Abstract: A heat transfer device comprising at least an aggregate of fibers or sheet of fibres (60) with internal passages and holes capable of capillary transport of liquids capable of capillary convection of coolant fluid from a heat source region (54) to heat dissipation region (56) and vice versa. A supply of coolant fluid in sufficient amount is provided to be absorbed or contained by said fibers or sheet of fibers (60) with internal passages and holes capable of capillary transport of liquids. A pressure tension member (70) comprising a strong yet resilient structure placed within said confined space and exerting pressure on said aggregate of fibers or sheet of fibers (60) with internal passages and holes capable of capillary transport of liquids against said heat source region (54) and/or heat dissipation region (57).

Abstract: A method of assembling thermal module includes steps of providing a first heat dissipation member and a second heat dissipation member, and aiming a section of the first heat dissipation member at a section of the second heat dissipation member, which section of the first heat dissipation member is to be assembled with the section of the second heat dissipation member and driving the first heat dissipation member to connect with the second heat dissipation member by means of striking the first heat dissipation member into the second heat dissipation member. By means of the method, the thermal module can be assembled at higher efficiency. Moreover, the manufacturing process of the thermal module is simplified.

Abstract: A heater wire including at least one extending component disposed thereon. The heater wire is positioned within a respiratory gas conduit.

Abstract: An apparatus for enclosing an electronic component to a base comprising, an enclosure attached to a base and surrounding an electronic component. The enclosure divided into a first portion and a second portion along a first plane substantially parallel to the base. The second portion of the enclosure is attached to the base. The first portion of the enclosure is attached to the second portion of the enclosure. The enclosure including one or more extruding elements on an exterior surface of the enclosure. The one or more extruding elements on the exterior surface of the enclosure increases an exterior surface area of the enclosure facilitating dissipation of heat from the electronic component.

Abstract: A heater wire for removing condensation from a respiratory gas conduit. The heater wire includes at least one groove disposed thereon. The heater wire is positioned in a respiratory gas conduit.

Abstract: An evaporator may include an outer enclosure and a wick within the outer enclosure. The wick may have an outer lateral side surface positioned adjacent to the outer enclosure and may comprise a plurality of circumferential grooves formed in the outer lateral side surface of the wick and a plurality of channels fluidly connected to the plurality of circumferential grooves. The evaporator may include an outer enclosure and an end cap bonded directly to the outer enclosure, contacting the wick, and having a thermal conductivity that is less than the thermal conductivity of the outer enclosure.

Abstract: A generally planar, conformable evaporative structure, particularly for incorporation in a garment or an item of personal protective equipment as part of a system to cool the wearer's body, includes an envelope of substantially impermeable, flexible material containing: a layer of flexible wick material disposed adjacent to a major face of the envelope and adapted to hold a working fluid in liquid phase for evaporation by heat conducted through the envelope; a layer of flexible, breathable fabric in parallel with the layer of wick material; and an array of flexible ribs such as open helical coils within the layer of breathable fabric adapted to maintain pathways for the flow of working fluid in vapor phase towards a condensation zone.

Abstract: Disclosed is a generator. The generator in accordance with an embodiment of the present invention includes: a thermoelectric element, which creates an electromotive force by using a temperature difference between a high-temperature portion and a low-temperature portion; a heat source, which is thermally coupled to the high-temperature portion and transfers heat to the high-temperature portion; and a vibrating capillary-shaped heat-pipe, which has a working fluid injected therein, is thermally coupled to the low-temperature portion, and discharges heat of the low-temperature portion. The generator in accordance with the present invention can increase an efficiency of power generation using the thermoelectric element by employing a highly exothermic vibrating capillary-shaped heat-pipe to maintain the temperature difference required for power generation.

Abstract: Methods for fabricating heat pipes and heat pipes therefrom are provided. The heat pipe (400) includes a heat pipe body (402) having an inner cavity (408), and a wick structure (404) disposed in the inner cavity. The wick structure includes a first woven mesh layer (410) and a second woven mesh layer (412) disposed on the first woven mesh layer. In the heat pipe, the first woven mesh layer is a first weave pattern of thermally conductive fibers (103) having a first warp direction (W3 or W4) and the second woven mesh layer is a second weave pattern of thermally conductive fibers (105) having a second warp direction (W5 or W6). The second woven mesh layer is disposed on the first woven mesh layer such that the first and the second warp directions are rotationally offset by an inter-layer warp offset angle (?i).

