint compositions, rare earth permanent magnets can be bonded simultaneously to a magnet system in a one method step and can be protected against corrosion. Due to the anti-corrosive paint, magnet systems which have excellent anti-corrosion properties, a satisfactory adhesive strength even at high temperatures and display good electric insulation properties, are provided.

Abstract: This invention relates to the modification of polyolefin structures, parts or components, used in assemblies to enhance the bonding of polar adhesives to surface of the polyolefin structures. Disclosed herein are novel articles comprising polyolefin structures having one or more surfaces modified according to the invention. The polyolefin structures have one or more surfaces with an epoxy resin layer disposed directly on the surface and then disposed on the epoxy resin layer is a layer of one or more compounds, oligomers or prepolymers having reactive isocyanate groups. The invention is also a method for modifying one or more surfaces of a polyolefin structure by successively depositing on the surfaces an epoxy resin layer disposed and a layer of one or more compounds, oligomers or prepolymers having reactive isocyanate groups. Also disclosed are kits of the modified polyolefin structures and one or more of adhesives or coatings having polar reactive groups.

Abstract: An exemplary embodiment discloses a structural adhesive including a structural adhesive; and, a hydrophobic material additive comprising a material selected from the group consisting of oil and carbon black.

Abstract: A hybrid adhesive incorporating cyanate ester and/or epoxy materials and utilizing atmospheric plasma treatment provides stronger, more reliable joints in structural composite parts.

Abstract: The present invention relates to a curable adhesive composition comprising a first part and a second part, the curable adhesive composition comprising: in the first part at least one epoxy resin and in the second part at least one curing agent in the form of an epoxy-amine and/or epoxy-thiol adduct obtainable by reacting at least one primary amine, secondary amine and/or a thiol with at least one polyol compound comprising at least one terminal epoxy group.

Abstract: A method for forming a composite structure according to one embodiment includes forming a first ply; and forming a second ply above the first ply. Forming each ply comprises: applying a bonding material to a tape, the tape comprising a fiber and a matrix, wherein the bonding material has a curing time of less than about 1 second; and adding the tape to a substrate for forming adjacent tape winds having about a constant distance therebetween. Additional systems, methods and articles of manufacture are also presented.

Abstract: This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-curable epoxy-based adhesive compositions that are capable of being easily pumped under high shear at temperatures around room temperature but are resistant to being washed off substrate surfaces prior to being cured.

Abstract: Disclosed is a magnetoelectric (ME) composite including both a piezoelectric material and a magnetostrictive material, wherein a piezoelectric single crystal material having high piezoelectric properties is used as the piezoelectric material, and a metal magnetostrictive material having high magnetostrictive properties is used as the magnetostrictive material, thus achieving an ME composite having a layered structure via adhesion. When the ME layered composite is manufactured such that a <011> crystal orientation of the piezoelectric single crystal material is set to a thickness direction, high ME voltage coefficient, which is at least doubled, compared to a conventional <001> crystal orientation, can be obtained, and such an effect is further maximized in the resonance of the composite.

Abstract: A sealing composition and a method of manufacturing a display panel using the sealing composition are disclosed. The sealing composition includes about 10% by weight to about 80% by weight of a denatured epoxy resin having a methacrylate group, about 5% by weight to about 40% by weight of a photo-curing acrylate monomer, about 1% by weight to about 10% by weight of a heat-curing agent, about 1% by weight to about 10% by weight of a photo-polymerization initiator, about 5% by weight to about 50% by weight of a filler, about 1% by weight to about 10% by weight of a flexibility improving agent and about 0.001% by weight to about 8% by weight of an additive.

Abstract: A method for applying stones to metallic elements, particularly for the adhesive bonding of glass crystals to surfaces of tubular elements, which includes the steps of preparing an application surface (2) of a metallic element, spreading an adhesive medium (3) on the application surface (2) and making a single lateral face (4) of a first stone (5) to be applied adhere to the application surface (2). The axis of symmetry (10) of the first stone defines a first angle of intersection (8) with the application surface (2).

Abstract: The disclosure relates to the field of two-component epoxy resin compositions and to the use thereof as a repair adhesive, in particular in vehicle manufacturing. The two-component epoxy resin compositions according to the disclosure contain a curing component K2, which comprises between 1 and 10 wt. % of an amino group-terminated polyamide B, together with an epoxy resin component K1. The compositions show that the impact resistance is highly increased while an acceptable sheer strength is simultaneously retained.

