By Direct Application Of Electrical Energy To Heat Exchange Material Patents (Class 165/104.23)
  • Patent number: 10203161
    Abstract: Condenser-evaporator tube, in whose interior flows a vapor to be condensed and over which flows a liquid to be evaporated, where both inside and outside faces of this tube are covered with capillary structures configured for the formation of liquid menisci having a contact angle smaller than 90° where the liquid-vapor interface curves, which allows capillary condensation inside the tube and evaporation on the outside face at the upper end (25) of the liquid menisci where the liquid layer is thinnest and the evaporation most efficient.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: February 12, 2019
    Assignee: WGA WATER GLOBAL ACCESS, S.L.
    Inventors: Dan Alexandru Hanganu, Juan Eusebio Nomen Calvet
  • Patent number: 10168113
    Abstract: A heat pipe with electrical pumping. The heat pipe includes a condenser to condense vapor into liquid droplets and an evaporator for the liquid-vapor conversion. Furthermore, the heat pipe includes liquid conduits for carrying the liquid droplets, where every liquid conduit includes electrodes for moving the liquid droplets along the liquid conduits. Additionally, the heat pipe includes vapor conduits for carrying the vapor. After the liquid is condensed and droplets are formed, they are electrically pumped towards the evaporator by sequentially actuating a series of electrodes in the liquid conduits. By implementing electrical pumping instead of wick-based pumping, the heat transport capacity over long distances is greatly increased. Additionally, since the electrical force is greater than gravity, it is possible to develop orientation independent long heat pipes.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: January 1, 2019
    Assignee: Board of Regents, The University of Texas System
    Inventors: Vaibhav Bahadur, Renee Hale
  • Patent number: 9826668
    Abstract: Provided are a composite sheet and a mobile terminal having the same, in which the composite sheet includes: a first heat insulation member having a plurality of fine pores to form air pockets for thermal insulation; and a second insulation member which is laminated on the first insulation member, and which facilitates a horizontal direction transfer of heat conducted hut suppresses a vertical direction transfer thereof.
    Type: Grant
    Filed: December 31, 2014
    Date of Patent: November 21, 2017
    Assignee: AMOGREENTECH CO., LTD.
    Inventors: Kil Jae Jang, Dong Hoon Lee, Seung Jae Hwang
  • Patent number: 9760122
    Abstract: A portable information handling system display integrates a cooling device that provides cooling airflow around the periphery of the display. For example, a piezoelectric device generates a cooling airflow directed through air channels formed in a substrate and bezel that couples an OLED display to the front and rear faces of a portable information handling system housing.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: September 12, 2017
    Assignee: Dell Products L.P.
    Inventors: Deeder M. Aurongzeb, Jung-Hwan Hong, Brian Hargrove Leonard, Christopher A. Torres, Paul J. Doczy, Priyank Jatin Gajiwala
  • Patent number: 9581390
    Abstract: A radiator of the thermosiphon type comprising a collector situated in the lowest part of the radiator, and adapted to contain an intermediate vector fluid, an external heat source, placed within the collector, wherein the intermediate vector fluid is adapted to evaporate on contact with a hot surface of the external heat source, at least one vertical tube containing therein one or more channels (4) connected to the collector and communicating with the same, characterized in that said collector and said channels are dimensioned so that each section thereof crossed by the intermediate vector fluid, excluding the thickness of the liquid film of moisture, has the smallest linear direction which is twice bigger than the diameter db of an intermediate fluid vapor bubble which, during operation, detaches itself from the hot surface of the external source during boiling of the intermediate fluid.
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: February 28, 2017
    Assignee: I.R.C.A. S.P.A. Industria Resistenze Corazzate e Affini
    Inventors: Michele Peterle, Simone Visentin, Diego Trentin, Federico Zoppas
  • Patent number: 8921702
    Abstract: In one possible implementation, a thermal plane structure includes a non-wicking structural microtruss between opposing surfaces of a multilayer structure and a thermal transport medium within the thermal plane structure for fluid and vapor transport between a thermal source and a thermal sink. A microtruss wick is located between the opposing surfaces and extends between the thermal source and the thermal sink.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: December 30, 2014
    Assignee: HRL Laboratories, LLC
    Inventors: William B. Carter, Peter D. Brewer, Adam F. Gross, Jeffrey L. Rogers, Keith V. Guinn, Alan J. Jacobsen
  • Publication number: 20140367073
    Abstract: A cooling device includes an electroosmotic liquid transport membrane and a passage through which a fluid to be cooled can flow. The passage has a wall which includes the electroosmotic liquid transport membrane. The membrane is arranged to transport liquid to effect evaporative cooling such that the fluid in the passage can be cooled. The fluid in the passage is a liquid and the cooling device is arranged so that in use, the liquid being transported to effect evaporative cooling is transported through the electroosmotic liquid transport membrane out of the passage.