Abstract: Disclosed are a flat heat pipe which has a structure integrated with a heat sink, and a facilitated fabrication method thereof. The flat heat pipe includes: a flat body portion including a plurality of heat sink fins formed on an outer surface thereof, and a plurality of through-holes formed therein and being separated by at least one separation film; and at least one groove formed in at least one surface from among a top surface and a bottom surface of one side portion of each of the plurality of through-holes.

Abstract: A heat pipe heat dissipation structure includes a main body. The main body has an evaporation section, a condensation section, a chamber filled with a working fluid and at least one first capillary structure. The first capillary structure is disposed on an inner wall face of the chamber. The first capillary structure has at least one swelling capillary section. The swelling capillary section swells from a part of the first capillary structure in the evaporation section.

Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

Abstract: A two-phase heat transfer system includes an evaporator unit configured to receive heat from a source, a liquid line fluidly connected to the evaporator unit, a vapor line fluidly connected to the evaporator unit, and a condenser. The condensing unit includes a thermal capacitance device and a condenser integrated with the thermal capacitance device. Methods of forming a thermal storage unit include preparing a honeycomb core to receive a phase change material, metallurgically bonding end pieces to the core, to thermally link the end pieces to the core, and bonding the end pieces together to form a seal for holding the phase change material within the core.

Abstract: A two-phase heat transfer system includes an evaporator, a condenser, a vapor line, and a liquid return line. The evaporator includes a liquid inlet, a vapor outlet, and a capillary wick having a first surface adjacent the liquid inlet and a second surface adjacent the vapor outlet. The condenser includes a vapor inlet and a liquid outlet. The vapor line provides fluid communication between the vapor outlet and the vapor inlet. The liquid return line provides fluid communication between the liquid outlet and the liquid inlet. The wick is substantially free of back-conduction of energy from the second surface to the first surface due to an increase in a conduction path from the second surface to the first surface and due to suppression of nucleation of a working fluid from the second surface to the first surface to promote liquid superheat tolerance in the wick.

Abstract: An internal liquid separating hood-type condensation head exchange tube, comprising an external heat exchange tube and an internal liquid separating hood disposed in the cavity of the external heat exchange tube and coaxial with the external heat exchange tube. The internal liquid separating hood is a hollow tube with a plurality of micropores or gaps distributed on a wall surface. The condensate formed during the heat exchange is pumped to the internal liquid separating hood in time under the effect of surface tension of the liquid via the micropores or gaps, and then is discharged from the heat exchange tube by the internal liquid separating hood. Vapor is retained to flow in the annular region between the external heat exchange tube and the internal liquid separating hood, so the inner wall of the external heat exchange tube comes into contact with the vapor to the greatest extent.

Abstract: A low-profile heat transfer device includes a main body and at least one wick structure. The main body extends from a first end to a second end and defines an inner space, in which the wick structure is provided. The wick structure also extends from the first end toward the second end, such that at least one channel is defined in the inner space by the main body and the wick structure. The low-profile heat transfer device can be flexibly designed into any desired shape according to actual need, and is able to absorb heat from a heat-producing element and quickly transfer the absorbed heat to a distant location for dissipation, and therefore enables highly efficient vapor-liquid circulation therein and allows an electronic device to have excellent heat dissipation efficiency.

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Abstract: A loop heat pipe structure includes an evaporator and a first pipe. The evaporator has a first chamber, a first wick layer, and a bottom. The first wick layer is provided in the first chamber. The first pipe includes a first inlet and a first outlet communicably connected to the evaporator. The first inlet internally defines a second chamber communicable with the first wick layer. By providing the second chamber outside the evaporator, the evaporator can have a reduced overall height without creating very high vapor pressure in the evaporator, enabling the loop heat pipe structure to have upgraded heat dissipation efficiency.

