Abstract: A description is given of a method for joining a first and a second film web (2, 2?) of a transfer film or laminating film, wherein the film webs (2, 2?) comprise a thermoplastic carrier film (21) and a decorative layer (23). Formed between the first and second film webs (2, 2?) is a common joining portion (3), in which the first and second film webs (2, 2?) are joined to each other by a welding process. A device for carrying out the method is also described.

Abstract: A method of manufacturing a multilayer coating for decoration of surfaces includes the successive steps of providing a supporting substrate, applying a protective layer on that substrate, applying at least one first decorative layer on the protective layer to transfer a first ornamental patter thereto, depositing at least one adhesive layer on the first decorative layer to form a multilayer coating configured to be applied on a surface to be decorated. The substrate is a film of a polymeric material configured to be removed from the protective layer after application of the multilayer coating on the surface to be decorated. A system of manufacturing a multilayer coating for the decoration of surfaces.

Abstract: The present invention sufficiently heats a repairing material while preventing change in quality of a base material provided with the repairing material so as to securely bond the repairing material to a repair target portion. The repair method of the present invention, in order to repair a repair target portion 14 existing in an outer panel 1, includes: a repairing material disposing step of disposing a repairing patch 21 including a resistance heating element 23 and a carbon fiber reinforced resin, and an adhesive 22A including a thermosetting resin before being hardened for bonding the repairing patch 21 on the repair target portion 14; and a heating-hardening step of heating and hardening the thermosetting resin of the adhesive 22A by causing the resistance heating element 23 to generate heat through supply of electricity thereto.

Abstract: Aspects of the present invention relate to systems and methods for customizing microwave energy distribution within a chamber to accommodate various load characteristics. Aspects of the present invention customized configurations of ports, deflectors, waveguides, conducting rods, and slots to shape and distribute energy.

Abstract: A laminating device for bonding a protective layer to a substrate, including a driver and a roller head having a shape with a contour to fit a geometric feature of the substrate, is provided. The roller head has a cylindrical symmetry with an axis; the laminating device includes a coupler for mechanically coupling the driver to the roller head. The coupler is parallel to the axis so that the driver provides a rotational motion and a liner displacement to the roller head. The driver also provides a bonding energy to the roller head through the coupler. A roller head for use in a laminating device as above is also provided. A method for bonding a protective layer to a substrate using a laminating device as above is also provided.

Abstract: A photocurable resin composition for sealing an organic EL device is provided, which can seal the organic EL device without exerting any bad influence on the device, thereby suppress the formation and growth of dark spots positively, and which can ensure a high transmittance of light, thereby maintain a stable light emitting characteristic over a long period of time. The composition comprises (A) an epoxy resin containing at least two glycidyl groups in each molecule thereof and having a molecular weight of 200 to 7000, (B) an epoxy resin containing at least one glycidyl group in each molecule thereof and having a molecular weight of 20000 to 100000, (C) a latent acid photo catalyst adapted to be activated and produce an acid upon being irradiated with energy beam, and (D) a silane coupling agent containing a glycidyl group in each molecule thereof, the composition exhibiting non-fluidity at 25° C., but exhibiting fluidity in a temperature range of 50° to 100° C.

Abstract: A method of high-throughput printing and selective transfer of graphene onto a substrate includes the steps of: providing a thermal release tape having graphene adhered thereto; placing a substrate onto the graphene; pressing the thermal tape and the graphene against the substrate at a uniformly-distributed pressure; heating localized portions of the thermal tape and graphene using a localized heat source, thereby diminishing the adhesive properties of the thermal release tape in the localized portions and transferring graphene from said localized portions to the substrate; and separating the thermal release tape from the substrate. The method may include the further step of moving the localized heat source to selected positions on the thermal release tape during the heating step, thereby forming a pattern of heated portions. The method may use a laser beam as the localized heat source, movement of the laser beam being performed by a computer-controlled deflectable mirror.

