Delaminating, Per Se; I.e., Separating At Bonding Face Patents (Class 156/701)
  • Publication number: 20140083624
    Abstract: The present disclosure is directed toward solutions, transparent films prepared from aromatic copolyamides, and a display element, an optical element or an illumination element using the solutions and/or the films. The copolyamides, which contain pendant carboxylic groups are solution cast into films using cresol, xylene, N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), dimethylsulfoxide (DMSO), or butyl cellosolve or other solvents or mixed solvent which has more than two solvents. When the films are thermally cured at temperatures near the copolymer glass transition temperature, after curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant.
    Type: Application
    Filed: September 24, 2013
    Publication date: March 27, 2014
    Applicants: Akron Polymer Systems, Inc., Sumitomo Bakelite Co., Ltd.
    Inventors: Frank W. Harris, Dong Zhang, Limin Sun, Jiaokai Jing, Toshimasa Eguchi, Hideo Umeda, Ritsuya Kawasaki, Toshihiko Katayama, Yusuke Inoue, Jun Okada, Fumihiro Maeda, Mizuho Inoue, Manabu Naito
  • Publication number: 20140076498
    Abstract: A film peeling method for a film-coated flat wire that is performed by a film peeling device including: a rotational holder that can rotationally convey in a perpendicular direction to a rotational axis; a positioning mechanism that positions a film-coated flat wire in a longitudinal direction; and a working section that is provided in plural, aligned at specified intervals, and works an end portion of the film-coated flat wire, the method includes: holding the film-coated flat wire that is cut in a specified length in advance by the rotational holder; rotationally conveying the film-coated flat wire that is held by the rotational holder in the perpendicular direction to the rotational axis; positioning the conveyed film-coated flat wire by the positioning mechanism; and working the end portion of the film-coated flat wire by the working section.
    Type: Application
    Filed: September 17, 2013
    Publication date: March 20, 2014
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Kazuhiro SATO
  • Publication number: 20140076497
    Abstract: A separation apparatus according to the present disclosure includes a first holding unit, a cutting unit, a measuring unit and a position adjusting unit. The first holding unit holds a first substrate of a superposed substrate formed by joining the first substrate and a second substrate. The cutting unit cuts a joining portion of the first substrate and the second substrate. The measuring unit measures a distance from a predetermined measurement reference position to a holding surface of the first holding unit or to an object interposed between the measurement reference position and the holding surface. The position adjusting unit adjusts a cutting position of the cutting unit based on a result of the measuring unit and information acquired in advance with respect to a thickness of the superposed substrate.
    Type: Application
    Filed: September 3, 2013
    Publication date: March 20, 2014
    Applicant: Tokyo Electron Limited
    Inventors: Masaru HONDA, Masanori ITOU
  • Publication number: 20140079922
    Abstract: Durable coatings and methods for producing the same are provided, where the coatings may include porous coatings encapsulated with a hardening solution that permeates into the porous structure of the film prior to curing. Curing of the hardening solution within the film provides for a durable coating having sufficient durability for use in many different applications, such as optical applications. Any convenient porous coatings may be used in the subject methods. Also provided are methods for forming a coating formulation, where the formulation includes porous coating particles dispersed in a carrier and the porous coating particles may be optionally encapsulated with a hardening solution prior to dispersion.
    Type: Application
    Filed: September 16, 2013
    Publication date: March 20, 2014
    Applicant: Svaya Nanotechnologies, Inc
    Inventors: Benjamin Wang, David Olmeijer, Siglinde Schmid, Melissa Fardy, J. Wallace Parce, Kevin Krogman
  • Publication number: 20140060747
    Abstract: A method and a device for recycling labeled plastic articles are described. Accordingly, the labels are detached from the plastic articles and the plastic articles treated in this way are sorted in particular automatically. During sorting, plastic articles from which the labels have not been properly detached are sorted out and again subjected to the treatment for detaching the labels.