Abstract: A heat sink assembly includes a heat transfer block defining alternatively arranged mounting grooves and spacer ribs, and radiation fins respectively formed by bending one respective thin metal sheet member into a substantially inverted U-shaped profile having two radiation fin walls that have one end connected to each other and an opposite end terminating in a respective outwardly upwardly extending folded portion, each radiation fin wall with the respective outwardly upwardly extending folded portion being inserted into one respective mounting groove of the heat transfer block and fixedly secured thereto through a stamping operation to deform the folded portions of the radiation fin walls of the radiation fins and spacer ribs of the heat transfer block synchronously.

Abstract: The present invention provides a heat dissipation pipe loop and a backlight module using the heat dissipation pipe loop. The heat dissipation pipe loop includes: a first evaporator section (2), a second evaporator section (4) arranged opposite to the first evaporator section (2), a first pipe (6), a second pipe (8) arranged opposite to the first pipe (6), and a heat dissipation liquid arranged in the first pipe (6) and the second pipe (8). The first pipe (6) includes a first gas pipe (62) connected to the first evaporator section (2), a first condenser pipe (64) connected to the first gas pipe (62), and a first liquid pipe (66) connected to the first condenser pipe (64) and the second evaporator section (4). The second pipe (8) includes a second gas pipe (82) connected to the second evaporator section (4), a second condenser pipe (84) connected to the second gas pipe (82), and a second liquid pipe (86) connected to the second condenser pipe (84) and the first evaporator section (2).

Abstract: A heat transfer device including a container in which a heat-transfer fluid circulates in a closed loop. The heat transfer fluid is capable of undergoing an increase in volume on solidifying. The container further contains particles suspended in the heat-transfer fluid. At least some of the particles are compressible under the pressure of the fluid, as the fluid is solidifying, so as to at least partially compensate for the increase in volume of the fluid upon solidifying.

Abstract: A plate heat pipe includes a hollow housing formed in a plate shape and a flat-plate type capillary structure. The flat-plate type capillary structure includes a capillary boundary part and a plurality of primary capillary transportation parts; wherein the capillary boundary part is surroundingly arranged at the periphery of a vaporization portion of the plate heat pipe, and a hollow vapor flowing zone is defined between the capillary boundary part and the vaporization portion. Each of the primary capillary transportation parts is disposed in the vapor flowing zone and extended from the capillary boundary part to the vaporization portion so as to be respectively gathered on the vaporization portion.

Abstract: A solar collector (26) includes: an outer tube (64) of circular cross-section, closed at one of its ends, an absorption layer (52) arranged inside the outer tube (64), for absorbing solar radiation (Rs), and a heat pipe (56) including a hot part (58) laid out inside the outer tube (64), a cold part (60) arranged outside the outer tube (64), and a reservoir (62) containing a heat pipe fluid (63) and extending over the hot part (58) and the cold part (60). The outer tube (64) is hermetically closed around the heat pipe (56) at the other of its ends, a vacuum being formed inside said outer tube (64). For the hot part (58) of the heat pipe (56), the reservoir (62) is applied at least locally against the absorption layer (52).

Abstract: A heat exchanger is described and which includes a heat exchanger portion defining a multiplicity of internal passageways, and wherein at least one of the passageways is defined in part by a wicking structure; and a source of ammonia refrigerant which is supplied to the internal passageways of the heat exchanger portion, and wherein substantial equal amounts of liquid refrigerant are supplied to each of the passageways defined by the heat exchanger portion.

Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.

Abstract: A slim-type heat pipe includes a tube, being hollow and flat; and a wick structure, longitudinally disposed in the tube, having an attachment side attached on a local portion of an inner side of the tube and a formation side opposite to the attachment side, and a vapor passage formed between the formation side and the inner side of the tube. The wick structure is provided with grooves radially around the inner side of the tube. The attachment side is attached on the grooves. Depth of the groove is less than 30% of thickness of a wall of the tube.