Abstract: The present invention relates to a method for reshaping a workpiece, in which a reshaping force is exerted on the workpiece by means of a reshaping tool and the workpiece is heated during or before the reshaping of the workpiece, wherein the heating of the workpiece is performed by the at least partial absorption of an ultrasonic vibration in the workpiece. In order to provide a method and a device for reshaping a workpiece that avoids the aforementioned. disadvantages, in particular when reshaping materials with a highly temperature-dependent damping constant, it is proposed according to the invention that, before the reshaping force is applied to the workpiece, at least a first portion of the workpiece is brought to a temperature which differs from the temperature of a second portion of the workpiece that comes into contact with the reshaping tool.

Abstract: A multi-layered structure includes a first carrier, a second carrier, a first substrate and a second substrate. The first and second substrates are disposed between the first and second carriers. A panel sealant and a dummy sealant are positioned between the first and second substrates, wherein the panel sealant surrounds a display panel unit, and the dummy sealant is outside the panel sealant and surrounds the panel sealant. The dummy sealant to the peripheries of the first and the second substrates creates a gap. Then, glue seeps into the gap, and is cured subsequently. Next, a cutting step is performed on the first bonding structure (between the first substrate and the first carrier) and the second bonding structure (between the second substrate and the second carrier) to generate a cutting notch, respectively. The first and second carriers are peeled off from the corresponding cutting notches.

Abstract: A device uses magnetic force generated by a magnet to intensify compaction pressure applied to a composite laminate.

Abstract: A method for producing a receptacle which is closed by a sheet by transmission laser welding, and to an apparatus suitable to carry out same. The method and the apparatus are configured in such a way that a weld seam is formed between the wall structure of the receptacle and the sheet so as to be wider than the end faces of the wall structure.

Abstract: A joint system includes: a transfer-in/out station capable of holding a plurality of substrates or a plurality of superposed substrates, and transferring-in/out the substrates or superposed substrates to/from a processing station; and the processing station performing predetermined processing on the substrates and joining the substrates together. The processing station includes: a surface activation apparatus activating a front surface of the substrate; a surface hydrophilizing apparatus hydrophilizing and cleaning the front surface of the substrate; a joint apparatus joining the substrates together; and a transfer region for transferring the substrate or superposed substrate to the surface activation apparatus, the surface hydrophilizing apparatus, and the joint apparatus.

Abstract: An electrical charge is placed on a tool used to cure a composite resin part layup. The charged tool produces an electrostatic force that attracts entrapped gases in the resin to the surface of the tool, thereby reducing porosities in the cured part.

Abstract: An apparatus includes a metallic plate, a mixing assembly, a curing device, a receiving container, a mounting device, a cutting device, and a vacuum chamber. The metallic plate has a planar imprinting surface. The mixing assembly obtains a molding film material. The curing device cures the molding film material on the imprinting surface of the metallic plate to obtain an original film. The receiving container allows the original film to be immersed in a reaction liquid until the reaction liquid is absorbed by the original film, thereby obtaining a preprocessed molding film. The mounting device winds the preprocessed molding film around a main body. The cutting device cuts the preprocessed molding film to obtain a preprocessed molding roller. The vacuum chamber promotes the chemical reaction of the preprocessed molding film with the reaction liquid to form a number of silica nanoparticles in the preprocessed molding film.

Abstract: A system for constructing a pneumatic tire includes a tread component having two opposite tread splice ends, a water based adhesive applied to the tread splice ends for securing the tread splice ends to each other; and a heating means applied to the tread splice ends and water based adhesive for reducing drying duration of the water based adhesive.

Abstract: A method of singulating a plurality of semiconductor dies includes providing a carrier substrate and joining a semiconductor substrate to the carrier substrate. The semiconductor substrate includes a plurality of devices. The method also includes forming a mask layer on the semiconductor substrate, exposing a predetermined portion of the mask layer to light, and processing the predetermined portion of the mask layer to form a predetermined mask pattern on the semiconductor substrate. The method further includes forming the plurality of semiconductor dies, each of the plurality of semiconductor dies being associated with the predetermined mask pattern and including one or more of the plurality of devices and separating the plurality of semiconductor dies from the carrier substrate.

Abstract: An induction heating compaction system is provided. The system includes an induction heating member and a compaction member. The induction heating member is configured to generate an electromagnetic field at a select frequency. The select frequency causes at least one of the fibers and matrix in pre-preg material to heat up. The compaction member has at least a portion that is made from a material that is transparent to the select frequency of the electromagnetic field generated by the induction heating member. The compaction member includes a cooling assembly that is configured and arranged to extract heat from the pre-preg material while compacting the pre-preg material.

