Abstract: The present invention discloses a display panel substrate assembly and an apparatus and method for forming a display panel substrate assembly, wherein the substrate assembly includes a first substrate and a second substrate. At least one of the first substrate and the second substrate is optically clear. The method includes the steps of screen printing a non-sag adhesive composition onto a surface of the first substrate, bringing the non-sag adhesive composition into contact with a surface of the second substrate in an environment having a pressure of less than or equal to about 5000 pascals, and curing the non-sag adhesive composition to yield an adhesive layer. The non-sag adhesive composition is of a type which is optically clear after curing.

Abstract: A process and apparatus for producing perforated composite structures, such as acoustic skins suitable for aircraft engine nacelle and duct components. The process includes placing a mat member, a non-impregnated fabric member, and a resin film on a tool surface so that pins disposed on the mat member project through the fabric member and resin film to define holes therein. The fabric member is between the mat member and resin film, and the fabric member and resin film define a stack that conforms to the mat member and tool surface. A caul member is then placed on the stack so that apertures in the caul member are penetrated by the pins. The stack is heated to melt the resin film and cause molten resin to infuse the fabric member and yield a resin-infused fabric stack, after which the molten resin within the resin-infused fabric stack is at least partially cured.

Abstract: The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.

Abstract: Systems and methods of applying a decorating film to a substrate that reduce the occurrence of wrinkling of the decorating film during application of the film to the substrate and ensure a more uniform transfer of a pattern or image on the decorating film to the substrate. The same systems and methods can be used to apply a decorating film that laminates to a substrate. Systems of and methods for cooling a decorating chamber and removing the used decorating film from the substrate after a transfer of an image or pattern from the decorating film to the substrate.

Abstract: A bonding apparatus includes at least one stage unit to support a circuit board having a chip thereon and a bonding unit coupled to the stage unit to define a chamber. The bonding unit has at least one inductive heater to heat to bond the chip to the circuit board, and the stage unit includes a vacuum generator configured to generate a vacuum between the stage unit and the circuit board. The vacuum is used to hold the circuit board on the stage unit during bonding of the chip to the circuit board. The induction heater may include one or more induction heating antennas, and the chamber may include one or more stage units.

Abstract: A curing processing device including a top moving plate, a bottom moving plate, an intermediate moving plate, a heating unit which heats each of the moving plates, a moving plate driving unit, a carrying unit, and a controller, and wherein each of the top moving plates includes an elastic film and a positive pressure applying unit applying a positive pressure to a space between the moving plate and the elastic film, and the controller is configured to cause the curing processing device to operate in a carrying mode for carrying in or out the solar battery assembly and a compress mode for applying a positive pressure to a space between a lower surface of an upper side moving plate and the elastic film to press the solar batter assembly, and the controller changes a pair of moving plates in a predetermined order each time the mode is switched.

Abstract: The present invention is a process for performing rigid-to-rigid substrate lamination implementing pressure-sensitive adhesive (PSA). The process may include pressurizing a first sealed cavity to a first pressure. The process may further include creating a vacuum within a second sealed cavity, the second sealed cavity being sealed from the first sealed cavity by a flexible membrane. The process may further include applying the first pressure to a laminate assembly stack via the flexible membrane, the laminate assembly stack including a first substrate, a second substrate, and a PSA layer, the PSA layer being positioned between the first substrate and the second substrate. The process may further include applying the vacuum created within the second sealed cavity to the laminate assembly stack. The applied first pressure and the applied vacuum promote intimate contact between the first substrate and the second substrate of the laminate assembly stack via the PSA layer.

Abstract: The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.

Abstract: A method for temporary bonding first and second wafers includes, applying a first adhesive layer upon a first surface of a first wafer and then curing the first adhesive layer. Next, applying a second adhesive layer upon a first surface of a second wafer. Next, inserting the first wafer into a bonder module and holding the first wafer by an upper chuck assembly so that its first surface with the cured first adhesive layer faces down. Next, inserting the second wafer into the bonder module and placing the second wafer upon a lower chuck assembly so that the second adhesive layer faces up and is opposite to the first adhesive layer. Next, moving the lower chuck assembly upwards and bringing the second adhesive layer in contact with the cured first adhesive layer, and then curing the second adhesive layer.