Abstract: Disclosed are an electromagnetic wave absorber using a dielectric loss sheet, a method for fabricating the same, and a wind turbine blade having an electromagnetic wave function. The electromagnetic wave absorber comprises: a support layer for providing a resonant space of electromagnetic waves; a highly conductive backing layer assigned to a back surface of the dielectric support layer; and a dielectric lossy composite sheet layer formed on a front surface of the dielectric support layer, said dielectric lossy composite sheet layer having such a dielectric permittivity so as to generate a resonant peak with the electromagnetic waves reflected from the highly conductive backing layer.

Abstract: A method of forming a fan blade includes the step of applying an adhesive layer around a leading edge of a fan blade body. The adhesive layer includes an adhesive film supported by a scrim cloth, and the adhesive layer contacts a portion of an inner surface of the fan blade body and a portion of an outer surface of the fan blade body. A leading edge sheath is positioned relative to the fan blade body such that a first flank and a second flank of the leading edge sheath is positioned over the portion of the inner surface and the portion of an outer surface, respectively, of the fan blade body. Pressure is applied to the first flank and the second flank of the leading edge sheath to secure the leading edge sheath to the blade body and curing the adhesive film.

Abstract: Thermosetting adhesive compositions formed from an epoxy resin containing nano-sized core-shell particles, one or more thermoplastic toughening agent containing an amine-terminated polyethersulfone, and at least one multi-functional epoxy resin, together with at least one amine curing agent to allow full cure of the adhesive composition up to 400° F. are provided herein. Such compositions are useful for forming adhesive films that can bond composite/metal/honeycomb structures for aerospace including bonding of aircraft leading or trailing edges, acoustic nacelle structures, horizontal and vertical tail, and various other structures, as well as for other high performance industrial applications.

Abstract: A specimen carrier for use with an ex-situ lift-out (EXLO) milling process includes a carrier top surface having at least one specimen support area and at least one aperture formed through the specimen carrier top surface. The aperture includes a first opening having an open wider upper end and a narrower lower end. The first opening is bounded by opposed sidewalls in spaced-apart orientation that are inwardly inclined from the wider upper end to the narrower lower end. The aperture is configured to enable a specimen to sit over the opening and can be wedged between the first opening opposed sidewalls so that a region of interest to be milled is centered about the open end of the opening. Specimens so mounted can then be re-thinned via charged particle instruments such as focused ion beam (FIB) milling, broad beam ion milling, or via laser ablation.

Abstract: A composite structure includes at least one resin matrix layer having a resin material and a plurality of fiber elements and a plurality of titanium particles provided in the resin material. A method of toughening a resin matrix layer is also disclosed.

Abstract: A solid, dry to the touch at ambient temperature, heat curable, generally non-foaming structural adhesive that exhibits shape memory characteristics. The adhesive can be cured at an elevated temperature and contains a high molecular weight polymeric constituent that can be oriented such that at an elevated temperature below the curing temperature the material will shrink in one plane while increasing its thickness at a temperature in the range of from above the elevated temperature to below the curing temperature.

Abstract: Certain example embodiments relate to techniques for bonding automotive brackets for sensors, rear view mirrors, and/or other components to an interior surface of the glass. The adhesive films of certain example embodiments may be film-based adhesives that may be die-cut and pre-applied to the brackets or components. They may have a good initial adhesion or green strength immediately upon contact with the glass. In certain example instances, the films may be applied and successfully bond to the glass at near ambient temperature conditions to a strength level adequate to meet operational specifications for the component in under 72 hours.

Abstract: Provided are a bonded structure, a sealed structure, an electronic component including the same, a bonding method, and a sealing method, the bonded structure and sealed structure allow hermetic adhesion using an adhesive even when the materials of the bonding surfaces are different, or the bonding surfaces have low wettability for the adhesive. A sealed structure 21 used for an electronic component or the like includes a first bonding surface 17 on a first adherent 11 bonded to a second bonding surface 18 on a second adherent 16 via an adhesive layer 24, the first and/or second bonding surfaces 17 and 18 having films 22 and 23 of film-forming compounds, the film-forming compounds being bound to the surfaces 17 and 18 at one end of the molecule thereof, and bound to a molecule of the adhesive at the functional group at the other end of the molecule.