    Type: Application
    Filed: August 27, 2013
    Publication date: March 6, 2014
    Applicant: KRONES AG
    Inventor: Thomas Friedlaender
  • Publication number: 20140065416
    Abstract: A double-sided pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer containing an acrylic polymer formed of a component comprising, as an essential monomer component, an alkyl (meth)acrylate having an alkyl group having 9 or less carbon atoms. A shear storage elastic modulus at 23° C. of the pressure-sensitive adhesive layer, which is measured by dynamic viscoelasticity measurement, is 5.0×105 Pa or less, and a shear storage elastic modulus at ?50° C. of the pressure-sensitive adhesive layer, which is measured by dynamic viscoelasticity measurement, is 1.0×108 Pa or more.
    Type: Application
    Filed: August 30, 2013
    Publication date: March 6, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Masahito NIWA, Kaori MIKI, Masato FUJITA, Takahiro NONAKA
  • Publication number: 20140060748
    Abstract: A film peeling apparatus includes a peeling pin that push-lifts a first end portion of a cut portion of a film toward a second end portion of the cut portion, a peeling roller that push-lifts the second end portion of the cut portion toward the first end portion of the cut portion by closely contacting the second end portion of the cut portion and rotating, and an absorbing unit that absorbs and removes the cut portion of the film push-lifted by the peeling pin and peeling roller.
    Type: Application
    Filed: February 6, 2013
    Publication date: March 6, 2014
    Inventors: Il-Young JEONG, Gyoo-Wan HAN, Jeong-Hun WOO
  • Publication number: 20140054178
    Abstract: An electrode mask for electrowinning a metal is provided. An example technique forms openings in a solid nonconductive sheet, such as vinyl, polyvinyl chloride (PVC), or other plastic and adheres the sheet as a solid to a cathode surface as a mask. The mask protects the cathode surface from electrical interaction with an electrolyte, while the openings allow controlled electrodeposition of a metal in harvestable rounds, which can be stripped from the cathode. The electrode mask is reusable, and easily removed for recycling and replacement. A matrix design engine calculates pattern and sizes for the openings in the mask to optimize electrodeposition of the metal based on multiple parameters including the metal to be deposited, ions present in an electrolyte, electrolyte concentration, pH level, voltage, electrical current density, solution temperature, electrode temperature, or plating time.
    Type: Application
    Filed: August 21, 2013
    Publication date: February 27, 2014
    Inventor: Thomas W. Valentine
  • Patent number: 8652742
    Abstract: Provided is a method for producing a print having a toner image and a foil image, the method containing the steps of forming a foil transferring toner image with a foil transferring toner on an image supporting substrate produced; heating and pressing by laminating the foil transferring toner image onto a transferring foil layer of a transferring foil sheet which is composed of the transferring foil layer and a base film; forming a foil image having the transferring foil layer on the foil transferring toner image by peeling off the base film after cooling the foil transferring toner image with the transferring foil layer; and forming a toner image with an image forming toner on the image supporting substrate having the foil transferring image, wherein the foil transferring toner contains a resin produced by a vinyl monomer represented by Formula (1) and a polyvalent metal compound:
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: February 18, 2014
    Assignee: Konica Minolta Business Technologies, Inc.
    Inventors: Asao Matsushima, Tatsuya Nagase, Yasuko Uchino, Aya Shirai, Ryuichi Hiramoto, Michiyo Fujita
  • Patent number: 8652299
    Abstract: During the joining of PTFE parts (10), a binder (20) is applied to the joint surfaces of the PTFE parts, e.g. by welding, before the parts are joined. By establishing a bond between PTFE and binder in a separate, initial process, the parameters of this initial process may be determined regardless of other conditions, such as maintaining the dimensions, and the quality of this bond may be controlled and approved before the subsequent joining of the PTFE parts. During the subsequent joining, the temperature may be kept at a level, which is sufficiently low so as not to deform the PTFE material permanently, or the joining may be carried out by a process, which does not require heating, for example gluing.
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: February 18, 2014
    Assignee: Trelleborg Sealing Solutions Helsingor A/S
    Inventors: Gert Iversen, Agge Tonndorff, Bo Bøgelund
  • Publication number: 20140020845
    Abstract: An apparatus comprising a first substrate, a second substrate, a bonding layer positioned between the first substrate and the second substrate, the bonding layer holding the first substrate and the second substrate together, and a reactive layer embedded in the bonding layer. The reactive layer can generate sufficient thermal energy to cause the first substrate to separate from the second substrate without damaging at least one of the first substrate or the second substrate when the reactive layer is activated, and is preferably comprised of a reactive multilayer foil.
