Abstract: A method for fabricating a Fresnel lens or other lens having a structured surface such as refractive and/or diffractive bi-focal or other multi-focal lenses includes press-coating the structured surface with a low or very low refractive index coating material. The coating is sufficient thick to adequately cover the structured surface so that a smooth coating surface with good optical properties is obtained, for example in the case of a Fresnel structure a thickness greater than 1.5 times and less than 5 times the Fresnel structure height, and is cured in situ. A film, e.g., of PET, PC or PU or a film stack, e.g. a TAC/PVA/TAC film stack is prepared and a heat melting adhesive is applied to the side of the film or film stack to be contacted with the coated structured surface of the lens blank. The film or film stack is then laminated to the cured coating.

Abstract: Adhesive tape having a carrier and a layer of adhesive applied on at least one side to the carrier, the carrier having at least one foam layer composed at least in part of a polyolefin-based polymer, wherein the polyolefin-based polymer contains an ethylene multi-block copolymer in a fraction of at least 40% (w/w), the ethylene multi-block copolymer being composed of hard segment blocks, containing at least 95% (w/w) of ethylene and a comonomer, and of soft segment blocks, containing ethylene and a comonomer, the fraction of comonomer in the soft segment blocks being between 10 and 20 mol %.

Abstract: A microchip plate made such that polymer substrates made, in particular, of a cycloolefin polymer (COP) or a cycloolefin copolymer (COC) can be appropriately bonded to each other and a process for producing the microchip plate are provided. A microchip plate (1) of an embodiment is constituted by a first substrate (2) and a second substrate (3), which are bonded to each other through an adhesive layer (5), wherein the first substrate (2) and the second substrate (3) are formed by a COP or a COC, and the adhesive layer (5) is formed of paraffin or naphthene or formed including paraffin or naphthene and at least any one of an adhesion auxiliary material, a polymer constituting each of the first substrate and the second substrate, and a macromonomer.

Abstract: An inkjet head and a production method wherein the inkjet head is produced by forming a film on a head chip having a channel member with an ink channel formed thereon and joining an end surface of the head chip coated with the film to a nozzle plate. The method includes a step of applying an adhesive containing spherical particles, whose volume average particle diameter is in the range of 0.95*Rz (MV) to 2.0*Rz (MV), in the range of 0.1 volume % to 10.0 volume % to at least one of the end surface of the head chip and a joint surface of the nozzle plate and then joining the nozzle plate.

Abstract: A solid, dry to the touch at ambient temperature, heat curable, generally non-foaming structural adhesive that exhibits shape memory characteristics. The adhesive can be cured at an elevated temperature and contains a high molecular weight polymeric constituent that can be oriented such that at an elevated temperature below the curing temperature the material will shrink in one plane while increasing its thickness at a temperature in the range of from above the elevated temperature to below the curing temperature.

Abstract: The invention relates to a method for laminating a plastic film with a wood-base substrate, in particular for producing a high-gloss surface on a wood-base substrate, in which a plastic film is laminated by means of a laminating agent, preferably an adhesive, with a wood-base substrate and permanently bonded to the wood-base substrate, the plastic film being formed so as to be transparent on its top, and the products obtainable in this manner and their use, in particular in the area of the wood and furniture industry, for example for the production of pieces of furniture and fitments of all kinds.

Abstract: The invention relates to a crosslinkable one-component laminating adhesive containing (i) 25 to 80 wt % polyester prepolymers, polyether prepolymers, and/or polyurethane prepolymers that are free of NCO groups and comprise at least one crosslinkable alkoxysilane group, as well as additionally NCO groups reacted with compounds that contain no hydrolyzable groups, and the prepolymer possesses a molecular weight from 2000 to 30,000 g/mol, (ii) 75 to 20 wt % organic solvent having a boiling point of up to 130° C., (iii) 1 to 20 wt % polymers, oligomers, and/or monomers that contain one or more anhydride groups, (iv) 0 to 15 wt % additives, where the viscosity of the adhesive is between 50 and 20,000 mPas (per DIN ISO 2555), measured at 15 to 45° C.

Abstract: The invention relates to the use of a hot-melt adhesive having high hardness for adhesive bonding of metal films or foils, paper films or foils, and/or plastic films or foils. The invention further relates to a method for adhesively bonding a metal film or foil, paper film or foil, and/or plastic film or foil onto a substrate.