Abstract: Tubing sealers, whether hand held or desk mounted, heat seal liquid filled plastic tubing on command to develop sealed liquid filled easily separable segments serially attached to one another. The sealer generates a source of RF energy to heat seal the plastic tubing on placement of the tubing between a fixed jaw and a tubing compressing moveable ground jaw. The moveable ground jaw serves as a heat sink to dissipate heat and prevents a heat buildup during rapid repetitive operation of the sealer. The configuration of the moveable ground jaw coming in contact with the tubing primarily, but in combination with the degree of compression of the tubing and the RF power applied, controls both the integrity of the seal and the ease with which the sealed segments of tubing can be separated from one another.

Abstract: An adhesive may be formulated with a functional component that reacts in the presence of ultraviolet light with a neighboring functional component to form a nonreversible bond therebetween. The functional component may include at least one —C?C— functional group that is able to undergo dimerization with a neighboring component. A method for making the adhesive includes covalently bonding the functional component to a support polymer, wherein the functional component may be covalently bonded to the support polymer by a linking molecule. A kit containing the adhesive and an ultraviolet light source is also provided.

Abstract: A reactive polymer composition is provided, containing a (co)polymer that forms one or more reactive moities, either directly or indirectly, upon application of an ionizing radiation; and a multifunctional curing coagent, along with systems and methods for bonding substrates to one another using such a composition.

Abstract: The present disclosure provides a blocking device, which includes a blocking plat having a blocking pattern and transparent areas and an electromagnetic suction unit for sucking the blocking plate. In the embodiment, with the electromagnetic suction unit sucking the blocking plate, the requirements about the smoothness and cleanness of the surface of the blocking plate are decreased to reduce the manufacturing cost and maintaining cost of the sealant curing machine. Additionally, the blocking plate is more stably sucked.

Abstract: A method of processing a semiconductor assembly is presented. The method includes fabricating a photovoltaic module including a semiconductor assembly. The fabrication step includes performing an efficiency enhancement treatment on the semiconductor assembly, wherein the efficiency enhancement treatment includes light soaking the semiconductor assembly, and heating the semiconductor assembly. The semiconductor assembly includes a window layer having an average thickness less than about 80 nanometers, wherein the window layer includes cadmium and sulfur. A related system is also presented.

Abstract: The present invention relates to a process and to a device for manufacturing a hybrid contact lens (7, 21), from a composite part formed of a rigid central portion connected to a soft peripheral portion (9, 23) by an adhesive material (10, 24), to such a part and to such a lens. Starting from an oxygen-permeable rigid disc (2) and from a previously hydrated hydrophilic soft disc (3), a composite part (1) comprising three superposed layers is formed by bonding one disc to the other, said composite part (1) is dried for a defined time sufficient to allow the dehydration of the soft disc, then said composite part is dry cut with a machining tool by presenting the face of the hydrophilic soft portion (3) toward the tool in order to obtain the hybrid lens, by making a release strip (26) on the outer circumference (27) of the rigid peripheral portion.

Abstract: A device for manufacturing a reinforcing ply N by assembling lengths of strip cut at an angle, comprising: a feed means (300) for delivering a strip (B), an assembly belt (101), a transfer means (200) for conveying onto the assembly belt a given length of straight-grain strip in a direction (AA?) comprising a retaining wall (211), parallel to the planes of the assembly belt (101) and of the feed means, and a first face (211a) of which is intended to come into contact with the surface of the strip, in which device the feed means (300), the transfer means (200) and the assembly belt (101) are fitted with magnetic means.

Abstract: Disclosed are systems and methods for bonding wafers by use of microwave energy. Various components that facilitate relatively quick and efficient bonding provided by microwave energy are disclosed. In certain embodiments, devices and methods for applying desirable compression to the wafers can be implemented. In certain embodiments, devices and methods for providing a controlled gas environment such as vacuum can be implemented. In certain embodiments, devices and methods for maintaining the integrity of microwave mode of operation during the bonding process can be implemented. In certain embodiments, devices and methods for increasing throughput of the bonding process can be implemented.

