Abstract: A lamination device that laminates a plurality of types of workpieces includes a plurality of supply mechanisms that supply a workpiece to each of a plurality of supply positions, a movement mechanism including a stator of a linear motor having a predetermined traveling track and a mover of a linear motor that is movable between a plurality of the supply positions along a traveling track, and a control unit that controls at least the mover. The mover includes a lamination stage for laminating the workpiece. The control unit corrects a relative position of the workpiece supplied to the supply positions with respect to the lamination stage, laminates the workpiece whose relative position is corrected on the lamination stage, and controls the mover so as to move to a next one of the supply positions after lamination of the workpiece.

Abstract: An induction sealing device for induction welding of a packaging material is disclosed. In some embodiments, the induction sealing device comprises an inductor coil configured to induce an alternating current in a metal foil of the packaging material for inductive heating thereof. The induction sealing device can further comprise a magnetic insert encapsulating the inductor coil apart from an outer portion of the inductor coil, and the outer portion can be arranged towards the packaging material to be sealed. In some embodiments, the magnetic insert is configured to interact with the packaging material to be sealed via at least one interactive surface. In some embodiments, the induction sealing device comprises a connection unit. The connection unit can comprise a parallel connection configured to connect to the inductor coil and to an AC power source. A corresponding method of manufacturing an induction sealing device is also disclosed.

Abstract: The self fixturing heater includes an outer casing having a central channel therein for selectively receiving and retaining in friction-fit relation an elastomeric fixture from a nutplate fastener assembly that axially aligns the self fixturing heater with a nutplate fastener assembly. The outer casing encloses a heater element generally disposed circumferentially around the central channel and includes a thermal insulated cover to direct heat energy toward a heat transfer surface that includes a thermally conductive pressure pad in engagement with a substrate underneath a baseplate of a nutplate having an adhesive bonding agent thereon, the heat transfer surface imparting heat energy to the adhesive bonding agent thereby curing the adhesive in four hours or less.

Abstract: The present disclosure relates to an integrated electrode assembly, wherein a positive electrode, a first binder polymer layer, an inorganic coating layer comprising a plurality of inorganic layers and a second binder polymer, a third binder polymer layer, and a negative electrode are sequentially stacked and combined, each configurative element forming the electrode assembly is stacked and combined with excellent adhesion, and the durability of the inorganic coating layer preventing the internal short circuit of the electrode is excellent, and thus a lithium secondary battery using the integrated electrode assembly according to the present disclosure may have excellent cycle characteristics.

Abstract: A method and apparatus for additive manufacturing that includes a nozzle and/or barrel for extruding a plastic material and a supply of polymeric working material provided to the nozzle, wherein the polymeric working material is magnetically susceptible and/or electrically conductive. A magneto-dynamic heater is provided for producing a time varying, high flux, frequency sweeping, alternating magnetic field in the vicinity of the nozzle to penetrate into and couple the working material to heat the material through at least one of an induced transient magnetic domain and an induced, annular current.

Abstract: A device for heating and connecting sheets (11, 12, 111, 121) of bituminous or synthetic membranes (100), comprising at least one sheet (11, 12, 111, 121) of a bituminous or synthetic membrane (100) which is applied to at least one base layer (141), said membrane (100) being formed with a single compound or having at least one bottom layer including a compound or a bituminous mixture and at least one upper layer including a polymeric material and an electrically conductive material, which is heated; in particular, a body (13, 23) having a mainly longitudinal (A) development and placed on a first edge (11a, 21a) of a first sheet (11, 21, 111, 121) of the membrane (100) in order to connect said first edge to a second edge (12a, 22a) of a second sheet (12, 22, 111, 121) of the membrane (100) is provided with an upper face (13a, 23a).

Abstract: A method for electrically setting a gap for a piezoelectric pressure sensor. The method includes positioning a piezoelectric flex element on a tray; attaching a voltage source to the piezoelectric flex element of a piezoelectric pressure sensor; applying a voltage from the voltage source to the piezoelectric flex element; curing an adhesive between the piezoelectric flex element and the tray while the piezoelectric flex element is deflected by the voltage; and stopping the voltage from the voltage source to the piezoelectric flex element when the adhesive has been cured.