Abstract: Hot melt adhesive compositions which have enhanced adhesion to difficult substrates, particularly at refrigerator/freezer temperatures or at elevated temperatures. The inventive compositions require a base polymer comprising at least one metallocene ethylene-containing polymer or at least one non-metallocene, amorphous, propylene containing polymer; a tackifier; an optional wax; and an adhesion promoting additive comprising at least one semi-crystalline polymer having a weight average molecular weight of about 30,000 daltons or less. It has been found that the adhesion promoting additive of this invention enhances the adhesion properties of a hot melt adhesive composition having a metallocene ethylene-containing base polymer or non-metallocene, amorphous, propylene containing base polymer, particularly at elevated temperatures or at low refrigerator and freezer temperatures where other conventional adhesives have been unsuccessful.

Abstract: An OLED device is discussed. The OLED device includes: a board assembly configured to include organic light emission elements; a plastic cover attached to the board assembly; and an adhesive layer filled between the board assembly and the plastic cover. The adhesive layer is formed from an adhesive composition which includes 50˜95 parts by weight of an acryl-based copolymer resin, 4.7˜44 parts by weight of an acryl monomer, 0.1˜2 parts by weight of a cross linking monomer, 0.1˜2 parts by weight of a visible light initiator, and 0.1˜2 parts by weight of an additive.

Abstract: It has been discovered that amorphous polybutene copolymers that have a softening point of from about 70 to about 105° C. and viscosity of less than about 1,900 cP at 190° C. possesses desirable properties and may be used to make a low application temperature hot melt adhesive for disposable absorbent articles.

Abstract: A process margin is improved and high connection reliability is obtained. Disclosed is an anisotropic conductive material including an adhesive composite and conductive particles dispersed in the adhesive composite, the adhesive composite containing a film forming resin, an ethylene vinyl acetate copolymer, a radical polymerizable resin, and a radical polymerization initiator, wherein the ethylene vinyl acetate copolymer to be used has a melt flow rate of not less than 400 g/10 min.

Abstract: The invention relates to composition for an acrylic structural adhesive containing a mixture of block copolymers containing styrene and an elastomer.

Abstract: An adhesive composition including a hydrocarbon resin, a modified elastomer that is bonded with at least one functional group-containing atom group, and a solvent.

Abstract: The invention includes a hot melt adhesive composition that includes at least one of an isotactic copolymer of butene-1 and a metallocene catalyzed propylene homopolymer, a tackifying resin, and, optionally, a wax. The adhesive composition initially exhibits adhesion quality and subsequently non-adhesion quality. The invention also includes methods of using the adhesive composition for temporarily bonding substrates.

Abstract: A hot melt adhesive composition includes at least a semi-crystalline copolymer of propylene and a polyethylene wax having a Brookfield viscosity of about 20 cP to 500 cP at 140° C., a density of about 0.95 g/cm3 to 0.99 g/cm3 between 23° C. and 25° C., and a Mettler drop point of about 110° C. to 135° C., wherein the composition is characterized by a effective set time of about 0.1 second to 5 seconds. Articles including the composition and methods of making articles including the composition are described.

Abstract: Hot melt packaging adhesives comprising a base polymer component, a tackifier component and a wax component, which wax component comprises a soy wax, and are described.

Abstract: A joined body includes: an adherend; a primer layer provided on the adherend; and a pressure-sensitive adhesive layer provided on the primer layer. The primer layer contains, as an effective component, at least one of chlorinated polypropylene and chlorinated polyethylene and an amount of the effective component per unit area is 0.5 [mg/cm2] or less. The surface of the adherend may be formed of at least one of polypropylene (PP), polyvinyl chloride (PVC), and ethylene-propylene-diene rubber (EPDM).

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract: The invention relates to a single-ply protective film that is devoid of a supporting material and consists of a hot-melt adhesive. Said film can be rapidly and easily applied. The invention also relates to a method for applying said film and to a corresponding device.

Abstract: A hot melt adhesive composition that includes a non functionalized amorphous poly alpha olefin polymer, a second polymer selected from the group including polypropylene homopolymers, polypropylene copolymers and combinations there of, a functionalized wax and a second wax.