    Type: Application
    Filed: July 19, 2013
    Publication date: January 23, 2014
    Applicant: Thermal Conductive Bonding, Inc.
    Inventors: Ryan A. Scatena, Andrew P. Stack, Joseph A. Simpson
  • Publication number: 20140020818
    Abstract: Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers.
    Type: Application
    Filed: July 20, 2012
    Publication date: January 23, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai
  • Publication number: 20130343028
    Abstract: The invention specifies an electronic component which has a first electrode (10), a second electrode (20), an active region (30), which is electrically coupled to the first electrode (10) and to the second electrode (20), and a housing (100), wherein the housing (100) contains carbon layers which are monoatomic at least in subregions.
    Type: Application
    Filed: December 5, 2011
    Publication date: December 26, 2013
    Applicant: EPCOS AG
    Inventor: Gudrun Henn
  • Patent number: 8574662
    Abstract: A substrate section for a flexible display device is disclosed. The substrate section prevents adhesion loss between a reinforcing layer and a barrier layer, thereby preventing a peel-off phenomenon between an inorganic barrier layer and a reinforcing layer.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: November 5, 2013
    Assignee: Samsung Display Co., Ltd.
    Inventor: Dong-Beom Lee
  • Patent number: 8563117
    Abstract: Nano-scale or micro-scale adhesive structures comprising an array of nano-fabricated, pillars, the pillars having coated upon, or having disposed on a working surface thereof, a protein-mimetic, marine-adhesive coating. Methods of fabricating the nano-scale pillars, synthesis of the protein-mimetic coating or wet adhesive and application of the adhesive to the pillars are described.
    Type: Grant
    Filed: August 6, 2007
    Date of Patent: October 22, 2013
    Inventors: Phillip B. Messersmith, Haeshin H.L. Lee, Bruce P. Lee
  • Patent number: 8551277
    Abstract: A method for producing a light emitting diode device includes the steps of preparing a laminate including, in order, a supporting layer, a constraining layer and an encapsulating resin layer, each formed in a thickness direction; cutting the encapsulating resin layer and the constraining layer in the laminate into a pattern corresponding to the light emitting diode element; removing a portion which does not correspond to the light emitting diode element in the encapsulating resin layer and the constraining layer that are cut into the pattern; allowing the encapsulating resin layer corresponding to the light emitting diode element to be opposed to the light emitting diode element to be pressed in the direction where they come close to each other so as to encapsulate the light emitting diode element by the encapsulating resin layer; and removing the supporting layer and the constraining layer from the laminate.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: October 8, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Yasunari Ooyabu, Hiroyuki Katayama, Daisuke Tsukahara, Munehisa Mitani
  • Publication number: 20130255888
    Abstract: A system and method for refurbishing or recycling a layered article such as a golf ball is disclosed that includes removing a cover from the article. The system can include a golf ball guide, a golf ball scorer-driver that can score the outer shell of the golf ball while simultaneously advancing it along the golf ball guide, a cover peeler having an orifice with an inner diameter that is less than an outer diameter of the golf ball cover, and a press that can drive the golf ball core through the cover peeler orifice. The method includes inducing at least one weakened region in the outer shell of the golf ball, rupturing the weakened region to create at least one opening in the golf ball outer shell, and forcing a core portion of the golf ball through the opening in the golf ball outer shell.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 3, 2013
    Applicant: Nike, Inc.
    Inventor: Arthur Molinari
  • Publication number: 20130248118
    Abstract: A pressure-sensitive adhesive layer for an optical film made from an aqueous dispersion-type pressure-sensitive adhesive composition, wherein the aqueous dispersion-type pressure-sensitive adhesive composition is an aqueous dispersion comprising a water-dispersible (meth)acryl-based copolymer (A) having a glass transition temperature from ?55° C. to less than 0° C.; and a water-soluble or water-dispersible component (B) having a glass transition temperature of 0° C. or more, a mixture ratio (A)/(B) is in the range of 50-97/3-50, the component (B) forms domains with maximum lengths between 1 nm and 200 nm in a resin component made of the (meth)acryl-based copolymer (A), and the pressure-sensitive adhesive layer has a haze value (H20) of 1% or less when having a thickness of 20 ?m. The pressure-sensitive adhesive layer for an optical film, which is made from an aqueous dispersion-type pressure-sensitive adhesive composition has good reworkability or recyclability, and has a sufficient level of durability.
