Abstract: The present invention relates to methods for joining and for improving interfacial strength of joints in objects of fibre-containing composite materials, such as epoxy/glass fibre composite materials of a wind turbine blade, as well as fibre reinforced composite materials, laminates and other interconnected objects prepared by this method. In particular wind turbine blades prepared by this method are described. The present invention further relates to robots and robotic tools for carrying out the described methods for joining objects of fibre-containing composite materials.

Abstract: Provided are a bonded structure, a sealed structure, an electronic component including the same, a bonding method, and a sealing method, the bonded structure and sealed structure allow hermetic adhesion using an adhesive even when the materials of the bonding surfaces are different, or the bonding surfaces have low wettability for the adhesive. A sealed structure 21 used for an electronic component or the like includes a first bonding surface 17 on a first adherent 11 bonded to a second bonding surface 18 on a second adherent 16 via an adhesive layer 24, the first and/or second bonding surfaces 17 and 18 having films 22 and 23 of film-forming compounds, the film-forming compounds being bound to the surfaces 17 and 18 at one end of the molecule thereof, and bound to a molecule of the adhesive at the functional group at the other end of the molecule.

Abstract: Provided are (i) a one-pack epoxy resin which exhibits excellent storage stability in terms of not only composition viscosity but also flowability and (ii) use thereof. The one-pack type epoxy resin composition, contains, as main components, (A) epoxy resin; (B) a modified aliphatic polyamine compound; and (C) inorganic filler treated with a long-chain hydrocarbon-group containing compound. Therefore, the present invention achieves (i) the one-pack type epoxy resin composition which exhibits the excellent storage stability in terms of not only the viscosity but also the flowability and (ii) use thereof.

Abstract: Pre-assembled brick assemblies for refractory installations used in steel production. A purging block or well block can be pre-assembled out of fire brick to exactly fit an opening for a particular ladle, and hence can be supplied in different sizes and shapes, and a full refractory ladle bottom can be manufactured that can include a pre-assembled purging blocks and pre-assembled well blocks with dimensions from the old bottom, thus providing a near-perfect fit. The pre-assembled brick blocks and/or the entire pre-assembled bottom can be held together with a high-strength epoxy while being assembled and installed. Purging blocks or well blocks can be directly installed in a well in a pre-assembled brick bottom.

Abstract: Disclosed is a method to manufacture a carbon composite structure. First, a polymer nano fiber net is provided. The polymer nano fiber net is thermal oxidized to form an oxidized nano fiber net. The oxidized nano fiber net and an oxidized micro fiber net are stacked and impregnated in a resin. The resin is oxidized. Finally, the oxidized nano fiber net, the oxidized micro fiber net, and the oxidized resin are carbonized at a high temperature to form the carbon composite structure.

Abstract: An information recording medium excellent in long storage and capable of high-density recording, method of manufacturing the information recording medium, and information recording material are provided. Pulse laser light is focused onto a recording layer in which a thermosetting epoxy resin having a skeleton with high planarity and a curing agent are polymerized to form a recording mark. With a cured material of a recording layer having a density equal to or larger than 1.210 g/cm3 and a glass transition temperature of 110° C. to 140° C., high-speed recording is possible.

Abstract: Methods and systems for adhering microfeature workpieces to support members are disclosed. A method in accordance with one embodiment of the invention includes disposing a first adhesive on a surface of a microfeature workpiece, and disposing a second adhesive on a surface of a support member. The method can further include adhesively attaching the microfeature workpiece to the support member by contacting the first adhesive with the second adhesive while the second adhesive is only partially cured. In further particular embodiments, the first and second adhesives can have different compositions, and the second adhesive can be fully cured after the microfeature workpiece and support member are adhesively attached.

Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Abstract: The present technology provides a bisphenol A capture system for food and beverage containers which include BPA-containing coatings. The capture system is made of one or more materials which bind any BPA eluting from the BPA-containing coating. The present capture system therefore reduces or prevents BPA from migrating from the can coating into the food or beverages stored in the can. The present technology further provides methods of manufacturing and using such coatings.

Abstract: The invention relates to a process for improving the adhesion of carbon fibres with regard to an organic matrix forming a composite material with these fibres, this composite material being obtained by bringing the fibres into contact with a resin which can be cured by chain polymerization and then polymerizing the resin, which process is characterized in that it comprises the grafting, to the surface of the fibres, before they are brought into contact with the resin, of groups capable of acting as chain transfer agents during the polymerization of said resin. Fields of application: aeronautical, aerospatial, railway, ship building and automobile industries but also the armaments industry, the industry of sports and leisure articles, and the like.

