Means Bringing Discrete Articles Into Assembled Relationship Patents (Class 156/556)
  • Patent number: 8127820
    Abstract: Techniques for producing optical medium that can be read at substantially high speeds with greater stability and accuracy are disclosed. According to one aspect of the techniques, a molding station includes an optimized stampler which does not have an exact inverse image of a replica. To account for an inherent distortion in a substrate after being stamped, a stampler is pre-distorted so that the pit geometry in the stamped substrate becomes nearly perfect after the inherent distortion. In one embodiment, the injection of a molten material, the mold position and compression are respectively controlled to account for possible non-uniform density distribution of the material. To provide an effective bonding process, a bonding station is employed with what is referred to as index bonding technique and/or pulse bonding technique. The index bonding is provided to ensure that non-flatness of substrates is compensated when two substrates are bonded together so as to minimize possible dynamic imbalance of a disc.
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: March 6, 2012
    Assignee: Anwell Technologies Limited
    Inventors: Kai Leung Fan, Ming Sang Yeung
  • Patent number: 8127817
    Abstract: A rubber sheet jointing apparatus is provided with a first holding member for releasably holding a joint end portion of one of two rubber sheets; a second holding member provided movably relative to the first holding member for releasably holding a joint end portion of the other of the two rubber sheets; and an operating member for pressure-contacting the end surfaces of the two rubber sheets respectively held by the first and second holding member by moving the second holding member relative to the first holding member. Mutually facing surfaces of the first and second holding member are respectively provided with holder portions which are formed as rugged portions each taking a comb tooth shape and which are able to partly overlap to mesh with each other.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: March 6, 2012
    Assignees: Fuji Shoji Co., Ltd., Fuji Seiko Co., Ltd.
    Inventor: Shigemasa Takagi
  • Patent number: 8105459
    Abstract: A method and apparatus for producing labeled, plastic foam containers, such as a labeled EPS cup uses a heated pocket to thermally bond a label to a plastic cup. Also described is a labeled plastic foam container, such as a labeled EPS cup, having high quality printing capabilities, sufficient stiffness, acceptable insulation and barrier properties and reduced production cost.
    Type: Grant
    Filed: March 23, 2010
    Date of Patent: January 31, 2012
    Assignee: Grupo Convermex, S.A. de C.V.
    Inventor: Benito Alvarez
  • Publication number: 20110308691
    Abstract: Method and device for forming a packet-like back-to-back wafer batch made up of a predetermined even number of wafers that are to be doped on one side. The wafers of one half of the batch are horizontally and congruously arranged on supporting surfaces of a support system which are disposed at a vertical distance from each other. Holding elements of a holding system have a horizontal upper holding surface and a horizontal lower surface and are provided so as to be movable back and forth relative to two adjacent supporting surfaces between a releasing position and a holding position. The wafers of the second half of the batch, which have previously been moved into a position that is offset by 180° relative to the position of the wafers of the first half are inserted into a holding system so each wafer of the second half rests on the horizontal upper holding surface.
    Type: Application
    Filed: February 19, 2010
    Publication date: December 22, 2011
    Applicant: Jonas & Redmann Automationstechnik GMBH
    Inventors: Stefan Jonas, Lutz Redmann, Robert Hartwig
  • Patent number: 8069893
    Abstract: A cutting mechanism for dry film laminator includes a main base connected to a dry film laminator. The main base has a cutting space defined therein. The main base has two rollers disposed thereon and located beside the cutting space. The two rollers flatly guide a film above the cutting space. A film-carrying device is movably disposed on the main base. The film-carrying device includes a suction member movably disposed thereon. The suction member has at least one annular groove defined therein and corresponding to a shape of a wafer. A cutting device is movably disposed below the main base. The cutting device includes a film cutter movably disposed thereon. The cutting device includes an elevating device disposed thereon for moving the film cutter upward/downward. The cutting device includes a motor disposed thereon for rotating the film cutter.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: December 6, 2011
    Inventor: Chin-Sen Lai
  • Patent number: 8066046
    Abstract: A cutting and transfer drum in a continuous-film labeling machine, which allows disassembly into sectors comprised between two contiguous blades, each sector being provided with elements for locking in the active position, which comprise a rotating rod which is provided with an actuation crank, said rod having a portion which is adapted to mate with a reference element provided on the sector, elements adapted to retain the sector in the locking position, a cam adapted to make contact with an abutment provided on the sector, so as to ensure a contact pressure of the sector on a supporting ring which ensures the retention of the fluid that provides suction.
    Type: Grant
    Filed: December 6, 2007
    Date of Patent: November 29, 2011
    Assignee: P.E. Labellers S.p.A.
