Derived From Aldehyde Or Ketone Patents (Class 156/331.3)
  • Patent number: 10059028
    Abstract: The application describes a method of scavenging formaldehyde from a wooden composite comprising urea-formaldehyde or melamine urea-formaldehyde by providing a combination of formaldehyde scavengers in the face and core layers of the composite and further describes the composite produced with these scavengers.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: August 28, 2018
    Assignee: FPInnovations
    Inventors: Yaolin Zhang, Xiang-Ming Wang, Zhenhua Gao
  • Patent number: 9790313
    Abstract: Disclosed are curing compositions for resin systems and in particular for phenolic resin systems and epoxy resin systems, to methods of preparing the curing compositions and to resin systems incorporating same. The curing compositions of the invention are the reaction product of an aldehyde with an amine in the presence of an aprotic solvent.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: October 17, 2017
    Assignee: HEXION INC.
    Inventors: Ganapathy S. Viswanathan, Craig M. Zirkle
  • Publication number: 20140014267
    Abstract: The invention relates to an improved two component adhesive system, a kit comprising said two adhesive components, its use and a method for production of interior wood products, in particular form-pressed products, parquet floor elements and solid wood panels with very low formaldehyde emission and to the interior wood products obtainable having improved properties. The two-component adhesive system comprises adhesive component I comprising a 50-70 wt % melamine-formaldehyde (MF) type resin in 25-40 wt % water and adhesive component II comprising 25-40 wt % of a water based dispersion adhesive, 15-40 wt % of a formaldehyde scavenger and an acidic compound in an amount such that the pH of adhesive component II is 1.5-6.5, wherein adhesive component I and II are to be applied in a weight ratio I:II of 1:0.5 to 1:1.5 and the adhesive system has a molar ratio of formaldehyde (F) to total amino group (F/NH2) between 0.2 and 0.7.
    Type: Application
    Filed: February 4, 2013
    Publication date: January 16, 2014
    Applicant: DYNEA AS
    Inventors: Astrid PEDERSEN, Kristin GROSTAD, Per SANDBAKKEN
  • Patent number: 8323450
    Abstract: The invention relates to a method of manufacturing a heat storage material that contains heat storage capsules. The heat storage capsules include a phase change material that absorbs and/or discharges latent heat in response to a change in temperature. The phase change material resides within outer shells of the heat storage capsules. The method involves binding abutting peripheral portions of a plurality of heat storage capsules with a molding binder, so as to form an intermediate granular molded heat storage material. An outer peripheral surface portion of the granular molded heat storage material is coated with a coating binder. The coated granular molded heat storage material is then subjected to a treatment that causes the coating binder of the coating layer to polymerize. The invention also relates to heat storage adsorbent materials, and articles (e.g., canisters) that include such heat storage adsorbent materials.
    Type: Grant
    Filed: April 22, 2009
    Date of Patent: December 4, 2012
    Assignee: Osaka Gas Chemicals Co., Ltd.
    Inventor: Kenji Seki
  • Publication number: 20100236715
    Abstract: A melamine laminate article, having incorporated therein an isothjazolone antimicrobial agent, is formed by a high-pressure manufacturing process. The melamine resin is compounded with the antimicrobial as a finely divided powder diluted in a liquid forming a dispersion.
    Type: Application
    Filed: June 2, 2010
    Publication date: September 23, 2010
    Applicant: MICROBAN PRODUCTS COMPANY
    Inventors: William D. Hanrahan, Ivan W. Ong, Laurie W. Pariano
  • Patent number: 7342053
    Abstract: Producing a printed circuit board, by coating a resin composition comprising an aromatic cyanate compound having two or more cyanato groups in a molecule and a radical-polymerizable resin on a circuit substrate, photo-curing the resin composition, and thermally curing the photo-cured resin composition to thereby form an insulation layer, affords an insulation layer with improved surface smoothness and excellent dielectric properties.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: March 11, 2008
    Assignee: Ajinomoto Co., Inc.
    Inventor: Shigeo Nakamura
  • Patent number: 6956098
    Abstract: The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electronics type applications.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: October 18, 2005
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: John Donald Summers, Richard Frederich Sutton, Jr., Brian Carl Auman
  • Patent number: 6939432
    Abstract: The present invention provides an aqueous adhesive composition including a resinous phase dispersed in an aqueous medium, the resinous phase containing (a) a polychloroprene, (b) optionally, a halogenated polyolefin different from (a), and (c) optionally, an aminoplast resin. Further provided is an aqueous adhesive composition of a resinous phase dispersed in an aqueous medium wherein the resinous phase includes (a) a polychloroprene, (b) a halogenated polyolefin different from (a), and (c) a polyurethane polymer having ionic salt groups. A multi-layer composite and methods for adhering a thermoplastic material to a rigid substrate using the aqueous adhesive compositions also are provided.
