N In A Ring Patents (Class 156/331.5)
  • Patent number: 8470124
    Abstract: Embodiments of the present disclosure describe ambient temperature pressing (“cold pressing”) of a wood-based product using protein/PAE adhesives within industrially suitable set times and press pressures. A method includes preparing an adhesive comprising a protein source and polyamideamine-epichlorohydrin (PAE) resin, applying the adhesive to one or more wood-based components, and cold pressing the one or more wood-based components to form a wood-based structure, the cold pressing being the only pressing operation in the formation of the wood-based structure after applying the adhesive to the one or more wood-based components. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: August 9, 2011
    Date of Patent: June 25, 2013
    Assignee: Columbia Forest Products, Inc.
    Inventors: Timothy F. Spayde, Chris J. Watt, Steven Pung
  • Publication number: 20130139965
    Abstract: Novel benzoxazine-thiol adducts are described, which may be may be cured to produce compositions useful in coating, sealants, adhesive and many other applications.
    Type: Application
    Filed: January 30, 2013
    Publication date: June 6, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventor: 3M INNOVATIVE PROPERTIES COMPANY
  • Patent number: 8444805
    Abstract: The invention relates to an improved two component adhesive system, a kit comprising said two adhesive components, its use and a method for production of interior wood products, in particular form-pressed products, parquet floor elements and solid wood panels with very low formaldehyde emission and to the interior wood products obtainable having improved properties. The two-component adhesive system comprises adhesive component I comprising a 50-70 wt % melamine-formaldehyde (MF) type resin in 25-40 wt % water and adhesive component II comprising 25-40 wt % of a water based dispersion adhesive, 15-40 wt % of a formaldehyde scavenger and an acidic compound in an amount such that the pH of adhesive component II is 1.5-6.5, wherein adhesive component I and II are to be applied in a weight ratio I:II of 1:0.5 to 1:1.5 and the adhesive system has a molar ratio of formaldehyde (F) to total amino group (F/NH2) between 0.2 and 0.7.
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: May 21, 2013
    Assignee: Dynea Oy
    Inventors: Astrid Pedersen, Kristin Grøstad, Per Olav Sandbakken
  • Patent number: 8298368
    Abstract: A composition for and method for bonding a substrate. In general, applied to a substrate will be a primer composition that includes an adhesion promoter, which is an adduct prepared by the reaction of at least one aromatic polyisocyanate compound, with an active hydrogen containing moiety of an organofunctional silane, and a prepolymer derived from the reaction of at least one aliphatic polyisocyanate and a polyol, and is at least partially reacted with an active hydrogen containing moiety of an organofunctional silane.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: October 30, 2012
    Assignee: Dow Global Technologies LLC
    Inventors: Stefan Schmatloch, Dirk Schwöeppe
  • Patent number: 8277601
    Abstract: Solvent free, moisture curable reactive hot melt adhesives are prepared using an oxazolidine functional prepolymer and a polyfunctional isocyanate.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: October 2, 2012
    Assignee: Henkel Corporation
    Inventors: Andrew Slark, Malcolm Graham
  • Patent number: 8268102
    Abstract: Method for making lignocellulosic composites by adhering lignocellulosic substrates together. A first variant of the method involves using an adhesive composition that comprises a reaction product of (i) first ingredient selected from a soy protein or lignin and (ii) at least one substantially formaldehyde-free curing agent that includes at least one amine, amide, imine, imide, or nitrogen-containing heterocyclic functional group that can react with at least one functional group of the soy protein. A second variant of the method involves using an adhesive composition that comprises a reaction product of (i) a protein or lignin, (ii) a first compound that includes at least one amine, amide, imine, imide or nitrogen-containing heterocyclic functional group that can react with at least one functional group of the protein and (iii) a curing agent.