Abstract: A lamination device 30 includes a first charger 40 for emitting charged particles toward an uppermost surface of a battery stack 10 of a positive electrode sheet 12, a negative electrode sheet 14, and a separator sheet 16 that are stacked on a stacking stage 32. As a result of the emission of charged particles, the battery stack 10 and one of a positive electrode sheet 12, a negative electrode sheet 14, and a separator sheet 16 that is to be stacked on the stack 10 are electrostatically attracted to each other.

Abstract: The present disclosure provides an apparatus for preparing an electrode assembly, comprising a printing unit including a charging mean for bringing polymer particles into electric charging to obtain electrically charged polymer particles, and a transferring mean for coating the electrically charged polymer particles by way of transferring on at least one surface of a substrate for an electrochemical device to form an adhesive layer on the substrate, the substrate being at least one of a cathode, an anode and a separator; and a laminating unit that applies heat and pressure to the substrate having the adhesive layer formed thereon so as to obtain the electrode assembly comprising the cathode, the anode and the separator interposed therebetween.

Abstract: A flexible ferromagnetic strip is used to induction-weld seams in polymer pipes. The strip is a blend of strontium ferrite, a surfactant, and an LDPE binder. A process to produce the profile is to mix the ingredients together followed by granulation and extrusion or calendering. The strip is used in conjunction with an induction coil sized to fit over a polymer pipe coupling containing the strip and separate segments of polymer pipe. The strip is heated by induction current induced by an electromagnetic field generated by the coil. The heated strip causes the polymer pipe segments to be thermoplastically welded together.

Abstract: The present invention provides a method for laminating glass panels and a vacuum lamination device using the method. The method includes (1) providing a TFT substrate (240) and a CF substrate (220) to be laminated, the CF substrate (220) being coated with a seal resin (204), the TFT substrate (240) carrying liquid crystal (402) dropped thereon; (2) aligning and laminating the TFT substrate (240) and the CF substrate (220) in a vacuum environment to complete a lamination process; (3) applying UV light to transmit through the TFT substrate (240) for carrying out UV curing of the seal resin (204) interposed between the CF substrate (220) and the TFT substrate (240) so as to complete a UV curing process; (4) removing the laminated CF substrate (220) and the TFT substrate (240) that have been subjected to the UV curing process out of the vacuum environment.

Abstract: An apparatus for temporarily bonding a substrate on a carrier includes an electrically conductive adhesion layer disposed between the carrier and the substrate, and a current supply source configured to apply a current to the electrically conductive adhesion layer.

Abstract: A system for bonding electrical devices using an electrically conductive adhesive to adhere the electrical devices together, the system including: an ultrasonic transducer to generate an ultrasonic vibration; and an ultrasonic to thermal energy apparatus operatively attached to and covering an operational end of the ultrasonic transducer, the ultrasonic to thermal energy apparatus damping the ultrasonic vibration to minimize ultrasonic vibration transmitted to a first electrical device and causing the conversion of the ultrasonic vibration to a heating pulse which is conducted through the first electrical device to the adhesive. Whereby the adhesive is softened by the heating pulse to bond the electrical devices together.

Abstract: The present invention provides a method and a system for manufacturing a circuit board for use during fabrication of LEDs. The method includes individual processes (in no particular order) like continuous contacting of various layers of the circuit board, B-staging of an adhesive used in the circuit board, pre-heating of the various layers when the various layers are arranged in an adjacent manner to each other, applying pressure to the circuit board when the various layers are arranged in an adjacent manner to each other, thermal curing of the adhesive and singulating the circuit board.

Abstract: A high-frequency induction heating apparatus is provided with a high-frequency oscillation apparatus, a heating coil, a high-frequency transformer and the like, the heating coil has a first coil through which prescribed current outputted by the high-frequency oscillation apparatus is flown, a second coil through which current different from the predetermined current is flown by the high-frequency transformer, and the first coil heats a trunk part and a bottom side part of the can body, and the second coil heats the trim side part of the can body.

Abstract: The present invention discloses a vacuum glass middle support placing system. Middle supports capable of being adsorbed by magnetic force are used as placed objects in the system; the system comprises a glass plate placing station, a middle support placing station and a vacuum sealing station; a glass plate for placing the middle supports is placed on a bracket, and the bracket is transferred among the stations; and the bracket is provided with a supporting face matched with the surface of the glass plate and a glass plate positioning structure, and a magnetic adsorption surface array corresponding to the middle supports to be placed one by one on the glass plate is arranged on the supporting face.