Abstract: A method of making a display assembly includes the steps of (a) attaching a first substrate and a second substrate with an optically clear heat activated adhesive to form a laminate. Each of the first and second substrate has opposing major surfaces. At least one of the first and second substrate has a three dimensional surface topography covering at least a portion of one of its major surfaces or is distortion sensitive. At a heat activation temperature, the adhesive is pressure sensitive. The method also includes heating the laminate to the heat activation temperature of the adhesive causing the adhesive to flow. The activation temperature is greater than 40° C. and less than 120° C.

Abstract: Cement tile adhesives and methods for using them, the adhesives comprising a dry mix of a water-redispersible polymer powder made from a low carboxylation, large particle size water-soluble film-forming vinyl aromatic-diene copolymer latex and a reduced amount of cellulose ether exhibit superior water immersion shear strength and freeze/thaw shear strength.

Abstract: Laminated metallic sheets which comprise an interior layer of a viscoelastic polymeric compound sandwiched between outer layers of metallic sheet may exhibit enhanced properties through modification of the viscoelastic phase. In a first embodiment the elastic modulus of the viscoelastic polymeric compound may be reduced by incorporating voids, bubbles or pores within the compound. These voids which may be introduced by introduction of polymeric microspheres are effective in reducing the internal stresses induced in the laminate by temperature changes. In a second embodiment, coating the microspheres with an electrically-conductive layer may be effective in enabling resistance spot welding of such laminated materials.

Abstract: The invention relates to a composition for an acrylic structural adhesive containing a mixture of block copolymers, of elastomer and of elastomeric polymer particles.

Abstract: The invention relates to a method of manufacturing a heat storage material that contains heat storage capsules. The heat storage capsules include a phase change material that absorbs and/or discharges latent heat in response to a change in temperature. The phase change material resides within outer shells of the heat storage capsules. The method involves binding abutting peripheral portions of a plurality of heat storage capsules with a molding binder, so as to form an intermediate granular molded heat storage material. An outer peripheral surface portion of the granular molded heat storage material is coated with a coating binder. The coated granular molded heat storage material is then subjected to a treatment that causes the coating binder of the coating layer to polymerize. The invention also relates to heat storage adsorbent materials, and articles (e.g., canisters) that include such heat storage adsorbent materials.

Abstract: The invention provides a carbon fiber-reinforced composite material including reinforcing fibers which are continuous carbon fibers in the form of a unidirectional (UD) material, a woven fabric, or a knitted fabric, and a matrix resin including a modified polyolefin resin, thereby achieving better adhesion and mechanical strength. The matrix resin forms a polyphase structure having a sea-island structure which has an average island (independent phase) diameter of not greater than 0.5 ?m. The composite material includes as a matrix resin a modified polyolefin resin obtained by, for example, graft-modifying a polyolefin resin with a monomer that contains an ethylenic double bond and a polar group in the same molecule; and includes as reinforcing fibers continuous carbon fibers.

Abstract: A cured adhesive composition comprising: (a) a copolymer comprising the reaction product of: 65 to 94.5 wt % of a C?8#191 acrylate ester, 0.5 to 5 wt % of a polar cross-linkable monomer, and 5-30 wt % of a non polar monomer, wherein the copolymer has a weight average molecular weight of 400,000 to 2,200,000 grains/mole; (b) 30 to 70 parts of a hydrogenated hydrocarbon tackifier per 100 parts of the copolymer; and (c) 0.01 to 3 parts (solid/solid) of a cross-linking agent per 100 parts of the copolymer wherein the cured adhesive has a peel value greater than 6 N/cm when tested according to FINAT test method No. 2 on a low density polyethylene; and further wherein the cured adhesive has a shear value greater than 2000 minutes when tested according to FINAT test method No. 8 on low density polyethylene. The cured adhesive of this disclosure is found to exhibit excellent adhesion to low surface energy substrates.

Abstract: The present invention pertains to carpet and method of making it. In one aspect, the carpet includes (a) a primary backing which has a face and a back surface, (b) a plurality of fibers attached to the primary backing and extending from the face of the primary backing and exposed at the back surface of the primary backing, (c) an adhesive backing, (d) an optional secondary backing adjacent to the adhesive backing, and (e) at least one homogeneously branched linear ethylene polymer. The method includes extrusion coating at least one homogeneously branched linear ethylene polymer onto the back surface of a primary backing to provide an adhesive backing. The method can include additional steps or procedures, either separately or in various combinations.