Abstract: An aspect of the present embodiment, there is provided a method for fabricating a semiconductor device including placing a semiconductor substrate, onto which a BSG tape bonded via a supporting substrate, on a stage placed a peeling tape in a state that an adhesive surface of the peeling tape is oriented upwards and the BSG tape is oriented downwards to the stage, bonding the peeling tape onto the BSG tape in a state that the BSG tape is retained to be oriented downwards and placed on the adhesive surface of the peeling tape, drawing the peeling tape to a lower side of the stage to peel the peeling tape in a state that the peeling tape is retained to be bonded onto the BSG tape, and supporting the supporting substrate exposed from the BSG tape in the drawing of the peeling tape.

Abstract: Geometrically versatile composite lattice support structure having a seamless three-dimensional configuration are disclosed and described. The lattice support structure is created by forming two or more cross supports, such as helical, longitudinal, circumferential and/or lateral cross supports, which intersect to form a plurality of multi-layered nodes. The lattice support structure may be designed without any protrusions extending outward from the overall geometry, thus enabling efficient tooling, and thus enabling ease of mass production. The lattice support structure may comprise a completely circumferentially closed geometry, such as a cylinder, ellipse, airfoil, etc. The method for fabricating the lattice support structure comprises laying up a fiber material, in the presence of resin, within rigid channels of a rigid mold, thus creating a green, uncured three-dimensional geometry of unconsolidated cross supports and multi-layered nodes where these intersect.

Abstract: A method of manufacturing a capsule 12 for holding a substance 14 includes providing a capsule body 2 having a closed end 5 and an opposed open end 6; providing a diaphragm 4 having a closed end 7 and an opposed open end 8; partially filling the body 2 with substance 14; providing a gas-tight chamber; providing a nitrogen gas environment within the chamber; applying a partial vacuum to the chamber; supporting an outer side 43 of the body 2; supporting an inner side 102 of the diaphragm 4; while supporting the body 2 and the diaphragm 4, inserting the closed end 7 of the diaphragm 4 into the open end 6 of the body 2 until regions of the body 2 and the diaphragm 4 overlap one another, thereby closing off the open end 6 of the body 2 and forming a chamber 104 within which the substance 14 is held; and heat welding the overlapping regions of the capsule body 2 and the diaphragm 4 to one another to hermetically seal the chamber 104.

Abstract: A method for producing a hollow product comprises a film arrangement step wherein a film is arranged on a fiber layer; a molded body arrangement step wherein a molded body having a recess is arranged on the film after the film after the film arrangement step in such a manner that the opening of the recess faces the film; the gas present between the fiber layer and the film is evacuated; the gas present between the film and the molded body is evacuated; a film-molded body bonding step wherein the film and the molded body are bonded together after the step of gas evacuation from between the film and the molded body; and a fiber layer-film bonding step wherein the fiber layer and the film are bonded together after the step of gas evacuation from between the fiber layer and the film.

Abstract: A film-forming apparatus (100) and method capable of film lamination with superior evenness and good followability regardless of the size, shape and number of articles being laminated.

Abstract: A composite is produced by providing a first and a second joining partner, a connecting means, a sealing means, a reactor having a pressure chamber, and a heating element. The two joining partners and the connecting means are arranged in the pressure chamber such that the connecting means is situated between the first joining partner and the second joining partner. A gas-tight region is then produced, in which the connecting means is arranged. Afterward, a gas pressure of at least 20 bar is produced in the pressure chamber outside the gas-tight region. The gas pressure acts on the gas-tight region and presses the first joining partner, the second joining partner and the connecting means together. The joining partners and the connecting means are then heated by means of the heating element to a predefined maximum temperature of at least 210° C. and then cooled.

Abstract: Provided is an adhesive injection device for injecting an adhesive between the substrates of laminates which each comprise at least two substrates that face each other. The adhesive injection device is provided with: a cassette which holds multiple laminates aligned along the direction of lamination of the substrates; and an adhesive injector which injects adhesive into each inter-substrate space, as the laminates are being held in the cassette, so that the actions of injecting the adhesive into each inter-substrate space overlap chronologically. Holding multiple laminates in the cassette makes it possible to treat the multiple laminates as a unit. By injecting adhesive into each inter-substrate space, as the laminates are being held, so that the actions of injecting the adhesive into each inter-substrate space overlap chronologically, the injection of adhesive into multiple laminates is simplified, and the time required for injection can be reduced.