    Type: Application
    Filed: November 18, 2011
    Publication date: September 26, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kunihiro Inui, Toshitsugu Hosokawa, Takaaki Ishii, Masayuki Satake, Kenichi Okada, Toshitaka Takahashi, Taiki Shimokuri, Yousuke Makihata
  • Publication number: 20130233479
    Abstract: There is provided a method by which it is possible to precisely process a translucent rigid substrate laminate. The method for processing a translucent rigid substrate laminate includes the steps of: preparing a translucent rigid substrate laminate by adhering two or more translucent rigid substrates with photocurable adhering agent; fixing the laminate to a cradle with predetermined adhesive; performing processing A for cutting the laminate, which is fixed to the cradle, in a thickness direction and forming a desired number of divided translucent rigid substrate laminates, or performing desired outline processing B on the laminate which is fixed to the cradle; and peeling the processed translucent rigid substrate laminate from the cradle by applying external force without heating the translucent rigid substrate laminate at 40° C. or more.
    Type: Application
    Filed: November 17, 2011
    Publication date: September 12, 2013
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Hiroyuki Kurimura, Hayato Miyazaki
  • Patent number: 8524027
    Abstract: A label dispensing device is disclosed for dispensing labels from a web that has a web path extending through the label dispensing device. The label dispensing device includes a dispensing member and a transition member. The dispensing member is shaped to effectuate a flexure of the web and includes a peel edge disposed along a portion of the web path. The transition member has a web control surface disposed along a portion of the web path. The web control surface is downstream of the peel edge and is configured to engage the first side of the web, thereby reducing the flexure of the web effectuated by the dispensing member.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: September 3, 2013
    Assignee: Brady Worldwide, Inc.
    Inventors: Sohail Anwar, Peter Hartmann
  • Patent number: 8518203
    Abstract: Two stacked bodies, each having a metal layer provided on a first metallic foil with carrier via a first insulating layer, are prepared. The first metallic foil with carrier has a metallic foil provided on a carrier plate via a peeling layer. A joined body is formed by jointing the stacked bodies such that the carrier plates are joined via a joining layer. First conductor patterns are formed by patterning the metal layers on both sides of the joined body. Second metallic foils with carrier are provided to the first conductor patterns of the joined body such that the first conductor patterns are opposed to the metallic foils via second insulating layers. Two substrates are formed by peeling the carrier plates with carrier from the peeling layers. Second conductor patterns which are connected electrically to the first conductor patterns are formed from the metallic foils of the substrate.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: August 27, 2013
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Tatsuya Nakamura, Tomoko Yamada
  • Publication number: 20130213265
    Abstract: A method of forming a monolayer film of nanoparticles includes forming a fluid mixture by combining nanoparticles dispersed in water with a water-miscible organic solvent and a molecular ligand comprising a head group with affinity for the nanoparticle, and introducing the fluid mixture to a substrate in the presence of an air/fluid interface, thereby causing a monolayer film of nanoparticles to form on the substrate. Such monolayers films can include metallic nanoparticles such as gold, and possess substantially uniform spacing over at least a one centimeter length scale.
    Type: Application
    Filed: February 20, 2013
    Publication date: August 22, 2013
    Applicant: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Jake Fontana, Jawad Naciri, Banahalli R. Ratna
  • Publication number: 20130192754
    Abstract: Embodiments in accordance with the present invention provide for materials, methods for using such materials and structures that both incorporate such materials and are made using such methods that can be smoothly debonded at or near room temperature while providing a fixable bond that allows for wafer processing such as wafer thinning, anisotropic dry etching and chemical resistance during plating and etching.
    Type: Application
    Filed: January 25, 2013
    Publication date: August 1, 2013
    Applicants: Sumitomo Bakelite Co., Ltd., Promerus LLC
    Inventors: Promerus LLC, Sumitomo Bakelite Co., Ltd.