Abstract: The invention relates to a method of manufacturing a heat storage material that contains heat storage capsules. The heat storage capsules include a phase change material that absorbs and/or discharges latent heat in response to a change in temperature. The phase change material resides within outer shells of the heat storage capsules. The method involves binding abutting peripheral portions of a plurality of heat storage capsules with a molding binder, so as to form an intermediate granular molded heat storage material. An outer peripheral surface portion of the granular molded heat storage material is coated with a coating binder. The coated granular molded heat storage material is then subjected to a treatment that causes the coating binder of the coating layer to polymerize. The invention also relates to heat storage adsorbent materials, and articles (e.g., canisters) that include such heat storage adsorbent materials.

Abstract: An easy to use epoxy-mount base plate assembly has components of a two-part epoxy adhesive pre-dispensed on the assembly's base plate in a plurality of alternating segments and prepackaged with a protective adhesive cover that keeps each epoxy component segment separated from one another until ready for use. To attach the base plate of the assembly to a surface, the adhesive cover is removed exposing the epoxy segments. The base plate is then pressed against a mounting surface and twisted thus mixing the epoxy components and initiating a curing process for the epoxy.

Abstract: Certain aluminum salts of organic phosphorus acids are found to have a strong effect on inhibiting the epoxy cure rate in epoxy formulations. The substances act catalytically and can be used at a low level in an epoxy formulation to adjust the reactivity of a resin formulation to give longer gel times. Compositions and methods of preparing and using the compositions are disclosed.

Abstract: In an optical system including an optical bench and an imaging device that is configured to be mounted to the optical bench, a method of aligning the imaging device on the optical bench includes the steps of: (1) inserting an alignment pin extending from a mounting surface of either the optical bench or the imaging device into a hole defined in the other of the optical bench and the imaging device; (2) aligning the imaging device with respect to a target image by translating and/or rotating the imaging device on the mounting surface of the optical bench while the pin is inserted in the hole to meet pre-defined center pixel, scan line and/or resolution requirements of the optical system; and (3) applying epoxy to the pin and the hole to mount the optical bench to the imaging device.

Abstract: To provide a conductive particle, which contains a core particle, and a conductive layer formed on a surface of the core particle, where the core particle is formed of a resin, or a metal, or both thereof, and the conductive layer contains a phosphorus-containing hydrophobic group at a surface thereof.

Abstract: A ceramics composite member includes a structure in which a first ceramic member and a second ceramic member are integrated with a joint portion. The joint portion has a texture in which a silicon phase having an average diameter of 0.05 ?m or more and 10 ?m or less is continuously provided in a network form in interstices of silicon carbide particles having an average particle diameter of 0.1 ?m or more and 0.1 mm or less.

Abstract: An epoxy resin composition is a one-part epoxy resin composition for hermetic sealing of an electronic component or an electrical component, containing: a liquid epoxy resin; dicyandiamide; and a filler, the filler having an average particle size between 0.1 ?m and 1 ?m, the filler containing particles not less than 5 ?m in particle size in an amount of not more than 20 wt %, and the amount of the filler contained in the one-part epoxy resin composition being between 5 and 60 parts by weight relative to 100 parts by weight of the liquid epoxy resin. This achieves a one-part liquid epoxy resin composition in which a great variety of curing agents can be used and dissociation of an epoxy resin and a curing agent is suppressed even when used in a gap of approximately several tens of micrometers.

Abstract: The invention relates to a process that makes it possible to improve the mechanical strength of bonds between substrates when these bonds are produced by means of an adhesive that comprises a resin that can be cured by chain polymerization, and in particular a resin that can be cured under the effect of ionizing or light radiation. This process is characterized in that it comprises the grafting of groups capable of acting as chain transfer agents during the polymerization of said resin to the surface of the substrates, before the latter are brought into contact with the adhesive. Applications: assembling of structural, engine, passenger compartment or bodywork parts in the aeronautical, space, railway, ship-building and automotive industries.

Abstract: An imaging optic comprising a first combination element comprised of at least two individual lens elements, aligned with each other along an optical axis and adhered to each other, a second combination element comprised of at least one individual lens element and an aperture disposed between the first and second combination elements, the surfaces of the imaging optic having less than about 3 minutes tilt relative to the optical axis and less than about 0.005 mm de-center relative to the optical axis. A method of making the imaging optic and an endoscope comprising the imaging optic.