Abstract: A method for producing a valve device is provided. The airbag has at least one substantially air-permeable textile, fabric layer and with a film. The textile layer and the film are arranged in a deep-drawing tool with at least area-wise reciprocal overlapping. The film is deep-drawn in deep-drawing regions by the deep-drawing tool to form a plurality of depressions of the film. The textile layer is connected to the film in regions of the film differing from the deep-drawing regions by the deep-drawing tool.

Abstract: A holding tool 2 for use in producing of laminated glass includes a frame 3, a bag member 4 and a supporting member 6b for suspending the bag member 4 from the frame 3. The bag member 4 is made of a film with flexibility and airtightness, is provided with a sealable opening and has evacuating ports 7a and 7b in the vicinity of an periphery of a flat shape thereof having the periphery sealed. The frame 3 has a first frame member 3w and a second frame member 3y opposing each other and disposed outside the periphery of the bag member 4, and the bag member 4 is suspended by the supporting member 6b movably against the frame 3 on a holding face formed at least by the first frame member 3w and the second frame member 3y inside an area formed by connecting ends of these frame members.

Abstract: A method and part forming apparatus configured for forming an aircraft stringer. The part forming apparatus may comprise a forming tool, a rigid plate, and a hollow bladder. The forming tool may comprise a material trough, a bladder extension trough laterally aligned with and open to the material trough, and a recessed pocket extending from either side of the bladder extension trough and adjacent to the material trough. The method comprises placing composite material into the material trough, placing the bladder onto the composite material and through the bladder extension trough, placing the rigid plate into the recessed pocket and over the bladder, and then placing skin laminate over the bladder and the composite material. Once each of these components is in place, the forming tool may be vacuum bagged and the composite material and skin laminate may be co-cured to form the stringer.

Abstract: A laminating apparatus is provided which causes a resin film to completely conform to protruding and recessed portions of a substrate, and which makes the film thickness of the conforming resin film uniform on a stricter level. To this end, the laminating apparatus includes a laminating mechanism including: an enclosed space forming receiver capable of receiving a provisionally laminated body therein; and a pressure laminator for applying pressure to the provisionally laminated body in non-contacting relationship in an enclosed space formed by the enclosed space forming receiver to form an end laminated body from the provisionally laminated body.

Abstract: A bonding apparatus for bonding a substrate to be processed and a support substrate including, a first holding unit which holds the substrate to be processed, a second holding unit disposed to face the first holding unit and configured to hold the support substrate, a pressurizing mechanism including a vertically-expansible pressure vessel which is installed to cover the substrate to be processed held by the first holding unit and the support substrate held by the second holding unit, the pressurizing mechanism being installed in any one of the first holding unit and the second holding unit and configured to flow air into the pressure vessel and press the second holding unit and the first holding unit towards each other, an internally-sealable processing vessel which receives the first holding unit, the second holding unit and the pressure vessel, and a depressurization mechanism which depressurizes an internal atmosphere of the processing vessel.

Abstract: A tool comprises a caul plate having at least one suction hole and a vacuum port fluidly coupled to the suction hole for drawing a patch against the caul plate under vacuum.

Abstract: A bonding apparatus has an upper chuck and a lower chuck for holding wafers. The upper chuck is configured such that the center portion is bent to be convex when pressurized with a predetermined pressure. On the bottom surface of the lower chuck, there is an insulating ring formed of a combination of a plurality of insulating members to support the periphery of the lower chuck. The bottom surface of the insulating ring is supported by a support ring formed of a combination of a plurality of supporting members. The supporting members and the lower chuck are fixed by a bolt provided for each of the supporting members. The bolt is inserted through a through hole and a through hole which are formed in the insulating members and the supporting members, respectively, the through holes having a diameter larger than a diameter of the bolt.

Abstract: An enclosure is filled with a filling gas according to the disclosed method. An enclosure is provided having an interior, a width, a height, a thickness, and fluid filling and exit holes fluidly communicating with the interior. Filling of the enclosure is commenced by directing a flow of the filling gas at a filling flow rate into the fluid filling hole. An oxygen concentration of gas exiting the fluid exit hole is sensed. The filling of the enclosure is stopped when the sensed oxygen concentration reaches a threshold concentration, wherein the threshold oxygen concentration and/or the filling flow rate are selected by a Decision Support Tool based upon the width, height, and/or the thickness.