  • Patent number: 8497058
    Abstract: An image forming method comprising the step of: forming a toner image employing toner particles containing at least a resin on an image supporting substrate having thereon a toner holding layer via a toner image holding process to form an image print, the toner image being held in the toner holding layer in the toner image holding process, wherein at least the toner particles or the image supporting substrate is separated from the image print via a separation process; and at least the separated toner particles or the separated image supporting substrate is recyclable as an image forming material.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: July 30, 2013
    Assignee: Konica Minolta Business Technologies, Inc.
    Inventors: Mitsutoshi Nakamura, Shigenori Kouno, Masaharu Matsubara
  • Publication number: 20130186573
    Abstract: A method for processing a supply of post consumer scrap linear low density or low density polyethylene film into near-virgin quality blown film product. The method includes tearing the supply of film in a shredder, wherein the surface area of the film is exposed, including delaminating the film. The torn supply of film is washed in a water bath including a surfactant. The film is agitated in the bath containing the surfactant wherein contaminants on the film are removed from the film. The washed film is ground into smaller pieces and additional washing of the ground film in a rotating friction washer occurs wherein additional contaminants are removed from the film. The ground film is then dried and compacted without addition of water into granulated objects of near-virgin quality blown film product.
    Type: Application
    Filed: March 12, 2013
    Publication date: July 25, 2013
    Inventors: Robert Francis Kulesa, James J. Feeney, Richard Wayne Carlstedt, Daniel William Blake, Buckell Gary Hacker, Abby Marie Johnson
  • Publication number: 20130186572
    Abstract: A method of reusably separating two plates adhered to each other via an adhesive sheet or a curable resin layer, including relatively rotating the two plates using the vertical line penetrating opposing faces of the two plates as a rotation axis and then relatively moving the two plates in parallel.
    Type: Application
    Filed: January 22, 2013
    Publication date: July 25, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventor: NITTO DENKO CORPORATION
  • Publication number: 20130168018
    Abstract: The invention relates to an adhesive composition comprising at least one natural latex and at least one polymeric composition having a glass transition temperature ranging from ?50° C. to 0° C. The invention also relates to a membrane obtained after drying the adhesive composition according to the invention, to a combination of a flexible surface coating with an adhesive composition according to the invention, to a method for applying a flexible surface coating onto a substrate as well as a substrate coated with a peelable adhesive membrane according to the invention.
    Type: Application
    Filed: December 26, 2012
    Publication date: July 4, 2013
    Applicant: BOSTIK SA
    Inventor: BOSTIK SA
  • Publication number: 20130146205
    Abstract: A flexible, polymeric, self-adhering, disposable film and delivery system for countertop protection during food preparation. The film or sheet is constructed and arranged to temporarily and releasably adhere to an upper surface of the countertop to cover enough of the food-preparation surface in order to protect that surface from any particulates coming from food preparation activity. In one form, multiple film sheets are packaged together by stacking the individual sheets or by forming a continuous roll of sheets. The continuous roll of sheets are separable into individual sheets by means of a perforated score line or by cutting such as with scissors or other tools. One or more perforated score lines can be formed in the roll of sheets thereby forming a pattern of score lines for creating a wide variety of sizes and shape options for the individual sheets from a single roll of sheets.
    Type: Application
    Filed: December 12, 2012
    Publication date: June 13, 2013
    Inventors: Stephanie Lynn Blackwell, Robert D. McNeeley
  • Publication number: 20130146229
    Abstract: The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit.
    Type: Application
    Filed: March 4, 2011
    Publication date: June 13, 2013
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Osamu Hirakawa, Naoto Yoshitaka, Masataka Matsunaga, Norihiko Okamoto
  • Publication number: 20130146228
    Abstract: A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate, includes: a first holding unit which holds the processing target substrate; a second holding unit which holds the supporting substrate; a moving mechanism which relatively moves the first holding unit or the second holding unit in a horizontal direction; a load measurement unit which measures a load acting on the processing target substrate and the supporting substrate when the processing target substrate and the supporting substrate are separated; and a control unit which controls the moving mechanism based on the load measured by the load measurement unit.