    Type: Grant
    Filed: August 23, 2002
    Date of Patent: September 6, 2005
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Tien-Chieh Chao, Umesh C. Desai, Charles M. Kania, Masayuki Nakajima, Kaliappa G. Ragunathan
  • Patent number: 6821636
    Abstract: A method of producing formaldehyde laden layered products, the products having reduced emission of formaldehyde, of at least 2 layers, at least one of the layers being a veneer, comprising a step of treating at least one of the surfaces of said veneer, prior to bonding the layers together, with a solution comprising an ammonium salt. The invention also relates to a flooring material obtained by the method.
    Type: Grant
    Filed: March 11, 2002
    Date of Patent: November 23, 2004
    Assignee: Akzo Nobel N.V.
    Inventors: Robin Ljungar, Ingvar Lindh, Salme Pirhonen
  • Publication number: 20030217807
    Abstract: A method of joining at least two objects (2,4) by gluing with a two-component adhesive system to form a composite structure is disclosed. It comprises providing a first adhesive component including liquid urea-formaldehyde in combination with a powdery urea, so as to render the first component sufficiently viscous. Furthermore, a second adhesive component including a hardener is provided. At least one of the objects (4) is preheated prior to joining said objects. The first and second adhesive components are then applied separately to said objects. Finally, heat and pressure (14) is applied for a time sufficient to cause said adhesive to cure.
    Type: Application
    Filed: January 27, 2003
    Publication date: November 27, 2003
    Inventors: Leif Lesmann, Sofie Keiler
  • Patent number: 6652970
    Abstract: The present invention is directed toward compositions that are chemically different after application to a substrate as compared to the composition prior to its application. A method of the invention comprises a method of transitioning a crosslinked polymer composition from a first chemical state to a second chemical state. Advantageously, compositions of the invention are relatively stable after transformation to their altered, or second, chemical state.
    Type: Grant
    Filed: July 7, 2000
    Date of Patent: November 25, 2003
    Assignee: 3M Innovative Properties Company
    Inventors: Albert I. Everaerts, Charles M. Leir, Roger A. Mader, Peter A. Stark
  • Patent number: 6444329
    Abstract: The present invention is related to a method of preserving plywood, particle board and similar wood composite products made from wood pieces/particles and a binder used to adhere such wood pieces/particle together against rot and mould decay. According to the invention, the preservative of the wood material is a complexing agent which is capable of binding transition group metals and is admixed into the binder used in the manufacture of said wood composite products prior to the formation of said product. The invention also concerns a binder composition, which contains a polymer resin as its adhesive component and a complexing agent, particularly an aminotetracarboxylic acid or a salt thereof, by approx. 1-30 wt.-% as the preservative of the wood material, and a method of producing said binder composition. Tests performed on faced plywood indicated that a water-soluble, environmentally safe complexing agent offers a white rot resistance which is superior to conventional preservatives commonly used today.
    Type: Grant
    Filed: December 11, 1998
    Date of Patent: September 3, 2002
    Assignees: UPM-Kymmene Oy, Koskisen Oy, Metsalitto Osuuskunta
    Inventors: Markku Lehtonen, Markku Lähteenmäki, Anne-Christine Ritschkoff, Jaakko Korpela
  • Patent number: 6436865
    Abstract: The invention provides a liquid catalyst capable of cross-linking amino resins. The liquid catalyst has improved flexibility and adhesive properties. It is comprised of a cross-linkable polyvinyl acetate, an acid, and an ammonium salt.
    Type: Grant
    Filed: November 13, 2000
    Date of Patent: August 20, 2002
    Assignee: Multibond Inc.
    Inventors: Serge Berube, John Cutt
  • Patent number: 6217702
    Abstract: Relatively low molecular weight olefin/CO polymers are graft copolymerized. The graft copolymers provide the basis for waterborne adhesives that are particularly useful for making wood composites.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: April 17, 2001
    Assignee: Shell Oil Company
    Inventor: Pui Kwan Wong