    Inventor: Mario Ballarotti
  • Patent number: 8057620
    Abstract: Multilayer absorbent pads for nappy/diaper pants are manufactured on a unit (1) comprising a first device (3a) and a second device (3b) by which respective first and second layers (4a, 4b) of absorbent material (5) are taken up from two infeed stations, shaped, and transferred to two release stations. The devices (3a, 3b) are synchronized in operation, and associated by way of a transfer station (8) at which the first layer (4a) of absorbent material is joined directly to the second layer (4b), positioned selectively and with the second layer still retained by suction on the second device (3b); the two layers are thereupon compressed simultaneously to form an absorbent pad (2) that emerges from the unit as a stable, one-piece core.
    Type: Grant
    Filed: August 31, 2006
    Date of Patent: November 15, 2011
    Assignee: GDM S.p.A.
    Inventors: Alberto Perego, Stefano Nanni, Matteo Piantoni, Luca Aiolfi
  • Publication number: 20110268928
    Abstract: The open edge(s) of a multi-walled panel made of a thermoplastic resin are sealed by selecting a resin film or tape having a width that is greater than the thickness of said panel edge(s), welding the resin layer to the panel edge(s) to provide a projecting portion of said layer on at least part of at least one side of the said panel, and removing at least part of said projecting portion(s) from the sealed panel.
    Type: Application
    Filed: February 2, 2009
    Publication date: November 3, 2011
    Applicant: MP MASTERPLAST INTERNATIONAL LLC
    Inventor: Stanislav Jurcik
  • Patent number: 8047249
    Abstract: A strip pack apparatus is an apparatus for manufacturing a strip pack with a plurality of items attached on a backing sheet. The strip pack apparatus includes a conveying unit configured and arranged to convey the item generally in the horizontal direction, a moving unit configured and arranged to move the item from the conveying unit to a position obliquely downward on the front side in the conveying direction, and an attaching unit configured and arranged to attach the item moved by the moving unit to the backing sheet.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: November 1, 2011
    Assignee: Ishida Co., Ltd.
    Inventors: Yoshio Iwasaki, Akira Yamamoto
  • Patent number: 8037918
    Abstract: Pick-up heads and systems are especially useful for picking up, transporting, and placing semiconductor dies at bond sites on packaging substrates. Alternatively, the heads and systems are useful for performing these tasks with any of various other planar objects. An exemplary head includes a shank and a body. The body includes a compliant end portion contactable by the shank, and the end portion includes a face. The shank is movable relative to the end portion such that, whenever the shank is retracted, the face has a substantially planar contour, and whenever the shank is extended, the shank contacts and urges the end portion to provide the face with a convex contour. The end portion desirably defines at least one vacuum orifice connected to an evacuation device (e.g., a vacuum pump) that evacuates the vacuum orifice sufficiently to cause the planar object to adhere to the face.
    Type: Grant
    Filed: December 4, 2006
    Date of Patent: October 18, 2011
    Assignee: Stats Chippac, Inc.
    Inventors: Ya Ping Wang, Jian Ming Yang, Guo Qiang Shen, Chee Keong Chin
  • Patent number: 8038826
    Abstract: An improved tabbed divider making apparatus is disclosed. The machine preferably improves upon existing tabbed divider making machines in its ease of use and efficiency. Among other elements, the machine may include a paper feeder, a processing section, and an output tray. An improved film delivery system is also disclosed, as well as methods relating to manufacturing of tabbed dividers.
    Type: Grant
    Filed: January 22, 2008
    Date of Patent: October 18, 2011
    Assignee: Scott Office Systems, LLC
    Inventors: Mark Kucera, Kevin Hartnett, Thomas J. Richmond
  • Publication number: 20110232827
    Abstract: It can prevent extension of the time required for bonding, even when relatively large members are bonded. a bonded member manufacturing apparatus comprises a first holder 11 for holding a first member D, a second holder 12 for holding a second member E, an application device 40 for applying the intermediate substance G to a first bonded surface Df, a moving device 20 for moving the first holder 11 and/or the second holder 12, and a controller.
    Type: Application
    Filed: December 30, 2010
    Publication date: September 29, 2011
    Applicant: ORIGIN ELECTRIC COMPANY, LIMITED
    Inventors: Takayuki SUZUKI, Tomoyuki SAITO, Masahiro NAKAMURA
  • Patent number: 8025085
    Abstract: An apparatus and method for applying a label to a specific location on a vial. The apparatus may comprise a label dispenser, a vial placement assembly for orienting the vial and placing it onto a track, a pushing device for pushing the vial down the track into an adhesive side of the label, and a labeling gate for contacting a non-adhesive side of the label to smooth the label onto the vial. The apparatus may further comprise a label positioning device for correcting unwanted curling of the label, a stopper positioned to engage a portion of the pushing device as the vial contacts the label to cause the pushing device to release the vial, and a label-release switch configured to signal for the label dispenser to release a trailing edge of the label once the vial contacts the labeling gate.