    Type: Application
    Filed: December 20, 2012
    Publication date: December 18, 2014
    Applicant: OSMOTEX AG
    Inventors: Trond Heldal, Dominique Lauper
  • Patent number: 8869878
    Abstract: The present invention relates to a flat plate heat pipe and a method for manufacturing the same. The heat pipe includes a flattened pipe whose inner surface is coated with a wick structure layer. The interior of the flattened pipe is provided with a sintered supporting layer and a working fluid. The sintered supporting layer has a plurality of posts arranged in the flattened pipe to vertically support therein. With this arrangement, the thickness of the pipe can be reduced but the whole structural strength can be maintained to prevent deformation. Further, a return path for the working fluid can be provided in the pipe. By only sealing two sides of the pipe, a sealed chamber can be formed for the operation of the working fluid. By the inventive method, the manufacturing process can be simplified and a larger space inside the chamber can be obtained.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: October 28, 2014
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Hsiu-Wei Yang
  • Patent number: 8869542
    Abstract: Cooling devices (i.e., refrigerators or heat pumps) based on polymers which exhibit a temperature change upon application or removal of an electrical field or voltage, (e.g., fluoropolymers or crosslinked fluoropolymers that exhibit electrocaloric effect).
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: October 28, 2014
    Assignee: The Penn State Research Foundation
    Inventors: Qiming Zhang, Sheng-Guo Lu, Xinyu Li, Lee Gorny, Jiping Cheng, Bret P. Neese, Baojin Chu
  • Patent number: 8848371
    Abstract: A cooling system has an inlet plenum and at least one cooling channel which communicates with the inlet plenum. The cooling channel passes adjacent to a component to be cooled from an upstream inlet to a downstream outlet. A pair of electrodes are positioned adjacent the inlet to create an electric field tending to resist a bubble formed in an included dielectric liquid from moving in an upstream direction due to a dielectrophoretic force. Instead, a dielectrophoretic force urges the bubble in a downstream direction.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: September 30, 2014
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Matthew Robert Pearson
  • Patent number: 8493736
    Abstract: The present disclosure is related to a device for cooling the surface of a semiconductor device such as an integrated circuit or the like, the cooling device comprising a plurality of channels (3?) which are non-parallel to the surface to be cooled, each channel comprising a plurality of separate electrodes (5) or equivalent conducting areas arranged along the length of each channel, the device further comprising or being connectable to means for applying a voltage to the electrodes or conducting areas in each channel according to a sequence, the sequence being such that a droplet (6) of cooling liquid in a channel may be moved from one electrode to the next, thereby transporting the droplet from the top of the channel to the bottom, from where the droplet impinges on the surface to be cooled.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: July 23, 2013
    Assignee: IMEC
    Inventors: Herman Oprins, Bart Vandevelde, Paolo Fiorini, Eric Beyne, Joeri De Vos, Bivragh Majeed
  • Publication number: 20130146258
    Abstract: An isothermal heating apparatus includes a plate including formed therein a heat pipe circuit in which working fluid is charged, and a heating mechanism heating the working fluid. The heat pipe circuit includes a header portion at which the working fluid is heated and evaporated and a plurality of branch portions in which vapor produced by vaporization of the working fluid exchanges heat with the plate and condensates, the branch portions branching off from the header portion. The heating mechanism is provided on an evaporating surface side of the header portion with which the working fluid is in contact when the heating mechanism heats the working fluid. The isothermal heating apparatus can achieve isothermal heating of a heat-treatment subject and size reduction of the apparatus.