Abstract: A method of controlling corrosion at an interface formed between at least two metal components includes applying a blend of magnesium particles and one of an adhesive or a sealant to the interface. The magnesium particles have a diameter sufficient to span a distance between the metal components. The method further includes exposing the metal components to a substantially corrosive environment, where the corrosive environment at least partially dissolves the magnesium particles. At least partial dissolution of the magnesium particles i) cathodically protects the metal components at the interface, ii) alkalizes the corrosive environment, and iii) generates hydrogen bubbles that substantially block a crevice formed at the interface.

Abstract: Embodiments of the disclosed technology disclose a method for fixing glass substrates and a method for preparing a flexible display device. The method for fixing glass substrates comprises coating an edge portion of a first glass substrate corresponding to a second glass substrate with epoxy resin and screeding the coated epoxy resin layer, adhering the second glass substrate to the first glass substrate, and annealing the two glass substrates. With the technical solution of this disclosed technology, the time period for fixing the adhered glass substrates can be reduced with an improved productivity.

Abstract: A method of using UV cationic epoxy to repair cracks and breaks windshields in order to eliminate oxygen inhibition and shrinkage. The method includes embodiments that employ pretreatment or priming of the of a crack or break in order to negate the moisture and PVB retardation of the UV cationic epoxy polymerization and mixing the UV cationic epoxy and a UV radical resin to create a hybrid or; adding other ingredients to the UV cationic epoxy to negate the moisture and PVB retardation; and use of the UV cationic epoxy as a cap over repair resin/epoxy and as a pit filler. Other combinations of materials and procedures are disclosed.

Abstract: This disclosure provides systems, methods, and apparatus for treating a self-assembled monolayer coating on a dielectric layer to improve epoxy adhesion to the self-assembled monolayer coating. In implementations of the methods, a dielectric layer on a surface of a substrate is provided. A self-assembled monolayer coating is formed on the dielectric layer. A seal region of the self-assembled monolayer coating is selectively treated. A component is bonded to the seal region of the self-assembled monolayer coating with an epoxy. Implementations of the methods may be used to encapsulate an electromechanical systems device on the substrate with a cover using an epoxy.

Abstract: A lightweight, structurally strong skin panel having one or more transparent areas forming see-through windows, and a method of making same. A pre-impregnated resin tape comprised of a plurality of fibers impressed into a resin is provided. A metal sheet is provided. The pre-impregnated resin tape and the metal sheet are layered onto a molding tool such that the metal sheet and the pre-impregnated resin tape are aligned one atop the other. The tool, metal sheet, and pre-impregnated resin tape are heated such that the resin flows and at least partially covers the metal sheet and the fibers. The resin and fibers are substantially transparent to form a see-through window portion in the skin panel. The transparent window skin panel eliminates the bulky and heavy frame structure traditionally employed on aircraft, and which has heretofore limited the size of aircraft windows.

Abstract: Structural adhesives are prepared from an elastomeric toughener that contains urethane and/or urea groups, and have terminal isocyanate groups that are capped with ketoxime compound. The adhesives have very good storage stability and cure to form cured adhesives that have good lap shear and impact peel strengths, even at ?40° C.

Abstract: The present disclosure provides an epoxy resin composition that has storage stability and allows the formation of cured products having flexibility. The epoxy resin composition is a one-pack type liquid epoxy resin composition comprising a polyfunctional linear epoxy resin having an epoxy equivalent of 400 or more, a tetrabasic acid anhydride having a melting point of 10° C. or higher, and an organic metal compound.

Abstract: A method for electrically coupling an anti-tamper mesh to an electronic module or device using wire bonding equipment and a device made from the method. Stud bumps or free air ball bonds are electrically coupled to conductive mesh pads of an anti-tamper mesh. Respective module pads have a conductive epoxy disposed thereon for the receiving of the stud bumps or free air ball bonds, each of which are aligned and bonded together to electrically couple the anti-tamper mesh to predetermined module pads.

Abstract: Provided are a semiconductor device producing method with simple production steps while preventing contamination of a bonding pad and preventing warp generation in an adherend such as a substrate, a lead frame, or a semiconductor element, thereby improving yield; an adhesive sheet used in this method; and a semiconductor device obtained by this method. The invention includes a pre-setting step of pre-setting a semiconductor element 13 to an adherend 11 through an adhesive sheet 12, and a wire bonding step of wire bonding the element 13 in the bonding temperatures range of 80 to 250° C. without performing any heating step, wherein, as the adhesive sheet 12, a sheet having a storage elastic modulus of 1 MPa or more in the temperature range of 80 to 250° C. or a storage elastic modulus of 1 MPa or more at any temperature in the temperature range before curing the sheet 12 is used.