Abstract: There is described a heating induction sealing device for forming a seal in a packaging material comprising an electrically conductive element and advancing along a direction; sealing device comprises one first inductive element and one second inductive element; first inductive element comprises a first portion facing second inductive element and defining with second inductive element a passage for packaging material; and a second portion; sealing device is selectively arrangeable in a first configuration, in which alternate currents flow within first and second inductive element; first portion and second inductive element are configured to generate a first magnetic flux transversally to direction, when sealing device is arranged in first configuration; second portion is configured to generate, in use, a second magnetic flux with a main component parallel to direction, when sealing device is arranged in first configuration.

Abstract: The present disclosure relates to an antimicrobial filter medium with improved antimicrobial property and microbe capture ability wherein gaseous antimicrobial nanoparticles are uniformly coated onto the filter medium and conductive members are attached on both sides of the filter medium, and an apparatus and a method for fabricating the same.

Abstract: An apparatus for making a conductive element includes an original carbon nanotube film supply unit configured to continuously supply an original carbon nanotube film; a patterned unit configured to form a patterned carbon nanotube film; a solvent treating unit configured to soak the patterned carbon nanotube film to form a carbon nanotube film; a substrate supply unit providing a substrate; a pressing unit configured to generate a pressure on the carbon nanotube film and the substrate and fix the carbon nanotube film on the substrate; and a collecting unit capable of collecting the conductive element. The original carbon nanotube film includes a number of carbon nanotubes extending along a first direction. The patterned carbon nanotube film defines through holes arranged in at least one row in the patterned carbon nanotube film along the first direction, the through holes of each row includes at least two spaced though holes.

Abstract: The invention relates to a method for connecting sheet metal parts (4) to form a laminated core (11), wherein sheet metal parts (4) are separated, in particular punched, from a sheet metal strip (2) that has, at least in some areas, a layer having curable polymer adhesive (12), and the sheet metal parts (4) are preliminarily connected to form a laminated core (11), the preliminary connection comprising plasticizing the adhesive (12) at least in some areas and joining the sheet metal parts (4) in order to connect the sheet metal parts by means of the plasticized adhesive (12) of at least one of the sheet metal parts (4), and in a subsequent step the laminated core (11) having preliminarily connected sheet metal parts (4) is subjected to a curing of the adhesive (12). In order to create an advantageous connection between the sheet metal parts, the plasticizing of the adhesive (12) comprises the introduction of a softener (16), in particular H2O.

Abstract: An apparatus for bonding a first carbon composite to a second carbon composite through a reactant layer includes a housing, and a pair of conductive press plates electrically isolated from the housing. The press plates are adapted to position the two parts to be bonded with a reactant layer therebetween. The press plates are subjected to an electrical potential and a clamping force, sufficient to initiate a combustion reaction that creates a molten ceramic to bond together the carbon-carbon composites.

Abstract: A lamination apparatus has opposed plenums that project pressurized fluids toward a fluid pressure lamination zone. Material sheets to be laminated are advanced through the lamination zone and laminated together due to the pressure exerted by the pressurized fluid.

Abstract: A method for manufacturing a structural component includes a first step of attaching at least one conductive member to a surface of a base material made of a composite material and a second step of forming the base material by conducting electricity to part or the whole of the conductive member to generate heat and/or making an assembly of the structural component by conducting electricity to part or the whole of the conductive member to generate heat. Part or the whole of the conductive member contained in the structural component produced in the first and second steps serves as a member giving to the aircraft at least one of a lightning strike protection function, an anti-icing and deicing function and an electromagnetic interference shielding function.

Abstract: A method for producing an envelope having improved seal integrity, comprising the steps of (i) applying a first conductive material to the flap of the envelope in an first area corresponding to a first seal location between the flap and the body portion of the envelope and (ii) applying a second conductive material to the body portion of the envelope in a second area corresponding to a second seal location between the body portion and flap of the envelope, the first and second seal locations being selected such that an end of the first conductive material contacts an end of the second conductive material when the conductive materials are arranged in a substantially common plane.