Abstract: The present invention relates to a flat plate heat pipe and a method for manufacturing the same. The heat pipe includes a flattened pipe whose inner surface is coated with a wick structure layer. The interior of the flattened pipe is provided with a sintered supporting layer and a working fluid. The sintered supporting layer has a plurality of posts arranged in the flattened pipe to vertically support therein. With this arrangement, the thickness of the pipe can be reduced but the whole structural strength can be maintained to prevent deformation. Further, a return path for the working fluid can be provided in the pipe. By only sealing two sides of the pipe, a sealed chamber can be formed for the operation of the working fluid. By the inventive method, the manufacturing process can be simplified and a larger space inside the chamber can be obtained.

Abstract: A circuit includes an evaporator receiving heat from a hot body; a condenser transmits heat to a cold body, a working fluid flows through a first conduit in vapour phase from the evaporator to the condenser, and flows through a second conduit in liquid phase, from the condenser to the evaporator. A first evaporator portion is in fluid communication with the second conduit and acts as a compensation chamber. A second evaporator portion is in fluid communication with the first conduit and contains the vapour phase. A porous wick moves the working fluid from the first evaporator portion to the second evaporator portion. A first flow controller interrupts or allows flow when fluid temperature in the elevator is respectively lower or higher than a first threshold. A second flow controller interrupts or allows flow when the temperature in the condenser is respectively higher or lower than a second threshold.

Abstract: A capillary-driven heat transfer device is adapted to extract heat from a heat source and release this heat to a cold source using a two-phase working fluid. The device includes an evaporator having a microporous mass performing capillary pumping of fluid in the liquid phase, a condenser, a reservoir having an inner chamber and an inlet and/or outlet port, a vapor communication circuit, connecting the outlet of the evaporator to the inlet of the condenser, a liquid communication circuit, and a non-return device arranged between the inner chamber of the reservoir and the microporous mass of the evaporator, and arranged to prevent liquid present in the evaporator from moving to the inner chamber of the reservoir.

Abstract: A heat exchanger which including a metal exchange surface having a plurality of upward extending walls forming channels between the walls. The channels are between about 5 and about 500 um in width and the walls are between about 50 and about 1000 um in height. At least one reservoir communicates with the channels and a refrigerant is position in the reservoir, the refrigerant having a boiling point of at least about 50° C. A cover is positioned above the exchange surface such that refrigerant is returned to the exchange surface.

Abstract: A heat pipe with an ultra-thin capillary structure includes a tube body being hollow and flat, and a capillary structure disposed in the tube body and shaped as a thin plate. The capillary structure has a first adhering surface attaching on a partial portion of an inner wall of the tube body, a forming surface opposite to the first adhering surface, and a second adhering surface forming at one side between the first adhering surface and the forming surface. The second adhering surface is attached on the inner wall so that a vapor channel is formed between the forming surface and the inner wall; wherein the forming surface elongates along a longitudinal direction of the vapor channel, and is tapered to form an inclined interface between the capillary structure and the vapor channel as a capillary transmission surface.

Abstract: A heat pipe with an ultra-thin capillary structure includes a tube body which is hollow and flat, and a capillary structure which is in the tube body and is shaped as a thin plate. The capillary structure has an adhering surface attached on a partial portion of an inner wall of the tube body, and a forming surface corresponding to the adhering surface. A vapor channel formed between the forming surface and the inner wall of the tube body; wherein the forming surface further includes an abutting surface elongated along a longitudinal direction of the vapor channel and at least one capillary transmission surface extending from a side of the abutting surface to connect to the adhering surface the steam channel, and the capillary transmission surface is gradually inclined between the adhering surface and the abutting surface.

Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.

Abstract: A thermal conductor with an ultra-thin flat wick structure (2) includes a hollow shell (1) having a flat shape, and a wick structure (2) disposed in the shell (1) and contacted with an inner wall (100) of the shell (1), wherein the wick structure (2) is a thin planar body having a plane (20) and a pressing surface (21) opposite to the plane (20), wherein the plane (20) is attached to the inner wall (100) of the shell (1), wherein a plurality of elongated concave surfaces (210) are spacedly arranged on the pressing surface (21) such that a steam channel (101) is formed in the shell (1) via each of the concave surfaces (210) and an elongated wick structure connection (200) is formed between each concave surface (210) and the plane (20).