Abstract: An industrial-scale high throughput wafer bonding apparatus includes a wafer bonder chamber extending along a main axis and comprising a plurality of chamber zones, a plurality of heater/isolator plates, a guide rod system extending along the main axis, a pair of parallel track rods extending along the main axis, and first pressure means. The chamber zones are separated from each other and thermally isolated from each other by the heater/isolator plates. The heater/isolator plates are oriented perpendicular to the main axis, are movably supported and guided by the guide rod system and are configured to move along the direction of the main axis. Each of the chamber zones is dimensioned to accommodate an aligned wafer pair and the wafer pairs are configured to be supported by the parallel track rods. The first pressure means is configured to apply a first force perpendicular to a first end heater/isolator plate.

Abstract: Composite sections for aircraft fuselages and other structures, and methods and systems for manufacturing such sections, are disclosed herein. A method for manufacturing a shell structure in accordance with one embodiment of the invention includes applying composite material to an interior mold surface of a tool to form a skin extending 360 degrees around an axis. The method can further include positioning a plurality of stiffeners on an inner surface of the skin. After the stiffeners have been positioned, a vacuum bag can be installed over the stiffeners and evacuated to press the stiffeners and the skin outwardly against the interior mold surface of the tool. Next, the skin/stiffener combination can be cocured to bond the stiffeners to the skin and harden the shell structure.

Abstract: A method of manufacturing two or more composite parts, the method comprising: assembling the composite parts on a mandrel by laying a series of layers of bands of composite material onto the mandrel with a placement machine,—rotating the mandrel as the bands are laid onto the mandrel; attaching two or more debulk frames (10, 11) to the mandrel between opposed edges of the composite parts after the composite parts have been assembled; wrapping the mandrel, debulk frames (10, 11) and composite parts in a debulk bag; heating the composite parts,—forming a vacuum between the mandrel and the debulk bag so that the debulk bag is sucked into voids between the debulk frames and the heated composite parts and progressively presses against the heated composite parts whereby excess material is squeezed by the debulk bag towards their opposed edges; and removing the debulk bag and the composite parts from the mandrel.

Abstract: A lamination apparatus has opposed plenums that project pressurized fluids toward a fluid pressure lamination zone. Material sheets to be laminated are advanced through the lamination zone and laminated together due to the pressure exerted by the pressurized fluid.

Abstract: A vacuum lamination device for laminating a lamination member includes a base plate having an uneven surface contacting the lamination member for placing the lamination member, a frame member fixed to the base plate and having a discharge port for evacuating a processing space, and a cover member for hermetically sealing the processing space in the lamination process. The lamination member is placed on the uneven surface, and the cover member is placed so as to cover the lamination member. Then, a gaseous material in the processing space is evacuated through the discharge port while heating the processing space.

Abstract: An improved laminating equipment for touch panel includes a working recess and a pressing cap. The working recess has a first and a second positioning frame for precisely positioning a first and a second plate respectively. A plurality of elastic supporter is arranged between the first and the second positioning frame for forming a gap between the first and the second plates. The pressing cap has a pressing unit having a soft contact surface on a bottom surface thereof. The working recess is sealed by covering of the pressing cap to create vacuum by a vacuum pump during the laminating process. The pressing unit will provide a downward force to the second plate to overcome the support of the plurality of elastic supporter so as to attach the first and the second plates as one.

Abstract: A joint apparatus that joins a processing target substrate and a supporting substrate together, includes: a processing container that is capable of hermetically closing an inside thereof; a joint unit that joins the processing target substrate and the supporting substrate together by pressing the processing target substrate and the supporting substrate via an adhesive; and a superposed substrate temperature regulation unit that temperature-regulates a superposed substrate joined in the joint unit, wherein the joint unit and the superposed substrate temperature regulation unit are arranged in the processing container, A delivery unit for delivering the processing target substrate, the supporting substrate, or the superposed substrate to/from an outside of the processing container is provided in the processing container, and the superposed substrate temperature regulation unit is provided in the delivery unit.

Abstract: A system for processing a composite material may comprise a chamber, a mandrel, an upper ramp, and an upper diaphragm. The chamber generally provides structural support while a vacuum is applied to the system and may have a six-sided generally rectangular box shape. The mandrel generally provides support for the composite material, and may be located within the chamber. The upper ramp generally provides a path for the upper diaphragm to follow under vacuum, and may be located adjacent to the mandrel and tilted at approximately 45 degrees downward thereto. The upper diaphragm may be placed over an opening along one side of the chamber. During processing, a vacuum may be applied to chamber and the upper diaphragm may be pulled inward through the opening to press the composite material against the mandrel.

