Abstract: A vapor chamber has: a container in which a cavity portion is formed in an inside; a wick structure provided in the cavity portion; a working fluid enclosed in the cavity portion; a vapor flow path which is formed in the cavity portion and through which the working fluid in a gas phase flows; and a hydrogen occlusion metal that is disposed in the cavity portion and absorbs hydrogen at 350° C. or lower and does not release hydrogen at 350° C. or lower, the hydrogen occlusion metal being coated in a region in contact with the working fluid in an inner surface of the cavity portion and/or the wick structure.

Abstract: A heat pipe is provided for cooling an electronic component of a printed circuit board. The heat pipe includes a tube having an inner diameter surface defining a bore, with the tube having first and second ends along the bore. The heat pipe further includes a sorbent material coated onto the inner diameter surface of the tube, a first liquid contained within the bore, and a second liquid adsorbed by the sorbent material. The second liquid has a second boiling temperature that is higher than a first boiling temperature of the first liquid. The first liquid vaporizes into a first vapor, in response to the tube receiving heat from the electronic component and the first liquid reaching the first boiling temperature. The second liquid is desorbed from the sorbent material and vaporizes into a second vapor in response to the second liquid reaching the second boiling temperature.

Abstract: The invention relates to a method which comprises making a hole in a metallic support of an absorber tube, putting a vacuum pump in fluid communication with the chamber of the absorber tube by means of the hole, actuating the vacuum pump to generate a vacuum in the chamber until reaching a predetermined vacuum threshold, and introducing an inert gas inside the chamber and performing a plurality of sweeps with said inert gas, removing hydrogen from the chamber, allowing to thus reduce or remove the accumulation of hydrogen in said chamber, such that, as a result, at least part of the hydrogen absorption capacity of the getter material is recovered.

Abstract: Disclosed herein are processes and reaction systems for controlling a temperature of an oligomerization reaction zone using a heat exchange system.

Abstract: In one embodiment, a cooling system for buffering cooling capacity variations and heat load variations includes a buffering unit with a fluid container and a gas container; and a multi-way valve positioned between a fluid inlet and the buffering unit. The multi-way valve can operate to form multiple fluid loops, which include a fluid loop through the fluid container. When the cooling system in an under-provision period, the buffering unit can store a portion of fluid to the fluid container. When the cooling system is in an over-provision period, fluid stored in an under-provision period can be discharged from the fluid container due to gas pressure in the gas container reaching a threshold.

Abstract: Systems and methods for data center liquid cooling apparatus provisioning are described. In some aspects, such systems and methods may provision one or more data center liquid cooling apparatus, e.g., prior to such apparatus being put into service to a data center to cool data center devices, such as server trays (and more specifically, heat-generating devices such as processors, memories, voltage regulators, and other devices mounted on motherboards of the server trays). In some aspects, such liquid cooling apparatus include cold plates or evaporators that are mounted in thermal communication with the heat generating devices (in the server trays) and utilize a flow of a cooling liquid (e.g., water, glycol, refrigerant) to remove heat from the server tray (e.g., with or without a phase change of the cooling liquid).

Abstract: A core-in-shell heat exchanger, a method of fabricating the core-in-shell heat exchanger, and a method of exchanging heat in a core-in-shell heat exchanger disposed on a slosh-inducing moving platform are described. The method of exchanging heat includes introducing a shell-side fluid into a shell of the core-in-shell heat exchanger and introducing a fluid to be cooled into each of one or more cores of the core-in-shell heat exchanger, the one or more cores being arranged along an axial length of the shell with a plurality of baffles disposed on either side of the one or more cores along the axial length of the shell to reduce slosh of the shell-side fluid. The method also includes draining excess shell-side fluid using a plurality of drains, at least two of the plurality of drains being disposed on opposite sides of one of the plurality of baffles.

Abstract: A cooling system includes: an evaporator configured to evaporate coolant by receiving heat of a heating device; a heat radiator configured to radiate heat of the coolant; a circulation passage through which the coolant circulates between the evaporator and the heat radiator; a pump that is provided in the circulation passage and is configured to circulate the coolant through the circulation passage; and an expandable device that is provided in the circulation passage and has expandable inner space into which the coolant flows, wherein the evaporator, the heat radiator, the circulation passage and the inner space are fully filled with the coolant.

Abstract: A cooling device includes a sink, a first tube, a second tube, a heat exchanger, a pressure adjuster, and a dielectric liquid. The sink has a first outlet and a second outlet. The first tube has a first outlet connected to the first outlet of the sink, and a second outlet. The second tube has a first outlet connected to the second outlet of the sink, and a second outlet. The heat exchanger has a first outlet connected to the second outlet of the first tube, a second outlet connected to the second outlet of the second tube, and a third outlet. The pressure adjuster has an outlet connected to the third outlet of the heat exchanger. A heating element is placed in the sink and immersed in the dielectric liquid. The size of the pressure adjuster is defined by a volume of a vaporization status of the dielectric liquid.