Abstract: An implant applicator and method for positioning a resistive implant material on a first plastic component to be used to form a resistive implant weld between that first plastic component and a second plastic component. The resistive implant material is heated and pressed into a targeted surface of the first plastic component to tack the resistive implant into place. The second plastic component is positioned over the tacked resistive implant and a weld formed in a known manner. The resistive implant material can be heated for tacking by passing an electric current through it before it is pressed into the first plastic component by a second member or by contacting the resistive implant material against a separately heated surface prior to pressing it into the first plastic component.

Abstract: A method of assembling a chair includes providing a first chair component composed of a first polymeric material and a second chair component composed of a second polymeric material. An adhesive is positioned on or in the first chair component. The adhesive is composed of a third polymeric material and at least one ferromagnetic susceptor. The second chair component is positioned in engagement with the adhesive and adjacent to the first chair component. A magnetic field or electromagnetic waves are applied to the adhesive to activate the adhesive. A force is also applied to at least one of the first chair component and the second chair component to press the first chair component and the second chair component. A chair is also provided that includes the first and second chair components and the adhesive.

Abstract: A microcircuit deposition system incorporates a first printing engine for depositing a dielectric on a substrate. A microwire spooling machine houses a microwire spool and incorporates a tension guide to position a microwire trace onto the dielectric layer. A second printing engine trails the microwire spooling machine to deposit a covering dielectric layer over the microwire trace.

Abstract: Methods and apparatus provide for: disposing an intermediate layer formed from at least one of: a metal, a conductive oxide, and combined layers of the metal and the conductive oxide, on one of a first material layer and a second material layer; and coupling the first and second material layers together via an anodic bond between the intermediate layer and the other of the first and second material layers.

Abstract: A method of making a photovoltaic device includes providing a first photovoltaic cell, placing a conductive interconnect in contact with an upper surface of the first photovoltaic cell, providing a thermoset adhesive over the conductive interconnect and over the upper surface of the first photovoltaic cell, and applying a current or voltage to the conductive interconnect to cure the thermoset adhesive such that the cured thermoset adhesive bonds the conductive interconnect to the upper surface of the first photovoltaic cell. The system used to make the device includes a conveyor, a wire applicator, a thermoset adhesive reservoir, a pressure roller in fluid communication with the reservoir, and first and second electrode rollers configured to apply a current or voltage to the conductive wire interconnect.

Abstract: The present invention is premised upon a multi-layer laminate structure and method of manufacture, more particularly to a method of constructing the multi-layer laminate structure utilizing a laminate frame and at least one energy activated flowable polymer.

Abstract: A flat panel display is manufactured by mass production and easily stored and transported at low cost. Provided is a thin film semiconductor substrate which faces a plastic substrate 7 and is combined with the plastic substrate 7 so as to be a flat panel display. Single-board-like insulating substrates 4 each of which has a thin film semiconductor array 3 are continuously bonded onto a lengthy plastic film 2. An apparatus is also provided for manufacturing the thin film semiconductor substrate which faces the plastic substrate 7 and is combined with the plastic substrate 7 so as to be the flat panel display.

Abstract: The invention relates to a method for axial joining of a hybrid joining component to a workpiece, wherein the joining component has a thermoplastic joining section and a metal section which can be heated, having the following steps: moving the joining component into contact with a surface of the workpiece; heating of the metal section such that the joining section at least partially melts; ending the heating of the metal section such that the joining component makes a force-fitting, interlocking and/or integral connection with the surface of the workpiece. In this case, the joining component is held with a regulated force and/or in a regulated position with respect to the workpiece at least during the heating of the metal section, in such a manner that the joining component can be joined to the surface of the workpiece without any opposing support.

Abstract: A wafer bonding method includes: holding a first substrate with an upper holding mechanism 7 by applying a voltage to the upper holding mechanism 7; generating a bonded substrate by bonding the first substrate and a second substrate held with a lower holding mechanism 8; and dechucking the bonded substrate from the upper holding mechanism 7 after a voltage which attenuates while alternating is applied to the upper holding mechanism 7. By applying the voltage which attenuates while alternating to the upper holding mechanism 7, residual attracting force between the bonded substrate and the upper holding mechanism 7 is reduced, thereby enabling the bonded substrate to be dechucked from the holding mechanism more surely in a shorter time period. As a result, the first substrate and the second substrate can be bonded in a shorter time period.