Abstract: The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.

Abstract: A multilayer assembly comprising a first inner layer (L1) made from a first composition (C1), said first composition (C1) comprising at least one polymer comprising recurring units derived from ethylene (E) and from chlorotrifluoroethylene (CTFE), and at least one Ti compound; and a second outer layer (L2) made from a second composition, said second composition (C2) being free from TiO2-containing additives, said second composition (C2) comprising at least one semi-crystalline polymer (A) comprising recurring units derived from ethylene and from at least one fluoromonomer selected from chlorotrifluoroethylene (CTFE), tetrafluoroethylene (TFE) and mixtures thereof, said semi-crystalline polymer (A) having a heat of fusion of at least 35 J/g.

Abstract: Novel thin film optical filters have an integral air layer. The frustrated total internal reflection (FTIR) phenomenon, combined with thin film interference, is used to effectively control the polarization properties of thin film coatings operating at oblique angles. The invention is applicable to high-performance thin film polarizing beam-splitters, non-polarizing beam-splitters, non-polarizing cut-off filters and non-polarizing band-pass filters, and any other thin film coatings that require the control of polarization effect. The low index layer offers an improvement in performance and the simplification of the thin film optical filter coating designs by reducing the total number of layers and the total layer thicknesses to minimize the angles of incidence and the size of the filter substrates, thereby minimizing the contact area and hence reducing the manufacturing costs.

Abstract: A two-part structural adhesive composition comprising a curable epoxy resin, an amine curing agent, a toughening agent, and a reactive liquid modifier. The structural adhesive may also include secondary curatives, initiators, reactive diluents and combinations thereof. The structural adhesives may be used to replace or augment conventional joining means such as welds or mechanical fasteners in bonding parts together.

Abstract: An adhesive composition or a coating composition of the present invention contains (a) 10 to 30% by mass of an epoxy resin; (b) 25 to 55% by mass of an oxetane compound; (c) 25 to 55% by mass of a vinyl ether compound; (d) 1 to 15% by mass of a modifier (wherein the total amount of the components (a) to (d) is 100% by mass); and (e) 3 to 15 parts by mass of a photocationic polymerization initiator with respect to 100 parts by mass of the total amount of the components (a) to (d).

Abstract: Fumed silicon dioxide powder in the form of aggregated primary particles having a BET surface area of 175±15 m2/g and a thickening effect, based on the BET surface area, of greater than 18 mPas g/m2 is hydrophobicized with polydimethylsiloxane. This hydrophobic fumed silica has a BET surface area of 110±25 m2/g. It can be used in epoxy resins. These epoxy resins in turn can be used as adhesives.

Abstract: We propose a thermosetting solvent-free single-component composition having a storage stability at room temperature of at least 2 weeks, consisting of (A) 5-90 parts by weight of one at least difunctional (iso)cyanate component, (B) 5-50 parts by weight of a latent curing agent solid up to a temperature of at least 40° C. based on nitrogen compounds suitable for addition crosslinking, (C) 0-50 parts by weight of an epoxy-containing compound and (D) 0-50 parts by weight of modifiers, with the sum of all parts by weight being 100, and its use for bonding, casting, sealing and coating of substrates, in particular electronic parts. The composition is cured at 120° C. to 150° C. within seconds.

Abstract: An OLED device is discussed. The OLED device includes: a board assembly configured to include organic light emission elements; a plastic cover attached to the board assembly; and an adhesive layer filled between the board assembly and the plastic cover. The adhesive layer is formed from an adhesive composition which includes 50˜95 parts by weight of an acryl-based copolymer resin, 4.7˜44 parts by weight of an acryl monomer, 0.1˜2 parts by weight of a cross linking monomer, 0.1˜2 parts by weight of a visible light initiator, and 0.1˜2 parts by weight of an additive.

Abstract: A reinforcing method and structure for a steel structure and an elastic layer forming material for reinforcing a steel structure are provided that can prevent a reinforcing effect from being lowered by direct sunlight, can obtain a sufficient reinforcing effect, and can prevent a fiber sheet from being peeled away from a steel structure surface before the fiber sheet is torn. The reinforcing method for a steel structure, in which a fiber sheet including reinforcing fibers is bonded to a surface of the steel structure to integrate the fiber sheet with the steel structure, includes (a) a step of applying and hardening a polyurea resin putty to the surface of the steel structure to form an elastic layer, and (b) a step of bonding the fiber sheet to the surface of the steel structure having the elastic layer formed thereon with an adhesive agent.