    Type: Application
    Filed: December 4, 2012
    Publication date: June 13, 2013
    Applicant: TOKYO ELECTRON LIMITED
    Inventor: Tokyo Electron Limited
  • Patent number: 8454792
    Abstract: The present invention includes compositions relating to a hot melt adhesive that includes a copolymer of butene-1, a wax, and a tackifying resin. The present invention further relates to adhesives initially exhibiting adhesion properties and subsequently non-adhesion qualities. Methods of using these adhesives are also part of the claimed invention.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: June 4, 2013
    Assignee: H.B. Fuller Company
    Inventors: Michelle C. Kueppers, Steven W. Albrecht, Steven R. Vaughan, Kevin P. Burge
  • Patent number: 8444793
    Abstract: The present invention provides a semiconductor device and a fabricating method thereof. The fabricating method comprises: providing a first substrate; forming a soft dry film having an adhesive film and a release film; sticking the soft dry film on the first substrate with the adhesive film; removing the release film; sticking a second substrate on the adhesive film; and heating the adhesive film to solidify the adhesive film to form a solid adhesive film. The semiconductor device comprises: a first substrate, a solid adhesive film, and a second substrate. The solid adhesive film is formed on the first substrate, and the second substrate is formed on the solid adhesive film.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: May 21, 2013
    Assignees: Himax Semiconductor, Inc., Core Precision Material Co., Ltd.
    Inventors: Hsin-Chang Hsiung, Shu-Lin Ho
  • Publication number: 20130105090
    Abstract: Improved semiconductor wafer debonding system, method, and apparatus, including a stress-free means for multi-axis debonding utilizing a specialized tool or fixture having at least one ultrasonic transducer.
    Type: Application
    Filed: October 17, 2012
    Publication date: May 2, 2013
    Inventor: Masahiro Lee
  • Publication number: 20130105089
    Abstract: A method for separating a substrate assembly is provided. A substrate assembly including a first substrate and a second substrate is provided first. The second substrate has at least a through hole. The first substrate and the second substrate are adhered together so that the through hole exposes the first substrate. A fluid is then injected between the first substrate and the second substrate through the through hole so as to separate the first substrate from the second substrate.
    Type: Application
    Filed: October 26, 2012
    Publication date: May 2, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventor: Industrial Technology Research Institute
  • Patent number: 8404079
    Abstract: The invention includes a hot melt adhesive composition that includes at least one of an isotactic copolymer of butene-1 and a metallocene catalyzed propylene homopolymer, a tackifying resin, and, optionally, a wax. The adhesive composition initially exhibits adhesion quality and subsequently non-adhesion quality. The invention also includes methods of using the adhesive composition for temporarily bonding substrates.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: March 26, 2013
    Assignee: H.N. Fuller Company
    Inventors: Michelle C. Kueppers, Steven W. Albrecht, Mark S. Kroll, Vitaly Rogachevsky
  • Publication number: 20130071589
    Abstract: An embossed thermoplastic label includes (a) a facestock having an upper surface and a lower surface with at least one layer and the layer has at least one thermoplastic resin, and (b) the facestock includes at least one embossed pattern on the upper surface of the facestock. The embossed pattern includes at least one embossed section and at least one unembossed section on the facestock. An intermediate configuration is also disclosed. A method is provided for embossing a thermoplastic label. The embossed thermoplastic label is useful in various labeling and brand awareness applications and provides visual and textural effects.
    Type: Application
    Filed: September 20, 2012
    Publication date: March 21, 2013
    Applicant: Avery Dennison Corporation
    Inventor: Avery Dennison Corporation
  • Patent number: 8398799
    Abstract: A method of manufacturing a honeycomb structure having honeycomb segments, which includes a masking step (S1) of attaching masking materials (8) to both end surfaces (2a) of the honeycomb segments (2), a stacked body bonding step (S2) of bonding the honeycomb stacked body (3) by bonding the plurality of honeycomb segments (2) together while interposing adhesive layers therebetween, an adhesive layer drying step (S3) of integrally fixing the honeycomb stacked body (3) by heating and drying the adhesive layers, a masking material separating step (S4), of separating the masking materials (8), and a grinding step (S5) of grinding an outer peripheral portion of the honeycomb stacked body (3) into a predetermined shape.
    Type: Grant
    Filed: January 20, 2004
    Date of Patent: March 19, 2013
    Assignee: NGK Insulators, Ltd.