Abstract: An adhesive includes a base resin and a mixture. The base resin maintains a shape of the adhesive. The mixture is mixed in the base resin and a monomer reacts with the base resin and an ultraviolet (UV) initiator to initiate a polymerization reaction of the monomer as it is irradiated with UV light. The output pad electrode of the driving part and the input pad electrode of the display panel are electrically and physically connected to each other by using the adhesive cured as the UV light is irradiated, thereby simplifying a manufacturing process of a display apparatus and preventing a short that may be generated between pad electrodes.

Abstract: A method and assembly for chemically modifying chromate converted aluminum work pieces to improve adhesion. The chromate converted aluminum work pieces are treated with oxygen plasma within the range of 500 W to 1500 W for approximately 5 to 30 minutes to chemically modify the free cyanide in the chromate coating. The free cyanide is modified into functional groups that chemically bond with silicone based adhesives. Adhesion strength of at least 100% improvement is observed. An aluminum heat sink is attached to modules with a silicone based elastomer containing a thermally enhanced additive. The thermally enhanced adhesive is dispensed onto application specific integrated circuit (ASIC) chips, memory chips, or laminates of the modules. Subsequently, the assembled device is cured at 150° C. for approximately one hour.

Abstract: Methods and systems for producing a change in a medium. A first method and system (1) place in a vicinity of the medium at least one upconverter including a gas for plasma ignition, with the upconverter being configured, upon exposure to initiation energy, to generate light for emission into the medium, and (2) apply the initiation energy from an energy source including the first wavelength ?1 to the medium, wherein the emitted light directly or indirectly produces the change in the medium. A second method and system (1) place in a vicinity of the medium an agent receptive to microwave radiation or radiofrequency radiation, and (2) apply as an initiation energy the microwave radiation or radiofrequency radiation by which the agent directly or indirectly generates emitted light in the infrared, visible, or ultraviolet range to produce at least one of physical and biological changes in the medium.

Abstract: A liquid crystal device is provided, having one or several display segments, a first display substrate, a second display substrate, a layer of liquid crystal material disposed between the first and second substrate; and layer of conductive material disposed on the substrates. The conductive layers form electrodes for applying an electric field across the liquid crystal for switching the liquid crystal material between a first optical state and a second optical state different from the first optical state. Image features of the display are further defined by the inclusion of a layer of patterned non-conductive or passive dielectric material on at least one of the substrates, the patterned material forming a mask defining image elements of the display segments.

Abstract: A system for bonding electrical devices using an electrically conductive adhesive to adhere the electrical devices together, the system comprising: an ultrasonic transducer to generate an ultrasonic vibration; and an ultrasonic to thermal energy apparatus operatively attached to and covering an operational end of the ultrasonic transducer, the ultrasonic to thermal energy apparatus damping the ultrasonic vibration to minimize ultrasonic vibration transmitted to a first electrical device and causing the conversion of the ultrasonic vibration to a heating pulse which is conducted through the first electrical device to the adhesive; wherein the adhesive is softened by the heating pulse to bond the electrical devices together.

Abstract: An implant applicator and method for positioning a resistive implant material on a first plastic component to be used to form a resistive implant weld between that first plastic component and a second plastic component. The resistive implant material is heated and pressed into a targeted surface of the first plastic component to tack the resistive implant into place. The second plastic component is positioned over the tacked resistive implant and a weld formed in a known manner. The resistive implant material can be heated for tacking by passing an electric current through it before it is pressed into the first plastic component by a second member or by contacting the resistive implant material against a separately heated surface prior to pressing it into the first plastic component.

Abstract: A bonding apparatus including a chamber for maintaining an inert gas atmosphere; a first plasma torch for performing a surface treatment on pads and electrodes, the first plasma torch being attached in the chamber, to apply gas plasma to a substrate and a semiconductor chip that is placed inside the chamber; a second plasma torch for performing a surface treatment on an initial ball and/or wire at a tip end of a capillary that is positioned inside the chamber, the second plasma torch being attached in the chamber, to apply gas plasma to the initial ball and/or wire; and a bonding unit for bonding the surface-treated initial ball and/or wire to the surface-treated pads and electrodes in the chamber, thereby cleaning of the surface of the electrodes and pads as well as the wire can be effectively performed.