Abstract: To provide a phase change module as a cooling system capable of saving energy and miniaturizing of the cooling system utilizing a thermo siphon, and an electronic device suitable to mounting such a phase change module. The phase change module 300 includes a jacket case 312 attached with an evaporator surface 311 with the evaporator surface 311 being arranged on a heat generating body, a radiator case 321 attached with cooling fins (radiator) 322 arranged at a position departing from the heat generating body, and a connecting plate 330 that connects the jacket case 312 and the radiator case 321, in which holes are bored in the connecting plate 330 at a position where the jacket case 312 and the radiator case 321 overlap.

Abstract: A heat pipe with an ultra-thin flat wick structure includes a shell and a wick structure disposed in the shell. The wick structure includes heat exchange zones and at least one liquid channel connected between the heat exchange zones which are divided into an evaporation portion and a condensation portion. Each of the heat exchange zones has a plane and a pressing surface opposite to the plane. A plurality of elongated concave surfaces are spacedly arranged on the pressing surface such that a respective steam channel is formed via each of the concave surfaces in the shell and a respective elongated wick structure connection is formed between each concave surface and the plane. Cut-out zones are formed at two sides of the liquid channel between the heat exchange zones in the shell.

Abstract: A pipe having variable cross section and including a working core pipe, capillary pipes or sheets, an outer pipe, a connection support, and a cavity. The capillary pipes or sheets are attached to an external surface of the working core pipe. The connection support connects the working core pipe and the outer pipe. The cavity is formed between the working core pipe and the outer pipe and has variable cross section.

Abstract: A heat-dissipating unit having a hydrophilic compound film and a method for depositing a hydrophilic compound film are disclosed. The heat-dissipating unit includes a metallic body having a chamber and a working fluid. The chamber has a liquid-guiding structure constituted of an evaporating portion, a condensing portion and a connecting portion. At least one hydrophilic compound film is coated on surfaces of the chamber and the liquid-guiding structure. By this arrangement, the flowing of the working fluid in the heat-dissipating unit is enhanced to improve the heat-conducting efficiency of the heat-dissipating unit.

Abstract: A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost.

Abstract: A heat transfer device filled with a working fluid, includes a casing and a wick disposed within the casing. The wick includes a first sintered layer, a second sintered layer, and a third sintered layer. The first sintered layer is disposed proximate to an inner surface of the casing and the second sintered layer is disposed on the first sintered layer. The second sintered layer includes a first set of 3-dimensional sintered projections and a second set of 3-dimensional sintered projections disposed along a portion of the wick. Further, the third sintered layer is disposed on at least a portion of the second sintered layer. The heat transfer device includes at least one first sintered particle of the first sintered layer, which is smaller in size than at least one second pore of the second sintered layer.

Abstract: A heat dissipation structure for hand-held mobile device includes a supporting body having a first and an opposite second side and including at least one heat dissipation area. In the heat dissipation area, a heat dissipation element is correspondingly fitted without increasing an overall thickness and volume of the supporting body for the hand-held mobile device. With the heat dissipation element fitted in the heat dissipation area on the supporting body, heat produced by the hand-held mobile device during operation thereof can be quickly transferred to the heat dissipation element for dissipating into ambient air.

Abstract: A heat transfer system including a first heat exchange assembly, a second heat exchange assembly, and a heat transfer circuit interconnecting the first and second heat exchange assemblies, the circuit incorporating a working fluid to transfer heat between the first and second heat exchange assemblies. The heat transfer circuit preferably takes the form of a closed loop heat-pipe system. The heat transfer system is operative in a first mode where the working fluid is at or below a threshold pressure and in a second mode where the working fluid is at a higher pressure than the threshold pressure. A pressure regulating device is also provided to increase the pressure of the working fluid above the threshold pressure to effect change of operation of the heat transfer system from the first mode to the second mode. Optionally the pressure regulating device is a pressure vessel having at least one heat transfer surface.