    Inventors: Jun Fujita, Takahisa Kaneko
  • Patent number: 8397786
    Abstract: The invention can firmly and easily remove a finely divided weft piece without leaving the weft piece by constituting a method and an apparatus of removing weft from a cord fabric for a topping sheet in a calender line for topping rubber on a number of pieces of aligned cords by a calender roll. In the midst of transferring a cord fabric transferred to a calender apparatus, weft is finely divided by passing the cord fabric through weft dividing means, thereafter, a plurality of blades arranged movably in a width direction on an upper face side of the cord fabric are reciprocally moved in the width direction over an entire width thereof to be brought into contact with the cord fabric, and the divided weft piece is wiped off to remove by respectively striking respective cords of the cord fabric by the respective blades.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: March 19, 2013
    Assignee: Toyo Tires & Rubber Co., Ltd.
    Inventors: Tetsuo Tatara, Tomoyuki Takatsuka, Hirokatsu Mizukusa, Osamu Fujiki
  • Patent number: 8388801
    Abstract: There is provided a method for separating an optical film bonded to an adherend with a pressure-sensitive adhesive layer interposed therebetween from the adherend. The pressure-sensitive adhesive layer is formed using an optical pressure-sensitive adhesive. The optical pressure-sensitive adhesive of the invention comprises a base polymer having a functional group (F); and a coupling agent that has a benzyl ester group and is represented by Formula (1): wherein A1 and A2 are different functional groups, one of A1 and A2 shows reactivity or interaction with the functional group (F) of the base polymer, R1 is an optionally substituted alkylene group of 1 to 12 carbon atoms and/or an optionally substituted phenylene group, and R2 and R3 are each a hydrogen atom or an alkyl group of 1 to 12 carbon atoms and may be the same or different.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: March 5, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Takashi Shimizu, Toshitsugu Hosokawa, Masayuki Satake
  • Patent number: 8388793
    Abstract: The invention provides a method for fabricating a camera module. An exemplary embodiment of the method for fabricating a camera module comprises providing plurality of lens sets. A dry film layer is formed on the plurality of lens sets. The dry film layer is patterned to form a plurality of dry film patterns respectively attaching to a plurality of lens sets. The plurality of lens sets are separated. A lens set separated from the plurality of lens sets is bonded to an image sensor device chip. The dry film pattern on the lens set is removed.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: March 5, 2013
    Assignees: VisEra Technologies Company Limited, OmniVision Technologies, Inc.
    Inventors: Tzy-Ying Lin, Chieh-Yuan Cheng, Hung-Yeh Lin
  • Publication number: 20130048222
    Abstract: A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to each other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder.
    Type: Application
    Filed: August 24, 2012
    Publication date: February 28, 2013
    Inventors: Keiichi TANAKA, Masahiro YOSHIHASHI
  • Publication number: 20130048220
    Abstract: A cover tape for use with a carrier tape, where the cover tape includes at least one tear-initiation feature that defines a predetermined direction of tear to initiate a tear along portions of the cover tape.
    Type: Application
    Filed: October 29, 2012
    Publication date: February 28, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventor: 3M Innovative Properties Company
  • Publication number: 20130026135
    Abstract: Provided is an apparatus, system and method for treating a substrate, and more particularly, a substrate treating apparatus having a cluster structure, a substrate treating system, and a substrate treating method using the substrate treating system. The substrate treating apparatus includes a load port on which a container containing a substrate is installed, a plurality of process modules treating the substrate, a transfer module disposed between the load port and the process modules, and transferring the substrate between the container and the process modules, and a buffer chamber disposed between neighboring ones of the process modules, and providing a space for carrying the substrate between the neighboring process modules.
    Type: Application
    Filed: July 27, 2012
    Publication date: January 31, 2013
    Applicant: SEMES CO., LTD.
    Inventor: Hyung Joon KIM
  • Publication number: 20130020031
    Abstract: A workpiece composed of a glass plate and a display panel joined to each other via an adhesive sheet is suction-held on both surfaces thereof by a pair of upper and lower holding members. The glass plate is detached from the display panel through swinging downward one end of the lower holding member around a support shaft provided on the other end side thereof with an entire surface of the glass plate being held in a planar state with a suction surface of the lower holding member.