Abstract: A substrate laminating apparatus which sticks substrates together in vacuum with high accuracy. The apparatus includes a first chamber into which two substrates are carried; a second chamber in which substrates are stuck together; and a third chamber which delivers a substrate laminate. The pressure level in the first chamber and the third chamber is varied from atmospheric to medium vacuum under control and that in the second chamber is varied from medium vacuum to high vacuum under control. In the second chamber, electrostatic adsorption means which can move up and down picks up an upper substrate and holds it on an upper table.

Abstract: A reusable vacuum bag for processing parts is made by encapsulating a generally rigid frame within a flexible diaphragm.

Abstract: A flexible compaction sheet is used to compact uncured composite plies onto the surface of a ply layup. The compaction sheet includes a peripheral seal that seals the perimeter of the sheet to the surface of the part layup and forms a vacuum chamber over the plies which is evacuated through the sheet to apply compaction pressure to the plies.

Abstract: A system and method for forming a hollow, complex, monolithic composite part. Composite material may be placed around the mandrel, then an internal impermeable membrane may be placed into and/or through tunnels formed in the mandrel. Next, an external impermeable membrane may be placed around the composite material and sealed against itself and the internal impermeable membrane such that the mandrel and the composite material are both contained in an airtight manner between the internal and external impermeable membranes. Air may then be removed from within the sealed impermeable membranes, compressing the impermeable membranes against the mandrel and/or the composite material. The consolidated composite material may be hardened to form the composite part. Finally, the impermeable membrane may be removed from around the hollow composite part and from within the mandrel, followed by removal of the mandrel from within the composite part by breaking it up into smaller pieces.

Abstract: The present invention relates to an apparatus for the manufacture of semiconductor devices wherein the apparatus includes a bonding module that has a vacuum chamber to provide bonding of wafers under pressure below atmospheric pressure; and a loadlock module connected to the bonding module and configured for wafer transfer to the bonding module. The loadlock module is also connected to a first vacuum pumping device configured to reduce the pressure in the loadlock module to below atmospheric pressure. The bonding and loadlock modules remain at a pressure below atmospheric pressure while the wafer is transferred from the loadlock module into the bonding module.

Abstract: In order to repair a composite-material panel forming part of the external surface of an aircraft, a portable device is applied onto that surface, the portable device including an inflatable chamber consisting of a flexible and airtight membrane and a concave body of rubber-like material sealed with the membrane. The concave body incorporates an inextensible inner reinforcement. Pressurized air is introduced into the chamber via a valve. A further valve, which passes through the membrane in a zone of the membrane external to the chamber, is used to suck air from one side of the membrane to the other.

Abstract: A tool for curing a composite layup comprises a tool body having a surface adapted to support a composite layup thereon. The tool includes an integrated breather for allowing removal of air from the layup during curing.

Abstract: A method for fabricating a sheet-shaped electrode for an electrostatic coalescing device. A layered material structure including an electrically conductive layer for forming a conductive member of the electrode and two electrically non-conductive insulation layers are arranged in an envelope. The insulation layers include thermoplastic or thermoset material for forming the insulation of the electrode. The conductive layer is arranged between the insulation layers. The envelope is sealed. Gas is evacuated from the envelope. The material structure is heated to a temperature above the melting temperature of the thermoplastic material or above the curing temperature of the thermoset material so as to consolidate the material structure while keeping the material structure inside the evacuated envelope. The material structure is cooled and removed from the envelope.

Abstract: An attaching device and a method of fabricating an organic light emitting device using the same are disclosed. The attaching device includes a process chamber, first and second substrate supporters, a substrate detachable part, and an open-close valve. The first and second substrate supporters are positioned inside the process chamber, load and fix substrates. The substrate detachable part is positioned inside the second substrate supporter, and moves up and down to allow the second substrate supporter to instantaneously receive a physical pressure. The open-close valve is positioned on a portion of the process chamber, and opens and closes the process chamber to control a pressure inside the process chamber.

Abstract: A substrate sealing apparatus includes a chamber, at least one lower compressing member, and at least one lower compressing member. The lower compressing member includes a lower compressing surface for emitting heat, is configured to be elevated up and lowered down in a vertical direction with respect to the compressing surface, and rotates about the vertical direction. The upper compressing member includes a lower compressing surface for emitting heat, and is configured to be elevated up and lowered down in the vertical direction.