Abstract: A method of forming an adhesive bond between a first substrate and a second substrate includes applying a semi-crystalline polymeric adhesive composition to a bonding area of the first substrate, and, after applying, disposing the second substrate adjacent to and in contact with the composition to form a workpiece. After disposing, the method includes heating the workpiece to cure the composition and thereby form a thermoset polymeric adhesive material that is crosslinked. After heating, the method includes cooling the workpiece such that the material has a crystalline molecular structure. Concurrent to cooling, the method includes imposing a stress on the material to thereby orient the crystalline molecular structure in a desired direction, and, after imposing, dissipating the stress along the crystalline molecular structure in the desired direction to thereby form the adhesive bond between the first substrate and the second substrate.

Abstract: Systems and methods for covering a manmade pool (10) are disclosed. The system comprises an insulating cover (12) and a roller (14) positioned along at least one edge of the pool (10), wherein the roller is attached to at least one edge of the insulating cover (12) and the insulating cover is capable of being wound upon the roller (14). In an embodiment, the system further comprises a guide (18) capable of guiding at least one leading edge of the insulating cover (20) across the pool (10), such that the insulating cover can be moved from an open position, with the insulating cover wound around the roller (14), to a closed position, with the insulating cover secured over the pool. In some embodiments, the insulating cover (12) further comprises reinforcing material that adds sufficient strength to the cover that when in the closed position over the pool, the cover can support the weight of at least one adult human.

Abstract: [Problem] To provide a thermoplastic resin composition which is excellent in transparency and adhesion properties and hardly causes staining of an adherend after it is separated, a multilayer laminate using the composition, an article, and a method for protecting a surface of an article. [Means for solving problem] A thermoplastic resin composition (X) comprising the following components (A) to (C): (A) isotactic polypropylene containing not less than 90% by mol of propylene units, in an amount of 1 to 65% by weight, (B) a propylene copolymer which is a copolymer of propylene and at least one ?-olefin of 2 to 20 carbon atoms (excluding propylene) and whose melting point, as measured by DSC, is lower than 65° C.

Abstract: A process for producing a multilayer structure comprising: contacting an adhesive layer having a first side and a second side, on its first side with a metal layer having a first side and a second side, on its first side at a temperature of 325° F. to 425° F. for a contact time of 0.5 to 5.0 seconds, thereby adhering the adhesive layer to the metal layer. The adhesive layer comprises an ethylene-C4-8 ?-olefin linear low density copolymer; a polymer grafted with an ethylenically unsaturated carboxylic acid or acid derivative; and a styrene-butadiene-styrene triblock copolymer having an MI of 5 to 50.

Abstract: A process is provided for making a bond between a first, relative hydrophilic nonwoven and a second relatively less hydrophilic nonwoven by use of a construction adhesive, by applying the adhesive only to the first more hydrophilic nonwoven; also provided are absorbent cores for absorbent article comprising such bonded nonwovens, and such absorbent articles.

Abstract: A low viscosity, high tensile strength polymer having a bi-modal molecular weight distribution is produced using a combination of high molecular weight polymer and low molecular weight polymer. The polymer chains have a high content of meso dyads that results in a greater amount of crystalline regions when the polymer is solidified. The low molecular weight chains provide high flow characteristics when the polymer is molten. The process for producing the high content of meso dyads includes the use of an external donor catalyst during the reaction.

Abstract: A hot-melt adhesive composition, the use thereof, and a composite body including the hot-melt adhesive composition. The hot-melt adhesive composition includes a polyolefin P, which is solid at 25° C., a soft resin WH with a softening point between ?10° C. and 40° C., and a polar modified polyolefin wax PW.

Abstract: A hot melt adhesive composition that includes a first tackifying agent that includes phenol-modified aromatic hydrocarbon resin, thermoplastic polymer that includes ethylene copolymer, and a first wax.

Abstract: Styrene-acrylic-based binder compositions and methods for their preparation and use are described herein. The binder compositions include a filler and a binder comprising a styrene-acrylic-based copolymer. In some embodiments, the copolymer has a gel content of less than 75%. In some embodiments, the copolymers can be derived from at least one crosslinkable monomer. The weight ratio of filler to binder in the compositions is at least 5:1.

Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.