Abstract: An image reading device and a method for manufacturing the same are provided, where the image reading device is capable of being assembled more efficiently. The image reading device includes: an optical part, extending long in a direction; a case, having an accommodating portion for accommodating the optical part; and a light receiving component, accommodated in the case. The optical part is fixed in the accommodating portion through a first adhesive and a second adhesive with hardening time longer than that of the first adhesive.

Abstract: Disclosed herein is a method for bonding dissimilar materials using an elastic adhesive to permit the bond to withstand variations in temperature and pressure. The use of elastic adhesive accommodates previous problems associated with large differences in thermal expansion coefficient between dissimilar materials, and provides a thermally and chemically stable materials combination that withstands large thermal shock loads, such as may be experienced in a space environment. Also disclosed herein is a method for attaching a coating to a structure. In particular applications, the coating may be (1) specular (greater than 98% specularity); or (2) RF reflective for use in applications including but not limited to high frequency satellite communications.

Abstract: A light source comprises a heat-sink having a mounting region, and heat-dissipating fins, a base housing having an inner cavity and coupled to the heat-sink, and an integrated lighting module including: a printed circuit board; an LED on a substrate coupled to the printed circuit board within a first lateral region of the printed circuit board, and an electronic driving circuit for providing power to the LED and coupled to the printed circuit board within a second lateral region of the printed circuit board, wherein a bottom surface of the substrate is thermally coupled to the mounting region of the heat-sink, and wherein the second lateral region of the integrated lighting module is located within the inner cavity of the base housing.

Abstract: A ballistic-resistant fabrication including a matrix formed by a number of elongated used tire segment layers along with high strength sheeting material which may be held together with an interstitial material, such as epoxy. More layers may be utilized as needed. These layers may be non-bonded, partially, or completely bonded and/or covered with other materials to produce a finished product. Due to the deformable and frictional properties of the rubber, along with the tensile strength of the sheeting, the fabrication has the ability to absorb and protects against multiple projectile impacts. These ballistic-resistant fabrications are much less expensive to produce than similar conventional products due to the use of recycled rubber tires and/or recycled plastic material, but are very efficient in resisting penetration by ballistic projectiles.

Abstract: The bonding method of the present invention is a method of bonding a member (a) having a layer (a1) comprising an organic polymer (A), and a member (b) containing a compound (B) having specific functional groups, wherein the bonding method comprises bonding the member (a) and the member (b) via a layer comprising an inorganic compound (C) having a nitrogen atom and a hydrogen atom, which is at least partly provided on the outermost surface of the member (a).

Abstract: The invention relates to a method for adhesively bonding a magnet onto the surface or into a slot of a rotor or stator of an electric motor or a generator, wherein i) the surface or surfaces to be glued of the magnet, rotor or stator are pre-coated with an adhesive that is not liquid at 22° C. and that does not cure without an activation step, iii) the magnet is brought into contact with the rotor or stator at the adhesive location, and iv) the adhesive is activated by heating or by high-energy radiation so that it cures, characterized in that the adhesive comprises a) at least one reactive epoxide prepolymer, b) at least one latent hardener for epoxies, and c) one or more elastomers. The adhesive preferably comprises a blowing agent. The invention further relates to a corresponding pre-coated magnet.

Abstract: The invention relates to a laminated core with soft-magnetic material and to a method for joining core laminations by adhesive force to form a soft-magnetic laminated core. The laminated core comprises core laminations made of soft-magnetic sheets, which form a core lamination stack. The core lamination stack has intermediate layers between the core laminations. The intermediate layers comprise a cured adhesive introduced in a state of low viscosity into interstices between the core laminations. For this purpose, the core laminations comprise a final-annealed, crystalline CoFe alloy, an adhesive-wettable top side and an adhesive-wettable underside. Together with the intermediate layers, the core laminations form a dimensionally accurate laminated core. The laminated core has a substantially adhesive-free contour consisting of contour surfaces of the core laminations. The adhesive is solvent-free in its low-viscosity state.

Abstract: A method for preparing a laminated multilayer article is disclosed. In one embodiment, the multilayer article is a conformally sealed printed wiring board. The method comprises contacting a first substrate having a coating to a second substrate such that said coating is disposed between said first and second substrate, forming an uncured multilayer article, applying heat and pressure to said multilayer article thereby forming a cured multilayer article, said coating comprising an uncured epoxy composition comprising a combination of an epoxy, a phenolic curing agent, and an imidazolium monocarboxylate salt, In one embodiment the second substrate is a printed wiring board. Of particular utility are compositions comprising 2-ethyl-4-methyl imidazolium monocarboxylate salts.

Abstract: Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin with, on average, more than one epoxide group per molecule, at least one curing agent for epoxy resins, which is activated by an increased temperature and at least one terminally blocked polyurethane prepolymer. Said epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.