Abstract: The invention relates to a production method for incorporating an object into a multi-part, transparent casing. According to the method, an object is aligned on a first joint surface of a first casing part and is pressed into said part using a second casing part with a second joint surface. The first joint surface of the first casing part and the second joint surface of the second casing part are then fused by pressure and temperature, forming a region between the casing parts that is devoid of a visible seam.

Abstract: An improved apparatus for debonding temporary bonded wafers includes a debonder, a cleaning module and a taping module. A vacuum chuck is used in the debonder for holding the debonded thinned wafer and remains with the thinned debonded wafer during the follow up processes steps of cleaning and mounting onto a dicing tape. In one embodiment the debonded thinned wafer remains onto the vacuum chuck and is moved with the vacuum chuck into the cleaning module and then the taping module. In another embodiment the debonded thinned wafer remains onto the vacuum chuck and first the cleaning module moves over the thinned wafer to clean the wafer and then the taping module moves over the thinned wafer to mount a dicing tape onto the wafer.

Abstract: A tape bonding device for bonding a tape member to a work piece, wherein the tape bonding device has a main body section, and a cover body section provided reopenable to the main body section. The main body section has a mount member on the upper surface of which the work piece is mounted; a tape holding unit which holds the tape member in a stretching state, and, at the same time, locates the tape member in the upper portion of the work piece mounted on the mount member; and a sucking unit for vacuum suction of space between the tape member and the work piece. The cover body section has a concave section which is depressed upward in the blocked state of the cover body section, and, at the same time, the upper bottom surface of the concave section presses downward the work piece and the tape member, which move upward.

Abstract: A device and a method for producing laminated safety glass from at least two glass panes having an adhesive layer arranged in between. In order to provide a device and a method for producing laminated safety glass that allow for the cost-effective production of laminated safety glass, the device includes a base plate and a cover plate that can be adjusted relative to each other between an operating position and a removal position, a sealing frame disposed in a pressure tight manner in the operating position on the base plate and the cover plate, means for creating a vacuum in a hollow space formed between a cladding material covering the glass panes in the operating position and the base plate, means for creating an overpressure in the working space created between the cover plate and the flexible cladding material arranged on the glass panes in the operating position, and heating means for heating the glass panes to be joined.

Abstract: A flexible compaction sheet is used to compact uncured composite plies onto the surface of a ply layup. The compaction sheet includes a peripheral seal that seals the perimeter of the sheet to the surface of the part layup and forms a vacuum chamber over the plies which is evacuated through the sheet to apply compaction pressure to the plies.

Abstract: A mould for moulding a wind turbine blade using a reinforcing material and a matrix material is provided. The mould includes a solid non-stick lining, and wherein the material properties of the non-stick lining are chosen to prevent a matrix material from bonding with the non-stick lining of the mould. A method of moulding a wind turbine blade in a mould is also provided. The method includes applying a solid non-stick lining to an inside surface of the mould, assembling a reinforcement material lay-up for the wind turbine blade on the non-stick lining, distributing a matrix material through layers of the reinforcement material lay-up, performing curing steps to harden the matrix material, and subsequently removing the cured wind turbine blade from the mould.

Abstract: A method of manufacturing root of megawatt wind-turbine blade includes the following steps: (1) manufacturing an independent female mould, and arranging a positioning stop-ring on the female mould; (2) clinging on one side of the positioning stop-ring, a plurality of glass fabrics and macroporous glass fabrics are laid on the curved surface of the female mould; (3) after laying the glass fabrics, sealing the female mould using a vacuum bag, and vacuumizing the female mould after a curved supporting board is arranged on the vacuum bag; (4) after laying a plurality of glass fabrics in the blade mould, slinging the prefabricated part and the curved supporting board to arrange them in the blade mould; (5) sealing the blade mould using another vacuum bag, vacuumizing the blade mould, thereafter infusing resin into the blade mould, after curing the root of the blade is finally formed.

Abstract: A method of manufacturing a flexible display device is disclosed. The flexible display device manufacturing method includes: preparing a support substrate; coating a sealant on edge areas of the support substrate; combining a flexible substrate and the support substrate coated with the sealant in a vacuum state; hardening the sealant between the support substrate and the flexible substrate; forming display components used in a configuration of the flexible display device on the flexible substrate; and cutting the flexible substrate along a cutting line on the flexible substrate to separate the flexible substrate from the support substrate.