    Type: Application
    Filed: October 1, 2010
    Publication date: June 13, 2013
    Applicant: Toshiba Mitsubishi-Electric Industrial Systems Corporation
    Inventors: Junichi Uno, Hisaaki Yamakage, Takeshi Funabiki, Yoshihito Yamada
  • Patent number: 8413713
    Abstract: A heat sink includes a base member having stepped channels spaced on the surface thereof in a parallel manner and first and second ribs protruding from the surface and respectively extending along two opposite lateral sides of each of the stepped channels, and radiation fins respectively mounted in the channels of the metal base member and supported on the second ribs vertically, each radiation fin having a Z-shaped foot portion that is inserted into one respective stepped channel of the base member and secured thereto by the associated first and second rib that are stamped to clamp on the Z-shaped foot portion of the associated radiation fin after its insertion into the respective stepped channel.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: April 9, 2013
    Inventor: Tsung-Hsien Huang
  • Publication number: 20120196006
    Abstract: Embodiments of the present invention relate to a method and apparatus for coating cryogenically frozen particles, such as food particles, with a powder at least in part by random contact with the powder while the particles and powder are circulating in a liquid cryogen. The powder and/or food particles may be electrically charged to increase their affinity for one another as well as the rate of powder coating of the frozen particles.
    Type: Application
    Filed: January 27, 2012
    Publication date: August 2, 2012
    Inventor: Stan Jones
  • Publication number: 20120180978
    Abstract: A heat exchange device with convective and confined boiling includes a channel in a substrate in contact with an element to be cooled, in which a polar fluid flows from upstream to downstream, a mechanism of movement of the fluid by convection in the channel imposing a direction of flow, and a device for movement by electro-wetting positioned between the channel and the element to be cooled to move the fluid in the channel. The channel includes an inner surface having low wettability with regard to the polar fluid. The mechanism of movement by electro-wetting includes electrodes and a controller to apply selectively a potential to the electrodes such that an electrostatic force gradient is applied to the fluid in the direction of flow.
    Type: Application
    Filed: September 13, 2010
    Publication date: July 19, 2012
    Applicant: Commissariat a l'energie atomique et aux ene. alt.
    Inventors: Jerome Gavillet, Hai Trieu Phan
  • Publication number: 20120168131
    Abstract: A method for heat exchange by boiling a polar liquid on a surface including at least one low-wetting zone, including: a) generating appearance of nuclei of vapor bubbles on the low-wetting zone, and causing the nuclei to grow; and b) making the surface wetting by at least one electro-wetting system, to favor detachment of the gas bubbles formed in this manner.
    Type: Application
    Filed: September 13, 2010
    Publication date: July 5, 2012
    Applicant: Commissariat a l'energie atomique et aux energies alternatives
    Inventors: Jerome Gavillet, Hai Trieu Phan
  • Publication number: 20110157813
    Abstract: A flow tube apparatus may include a flow tube having a first opening and a second opening, a corona electrode provided in the flow tube, a collecting electrode provided in the flow tube, and at least one focusing electrode provided in the flow tube to guide ions and thereby provide an ionic wind. In at least one embodiment, the flow tube apparatus may be provided in an electronic apparatus to provide an air flow.
    Type: Application
    Filed: December 24, 2009
    Publication date: June 30, 2011
    Inventors: Mark MacDONALD, Rajiv K. Mongia, David B. Go
  • Patent number: 7926554
    Abstract: A liquid-cooled heat dissipation system includes a heat absorber; a heat dissipating member; two connecting pipes connecting the heat absorber and the heat dissipating member; and a working fluid filled in the heat absorber, the heat dissipating member, and the connecting pipes. The working fluid is capable of circulating in the circuit. The working fluid includes a base fluid, a plurality of nanoparticles and a protective agent dispersed in the base fluid. A percentage by weight of the nanoparticles in the working fluid is in the range from 0.1% to 3%.
    Type: Grant
    Filed: May 19, 2006
    Date of Patent: April 19, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Tsai-Shih Tung, Chun-Yi Chang
  • Patent number: 7913747
    Abstract: A miniaturized liquid cooling device (200) includes at least a heat absorber (20), at least a heat dissipater (30), a droplet generator (40) driving a working fluid circulating between the at least a heat absorber and the at least a heat dissipater, and a plurality of tubes (50) connecting the at least a heat absorber, the at least a heat dissipater and the droplet generator together to form a loop. The droplet generator includes an array of control electrodes (422) and an array of reference electrodes (442) crossed over the array of control electrodes. A plurality of superposed areas (45) are formed between the control electrodes and the reference electrodes. Voltages are regularly applied on the superposed areas for dividing the working fluid into fluid droplets when the working fluid flows through the droplet generator.