    Type: Grant
    Filed: January 27, 2009
    Date of Patent: September 27, 2011
    Assignee: ScriptPro LLC
    Inventors: Michael Skaggs, Ronald A. Leonard, Travis Putman, George Brown
  • Patent number: 8025086
    Abstract: To provide a manufacturing apparatus of an electronic component using an interposer, having high installation flexibility and high production efficiency. The electronic component manufacturing apparatus includes a converter unit configured to place an interposer on a surface of a base circuit sheet, and an interposer supply unit configured to continuously convey carriers holding the interposers and supply the interposers to the converter unit. The interposer supply unit has the carriers that hold the interposers, and is configured to convey the interposers via the carriers.
    Type: Grant
    Filed: April 6, 2006
    Date of Patent: September 27, 2011
    Assignee: Hallys Corporation
    Inventors: Hiroshi Aoyama, Ryoichi Nishigawa
  • Patent number: 8020601
    Abstract: A machine for equipping articles with labels, such as vessels or similar items, including at least one carousel which transports the articles, at least one exchangeable labeling aggregate which is arranged on the periphery of the carousel for equipping the articles, where, on the periphery of the carousel, at least one stationary floor-supported aggregate reception for a labeling aggregate is arranged.
    Type: Grant
    Filed: January 5, 2005
    Date of Patent: September 20, 2011
    Assignee: Krones AG
    Inventors: Erich Eder, Thomas Oestreicher, Dieter Leykamm
  • Publication number: 20110214818
    Abstract: A machine for equipping articles with labels, such as vessels or similar items, including at least one carousel which transports the articles, at least one exchangeable labeling aggregate which is arranged on the periphery of the carousel for equipping the articles, where, on the periphery of the carousel, at least one stationary floor-supported aggregate reception for a labeling aggregate is arranged.
    Type: Application
    Filed: May 17, 2011
    Publication date: September 8, 2011
    Applicant: KRONES AG
    Inventors: Erich Eder, Thomas Oestreicher, Dieter Leykamm
  • Patent number: 8012279
    Abstract: In a method for labeling, a label strip (20) is moved by means of an electric motor (80). Arranged on this label strip are labels (26) of predetermined length (EL) with uniform interstices (SB). The motor has associated with it a position controller (218), also a sensor (44) for sensing a predetermined position of a label (26) when the latter is moved on the label strip (20) relative to the sensor (44). The method has the following steps: in accordance with a stored profile, the label strip (20) is set in motion beginning from a start position (A), a first target position (Z) of the label strip being specified to the position controller (218); during the motion of the label strip (20), a predetermined position (M) of the label strip (20) is sensed; and subsequently thereto, a revised target position (Z) is specified to the position controller (218). This makes possible fast and precise labeling, since the target position can be reached very accurately. A corresponding device has a compact design.
    Type: Grant
    Filed: September 3, 2004
    Date of Patent: September 6, 2011
    Assignee: Herma GmbH
    Inventors: Roger Thiel, Thomas Osswald, Reiner Mannsperger
  • Publication number: 20110189410
    Abstract: A process and system for making a laminated surface covering and the surface covering itself are described. The covering includes several layers bonded to each other. The system performs the process. One example of the process includes passing a first material across a first conveyor, passing a second material across a second conveyor, passing a bonding material across a third conveyor, contacting the first material and the second material to the bonding material, and heating at least one of the first material and the second material. The process also includes introducing the first material, the second material, and the bonding material into a pressure zone such that the bonding material is introduced between a bottom surface of the first material and a top surface of the second material. The process applies pressure to bond the first material and second material together via the bonding material to produce a laminated material.
    Type: Application
    Filed: April 8, 2010
    Publication date: August 4, 2011
    Applicant: ECORE INTERNATIONAL INC.
    Inventors: Arthur B. DODGE, III, John McFalls
  • Patent number: 7988810
    Abstract: An adhesive is applied to an inner surface of a sleeve housing, and a sleeve is relatively moved toward the sleeve housing from inserted into the sleeve housing. The adhesive is cured while a predetermined distance is maintained between a first bearing surface of the sleeve and a lower surface of a flange portion of the sleeve housing.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: August 2, 2011
    Assignee: Nidec Corporation
    Inventor: Takehito Tamaoka
  • Publication number: 20110177261
    Abstract: A distance between a liquid crystal display panel set on a lower support mechanism and a front window set on an upper support mechanism is accurately determined by a stopper. An ultraviolet irradiation mask is provided on the front window. A part of the ultraviolet curable resin corresponding to a transmission pattern of the ultraviolet irradiation mask is temporarily cured through ultraviolet irradiation. The temporarily adhered structure of the liquid crystal display panel and the front window is taken from an attachment device to be left standing for a predetermined time period on a tray until an area and a thickness of the ultraviolet curable resin reach respective predetermined values. The ultraviolet light is then irradiated to an entire surface of the ultraviolet curable resin to finalize the adhesion. The time for which the attachment device is occupied is short, thus improving an operation rate of the device.