    Type: Grant
    Filed: May 7, 2007
    Date of Patent: September 18, 2012
    Assignee: State of Oregon acting by and through the Oregon State Board of Higher Education on behalf of Oregon State University
    Inventor: Kaichang Li
  • Patent number: 8080609
    Abstract: The invention is a composition comprising a) one or more prepolymers having on average three or more aliphatic isocyanate groups and further containing alkoxysilane groups; b) one or more aromatic polyisocyanates; c) one or more compounds having at least one heterocyclic ring which hydrolyzes when exposed to moisture to form at least one isocyanate reactive group; d) one or more solvents; and e) one or more amine and/or organometallic polyurethane catalysts; wherein the ratio of aromatic isocyanate groups to aliphatic isocyanate groups in the composition is from about 0.5:1.0 to about 1.5:1.0, preferably about 0.9:1.0 to about 1.5:1.0, and the equivalent ratio of isocyanate groups to isocyanate reactive groups derivable from the one or more compounds having at least one hydrolyzable heterocylic ring is from about 0.8:1.0 to about 5.3:1.0, and most preferably about 1.5:1.0 to about 1.7:1.0.
    Type: Grant
    Filed: October 29, 2009
    Date of Patent: December 20, 2011
    Assignee: Dow Global Technologies LLC
    Inventor: Stefan Schmatloch
  • Patent number: 8066891
    Abstract: The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.
    Type: Grant
    Filed: October 6, 2006
    Date of Patent: November 29, 2011
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Shigeki Kawano, Michiaki Uchiyama, Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose
  • Patent number: 8043534
    Abstract: The invention is based on the discovery that compositions containing certain maleimide compounds and aromatic diene compounds are useful as thermosetting resins for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways, with or without a catalyst. In some embodiments, the well-known “ene” reaction can be used to cure the compositions described herein, and therefore no catalyst is required.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: October 25, 2011
    Assignee: Designer Molecules, Inc.
    Inventor: Stephen Dershem
  • Publication number: 20110198028
    Abstract: The invention relates to an improved two component adhesive system, a kit comprising said two adhesive components, its use and a method for production of interior wood products, in particular form-pressed products, parquet floor elements and solid wood panels with very low formaldehyde emission and to the interior wood products obtainable having improved properties. The two-component adhesive system comprises adhesive component I comprising a 50-70 wt % melamine-formaldehyde (MF) type resin in 25-40 wt % water and adhesive component II comprising 25-40 wt % of a water based dispersion adhesive, 15-40 wt % of a formaldehyde scavenger and an acidic compound in an amount such that the pH of adhesive component II is 1.5-6.5, wherein adhesive component I and II are to be applied in a weight ratio I:II of 1:0.5 to 1:1.5 and the adhesive system has a molar ratio of formaldehyde (F) to total amino group (F/NH2) between 0.2 and 0.7.
    Type: Application
    Filed: February 11, 2011
    Publication date: August 18, 2011
    Applicant: DYNEA OY
    Inventors: Astrid PEDERSEN, Kristin GRØSTAD, Per Olav SANDBAKKEN
  • Publication number: 20110133330
    Abstract: The present invention relates to thermosetting resin compositions that include maleimide-, nadimide- or itaconimide-containing compounds and a metal/carboxylate complex and a peroxide, which is curable at a low temperature at relative short period of time, such as less than about 100° C., for instance 55-70° C., over a period of time of about 30 to 90 minutes. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and packages and assemblies prepared therewith for connecting microelectronic circuitry.
    Type: Application
    Filed: February 15, 2011
    Publication date: June 9, 2011
    Applicant: Henkel Corporation
    Inventors: Jie Bai, Shashi K. Gupta
  • Publication number: 20110135944
    Abstract: A thermosetting composition comprising (a) (a) at least one phosphorous-free dihydrobenzoxazine component; (b) at least a sulfonium salt and (c) optionally a compound comprising at least an epoxy group is disclosed. Cured products made from these compositions have valuable chemical, physical and mechanical properties.
    Type: Application
    Filed: April 24, 2009
    Publication date: June 9, 2011
    Applicant: Huntsman International LLC
    Inventor: Frans Setiabudi
  • Publication number: 20100092731
    Abstract: Building panels with a thin and embossed surface layer and a sub layer between a surface layer and a core.