    Type: Application
    Filed: July 19, 2012
    Publication date: January 24, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Masato FUJITA, Shinji Hoshino, Takahiro Nonaka
  • Publication number: 20130011628
    Abstract: A method and an apparatus for processing display laminate, wherein the display laminate comprises a front electrode layer (106), a display material layer (104) and a protective film layer (102). The display laminate is continuous. A section of protective film layer (102) is continuously removed from the edge of the display laminate by a cutting unit (304) while the display laminate is running through the cutting unit (304). After removing the section of the protective film layer (102), a section of the display material layer (104) located at the same edge as the removed section of the protecting film layer (102) is continuously removed by spraying medium in a spraying unit (310) while the display laminate is running through the spraying unit (310).
    Type: Application
    Filed: January 11, 2011
    Publication date: January 10, 2013
    Applicant: MARISENSE OY
    Inventors: Esa Hämäläinen, Tero Kallioiinen, Jouko Parppei
  • Patent number: 8349104
    Abstract: A method includes positioning a layer of adhesive between a first structural component and a second structural component, positioning a first evaluation film between the first structural component and the layer of adhesive, curing the adhesive at least partially, separating the first structural component and the first evaluation film by a relative movement therebetween, and inspecting bond line quality of the adhesive.
    Type: Grant
    Filed: July 21, 2008
    Date of Patent: January 8, 2013
    Assignee: United Technologies Corporation
    Inventor: John H. Vontell, Sr.
  • Publication number: 20130005928
    Abstract: The present invention provides an optical double-sided pressure-sensitive adhesive sheet excellent in reworkability, step absorbability and anti-foaming release property. The invention relates to an optical double-sided pressure-sensitive adhesive sheet including an acrylic pressure-sensitive adhesive layer which contains an acrylic polymer (X), wherein: the acrylic polymer (X) is formed from a monomer component including an alkyl(meth)acrylate having a linear or branched alkyl group having 1 to 14 carbon atoms in an amount of 50 to 100 wt % based on a total amount of the monomer component (100 wt %) forming the acrylic polymer (X), and a content of a polar group-containing monomer is 0 to 15.0 wt % based on the total amount thereof; and a gel fraction of the acrylic pressure-sensitive adhesive layer is from 20 to 74 wt %.
    Type: Application
    Filed: June 28, 2012
    Publication date: January 3, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinji HOSHINO, Masato FUJITA, Takahiro NONAKA
  • Publication number: 20120325410
    Abstract: The invention concerns a method for controlling the adhesive bond between an electric-field responsive material and a substrate, which method comprises using an electric field to control the strength and integrity of the adhesive bond. The method may be used, for example, for removing or delaminating a material, which material is responsive to an electric field, from a substrate. The invention further comprises elimination of the application of the electric field and application of the previously removed electric-field-responsive material to the substrate, thereby resuming the strength and integrity of the adhesive bond. The invention includes apparatus for use in the bond controlling process.
    Type: Application
    Filed: August 9, 2012
    Publication date: December 27, 2012
    Inventors: Victor Barinov, Robert Dabrowski, Kalle Levon
  • Patent number: 8337657
    Abstract: A method of fabricating a plurality of electronic component packages includes coupling a tape to a panel. Electronic components are coupled to the tape and encapsulated to form a molded wafer. The molded wafer is mechanically separated from the panel without heating by breaking a mechanical separation adhesive of the tape. By mechanically separating the molded wafer from the panel without heating, warpage of the molded wafer associated with heating is avoided.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: December 25, 2012
    Assignee: Amkor Technology, Inc.
    Inventors: Brett Arnold Dunlap, Robert Francis Darveaux
  • Publication number: 20120322015
    Abstract: Provided are an apparatus and method for treating a substrate, and more particularly, to a substrate treatment apparatus having a cluster structure and a substrate treatment method using the same. The apparatus for treating the substrate includes a load port on which a container for receiving the substrate is placed, a treatment module for treating the substrate, and a transfer module including a robot for transferring the substrate between the container and the treatment module. The treatment module includes a transfer chamber including a robot for transferring the substrate, a load lock chamber disposed between the transfer chamber and the transfer module, a first treatment chamber disposed spaced from the transfer module around the transfer chamber to perform a first treatment process, and a second treatment chamber disposed around the transfer chamber to perform a second treatment process.
    Type: Application
    Filed: May 31, 2012
    Publication date: December 20, 2012
    Inventor: Hyung Joon Kim