    Type: Application
    Filed: January 11, 2011
    Publication date: July 21, 2011
    Inventors: Akira ISHII, Risa Takahashi, Hitoshi Ishii, Shigemi Shito, Shuji Iwasaki, Katsuhiko Ishii
  • Patent number: 7980287
    Abstract: A substrate bonding apparatus includes a first chamber including a first surface plate on which a first substrate is supported, a second chamber spaced from the first chamber and including a second surface plate on which a second substrate to be bonded to the first substrate is supported, an adhesive module provided on the first surface plate and including a plurality of adhesive rubber areas holding the first substrate, and a lift module for lifting at least one of the plurality of adhesive rubber areas.
    Type: Grant
    Filed: June 3, 2008
    Date of Patent: July 19, 2011
    Assignee: ADP Engineering Co., Ltd.
    Inventor: Jae Seok Hwang
  • Patent number: 7967046
    Abstract: The invention relates to an adhesive application apparatus for use with an assembling machine for assembling operatively upper and lower components for carrying printhead integrated circuits. The application apparatus includes a plate and a dispensing mechanism which includes an adhesive reservoir, said mechanism being operatively engaged with said plate in a sealing and sliding manner, the mechanism configured to dispense adhesive onto the plate when sliding along the plate. The apparatus also includes a displacement mechanism to slide the dispensing mechanism along the plate, and a control system to control operation of the dispensing and displacement mechanisms.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: June 28, 2011
    Assignee: Silverbrook Research Pty Ltd
    Inventors: Stephen Richard O'Farrell, Jan Waszczuk, David Bernardi, Toby Desmond Oste, Mark Janos, William Granger
  • Patent number: 7967048
    Abstract: A transferring device 10 for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2 and the third table T3. The transferring device 10 includes a supporting unit provided with a supporting face for the semiconductor wafer W, and a multi joint robot 12 for transferring the supporting unit 11. The supporting face includes an adhesive sheet S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table T1 through T3 can be performed through sticking and peeling operation between the adhesive sheet S and the semiconductor wafer.
    Type: Grant
    Filed: April 29, 2008
    Date of Patent: June 28, 2011
    Assignee: Lintec Corporation
    Inventors: Takahisa Yoshioka, Yoshiaki Sugishita
  • Patent number: 7963020
    Abstract: A method and machine for manufacturing foam parts are provided. The method generally includes cutting a plurality of sections across the width of the base sheet, engaging and reorienting at least one portion of each section, and joining the portions of each section in a desired configuration to thereby form a plurality of parts. The portions can be engaged by actuator assemblies operating in successively adjacent work spaces across the width of the base sheet to simultaneously produce a plurality of similar parts. In some cases, each part includes at least one portion that is reoriented relative to another portion, such as by rotating one of the portions or adjusting one of the portions to a position that is offset from the plane of the section.
    Type: Grant
    Filed: August 28, 2007
    Date of Patent: June 21, 2011
    Assignee: Sealed Air Corporation (US)
    Inventors: Nicholas P. De Luca, Andrew B. Perkins
  • Patent number: 7931063
    Abstract: A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: April 26, 2011
    Assignee: Alien Technology Corporation
    Inventors: Gordon S. W. Craig, Kenneth D. Schatz, Mark A. Hadley, Paul S. Drzaic
  • Publication number: 20110079361
    Abstract: An apparatus for semiconductor die bonding includes a first bonding head and a second bonding head configured to respectively pickup a first semiconductor chip and a second semiconductor chip located at a pickup point. The apparatus for semiconductor die bonding may also include a first transfer device configured to transfer the first bonding head from the pickup point to a bonding point located on a substrate along a transfer path. The first transfer device may further be configured to return to the pickup point along a first return path after the first semiconductor chip is bonded to the substrate. Also, the apparatus for semiconductor die bonding may include a second transfer device configured to transfer the second bonding head from the pickup point to the bonding point located on the substrate along the transfer path. The second transfer device may further be configured to return to the pickup point along a second return path after the second semiconductor chip is bonded to the substrate.