Abstract: Adhesive tape having a carrier and a layer of adhesive applied on at least one side to the carrier, the carrier having at least one foam layer composed at least in part of a polyolefin-based polymer, wherein the polyolefin-based polymer contains an ethylene multi-block copolymer in a fraction of at least 40% (w/w), the ethylene multi-block copolymer being composed of hard segment blocks, containing at least 95% (w/w) of ethylene and a comonomer, and of soft segment blocks, containing ethylene and a comonomer, the fraction of comonomer in the soft segment blocks being between 10 and 20 mol %.

Abstract: A method for producing an adhesive layer, an aqueous adhesive dispersion containing chlorinated polyolefins and further additives, having a pH from 10 to 13, being provided; said adhesive being adjusted, by the introduction of CO2, to a pH below 9.0; and an adhesive layer then being applied, wherein the quantity of CO2 to be introduced is determined and regulated by measuring the pH of the dispersion.

Abstract: High temperature performance hot melt adhesives are formulated for application at low temperatures below, i.e., below 300° F. Hot melt adhesives containing low levels of metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly useful as packaging case and carton adhesives.

Abstract: Thermoplastic oil-modified alkyd resins are described herein. Such resins can be used as the predominant component of a hot melt adhesive which can be employed for instance as a construction adhesive in the manufacture of disposable absorbent articles. The composition also includes a copolymer formed from at least two monomer types of which at least one monomer type is a polar monomer and at least one monomer type is an apolar monomer, and a solid plasticizer.

Abstract: Co-agglomerated dispersions and methods for their preparation are described herein. The co-agglomerated dispersions are prepared by co-agglomerating an anionic polymer dispersion and inert particles. The polymers for use in the co-agglomerated dispersions are derived from one or more monomers including at least one conjugated diene monomer. The inert particles have a particle size of less than 2 ?m. Also described herein is an aqueous dispersion including co-agglomerated particles formed from at least one polymer and at least one inert material. Further described herein are foamed polymers, latex-based adhesives, waterproofing membranes, sound absorbing coatings, and methods for their preparation and use.

Abstract: The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled without negatively affecting the performance of the adhesive. The thermally reversible composition may also be used as a primer layer. The thermally reversible hot melt adhesive and primer are particularly well suited for end use applications such as packaging, graphic arts, construction, footwear, textiles, general assembly, automotive and consumer goods.

Abstract: An adhesive tape that is stretch releasable, articles that contain the adhesive tape, and uses of the adhesive tape are disclosed. The adhesive tape includes a backing layer that is adjacent to at least one pressure-sensitive adhesive layer. The backing layer includes a poly(alkylene)copolymer. Each pressure-sensitive adhesive layer includes a polyisobutylene material. The adhesive tapes can be optically clear.

Abstract: Provided is an adhesive composition disclosed herein includes tannin, poly(ethylene glycol) and water. The adhesive composition has little toxicity, allows adhesion even in the absence of a thermosetting curing agent, and is hardly soluble in water to show moisture resistance, unlike known tannin adhesives. Therefore, the adhesive composition may be used as a medical adhesive, adhesive depot for sustained release of drug, anti-adhesion agent, cell/protein adsorption barrier and medical hemostatic applicable to various wet environments.

Abstract: A process of manufacturing paperboard includes mixing a predetermined weight percentage of polypropylene and a predetermined weight percentage of polyethylene in a tank; heating the tank to a predetermined temperature for forming an adhesive of the polypropylene and the polyethylene; flowing the adhesive out of the tank to coat on an outer surface of an endless, continuous paperboard member moving thereunder; and moving an endless, continuous textile to place on the adhesive at a joining line of a pair of opposite rotating rolls so that the rolls press the textile, the adhesive, and the paperboard member to cause the adhesive to adhere the textile and the paperboard member together to produce the finished paperboard having a textile surface.

Abstract: Absorbent articles comprising a low cold flow construction adhesive suitable for joining at least two absorbent article components together, wherein the adhesive comprises an ethylene-based polyolefin resin and certain crystallization enhancers, and wherein the absorbent articles have an in-bag compression opening force of less than about 0.75N. Also, a method for assembling such articles.

Abstract: A building panel comprising a fiberboard panel providing the structural integrity of the building panel. An insulation layer is laminated to the fiberboard panel, the insulation layer providing a required thermal value to the building panel. A functional layer forms an air barrier, a water barrier and/or a vapor barrier of the building panel. The functional layer is secured to the fiberboard panel on the opposite side of the insulation layer.