    Type: Grant
    Filed: December 12, 2007
    Date of Patent: March 29, 2011
    Assignee: Foxconn Technology Co., Ltd.
    Inventor: Yen-Chih Chen
  • Patent number: 7882889
    Abstract: A loop type heat dissipating apparatus with a sprayer for transferring heat between a heat source and a heat sink includes an evaporator, a condenser, and a working fluid. The evaporator contacts the heat source and includes a first chamber, a second chamber, and a sprayer disposed between therebetween. The condenser contacts the heat sink and includes a third chamber communicating with the second chamber and a wick structure disposed on one side of the third chamber. The working fluid fills the loop type heat dissipating apparatus and is turned into microdroplets via a sprayer. The sprayer impinges the microdroplets into the second chamber where the microdroplets are then evaporated by the heat source before proceeding to the third chamber for condensation, liquefaction and adhering to the wick structure. Eventually, the working fluid flows back to the first chamber under a pumping force actuated by the sprayer and completes the cycle.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: February 8, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Shih-Kuo Wu, Kuo-Hsiang Chien, Jinn-Cherng Yang, Chi-Ming Huang
  • Patent number: 7861769
    Abstract: A heat sink is configured to cool at least one hot spot of an integrated circuit. The heat sink has a first pipe and a second pipe disposed interior to and concentric with the first pipe, where at least a portion of each of the first pipe and the second pipe is arranged to be disposed vertically over the hot spot. An assembly connected to the first pipe and the second pipe is arranged to generate a magnetic field and induce electrical current flow through the magnetic field. A flow of thermally and electrically conductive fluid in the first pipe and a flow of the fluid in the second pipe are dependent on the electrical current flow and the magnetic field.
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: January 4, 2011
    Assignee: Oracle America, Inc.
    Inventor: Chien Ouyang
  • Patent number: 7621319
    Abstract: A heat sink uses thermally conductive ferrofluid to cool an integrated circuit. A direction of flow of the ferrofluid in the heat sink is controlled by a motorized pump assembly. The motorized pump assembly uses a motor to rotate a metal plate to which at least one magnet is connected. The direction of flow of the ferrofluid is dependent on a magnetic field induced between the at least one magnet and at least one magnetic particle in the ferrofluid passing through the motorized pump assembly.
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: November 24, 2009
    Assignee: Sun Microsystems, Inc.
    Inventor: Chien Ouyang
  • Patent number: 7410611
    Abstract: The present invention relates to a method and apparatus for the prevention of fouling of process streams by the application of electric charge on process components. The electric charge may be attractive or repulsive to the foulants, they may be constant or variable and may be applied to any section of the process stream where convenient and wherein their preventive effects are optimized.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: August 12, 2008
    Inventor: Dennis L. Salbilla
  • Patent number: 7269971
    Abstract: An electrohydrodynamic evaporator device (EHD) has an EHD electrode. An electric field is generated upon a fluid of low conductivity inside the evaporator device and an enhanced thermal transport effect is then achieved since a thermal boundary layer near a thermal transport surface is caused to have a greater perturbation while a very small voltage drop. With the EHD utilized, size, weight, cost and required refrigerant amount of the evaporator device are reduced. Further, thermal transport efficiency of the alternative refrigerant is improved, making the EHD evaporator device in compliance with associated refrigerant regulations made by CFC and achieve the purposes of environmental protection and energy saving.
    Type: Grant
    Filed: September 2, 2005
    Date of Patent: September 18, 2007
    Assignee: National Taipei University Technology
    Inventor: Po-Chuan Huang
  • Patent number: 7261144
    Abstract: A heat transfer assembly for transferring heat from a heat generating device to a circulating fluid, said heat transfer assembly comprising an evaporator device having at least one microchannel formed therein, in thermally conductive contact with said heat generating device, a condenser device, actuating means and manifold means for circulating said fluid between said evaporator device and said condenser device, wherein said heat transfer assembly further comprises a bubble generator capable to create bubbles in said at least one microchannel at a controlled frequency.