    Type: Application
    Filed: August 4, 2010
    Publication date: April 7, 2011
    Inventors: Byeong-kuk Park, Seok Goh, Kyoung-bok Cho, Dong-soo Lee, Jung-hwan Woo
  • Patent number: 7913737
    Abstract: The present invention provides a bonding apparatus and bonding method which can prevent warping of substrates by ensuring a sufficient standing time following bonding of the substrates, using a simple and compact apparatus. Substrate carrying parts 1a are formed along the circumference of a rotating turntable 1. The respective substrate carrying parts 1a are formed so that these parts pass through substrate placement positions 11 and 12, a bonding position 13, pre-curing standing positions 14a through 14d, a curing position 15, a post-curing standing position 16 and a conveying position 17 as the turntable 1 rotates. After being bonded in the bonding position 13, the substrates move through the pre-curing standing positions 14a through 14d as a result of the rotation of the turntable 1, and are allowed to stand for a fixed period of time, so that warping is corrected.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: March 29, 2011
    Assignee: Shibaura Mechatronics Corporation
    Inventors: Hachiya Takeuchi, Shohei Tanabe, Hisashi Nishigaki
  • Patent number: 7900676
    Abstract: A device that enables a user to properly place a label onto the center of an object such as a poker chip is disclosed and the method for using the device is also disclosed. This device uses the natural motions of the human hand and uses techniques that are common to people when applying adhesive labels onto objects. People naturally place one side of a label down carefully checking its alignment. When there is at least one square corner, a label is more easily aligned, but a circular label on a circular object is difficult at best. Consumers are interested in poker chips as form of entertainment as well wanting to customize these chips as an extension of their personality or persona. This device allows for the immediate and successful placement of many labels onto these chips.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: March 8, 2011
    Inventor: Daniel Lipsky
  • Patent number: 7900675
    Abstract: There is provided a printing device 12 that performs printing on each of first and second labels L1, L2 on the way of feeding out a raw strip sheet M, which is temporarily stuck with a first label L1 and a second label L2 having a smaller plane area than that of the first label on a release liner S, a peel plate 27 that peels off the first and second labels L1, L2 from the release liner S, first and second label suction plates 30, 31 that hold the respective peeled labels L1, L2, and a laminating device 17 that laminates the first and second labels L1, L2 with the adhesive layer of the second label L2 facing the adhesive layer of the first label L1. The adhesive layer of the first label L1 laminated with the second label L2 is exposed in a closed loop manner in an outer peripheral area all around the second label L2.
    Type: Grant
    Filed: January 17, 2006
    Date of Patent: March 8, 2011
    Assignee: Lintec Corporation
    Inventors: Akira Dangami, Kenji Kobayashi
  • Patent number: 7896051
    Abstract: A die bonding apparatus is presented which is capable of realizing different semiconductor packages, for example, a face up package and a face down package in a single die bonding apparatus. The die bonding apparatus includes a substrate transportation unit for transporting a substrate. A first bonding head unit is included which has a first bonding head for bonding a semiconductor chip disposed in a mount table adjacent to the substrate transportation unit over the substrate. A die transportation unit is included for transporting the semiconductor chip disposed in a mount table to a mount stage disposed at a lower portion of the substrate. A second bonding head unit is included in which the mount stage and a second bonding head disposed at an upper portion of the substrate corresponding to the mount stage and bonding the semiconductor chip disposed in the mount stage to the lower portion of the substrate.
    Type: Grant
    Filed: December 12, 2007
    Date of Patent: March 1, 2011
    Assignee: Hynix Semiconductor Inc.
    Inventors: Byung Chul Kang, Kwang Duck Koh, Jum Dong Lee, Hwa Seob Lee, Jae Moo Shin
  • Publication number: 20110036505
    Abstract: The receiving-heating unit contains a sleeve (9) fixed on the housing (2) of the heating element (1) and a sliding insert (5) therein. A sealing ring (11) is arranged in an annular groove between a collar (10) at the lower part of the sliding insert (5) and the front surface of the sleeve (9). There is a switch (8) provided with a switch arm (3) which can be rotated around the axis of the sleeve (9) and the sliding insert (5) against the action of a spring (4) and is provided with means for lifting and lowering the sliding insert (5). Means for holding the mouth part (22) of a bottle (21) is a lever (15) tiltable against the action of another spring (19), having a first arm (23) moved by the mouth part (22) and a second arm (20) locking the switch arm (3).
    Type: Application
    Filed: March 17, 2009
    Publication date: February 17, 2011
    Inventor: Lajos Simon
  • Patent number: 7875144
    Abstract: A transferring device 10 for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2 and the third table T3. The transferring device 10 includes a supporting unit 11 provided with a supporting face for a semiconductor wafer W, and a multi joint robot 12 for transferring the supporting unit 11. The supporting face includes a stacked body of adhesive sheets S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table T1 through T3 can be performed through sticking and peeling operation between the adhesive sheet S positioned in an outermost layer and the semiconductor wafer W.