    Type: Application
    Filed: April 6, 2009
    Publication date: April 15, 2010
    Applicant: Valinge Innovation Belgium BVBA
    Inventors: Darko PERVAN, Jan Jacobsson, Kent Lindgren, Göran Ziegler, Niclas Håkansson, Eddy Boucké
  • Patent number: 7629056
    Abstract: A circuit terminal connected structure and a circuit terminal connecting method are provided. Both the structure and the method feature a circuit connecting material formulated with the following components: a curing agent capable of generating free radicals upon heating; an acrylate or methacrylate radical polymerizable substance; and either an acrylic rubber or a maleimide radical polymerizable substance having at least two maleimide groups per molecule. In some embodiments, the curing agent features a 10-hour half life temperature of 40° C. or above and a 1-minute half-life temperature of 180° C. or below. In other embodiments, the circuit connecting material includes conductive particles. In additional embodiments, the circuit connecting material includes a hydroxyl-group-containing resin having a weight average molecular weight of 10,000 or more.
    Type: Grant
    Filed: June 4, 2004
    Date of Patent: December 8, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atsushi Kuwano
  • Patent number: 7537839
    Abstract: The present invention generally relates to anaerobically curable compositions of: (a) a cyanate ester compound having the structure of formula I: R1O—C?N)m??(I) ?wherein m is from 2 to 5 and R1 is an aromatic nucleus-containing residue; (b) a (meth)acrylate monomer; and (c) an anaerobic cure inducing composition comprising peroxide and saccharin, wherein said composition is free of added metallic catalyst.
    Type: Grant
    Filed: April 2, 2007
    Date of Patent: May 26, 2009
    Assignee: Henkel Corporation
    Inventors: Shabbir Attarwala, Qinyan Zhu, Susan Lamtruong Levandoski
  • Publication number: 20090087591
    Abstract: Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a liquid rubber, and a thermally activated free radical curing agent. Various embodiments add one or more of a silane coupling agent, an ethylenically unsaturated compound with acid functionality, electrically conductive particles, and electrically conductive scrim. Methods of using the compositions also are provided.
    Type: Application
    Filed: September 9, 2008
    Publication date: April 2, 2009
    Inventors: Eric G. Larson, Robert L.D. Zenner, Cameron T. Murray, Ravi K. Sura
  • Publication number: 20080311412
    Abstract: Adhesive polymers are formed when polyvalent azides and alkynes are assembled into crosslinked polymer networks by copper-catalyzed 1,3-dipolar cycloaddition. The condensation polymerization is efficiently promoted by Cu ions either leached from the metal surface or added to the monomer mixture, and strong interactions with metal surfaces are provided by the multiple triazole binding elements produced. The adhesive polymers may be formed either as adhesive polymer coatings or as adhesive polymer cement.
    Type: Application
    Filed: July 22, 2005
    Publication date: December 18, 2008
    Applicant: THE SCRIPPS RESEARCH INSTITUTE
    Inventors: Valery Fokin, M. G. Finn, K. Barry Sharpless
  • Patent number: 7452442
    Abstract: The present invention relates to a method of gluing wood based materials by providing an adhesive system onto wood based materials followed by curing, the adhesive system comprises a melaminic amino resin and a phenolic resin composition, wherein the phenolic resin composition comprises an acid and a phenolic resin. The invention also relates to an adhesive system and a stable phenolic resin composition as well as wood based products obtained by the method or through the use of the adhesive system.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: November 18, 2008
    Assignee: Akzo Nobel N.V.
    Inventors: Salme Pirhonen, Benyahia Nasli-Bakir, Ingvar Lindh
  • Publication number: 20080257493
    Abstract: The invention is based on the discovery that certain well-defined compounds derived from pentacyclopentadecane dimethanol are useful components in adhesive formulations. In particular, the invention compounds described herein provide high Tg values and low shrinkage. Compounds of the invention are useful as adhesives for use in the semiconductor packaging industry.