Abstract: A cooling system includes: a cooling device; a pump coupled to the cooling device; and a waste heat device coupled to the cooling device, wherein the cooling device includes: a first refrigerant tank and a second refrigerant tank that each stores a first refrigerant that is output from the waste heat device and input to the waste heat device; and a liquid immersion tank sandwiched between the first refrigerant tank and the second refrigerant tank and configured to hold an electronic device in a second refrigerant that is output from the pump and input to the pump.

Abstract: A non-combustible mixed refrigerant having a low greenhouse effect and an application thereof, the mixed refrigerant comprises the following components in mass fractions: 4-31.5% of R125, 50-80% of R1234ze (E) and 12-22% of R1234yf. Under the cooperation of each component dosage range, the mixed refrigerant becomes non-combustible, the ODP is 0, and the GWP is not greater than 1000. The present invention may be used in a refrigeration system, does not destruct ozone, reduces the greenhouse effect, and has a low slip temperature, relating to ternary azeotropic or near-azeotropic refrigerants, and being beneficial for the stable operation of a refrigeration system. The mixed refrigerant may also be used as a foaming agent or an aerosol propellant, and has the advantages of being non-combustible, having a low ozone destruction index, and being environmentally friendly, safe and reliable.

Abstract: A fluid injection device for vehicle radiator includes a main body. The main body includes a negative pressure device, a container, an injection opening, and a switching mechanism. The injection opening is adapted for connecting with an opening of a radiator of a vehicle. The negative pressure device and the container communicate the injection opening respectively.

Abstract: An apparatus for removing non-condensable gases from a self-contained or closed loop steam generator is provided. The apparatus is connected to an appliance, which includes the self-contained or closed loop steam generator. The apparatus may be configured to include a control system connected to various portions of the apparatus to provide for automatic removable of non-condensable gases from the steam generator. However, it should be understood that the apparatus can be operated manually. The removal of non-condensable gases occurs prior to generating steam for a cooking process with the apparatus attached directly to the appliance, or with the apparatus configured as a separate unit.

Abstract: A cooler configured to cool an electronic device includes: a refrigerant inlet portion configured to guide refrigerant from an outside of a casing to an inside of the casing; a refrigerant outlet portion configured to guide the refrigerant from the inside of the casing to the outside of the casing; and a metal member located inside the casing and configured to define a flow path region in which the refrigerant is caused to flow from the refrigerant inlet portion to the refrigerant outlet portion. The metal member includes: a plurality of opening portions configured to cause the refrigerant to pass therethrough; and a capture and reduction portion having such a shape as to capture air bubbles, which are generated through a connection surface between the casing and the electronic device. The air bubbles are reduced through cooling by the refrigerant when the electronic device is cooled.

Abstract: A thermal management system and method are presented for cooling an entity. The system comprises: a closed loop fluid flow line for flow of a coolant while being transferred in between its liquid and gas phases; at least one cooling zone located within the flow line and comprising at least one cooling interface; a vacuum generator unit operable for creating and maintaining vacuum condition at the cooling zone to thereby reduce evaporation temperature of the coolant located in the cooling zone; and a condensation zone spaced apart from the cooling interface downstream thereof with respect to a direction of the coolant flow from the cooling zone along the closed loop path wherein the coolant is condensed to liquid phase.

Abstract: A transformer system includes a transformer and a transformer tank housing the transformer in a bath of a coolant; and a plurality of radiator systems operative to transfer heat from the coolant, each radiator system being in fluid communication with the transformer tank. The transformer system also includes means for determining an occurrence of a potential coolant leak in one or more radiator system of the plurality of radiator systems; and means for isolating only radiator systems of the plurality of radiator systems that are leaking, in response to a determination of the occurrence of the potential coolant leak.

Abstract: According to one or more aspects, a hydrogen fueling station is provided and includes one or more hydrogen fuel storage tanks, a pressure control device positioned downstream from the hydrogen fuel storage tanks, a dispenser positioned downstream from the pressure control device, and a heat load reduction line which forms a circulation loops from a first point downstream of the pressure control device to one or more of the hydrogen fuel storage tanks.

Abstract: A heat pipe containing a working fluid includes a first metal layer and a second metal layer. The first metal layer includes an upper surface and bottomed holes depressed from the upper surface. The second metal layer includes a lower surface that is joined with the upper surface of the first metal layer and a recess that is depressed from the lower surface. The recess forms a vapor layer in which vapor vaporized from the working fluid moves. Adjacent bottomed holes are in communication with each other so that the bottomed holes form a liquid layer in which the working fluid liquefied from the vapor moves.