    Type: Grant
    Filed: April 29, 2008
    Date of Patent: January 25, 2011
    Assignee: Lintec Corporation
    Inventor: Kenji Kobayashi
  • Patent number: 7874339
    Abstract: A method and apparatus for applying indicia to a curved surface, including a compound curved surface having multiple axes of curvature. The curved surface is deformed to eliminate one axis of curvature. The invention is usable with hourglass or barrel shaped surfaces, as occur with containers, and to apply labels and other indicia to these surfaces.
    Type: Grant
    Filed: October 13, 2006
    Date of Patent: January 25, 2011
    Assignee: The Procter & Gamble Company
    Inventors: Paul Amaat Raymond Gerard France, Robert Paul Cassoni, Christopher Lawrence Smith
  • Publication number: 20110011536
    Abstract: A room temperature bonding apparatus includes: an angle adjustment mechanism that supports a first sample stage holding a first substrate to a first stage so as to be able to change a direction of the first sample stage; a first driving device that drives the first stage in a first direction; a second driving device that drives a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table that supports the second sample stage in the first direction when the second substrate and the first substrate are brought into press contact with each other. In this case, the room temperature bonding apparatus can impose a larger load exceeding a withstand load of the second driving device on the first substrate and the second substrate.
    Type: Application
    Filed: March 11, 2008
    Publication date: January 20, 2011
    Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Satoshi Tawara, Jun Utsumi, Yoichiro Tsumura, Kensuke Ide, Takenori Suzuki
  • Publication number: 20110011541
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: September 28, 2010
    Publication date: January 20, 2011
    Applicant: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Patent number: 7832447
    Abstract: A specification-attaching apparatus includes a transferring unit for transferring a specification fed from a specification-feeding unit to an attaching unit that includes a suction member movable, in response to rotation of a pivot rod, in sequence among angularly spaced sucking, standby and releasing positions. The suction member is operable so as to switch from a non-sucking state to a sucking state when at the sucking position, thereby sucking the specification transferred from the transferring unit and to switch from the sucking state to the non-sucking state when at the releasing position, thereby releasing the specification sucked thereby. A container sprayed with glue by a glue-spraying unit is conveyed by a motor-driven container conveying unit to move in synchronization with and contact the suction member during movement of the suction member from the standby position to the releasing position so that the specification is attached to the container.
    Type: Grant
    Filed: July 30, 2008
    Date of Patent: November 16, 2010
    Assignee: CVC Technologies, Inc.
    Inventor: Sheng-Hui Yang
  • Patent number: 7828031
    Abstract: An apparatus and a method are proposed for aligning and fixing a ribbon onto the groove of a solar cell for avoiding undue stress on the ribbon as well as crystal damage of the solar cells by hardening of the ribbon. The apparatus includes a frame, a leading arm, and a trailing arm, the leading and trailing arms being movably mounted on at least one linear guide arranged on said frame. The apparatus further provides for upward and downward movement of the at least one linear guide, and a shear for cutting said ribbon. Both the leading arm and the trailing arm have a gripper for gripping the ribbon. These grippers are provided to apply a predetermined longitudinal tension to the ribbon when the leading and trailing arms are moved relative to one another.
    Type: Grant
    Filed: February 14, 2006
    Date of Patent: November 9, 2010
    Assignee: Komax Holding AG
    Inventor: Brian S. Micciche
  • Patent number: 7819163
    Abstract: The present invention is directed to a method of making a door having first and second door facings and an internal doorframe. An interior side of a first facing is coated with quick acting adhesive. A frame is placed on the coated interior side about the periphery of the first facing. The frame is then coated with quick acting adhesive. An interior side of a second facing is placed on the coated frame. The facings and frame assembly are then compressed to form a door. The present invention also provides for an automated system of making the door.
    Type: Grant
    Filed: September 15, 2004
    Date of Patent: October 26, 2010
    Assignee: Masonite Corporation
    Inventor: Kenneth Charles Tyler
  • Publication number: 20100258249
    Abstract: Provided is a system for manufacturing an optical display unit and a feed mechanism, which can well prevent an optical film and a pressure-sensitive adhesive layer from being peeled from a release film. A pressure-sensitive adhesive type sheet material, wherein the optical film and the pressure-sensitive adhesive layer (film main body (F)) are cut without cutting a release film (F12, F22) which is laminated to the optical film with the pressure-sensitive adhesive layer in between, is fed along a feed path (12A, 22A). A press member (200) is arranged at a position opposed to a bent portion or a curved portion in the feed path (12A, 22A). Since the film main body (F) which is peeled from the release film (F12, F22) can be pressed to the release film (F12, F22) by the press member (200), the film main body (F) can be well prevented from being peeled from the release film (F12, F22).