Abstract: In a manufacturing method for a glass panel with a gasket, an elastic member is placed on a table, and a multilayer glass panel is placed thereupon. A die is pressed against a top surface of the multilayer glass panel, thereby compressing the elastic member and glazing gasket molding material together with adhesive ejected from the application nozzle and applied to the top surface of the multilayer glass panel.

Abstract: The invention provides a method and an apparatus for manufacturing a glass-sealed package, whereby anodic bonding of a pair of wafers is ensured over substantially the whole area of the wafers, and whereby a vacuum is ensured inside the cavity during the anodic bonding of the wafers. The invention also provides an oscillator having such characteristics. The manufacturing method of a glass-sealed package includes the step of anodically bonding a pair of wafers by applying voltage to positions corresponding to circumferential portions of the wafers stacked in layers, and the step of dividing the pair of anodically bonded wafers into individual pieces. A through hole is formed at a central portion of at least one of the wafers, and the anodic bonding of the wafers is made by applying voltage using a plurality of electrodes disposed at the positions corresponding to the circumferential portions of the wafers.

Abstract: The present invention relates to a method for the continuous inline production of coated polymeric substrates or laminates and also to an apparatus for implementing this method.

Abstract: The present disclosure discloses an optical fiber welding machine, including a device for butt joint of the optical fiber's core. The said device comprises a base and a number of units with V-shape groove. The base and the units are shaped respectively. The said units are mounted on the base fixedly. Comparing with the traditional overall molding device for butt joint of the optical fiber's core, the disclosed embodiment spats said traditional device, which has complicated structure and high accuracy requirements, into a base and a number of V-shape groove units, thus simplifies the shape of the components, which are shaped respectively, so as to facilitate the purpose of molding mould and shaping components, and then the v-shape groove units are mounted on the base. After completion of assembly, a v-shaped slot is grooved on top of each v-shape groove unit to ensure enough precision. The disclosed embodiment reduces both the mold manufacturing cost and the molding cost of components.

Abstract: A device for bonding a window includes a chamber having an internal space, a display panel fixing unit in the chamber and including a first curved surface, the first curved surface being configured to attach to a flexible display panel, a window fixing unit in the chamber and including a second curved surface, at least part of the window fixing unit including an ultraviolet transmitting material, the second curved surface facing the first curved surface and being complementary with the first curved surface, and the second curved surface being configured to attach to a window, and an ultraviolet irradiating unit on the window fixing unit, the ultraviolet irradiating unit being configured to irradiate ultraviolet light through the window fixing unit toward the first curved surface of the display panel fixing unit.

Abstract: Provided are a sealing method and device of a pouch type secondary battery including a pouch and an electrode tab provided for electrical connection with the pouch, in which the electrode tab is heated so that heat may be supplied to a tab sealant bonding between a bonding surface of a sealing part of the pouch and the electrode tab at the time of sealing the pouch type secondary battery.

Abstract: The invention relates to a device for producing a honeycomb structure from strip material comprising a supply and forming device, which forms a structured strip from the strip material and additionally determines a conveying speed of the structured strip, and a stop device comprising a feed channel, wherein the stop device is disposed downstream of the forming device such that the structured strip can be supplied to the feed channel, and wherein the honeycomb structure comprises a stop edge, which runs parallel to the feed channel, and wherein the stop device comprises a stop and stop means, which are designed in a movable manner such that the structured strip can be connected to a stop edge of the honeycomb structure.

Abstract: A fiber application machine comprising a fiber application head, a displacing system to displace said fiber application head, a fiber storage, and a fiber conveyor to convey the fibers from the fiber storage to the application head. The machine further comprises a safety system comprising at least one perimeter barrier defining a safety zone wherein the displacing system carrying the application head is placed, the fiber storage being arranged outside of said safety zone.

Abstract: A method for transferring an electronic component supported by a carrier to a desired position on a substrate include moving the carrier supporting the component relative to the substrate while the component is present on a side of the carrier facing towards the substrate, with the component is positioned opposite the desired position on the substrate. Then, a light beam is directed at the carrier, at the location of the component, from a side remote from the substrate, as a result of which a connection between the component and the carrier is broken and the component is transferred from the carrier to the substrate.

Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.

Abstract: A method and apparatus for sealing films. In one embodiment the sealing device comprises a horn and an anvil. The film has a standard portion and an increased portion. Increased energy is applied to the film in the increased portion compared to the energy applied to the standard portion. Such a method allows for sealing of varying number of layers.

Abstract: Process for manufacturing a plastic fuel tank provided with at least one accessory (14) connected to the internal space of the tank via at least one orifice (12) in the wall (10) of the tank, the accessory including a projecting element (24) extending to the outside of the tank, the processing comprising the steps consisting in providing a film (22) that includes a peripheral region (28) and a border region (30) around an opening in the film, in placing the film on the wall of the tank and on the outer surface of the accessory in such a way that the projecting element passes through the film via the opening, in welding the film over its entire peripheral region to the wall of the tank, and in welding the film, over its entire border region, to the outer surface of the accessory.

Abstract: The invention describes a device and method for making corrugated products. The device can be used with any substrate and includes, at least, first and second drive rollers for driving a middle substrate and a single wall corrugated product. In other embodiments the invention includes upper drive rollers, lower drive rollers and middle drive rollers for driving an upper substrate, a lower substrate and a middle substrate. The middle substrate is driven between the upper and lower substrates at a higher velocity to form flutes that are anchored between the upper an lower substrates thereby forming a corrugated product. The invention also provides for customized corrugated products having multiple fluted substrates in various desirable arrangements. Examples of such products include mattress, partition panels, other furniture and construction products.

Abstract: There is described a method for applying foil material (200) onto successive sheets (S), especially sheets of securities. In a first step, individual sheets (S) are transported in succession along a sheet transport path. In a second step, at least one continuous band of foil material (200) is applied onto the individual sheets (S) along a direction substantially parallel to a direction of displacement of the individual sheets, thereby forming a continuous flow of sheets linked to one another by the said at least one continuous band of foil material (200). In a third step, the said at least one continuous band of foil material (200) is cut by means of a laser beam such that the continuous flow of sheets is again separated into individual sheets (S) with portions of foil material (200*) remaining on the sheet. The cutting is performed at positions located on the sheets (S) such that said portions of foil material (200*) remaining on the sheets do not extend beyond leading and trailing edges of the sheets (S).

Abstract: The present invention comprises a jointing head 1, a robot with this jointing head 1, and a fastening method for affixing fastening elements 9 to a component surface B. The jointing head 1 comprises a gripper 30 that removes fastening elements 9 from a removal position E of a cartridge 70 by means of a pivoting movement. In addition, the jointing head 1 comprises a compensation mechanism 40 of the gripper 30 so that, when the fastening element 9 is mounted on a component surface B, the fastening element 9 is optimally arranged adjacent to a hardening source 60 such as a light source.

Abstract: A pick and place system with an integrated light source to partially cure a light-curable adhesives onto which components have been placed. After a light-curable adhesive in liquid or low viscosity form is applied to a location on a substrate, a pick-and-place head uses a vacuum introduced to its nozzle-like opening to pick a component and place it on to the light-curable adhesive. The pick-and-place head then transmit an appropriate light through the same nozzle-like opening to at least partially cure the adhesive. The component becomes, therefore, at least partially fixed to the substrate and will not shift as the substrate is moved.

Abstract: An automatic zipper device having a pair of bevel gears for biting and joining joint end portions of a sheet member wound around a periphery of the molding drum and having a plurality of magnet attractive metallic cords, and the device is provided with an inclined portion following cylinder which is attached to a lateral movement device laterally moving on the molding drum so as to be laterally movable and which adjusts a height of the bevel gear in accordance with an inclined surface of the sheet member to be joined, a clamping cylinder for adjusting a bitten amount of the bevel gears, and introduction magnet rollers for taking in the sheet member, and a member contact position stabilizing magnet for maintaining a constant position of the sheet member so that the sheet member to be joined can be brought into contact with the bevel gear at a constant angle.