    Type: Application
    Filed: April 9, 2008
    Publication date: October 23, 2008
    Inventor: Stephen M. Dershem
  • Patent number: 7342053
    Abstract: Producing a printed circuit board, by coating a resin composition comprising an aromatic cyanate compound having two or more cyanato groups in a molecule and a radical-polymerizable resin on a circuit substrate, photo-curing the resin composition, and thermally curing the photo-cured resin composition to thereby form an insulation layer, affords an insulation layer with improved surface smoothness and excellent dielectric properties.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: March 11, 2008
    Assignee: Ajinomoto Co., Inc.
    Inventor: Shigeo Nakamura
  • Patent number: 7297217
    Abstract: The invention is a method for application of a special low viscosity cyanoacrylate adhesive which is used for the manufacture and repair of wooden furniture. The cyanoacrylate adhesive quickly penetrates and bonds wood to wood. The wooden furniture that results from the process of this invention are cohesive in structure and are ready for immediate use. This special wood grade cyanoacrylate adhesive provided by this invention permits those in the furniture repair or furniture manufacture industries with a method of repairing or assembling wooden furniture in an easy and quick manner.
    Type: Grant
    Filed: May 27, 2003
    Date of Patent: November 20, 2007
    Assignee: The Wonderlokking Corp.
    Inventor: David Dewitt
  • Patent number: 7271227
    Abstract: The present invention generally relates to curable compositions free of metallic catalysts. The inventive compositions are capable of curing when applied to a metal substrate. The inventive compositions provide improved thermal performance and enhanced cure strength on oily metal surfaces.
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: September 18, 2007
    Assignee: Henkel Corporation
    Inventors: Shabbir Attarwala, Qinyan Zhu, Susan Lamtruong Levandoski
  • Patent number: 6858295
    Abstract: A pressure sensitive adhesive comprising a mixture of: a radiation-crosslinkable polymer A) composed of at least 40% by weight of C1 to C18 alkyl (meth)acrylates, and a polymer B) composed of at least 20% by weight of vinylpyrrolidone and of less than 40% by weight of C1 to C18 alkyl (meth)acrylates, wherein the fraction of the polymer B) in the mixture is less than 15% by weight, based on the sum of A)+B).
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: February 22, 2005
    Assignee: BASF Aktiengesellschaft
    Inventors: Heiko Diehl, Karl-Heinz Schumacher, Ralf Fink, Martin Jung
  • Publication number: 20040242817
    Abstract: Disclosed are internally coordinated organoboranes as 5, 6, or 7-membered rings formed from an unsaturated amine, amidine, or guanidine and dialkylhydroborane under hydroboration conditions, as well as two-part adhesive or coating kits containing radical polymerizable material and the internally coordinated organoborane.
    Type: Application
    Filed: May 29, 2003
    Publication date: December 2, 2004
    Applicant: Lord Corporation
    Inventors: Jonathan L. Kendall, Kirk J. Abbey
  • Patent number: 6824642
    Abstract: The following invention relates to phenyl-linked polybenzoxazoles having terminal, aryl- or heteroaryl-attached cyanate groups which can be used for adhesive bonding and as dielectrics, especially for electronic components, and to a process for preparing them.
    Type: Grant
    Filed: July 26, 2002
    Date of Patent: November 30, 2004
    Assignee: Infineon Technologies AG
    Inventors: Andreas Walter, Recai Sezi
  • Patent number: 6787244
    Abstract: The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).
    Type: Grant
    Filed: July 30, 2002
    Date of Patent: September 7, 2004
    Assignee: Infineon Technologies AG
    Inventors: Recai Sezi, Andreas Walter
  • Patent number: 6667108
    Abstract: A resin impregnated overlay is applied to a wood veneer, which in turn may be adhered to a substrate.