    Type: Grant
    Filed: September 14, 2004
    Date of Patent: August 28, 2007
    Assignee: Ecole Polytechnique Fédérale de Lausanne (EPFL)
    Inventors: John R. Thome, Vincent Dupont
  • Patent number: 7260958
    Abstract: An electrohydrodynamic (EHD) condenser device includes a condenser installed with an EHD electrode. An electric field is generated upon a fluid of low conductivity inside a compressor device and an enhanced thermal conduction effect is then achieved since the electric field induces current convection, migration and deformity of bubble, increases perturbation and mixture of the flow field and eliminates boiling and delay. With the EHD utilized, size, weight, cost and required refrigerant amount of the condenser device are reduced. Further, thermal conduction efficiency of the alternative refrigerant is improved, making the EHD compensator device in compliance with associated refrigerant regulations made by CFC and achieve the purposes of environmental protection and energy saving.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: August 28, 2007
    Assignee: National Taipei University Technology
    Inventor: Po-Chuan Huang
  • Patent number: 7159646
    Abstract: An electrohydrodynamically enhanced heat transfer system (EHD) includes an electrode completely encapsulated in an insulating material and coupled to a power supply to generate an electric field between a heat transfer surface and the encapsulated electrode when energized for interacting with the heat exchange surface and the working media to reduce frost formation on the heat transfer surface and to enhance heat transfer. The power supply may be completely encapsulated and immersed into the working media. In order to reduce accumulation of condensed liquid onto the electrode, the surface of the insulating material of the encapsulated electrode is either covered with a water repellent, or heated a few degrees above the dew point temperature of the air surrounding the heat transfer surface. The encapsulated electrode can be energized by an AC or DC electric field through a controlling switch.
    Type: Grant
    Filed: April 15, 2003
    Date of Patent: January 9, 2007
    Assignee: University of Maryland
    Inventors: Serguei V. Dessiatoun, Igor Ivakhnenko, Michael M. Ohadi
  • Patent number: 7108056
    Abstract: Cooling means for a heated surface comprising an enclosure for enclosing the heated surface and two oppositely charged interleaved radial arrays of microelectrodes positioned on the surface within the enclosure. The combined arrays have a closely spaced end and a periphery end. A volatile cooling liquid is contained in a reservoir within the enclosure but separate from the array. A slit-type restrictor is positioned between the reservoir and the array to restrict liquid flow from the reservoir toward the array. A portion of the closely spaced end of the array is positioned within the slit whereby the pumping action of the array draws only the amount of volatile liquid along the electrodes needed to form a thin evaporating film over the array area. The vapor from the thin film evaporator flows to a condenser where it is cooled, condensed to a liquid and returned to the liquid reservoir.
    Type: Grant
    Filed: October 15, 2003
    Date of Patent: September 19, 2006
    Assignee: Atec Advanced Thermal and Environmental Concepts
    Inventors: Saeed Moghaddam, Michael M. Ohadi
  • Patent number: 7085483
    Abstract: It is not possible to store heat of a domestic hot water supply level at a high density. If thermal storage temperature is T, variation in enthalpy in a chemical reaction is ?H, variation in entropy is ?S, and variation in free energy is ?G, a thermal storage material satisfying a relationship of T?S??G is used under a condition of ?H>0 so as to promote a reaction for putting the thermal storage material in a thermal storage reaction portion in an energy storing state by having supplemental energy added by an electrode portion when putting the thermal storage material in the energy storing state by decomposing or separating it.
    Type: Grant
    Filed: April 21, 2004
    Date of Patent: August 1, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tetsuo Terashima, Motohiro Suzuki
  • Patent number: 7069979
    Abstract: A method, and a system for reducing the internal temperature of an electrical solenoid or motor device involves placing a heat absorbing phase change material (PCM) in intimate contact with the device to reduce the internal temperature of the device. The PCM material reduces the internal operational temperature of the device by undergoing an endothermic phase transition in an operating temperature range of the device. The PCM material transitions between a solid phase and a liquid phase in the internal operational temperature range of the device, or between a liquid phase and a gaseous phase in the internal operational temperature range of the device. The PCM material can be affixed externally to the device. For example, the PCM material is affixed in the form of externally placed pads to the device. The PCM material can also be affixed inside of the device.
    Type: Grant
    Filed: April 17, 2002
    Date of Patent: July 4, 2006
    Assignee: Lockheed Martin Corporation
    Inventor: Lee A. Tobias
  • Patent number: 6873525
    Abstract: A liquid cooling system includes a pump for supplying a cooling liquid including water, a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the pump. Different parts of the liquid cooling system are provided with different corrosion resistance against the cooling liquid.