Abstract: There is provided an electrostatic support applicator, which comprises a body including: a first body portion and a second body portion; the first body portion including an electrostatic generating sub-assembly; the second body portion being implemented as an accumulating member for accumulating electrostatic charge; and an application member mounted onto said accumulating member and spaced away from said accumulating member by a separating distance “d”, said separating distance “d” being within an electric field of said accumulating member such that said application member gets charged from said accumulating member, when in use, by means of corona discharge.

Abstract: A production layout for an LCD is provided. The production layout for an LCD includes a bonding part operable to bond a pair of substrates for the LCD with a sealant and a hardening part operable to harden the sealant. The hardening part includes an ion provider operable to supply ions to the substrates during a hardening process of the sealant. The production layout further includes a transfer unit that loads and unloads the bonded substrates. Footprint and tact time for manufacturing the LCD may be reduced. Electrostatic removal effect of the bonded substrates may improve.

Abstract: Disclosed herein is an infrared emitter welder for fusion welding pipe joints. In one representative embodiment, the welder comprises a fuel tank adapted to contain a fuel under pressure and a heating element in fluid communication with the fuel tank. The heating element includes a pair of porous ceramic plates, each having opposing first and second surfaces, wherein the first surfaces of the ceramic plates are joined together, and wherein at least one of the first surfaces includes fuel distribution channels formed therein. A catalytic material, such as platinum, is disposed on at least one of the second surfaces and is operative to ignite the fuel as it reaches the second surface. A supply conduit interconnects the fuel tank and heating element.

Abstract: A thermal transfer method for selectively transferring a red organic light material of a transfer layer from a donor substrate to a recipient substrate to form a red organic light emitting element. The donor substrate has a reflecting layer in a planned formation region of the transfer layer and an absorbing layer in a region other than the planned formation region of the transfer layer. The transfer layer is formed on an area on the front face side of the base. The transfer layer in the region where the absorbing layer is formed is selectively removed. the donor substrate and the other substrate are placed in opposition. The transfer layer on the reflecting layer is transferred to the recipient substrate.

Abstract: The present invention provides a curing device for sealant, and which includes an ultraviolet light source, and a waveguide. A light beam projected from the ultraviolet light source enters the waveguide. The waveguide includes multiple light emitting ports, and the light beam emits from the multiple light emitting ports after one or several total internal reflection. The multiple light emitting ports are arranged and distributed according to the positions of the sealant to be cured. The present invention further provides a method for curing the sealant. The curing device and the method for curing the sealant can readily increase the efficiency of utilization of the ultraviolet light source, while it can readily reduce the cost associated thereof.

Abstract: A method and apparatus to mitigate the severity of the bond-line read-out defect, and more specifically microwave heating to locally cure adhesive bond-line in a single or two stage process comprising heating thermoset adhesive with microwave radiation until the adhesive is fully cured or partially cured. If the adhesive is partially cured, it can be fully cured by being subjected to an additional thermal cycle.

Abstract: An apparatus for manufacturing a roller includes a loading plate, a polishing device, a processing device, a hot pressing device, a mounting device, and a cutting device. The loading plate loads a preprocessed metal plate having a preprocessed molding surface. The polishing device polishes the preprocessed molding surface to obtain a polished molding surface. The processing device forms molding patterns on the polished molding surface to obtain a metal plate with a molding surface defining the molding patterns. The hot pressing device forms impression patterns on a preprocessed resin film to obtain a resin film by pressing the metal plate and the preprocessed resin film together. The mounting device mounts the resin film to a rolling surface of a main body until the resin film winds around the rolling surface. The cutting device cuts the resin film.

Abstract: A method of forming a bag assembly by RF welding includes generating from a single source of RF energy a high frequency electric field having a first strength between tube-welding electrodes of opposing die members and a second strength less than said first strength between perimeter-welding electrodes of the opposing die members. Subjecting a tube assembly and corresponding portions of sheets surrounding the tube assembly to the high frequency electric field of said first strength for a predetermined amount of time to weld the sheets to a tube along a tube-weld. Corresponding portions of the sheets between the perimeter-welding electrodes are subjected to the high frequency electric field of said second strength for said predetermined amount of time to weld the sheets together along a bladder perimeter-weld. The subjecting steps are performed simultaneously so that the bag assembly is formed in one welding operation.