    Type: Grant
    Filed: February 7, 2002
    Date of Patent: December 23, 2003
    Inventor: Erick Ellstrom
  • Publication number: 20030215630
    Abstract: A pressure sensitive adhesive composition is described, comprising the reaction product of a copolymer and a bisamide crosslinking agent, (A) the copolymer comprising the reaction product of (i) a (meth)acrylate ester of a non-tertiary alcohol in which the alkyl group contains between 1 and 4 carbon atoms, inclusive, and (ii) a carboxylic acid-functional, ethylenically unsaturated co-monomer, and (B) a bisamide crosslinking agent having the formula: 1
    Type: Application
    Filed: May 20, 2002
    Publication date: November 20, 2003
    Applicant: 3M Innovative Properties Company
    Inventors: Kurt C. Melancon, Timothy D. Filiatrault, Shwi-Long J. Hwang, Rodger J. Pereyra
  • Patent number: 6632314
    Abstract: A method of making a surface planarization is provided using a separate pre-cut or precured film laminated onto a metallized surface to form planarized dielectric coating. The method comprises the steps of: (a) providing a thin film interconnect module with a polyimide adhesive laminated with a pre-cut or pre-cured polyimide lamination film on the top of the polyimide adhesive, the polyimide lamination film being covered with a glass plate; (b) applying pressure and heat in a synchronized format to ensure a uniform curing and gap filling in the thin film module metal for the adhesive layer; and (c) releasing the glass plate to expose a smooth lamination film surface.
    Type: Grant
    Filed: December 29, 1999
    Date of Patent: October 14, 2003
    Assignee: International Business Machines Corporation
    Inventors: RongQing Yu, Kimberley A. Kelly, Chandrika Prasad, Sung Kwon Kang, Sampath Purushothaman
  • Patent number: 6613183
    Abstract: The invention is a method for application of a special low viscosity cyanoacrylate adhesive which is used for the manufacture and repair of wooden furniture. The cyanoacrylate adhesive quickly penetrates and bonds wood to wood. The wooden furniture that results from the process of this invention are cohesive in structure and are ready for immediate use. This special wood grade cyanoacrylate adhesive provided by this invention permits those in the furniture repair or furniture manufacture industries with a method of repairing or assembling wooden furniture in an easy and quick manner.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: September 2, 2003
    Assignee: The Wonderlokking Corp.
    Inventor: David Dewitt
  • Patent number: 6478920
    Abstract: A chip-type circuit component comprising a chip body which is formed by bonding first and second substrates with each other. A polyimide adhesion layer is provided between the first and second substrates and a thin film circuit pattern is formed on at least one of a pair of main surfaces of the first and second substrates which are opposite each other, while an external electrode is formed on an end surface of the chip body to be electrically connected with the thin film circuit pattern.
    Type: Grant
    Filed: August 1, 1997
    Date of Patent: November 12, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Osamu Kanoh, Masahiko Kawaguchi, Masahiro Bando, Atsuo Senda
  • Patent number: 6440258
    Abstract: The present invention provides an adhesive film for semiconductor package, which comprises a polycarbodiimide resin, an epoxy resin and an inorganic filler, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as measured by gel permeation chromatography, the epoxy resin is contained in an amount of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin, and the inorganic filler is contained in an amount of 30 to 70% by weight based on the total resin content.
    Type: Grant
    Filed: September 22, 1999
    Date of Patent: August 27, 2002
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Yasuo Imashiro, Takahiko Ito, Hideshi Tomita, Norimasa Nakamura
  • Publication number: 20010010860
    Abstract: A metal film, particularly, a stainless steel film having been not subjected to roughing treatment, and an aromatic polyimide substrate film having a thermoplastic surface can be combined with a high bonding strength to form a metal film/aromatic polyimide film laminate, utilizing an amorphous aromatic polyimide film of 0.05 to 3 &mgr;m thick which has a glass transition temperature in the range of 200 to 300° C.
    Type: Application
    Filed: January 31, 2001
    Publication date: August 2, 2001
    Applicant: Ube Industries, Ltd.
    Inventors: Hiroaki Yamaguchi, Fumio Aoki