    Type: Application
    Filed: January 7, 2009
    Publication date: October 14, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazuo Kitada, Takuya Nakazono, Satoru Koshio, Tomokazu Yura
  • Publication number: 20100252191
    Abstract: A sheet sticking apparatus 10 includes a first case 20 for accommodating a table 11 for supporting a semiconductor wafer W, a second case 21 for forming a decompression chamber C with the first case 20, and feeding means 15 for feeding an adhesive sheet S to a position where the adhesive sheet S faces the semiconductor wafer W. The second case 21 includes a bulkhead 30 for forming a pressure adjusting chamber C1 in a state where a single decompression chamber C is formed, the pressure adjusting chamber C1 being capable of controlling the pressure therein independently of the decompression chamber C, wherein the adhesive sheet S is stuck to the semiconductor wafer W under decompression by setting the decompression chamber C in a decompression state and relatively increasing the pressure in the pressure adjusting chamber C1.
    Type: Application
    Filed: November 28, 2008
    Publication date: October 7, 2010
    Applicant: LINTEC CORPORATION
    Inventors: Kan Nakata, Yota Aoki
  • Patent number: 7802602
    Abstract: The invention concerns a labelling device (1) comprising a conveying device (3) provided with a drive unit (14) for transporting a supporting band (7) having a plurality of labels, and a dispensing device (2). The supporting band (7) comprising labels (6) is unwound on a label roll (9), then, once the labels are removed from the supporting band (7), the latter (7) is wound on a supporting band roll (10). The conveying device (3) has two roll units (8, 12) for the label roll (8) and the supporting band roll (10), said roll units capable of being driven each in different rotational directions. The transporting direction of the supporting band (7) may be reversed by inversion of the driving direction of the drive unit (14) for labelling containers (19) in two different labelling directions (X1, X2). The roll units (8, 12) are identically shaped.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: September 28, 2010
    Inventor: Udo Siedlaczek
  • Publication number: 20100206490
    Abstract: The invention is generally applicable to labeling apparatus, and relates to a device (10) for rotating Container plates in a labeling apparatus; such device (10) being engaged by at least two wheels (1) with a cam (5) for guiding and rotating it, so that the plate connected therewith is also rotated; each wheel (1) consisting of at least one rigid element (2) and at least one elastic disk (3) coupled thereto, having a greater outside diameter, so that the cam (5) is first contacted by said elastic disk (3). As the load between the elastic disk (3) and the cam (5) is increased, and such disk (3) is elastically deformed, the cam (5) is contacted by the rigid element (2).
    Type: Application
    Filed: June 2, 2006
    Publication date: August 19, 2010
    Applicant: SIDEL S.P.A.
    Inventors: Vanni Zacche', Daniele Marastoni
  • Patent number: 7748423
    Abstract: The cover film sticking device is capable of securely sticking cover film pieces on specimen samples on all slide glasses stored in a basket, which starts to stick the cover film pieces formed, by cutting off long cover film unwound from a film roll to a specified length on the specimen samples on the plurality of slide glasses stored in the basket 26 taken out from a load tank 12 filled with a volatile protective solution. The sticking device is characterized by cover film length securing means for unwinding the long cover film from the film roll and extending the same until reaching cutting means so as to secure the cover film of such a length that can form the cover film pieces to be stuck onto the specimen samples on the maximum number of the slide glasses storable in the basket 26 taken out from the load tank 12.
    Type: Grant
    Filed: April 5, 2005
    Date of Patent: July 6, 2010
    Assignees: Sakura Seiki Co., Ltd., Sakura Finetek Japan Co., Ltd
    Inventors: Tomio Takahashi, Masanori Yamabe
  • Patent number: 7726372
    Abstract: A printer includes a driving station configured to drive print media between a pair of pinch rollers. A printing station is configured to print upon the driven print media. An adhesive application station is configured to apply an adhesive to the print media. A collection station is configured to collect a stack of printed print media bearing adhesive. The collection station includes a binding press configured to bind the stack together.
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: June 1, 2010
    Assignee: Silverbrook Research Pty Ltd
    Inventor: Kia Silverbrook
  • Publication number: 20100116426
    Abstract: The invention relates to a labeling device and method for attaching in particular elongated narrow labels. In the labeling device, a respective label dispensed from a dispensing edge is only partially received by a conveying belt. The conveying belt is moved into a position in which a portion of the label projecting from the conveying belt is attached at an item to be labeled. The conveying belt may be crossed by 90° while it passes a drive roll and a roller.