Abstract: Composite laminated article having: a first layer of a fiber-reinforced resin, a second layer of a closed cell foam of a thermoplastic material, and a third layer of a fiber-reinforced resin, the resin of the first and third layers respectively adhering a surface of the first and third layers to a respective surface of the second layer to form a sandwich construction of the first, second and third layers, wherein the closed cell foam comprises a plurality of expanded beads mutually welded together, each bead comprising a plurality of closed cells, wherein in each bead the closed cell foam has an average cell size of from 15 to 75 microns, at least 50% of the beads comprise first beads having a uniform cell size in which the maximum cell size is 100 microns and at most 50% of the beads comprise second beads having a non-uniform cell size in which the majority of cells have a maximum cell size of 100 microns and a minority of cells have a maximum cell size from more than 100 microns to up to 660 microns.

Abstract: A mirror or mirror assembly fabricated by molding, pressing, assembling, or depositing one or more bulk metal glass (BMG), bulk metal glass composite (BMGMC), or amorphous metal (AM) parts and where the optical surface and backing of the mirror can be fabricated without machining or polishing by utilizing the unique molding capabilities of this class of materials.

Abstract: Curable, one-package, stable adhesive compositions are provided comprising: (a) a resin component comprising a polyepoxide, (b) a polyamine having at least two primary amine, secondary amine, and/or ketimine functional groups; and (c) a curing component comprising dicyandiamide and an accelerator. At least a portion of the polyepoxide in the resin component is reacted with carboxy-terminated butadiene acrylonitrile polymer. The accelerator comprises a reaction product comprising a renewable polyol, a diisocyanate, and a dialkyl monoamine containing alkyl groups with at least two carbon atoms each. The compositions are suitable for use as adhesive compositions over a wide temperature range.

Abstract: The invention concerns a process for making a scrim-reinforced prepreg for use in building low-porosity lay-ups, characterized in that a conventional prepreg is formed of a fibrous reinforcement and a heat-curable resin, the prepreg having suitable viscosity and sufficient tackiness to hold a scrim which is adhered to the prepreg by applying light pressure, so that the scrim is impressed onto the prepreg to such a degree, that less than half of the circumference of the scrim strands becomes coated by the prepreg-resin.

Abstract: Disclosed are pneumatic bearings with a bonded polymer film wear surface and production methods thereof. For example, a pneumatic bearing for supporting a payload is disclosed. The pneumatic bearing has a bearing surface having a polyimide film fastened to a substrate with a bonding layer. The polyimide film can comprise poly-oxydiphenylene-pyromellitimide and the bonding layer can comprise diglycidyl ether of bisphenol A, 1,4-butanediol diglycidyl ether, and 2,2,4-trimetylhexametylen-1,6-diamin.

Abstract: The present invention relates to an inexpensive adhesive resin composition which is applicable even to a base material having a poor bonding property. The adhesive resin composition comprises (A) a polymer having no radical-polymerizable double bond and (B) a radical generating agent in which the radical generating agent (B) is present in an amount of 0.1 to 10 parts by weight on the basis of 100 parts by weight of the polymer (A). In the preferred embodiment of the present invention, the adhesive resin composition further comprises (C) a radical-polymerizable monomer wherein the monomer (C) is present in an amount of 0.1 to 10 parts by weight on the basis of 100 parts by weight of the polymer (A). The radical-polymerizable monomer (C) is a glycidyl group-containing monomer, and the glycidyl group-containing monomer is 4-hydroxybutyl acrylate glycidyl ether.

Abstract: A method for sealing electrodes on a semiconductor device using a sealing film which includes a resin layer having a flow within the range of 150 to 1800 ?m at 80° C., or having a resin layer with a viscosity within the range of 10,000 to 100,000 Pa·s in a B-stage state at 50 to 100° C. in thermosetting viscoelasticity measurement, and containing: (A) both (a1) a high-molecular-weight component including crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of ?50 to 50° C. and (a2) a thermosetting component including an epoxy resin as a main component, (B) a filler having an average particle size within the range of 1 to 30 ?m, and (C) a colorant.