    Type: Grant
    Filed: February 18, 2004
    Date of Patent: March 29, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Rintaro Minamitani, Makoto Kitano, Noriyuki Ashiwake, Shigeo Ohashi, Yoshihiro Kondo, Takashi Naganawa, Yuji Yoshitomi, Tsuyoshi Nakagawa
  • Publication number: 20040035557
    Abstract: A cooling device for an electronic apparatus, comprising: a heat generating element attached within a first housing; a heat receiving jacket, being connected with said heat generating element, and being attached within said first housing; a second housing being rotatably supported on said first housing; a first heat exchanger attached within said second housing, for exchanging heat between an outside; and a liquid driving means for supplying a cooling liquid to said heat receiving jacket, wherein a portion of a pipe for connecting between said heat receiving means, said first heat exchanger, and said liquid driving means is made of a flexible tube made of a resin, and further wherein, a second heat exchanger and an ion exchanger are provided in a part of said pipe, said second housing is received within said second housing, and said ion exchanger is received within said second housing.
    Type: Application
    Filed: May 1, 2003
    Publication date: February 26, 2004
    Inventors: Rintaro Minamitani, Shigeo Ohashi, Yoshihiro Kondo, Yuji Yoshitomi, Takashi Naganawa, Masato Nakanishi, Tsuyoshi Nakagawa
  • Patent number: 6697253
    Abstract: A liquid cooling system for a personal computer is suitable for cooling a semiconductor device, etc, generating high heat and is designed to suppress undesirable influence on the personal computer following corrosion in the liquid cooling system, thereby ensuring the dependability of the system as a whole. The liquid cooling system has a pump for supplying cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body; a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket; and a passage for circulating the cooling liquid passing through the heat radiation pipe into said pump. The heat radiation pipe is made of a material having a corrosion resistance that is higher than that of the heat receiving jacket.
    Type: Grant
    Filed: August 6, 2001
    Date of Patent: February 24, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Rintaro Minamitani, Makoto Kitano, Noriyuki Ashiwake, Shigeo Ohashi, Yoshihiro Kondo, Takashi Naganawa, Yuji Yoshitomi, Tsuyoshi Nakagawa
  • Patent number: 6655450
    Abstract: A forced oscillatory flow type heat pipe of which a ratio (motion coefficient) of the heat transport capacity to the oscillating energy is maintained within an appropriate range is provided. A heat pipe body (1) has a closed loop flow path (2). Operation of the vibrator (3), which is provided at a connecting portion (2a) between the ends of the flow path (2), causes an oscillatory flow of the charged liquid sealed in the flow path (2). The phases of the oscillatory flows of the charged liquid in the adjacent tube portions of the flow path are inverted. From a viewpoint that the dimensionless effective thermal diffusivity kef* of the COSMOS type heat pipe has a larger range in the modified Womersley number &agr; than that of the dream type heat pipe, the modified Womersley number &agr; is 0.4 to 7.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: December 2, 2003
    Assignee: TS Heatronics Co., Ltd.
    Inventors: Shigefumi Nishio, Hisashi Tanaka, Kouji Kubo
  • Publication number: 20020195242
    Abstract: The present invention provides a loop thermosiphon including an evaporator and a condenser interconnected in flow communication by a vapor conduit and a condensate conduit. A wick is disposed in a portion of the evaporator and a portion of the at least one condensate conduit adjacent to the evaporator to facilitate capillary action to cycle a coolant fluid through the loop thermosiphon. Advantageously, a porous valve is lodged within the condensate conduit so that a first pressure on a condenser side of the porous valve is greater than a second pressure on an evaporator side of the porous valve. In this way, a portion of the liquid coolant fluid disposed within the loop thermosiphon is forced through the porous valve and a remaining portion is forced through the at least one condenser.
    Type: Application
    Filed: June 20, 2001
    Publication date: December 26, 2002
    Inventor: Scott D. Garner
  • Patent number: 6418019
    Abstract: An electronic module includes a cooling substrate, an electronic device mounted thereon, and a plurality of cooling fluid dissociation electrodes carried by the cooling substrate for dissociating cooling fluid to control a pressure thereof. More particularly, the cooling substrate may have an evaporator chamber adjacent the electronic device, at least one condenser chamber adjacent the heat sink, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber.