Abstract: Latent thermal initiators and protectant compositions that remain shelf stable at elevated temperatures, yet readily cure during a solder bump reflow process or other high temperature processing. The thermal initiators comprise thermally labile cation-anion pairs where the blocked cation prevents cure at low temperatures, and the unblocked cation initiates cure at high temperatures. Also provided is a method of making a preferred initiator comprising the cation [N-(4-methylbenzyl)-N,N-dimethylanalinium] and the anion [N(SO2CF3)2].

Abstract: A hardener composition for epoxy resins, the hardener composition including a mixture of 1,3-bis(aminomethyl)cyclohexane and 1,4-bis(aminomethyl)cyclohexane. A prepolymer hardener composition for epoxy resins, the prepolymer hardener composition comprising the reaction product of an epoxy with a mixture of 1,3-bis(aminomethyl)cyclohexane; and 1,4-bis(aminomethyl)cyclohexane.

Abstract: Disclosed herein are 2K structural adhesive compositions comprising (a) a first component comprising (i) an epoxy-adduct formed as a reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid; and (ii) a second epoxy compound; and (b) a second component that reacts with the first component. In one embodiment, the second component is an amine compound. These adhesives may be used to bond together substrate materials such as two half shells of wind turbine blades.

Abstract: The invention relates to hybrid materials comprising polymers which envelop nanoscale, superparamagnetic, ferromagnetic, ferrimagnetic or paramagnetic powders, to a process for producing these materials and to their use.

Abstract: Epoxy adhesive compositions containing a rubber-modified epoxy resin contain a bisphenol. The bisphenol can be pre-reacted with the rubber-modified epoxy resin to advance the resin. The adhesives are resistant to thermal degradation as can occur in so-called “overbake” conditions, in which the adhesive is heated to high temperatures for prolonged periods of time. In addition, expanded microballoons are included in epoxy structural adhesives to promote a desired fracture mode.

Abstract: Reinforcement patches comprising a mastic and a plurality of unidirectionally-aligned fibers at least partially embedded in a first major surface of the mastic are described. Generally, at least 90% of the unidirectionally-aligned fibers are oriented having an axis of alignment within +/?10 degrees of the average axis of alignment of the unidirectionally-aligned fibers. Reinforcement patches that include an encapsulating resin and a cover layer are also described. Methods of reinforcing a panel using reinforcement panels, and panels reinforced with the patches are also disclosed.

Abstract: Reactive hotmelt adhesives based on copolyamide can be used in hybrid components. These hybrid components find application in, for example, vehicle construction and aircraft construction.

Abstract: The present invention relates to a novel composite structure with enhanced toughness, which incorporates features mimicked from nacre (mother of pearl). The structure can be used in many industrial and clinical applications, including aeronautics (aircraft skin), the defense industry (armor materials); orthopedics and medical devices (tough, biocompatible coatings on prostheses) and micro-electro-mechanical systems (MEMS; increased reliability for critical components).

Abstract: A description is given of the use of reactive hotmelt adhesives based on copolyamide and further comprising isocyanate and epoxide and also a functionalized polyolefin in hybrid components. These hybrid components find applications in vehicle construction and in aircraft construction, for example.

Abstract: The present technology provides a bisphenol A capture system for food and beverage containers which include BPA-containing coatings. The capture system is made of one or more materials which bind any BPA eluting from the BPA-containing coating. The present capture system therefore reduces or prevents BPA from migrating from the can coating into the food or beverages stored in the can. The present technology further provides methods of manufacturing and using such coatings.

Abstract: A flywheel includes a wheel having a composite rim structure with multiple radial layers of steel material. Epoxy type adhesive can bond the multiple layers of stainless steel together.

Abstract: Heat-curable epoxy resin compositions and the use thereof, for example, in motor vehicle construction and sandwich panel construction, are disclosed. Exemplary heat-curable epoxy resin compositions include, in addition to epoxy resin components A1, optionally A2, a hardener component B, a carboxylic acid C and a hydroxyalkylamide or hydroxyalkylurea H, an accelerator E for activation of the conversion of components A1, A2 and B. The compositions and the structural foams produced therefrom are notable for high mechanical strength, high glass strength and good adhesion capacity on metallic and nonmetallic substrates, and it is possible at the same time to dispense with the use of toxic or inflammable blowing agents.

Abstract: Constructional panel having a front side suitable to be exposed to outside weather conditions, comprising a front side element, a rear side element and an insulating material arranged between said front and rear side elements, where the front side element is made from a high strength concrete, and where the insulating material is adhered to the rear side of said front and rear side elements.