Abstract: A heat dissipation unit includes a housing and a heat pipe. The housing has a chamber in which a working fluid is contained. Multiple support posts and multiple fixing members are disposed in the chamber. The heat pipe has a heat absorption section positioned in the chamber of the housing and securely supported by the fixing members, and a heat dissipation section extending from the heat absorption section through the housing and positioned outside the chamber of the housing.

Abstract: A capillary-driven heat transfer device, adapted to extract heat from a heat source and to release this heat to a cold source by means of a two-phase working fluid, includes an evaporator, having a microporous mass adapted to perform capillary pumping of fluid in the liquid phase, a condenser, a reservoir having an inlet and/or outlet port, a vapor communication circuit connecting the outlet of the evaporator to the inlet of the condenser, and a liquid communication circuit connecting the outlet of the condenser to the reservoir and to the inlet of the evaporator. The reservoir includes multiple separate volumes that remain in fluid communication.

Abstract: A condensing device and a thermal module using same are disclosed. The condensing device includes a hollow main body having a first inlet, a first outlet, and a flow-guiding zone. In the flow-guiding zone, there is provided a plurality of spaced flow-guiding members to define at least one flow passage therebetween. The at least one flow passage is communicable at two opposite ends with the first inlet and the first outlet. The thermal module is formed by connecting the first inlet and the first outlet of the condensing device to a second outlet and a second inlet of a heat-absorption unit, respectively, via two separate heat-transfer units. With the flow-guiding zone provided in the condensing device, it is able to accelerate the vapor-liquid circulation in the condensing device to thereby provide upgraded heat transfer efficiency.

Abstract: A heat dissipation device with mounting structure includes a main body and a plurality of mounting elements. The main body includes an internally defined chamber having a first side and an opposite second side; a plurality of supports located in the chamber and respectively having two ends connected to the first side and the second side of the chamber; a working fluid filled in the chamber; and a plurality of connection sections in the form of recesses formed on an outer surface of the main body at positions corresponding to the supports in the chamber. The mounting elements are connected to the connection sections. With these arrangements, the heat dissipation device with the mounting elements connected to one outer surface thereof can maintain the chamber in the main body in an airtight state and ensure tight contact of it with a heat-generating element.

Abstract: An electronics device and method for assembling a heat transfer assembly of the same. An electronics device includes a circuit board, a chassis that houses the circuit board, a heat pipe configured to transfer heat from the circuit board to a wall of the chassis, and a brace configured to press the heat pipe against the wall. A brace includes a medial portion configured to contact a heat pipe and an end portion including a protrusion that is configured to be received in a depression of a chassis.

Abstract: A heat dissipation unit with mounting structure includes a main body and a plurality of mounting elements. The main body internally defines a chamber, and includes a plurality of supports located in the chamber, a working fluid filled in the chamber, and at least one wick structure formed on inner wall surfaces of the chamber. The mounting elements are externally connected to one side of the main body at positions corresponding to the supports in the chamber, and respectively define an internally threaded coupling bore therein. With these arrangements, it is able to ensure the air-tightness of the chamber of the heat dissipation unit having the mounting elements provided thereon. Further, the mounting elements with internally threaded coupling bore also provide good locking effect for the heat dissipation unit to securely connect with other elements via the mounting elements.

Abstract: Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container having a thickness of not larger than 0.5 mm. This container is formed by stacking and diffusion-joining together etched sheet bodies. Particularly, etching is performed on one side surface of each of the sheet bodies such that fine concavities and convexities can be formed on the inner surface of the container and the sheet-type heat pipe with a sufficient heat transport capability can thus be obtained even when the thickness of the container is not larger than 0.5 mm. More particularly, since the thickness of the container is formed to not larger than 0.5 mm, the sheet-type heat pipe can be effortlessly installed in a thin chassis such as that of a mobile terminal.

Abstract: A single-pass cold plate assembly having a base and a cover arranged in confronting relationship to define a cold plate with a spiral channel and a manifold with the manifold having a manifold inlet and a manifold outlet and where coolant may be introduced into the manifold inlet and may complete a single pass through the cold plate assembly.