Abstract: A donor substrate for a laser induced thermal imaging method and an organic light emitting display manufactured using the same are provided. A laser induced thermal imaging apparatus includes a stage grounded by a grounding means, and a method of fabricating an organic light emitting display is capable of controlling static electricity which may be built up while an organic layer is formed using the apparatus.

Abstract: The system contains a substrate having at least one electrical trace formed thereon. An opening is formed in the substrate. The opening comprising at least one wall. An electrically conductive fill is formed in the opening. The electrically conductive fill is chemically bonded to the wall and electrically contacted with the electrical trace.

Abstract: An array of resilient floor tiles is assembled into a continuous sheet after being laid down. An array of included, sacrificial resistive wires is buried along the edges of the tiles and is controllably heated in order to cause welding of the edges of tiles across the paths of the wires to neighbouring tiles. Subsequently the wires may be used to give the array integral tensile strength. The welded array is provided with greater strength for resisting use, expansive and contractile forces caused by environmental heat and cold and also long-term tile contraction owing to loss of plasticiser as may be seen with PVC-based tiles.

Abstract: An improved wafer-to-wafer bonding method includes aligning an upper and a lower wafer and initiating a bond at a single point by applying pressure to a single point of the upper wafer via the flow of pressurized gas through a port terminating at the single point. The bond-front propagates radially across the aligned oppositely oriented wafer surfaces at a set radial velocity rate bringing the two wafer surfaces into full atomic contact by controlling the gas pressure and/or controlling the velocity of the motion of the lower wafer up toward the upper wafer.

Abstract: A sharpened metallic probe having a top of main body including a carbon-containing metal and a method and an apparatus for fabricating the metallic probe. A metallic probe with an extremely sharpened tip is obtained by inducing a field emission from the tip of the main body of the metallic probe where a nanotube is joined thereto, heating and melting locally the tip of the main body of the metallic probe by a Joule heating, and tearing the nanotube toward a counter electrode by a Coulomb attractive force.

Abstract: System and methods offset mechanism elements during fabrication of Micro-Electro-Mechanical Systems (MEMS) devices. An exemplary embodiment applies a voltage across an offset mechanism element and a bonding layer of a MEMS device to generate an electrostatic charge between the offset mechanism element and the bonding layer, wherein the electrostatic charge draws the offset mechanism element to the bonding layer. The offset mechanism element and the bonding layer are then bonded.

Abstract: Electrically conductive workpieces with facing surfaces are bonded with an adhesive that is filled with conductive metal particles that are reactive with the surfaces of the workpieces. In the bonding process the surfaces are coated with the adhesive, pressed together and an electric current passed between them to momentarily melt the conductive particles. The molten droplets agglomerate and wet the facing surfaces. When the molten clusters re-solidify, electrically conductive paths are formed between the workpieces. For example, the practice is useful for bonding ferrous-based or aluminum-based alloy sheets, strips or plates in making products such as bipolar plates for fuel cells.

Abstract: A jointing strip for jointing by welding at least two portions of a plastics material or of two different plastics materials includes a substantially H-shaped plastic member with apertures defined by opposing jaw portions. Electrically conductive elements, for example foil portions, are located at or near to a surface in the apertures of the respective jaw portions. The edge portions of the plastics materials to be welded are inserted in the apertures.

Abstract: A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.

Abstract: The present invention provides an anodic bonding apparatus for bonding a laminate including an electrically conductive substrate and a glass substrate, the anodic bonding apparatus including: a container of which pressure is capable of being reduced; an upper electrode disposed in the container and configured in a movable manner in the vertical direction so as to contact to and separate from the laminate, and the upper electrode including: a main body part; an electrically conductive metal thin plate to be contacted with the laminate; and a space part; between the main body part and the electrically conductive metal thin plate, into and from which a fluid is supplied and drained, wherein the electrically conductive metal thin plate has a diaphragm structure being capable of deforming based on a pressure difference between the space part and the inside of the container, the electrically conductive metal thin plate is positioned at the main body part so as to swell in a convex form in the direction to the lamin