Abstract: A protection-plate-attached electronic member including: a first electronic member including a first transparent substrate; an adhesion layer which overlaps with the first transparent substrate; a protection plate fixed to the first electronic member in a state in which the adhesion layer intervenes between the protection plate and the first transparent substrate; and a peeling auxiliary section which intervenes between the adhesion layer and one of the protection plate and the first electronic member so as to lower bonding strength between the adhesion layer and the one of the protection plate and the first electronic member, wherein the adhesion layer includes an overlapping section which overlaps with the peeling auxiliary section; and a nonoverlapping section which does not overlap with the peeling auxiliary section and which directly contacts with the one of the protection plate and the first electronic member.

Abstract: An adhesion method capable of strongly adhering two members without using an adhesive and without impairing a fine structure or optical properties of a joining surface, and a biochemical chip and optical component made by the same are provided. The adhesion method includes step A of forming a coating film 13 of a first film compound having a first functional group on a first joining surface 11 of a first member 21, step B of forming a coating film 14 of a second film compound having a second functional group on a second joining surface 12 of a second member 22, and step C of bringing the first joining surface 11 into contact by pressure with the second joining surface 12 while bringing a coupling agent having at least one coupling reactive group that forms a bond by a coupling reaction with the first functional group and the second functional group into contact with the first and second functional groups to form bonds by the coupling reaction.

Abstract: The present invention provides an adhesive tape 10 for electrically connecting a plurality of solar battery cells, which adhesive tape has a metal foil 1 and an adhesive layer 2 composed of an adhesive provided on at least one surface of the metal foil 1, and a solar battery module using the adhesive tape. The adhesive tape of the present invention can suppress the decrease in the product yield and can improve the connection workability of solar battery cells.

Abstract: A method of manufacturing a metal-base substrate having an insulative adhesive layer and a conductor layer on a metal-based material is provided. The method includes the steps of dispersing a disperse phase in an insulative adhesive-dispersing medium that contains a wetting dispersant and constitutes the insulative adhesive layer; laminating step of laminating the insulative adhesive on the conductor foil as feeding the roll-shaped conductor foil; curing the insulative adhesive on the conductor foil under heat into a B stage state and thus forming a composite of the conductor foil and the insulative adhesive layer in the B stage state; laminating the metal-based material on the insulative adhesive layer in the B stage state to give a laminate; and then curing the insulative adhesive layer in the B stage state into a C stage state by heat pressurization of the laminate.

Abstract: A solid dry to the touch at ambient temperature structural adhesive which can be cured at elevated temperature and which can be moulded at an intermediate temperature is provided as well as the use of the adhesive for bonding metals.

Abstract: The present invention relates to heat-curable compositions containing a mixture of reactive epoxy resins that contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and at least one latent hardener.

Abstract: A process, apparatus, and system for joining at least two workpieces together using at least two adhesives each having substantially different cure times. A first adhesive having a first cure time is used to form a first bond between the two workpieces, the first adhesive having a first cure time. A second adhesive having a second cure time, the second cure time being substantially shorter than the first cure time is used to form a fixturing bond. The fixturing bond maintaining the first and second workpieces in position prior to the first adhesive curing.

Abstract: Processes are provided for forming film adhesives (10). The processes include applying an adhesive (18), such as a Bisphenol A epoxy resin, to a membrane (14), and partially curing the adhesive (18). The resulting film adhesives (10) can be shipped and stored at room temperature. The film adhesives (10) can be used to bond components such as, but not limited to printed wireboards (11, 12) and other substrates. A structural bond between the components can be formed by fully curing the resin (18) while the resin (18) is in contact with at least one of the components.

Abstract: The present disclosure relates to impact strength modifiers, the derivative products thereof, and the use thereof in producing two-component epoxy resin compositions. The disclosure in particular relates to amino group terminated impact strength modifiers prepared by reacting a polyurethane prepolymer having isocyanate groups, a primary diamine, and optionally at least one Michael acceptor. The two-component epoxy resin compositions thus formulated are characterized by a great increase in impact strength while retaining an acceptable tensile shear strength. The impact strength modifiers according to the disclosure and the epoxy resin compositions comprising same are in particular suitable for vehicle manufacturing.