    Type: Grant
    Filed: March 19, 2001
    Date of Patent: July 9, 2002
    Assignee: Harris Corporation
    Inventors: Steven Robert Snyder, Charles Michael Newton, Michael Ray Lange
  • Patent number: 6374909
    Abstract: An electrode arrangement for electrohydrodynamic (EHD) enhancement of heat and mass transfer is disclosed. Electrodes of alternating polarity are embedded within a nonconductive heat transfer wall material and are connected to a high voltage source at either end of the heat transfer wall material where the heat transfer wall material passes through a tube sheet, fitting or other confinement. When voltage from the high voltage source is applied to the alternating electrodes, electric field gradients are created on both the interior and exterior heat transfer surfaces of the heat transfer wall material. Regions of intense electric field gradient reside in close proximity to both heat transfer surfaces, thus when nonconductive fluids pass over the heat transfer surfaces, bubbles are repelled from the regions of strong electric field gradients above the electrodes and additional fluid is attracted into these regions.
    Type: Grant
    Filed: August 1, 1996
    Date of Patent: April 23, 2002
    Assignee: Georgia Tech Research Corporation
    Inventors: Sheldon M. Jeter, Said I. Abdel-Khalik
  • Patent number: 6364003
    Abstract: A heat absorbing and radiating device includes a driving unit having communicable first fluid outlets and fourth fluid inlets, a heat-exchange unit communicating at an end with third fluid outlets of the driving unit and at another end with an inlet end of a liquid-gas confluence unit, which communicates at an outlet end with an inlet end of a liquid-gas separation chamber, while the latter communicates at an outlet end with one of two second fluid inlets of the driving unit. The driving unit is provided therein with reciprocatingly movable magnets to alternately push first and second fluids into the heat-exchange unit before them enter the fluid-gas confluence unit, so that hot air is finally released from the liquid-gas separation chamber. Since radiating fins and cooling fan are omitted, the device has reduced volume for use with a heat source in a small space, such as a CPU of a portable computer.
    Type: Grant
    Filed: May 23, 2001
    Date of Patent: April 2, 2002
    Inventors: Ming-Hwa Liu, Brian D. F. Chen, Paug Chang Cheng
  • Patent number: 6247525
    Abstract: A preferred embodiment of an atomizing apparatus incorporates a source of heat transfer fluid and an atomizing surface adapted to receive a droplet of the heat transfer fluid thereon. A driver also is provided which is configured to control a vibration of the atomizing surface at a frequency less than ultrasonic so that the atomizing surface forms a spray of atomized droplets from the droplet of the heat transfer fluid. Preferably, the vibration is configured to form, on the droplet, surface waves having a smaller wavelength than a diameter of the droplet, thereby ejecting and propelling the atomized droplets from the droplet. Methods also are provided.
    Type: Grant
    Filed: May 23, 2000
    Date of Patent: June 19, 2001
    Assignee: Georgia Tech Research Corporation
    Inventors: Marc K. Smith, Ari Glezer
  • Patent number: 6183855
    Abstract: A highly flexible composite material having a flexible matrix containing a phase change thermal storage material. The composite material can be made to heat or cool the body or to act as a thermal buffer to protect the wearer from changing environmental conditions. The composite may also include an external thermal insulation layer and/or an internal thermal control layer to regulate the rate of heat exchange between the composite and the skin of the wearer. Other embodiments of the PCM composite also provide 1) a path for evaporation or direct absorption of perspiration from the skin of the wearer for improved comfort and thermal control, 2) heat conductive pathways within the material for thermal equalization, 3) surface treatments for improved absorption or rejection of heat by the material, and 4) means for quickly regenerating the thermal storage capacity for reuse of the material.
    Type: Grant
    Filed: December 20, 1999
    Date of Patent: February 6, 2001
    Inventor: Theresa M. Buckley
  • Patent number: 6167955
    Abstract: An electronic device has a heat pipe containing a heat transfer fluid. The heat pipe has a first section and a second section. Inside the heat pipe is a valve disposed between the first section and second section of the heat pipe. The valve has an actuator that is used to regulate the flow of the heat transfer fluid between the first section and the second section of the heat pipe in response to a changed state detected by a sensor.
    Type: Grant
    Filed: October 26, 1999
    Date of Patent: January 2, 2001
    Assignee: Hewlett-Packard Company
    Inventors: Andrew L. Van Brocklin, James F. Bausch, John R. Sterner