    Type: Application
    Filed: November 9, 2009
    Publication date: May 13, 2010
    Applicant: MR ETIKETTIERTECHNIK GMBH & CO. KG
    Inventor: Georg Austermeier
  • Patent number: 7699956
    Abstract: The invention relates to a method for making a cellular structure (1) comprising a plurality of elements (2), in which method a first plurality of elements (2) is provided that form a first row (3) of elements, and that furthermore a second plurality of elements (2) is provided that form a second row (4) of elements (2). The second row (4) is parallel to the first row (3) but displaced in phase in relation to this. An adhesive is applied to the elements (2) in at least one of the two rows (3, 4) and at least one of the two rows (3, 4) is brought closer to the other, so that the two rows are brought together and thereby bonded to one another by the adhesive. The invention also relates to a machine for executing the method according to the invention.
    Type: Grant
    Filed: June 27, 2003
    Date of Patent: April 20, 2010
    Assignee: Airwood Sweden Aktiebolag
    Inventors: Torsten Nilsson, Lenart Corbeus
  • Publication number: 20100089536
    Abstract: A labeling device includes a conveyor belt for taking up a row of labels, and two label dispensers, each for dispensing labels from a dispensing sheet over a dispensing edge onto the conveyor belt. The label dispensers are disposed one behind the other, the dispensing edge of a rear one of the dispensers being shifted, so that the dispensing edges of the two label dispensers are one above the other. The conveyor belt is guided over a belt deflector for changing the course of the belt between two positions as to the dispensing edges, the belt deflector including a tilting lever, over which the conveyor belt is deflected and which can be swiveled between two positions. The conveyor belt is in a first position for taking up labels at the first dispensing edge and in a second position, for taking up labels at the second dispensing edge.
    Type: Application
    Filed: January 5, 2009
    Publication date: April 15, 2010
    Applicant: MR ETIKETTIERTECHNIK GMBH & CO. KG
    Inventor: Georg Austermeier
  • Patent number: 7694710
    Abstract: An improved optical disk labeling device includes a label holding dock containing a holding portion and an optical disk holding dock slidable on the holding portion. The holding portion has downward and upward tracks. The downward and upward tracks have two ends forming a first anchor portion and a second anchor portion that communicate with each other. Through an actuation member the optical disk holding dock can be anchored at a first position to receive a first depressing force so that the actuation member is moved along the downward track to hold the optical disk holding dock at a second position. At the second position the optical disk holding dock can receive a second depressing force so that the actuation member slides along the upward track and allows the optical disk holding dock to return to the first position.
    Type: Grant
    Filed: July 7, 2008
    Date of Patent: April 13, 2010
    Inventor: Shu-Chi Hong
  • Patent number: RE41347
    Abstract: This invention provides joining methods of single veneer piece and a joining apparatus, which can produce more efficient, and effective joining process than the conventional method and apparatus produce. In the process of carrying a single veneer piece (T) in the orthogonal direction against the joining edge (Te) on the conveyor, the joining edges of the preceding and succeeding single veneer pieces come close together, the adhesive material (Sd) is supplied to the clearance between the joining edges, and then the adhesion enhancing action is supplied to the said adhesive material (Sd) to join each single veneer piece (T) successively. The adhesion enhancing action can be applied within the adhesion enhancing section as indicated by lines (Z1) and (Z2), provided on the farther side from the edge approaching position (U) via an adhesion enhancing component (6) to move back and forth at any time while the single veneer piece (T) is being carried or such a motion is halted.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: May 25, 2010
    Assignee: Meinan Machinery Works, Inc.
    Inventors: Mikio Tsutsui, Takayuki Yamauchi, Hideki Hasegawa, Sekiji Takahashi
  • Patent number: RE42176
    Abstract: Machine for manufacturing mesh bags from a continuous roll of tubular mesh, and for filling and closing said mesh bags, which comprise an expansion device which is perimetric to the tubular mesh, the core expander of which is equipped with a vertical aperture which, as if it were a slot, traverses said core expander and connects the two frontal faces thereof and extends from its base to an intermediate point, for which the core expander adopts an inverted “U” shape, the machine also being fitted with preventive welding means, adapted for partially welding the two frontal faces of the tubular mesh and, as the case may be, the adjoining laminates of thermally weldable material through the aperture of the core expander; a traction device which drags a section of the tubular mesh provided with a bottom; conveyor means; and second and third filling and closing stations, respectively, both being arranged linearly.
    Type: Grant
    Filed: September 3, 2008
    Date of Patent: March 1, 2011
    Assignee: Girnet Internacional, S.L.
    Inventor: Ezequiel Giro Amigo