Abstract: Heat transfer apparatuses and methods for directing heat transfer are disclosed. A heat transfer apparatus includes a vapor chamber having a first surface and a second surface where the first surface and the second surface define a chamber space and at least one of the first surface and the second surface includes a hydrophilic coating. The heat transfer apparatus also includes one or more first ultrasonic oscillators coupled to the first surface, one or more second ultrasonic oscillators coupled to the second surface, and a controller having a non-transitory, processor-readable storage medium storing programming instructions for selectively activating the one or more first ultrasonic oscillators or the one or more second ultrasonic oscillators based on an intended direction of heat flux.

Abstract: An apparatus for cooling a computer system includes a primary cooling loop. The primary cooling loop includes an evaporator configured to cool at least a component of the computer system, an ambient cooled condenser connected to the evaporator, a first pump to provide a coolant flow within the cooling loop, a pressure regulator configured to maintain a selected pressure in the primary cooling loop, and a controller responsive to changes in outdoor ambient conditions and an amount of heat dissipated by the computer system and configured to dynamically adjust the pump and pressure regulator in response thereto.

Abstract: A system for heat exchange includes a first condenser that places a first working fluid vapor in proximity to a second working fluid liquid. The two working fluids have respective saturation temperatures that enable the second working fluid to absorb sufficient amounts of heat from the first working fluid vapor to vaporize, while the first working fluid vapor condenses back into a liquid. The second working fluid vapor exits the first condenser via a first conduit and enters a first heat exchanger which places the second working fluid vapor in proximity to a third working fluid. The relative saturation temperatures of the second and third working fluids enables the transfer of sufficient amounts of heat from the second working fluid vapor to cause the second working fluid vapor to condense back into liquid while at least a portion of the third working fluid liquid vaporizes into third working fluid vapor.

Abstract: A window-type air conditioning system includes an outer housing having an indoor compartment, an outdoor compartment, and a water tank, a fan assembly, a compressor unit, an evaporator unit, and a water cooling unit. The water cooling unit includes a pumping device provided in the water tank, a top water collection basin for collecting the cooling water from the pumping device, a fill material unit provided underneath the top water collection basin, a bottom water collection basin provided underneath the fill material unit, and at least one heat exchanging pipe immersed in the cooling water. The cooling water collected in the bottom water collection tank is arranged to be guided to flow back into the top water collection basin, while a predetermined amount of refrigerant is arranged to flow through the heat exchanging pipe for performing heat exchanging process with the cooling water.

Abstract: A modular insulation fluid handling system for protecting insulation fluid of an inductive power device having an expansion vessel and for handling volume variations of the insulation fluid, the modular insulation fluid handling system includes a first protective housing including a resilient reservoir filled with an inert gas, a connector, and an adapter sealably connected to the inside of the resilient reservoir, an interface including a ventilation duct terminal and a reservoir terminal being sealably connected to the adapter, the connector is arranged between the adapter and the interface and configured to be connected to a connector of a second protective housing, and a vessel ventilation duct configured to be sealably connected to the expansion vessel and the ventilation duct terminal. The inside of the resilient reservoir is configured to be in hermetically sealed fluid communication with the expansion vessel via the adapter, the interface and the vessel ventilation duct.

Abstract: A thermosiphon system includes a condenser, an evaporator, and a condensate line fluidically coupling the condenser to the evaporator. The condensate line can be a tube with parallel passages can be used to carry the liquid condensate from the condenser to the evaporator and to carry the vapor from the evaporator to the condenser. The evaporator can be integrated into the tube. The condenser can be constructed with an angled core. The entire assembly can be constructed using a single material, e.g., aluminum, and can be brazed together in a single brazing operation.

Abstract: A transformer includes: a first winding; a second winding provided to maintain a first distance to the first winding; and a shell that seals the first winding and the second winding.

Abstract: A heating block including a heating block body which receives/guides a liquid medium, an electric heating element arranged in the cavity for heating the medium via electric current, a semiconductor switch for controlling the electric current flowing through the heating element to control a heating power of the heating element, and a closure piece for closing an opening in the heating block body to the cavity element. The semiconductor switch is electrically and thermally conductively connected to the closure piece via first connection terminal to electrically connect the first connection terminal to the heating element via the closure piece, and to thermally connect the first connection terminal to the medium via the closure piece. The semiconductor switch is directly connected to a control board by a second connection terminal so that the semiconductor switch is spatially arranged and mechanically connected directly between the control board and the connection piece.

Abstract: The current invention relates to a system for fast and accurate filling of a two-phase cooling device, comprising a binding device (30) intended to be hermetically mounted onto the cooling device, the binding device (30) comprising a through-hole (32) able to be in fluid contact with the cooling device, said through-hole (32) being extending between a lower surface adapted to the cooling device's surface, and an essentially plane upper surface, the binding device (30) further comprising a gripping head essentially level with said upper surface, allowing for a filling tool (400) to be put in hermetic contact with said upper surface. In a preferred embodiment, the through-hole (32) can be hermetically sealed by forced insertion of a pin-shaped plug (33). The invention also relates to the filling tool (400) to be used in combination with the binding device (30), allowing gas removal from the cooling device, filling of a working fluid, and hermetic sealing of the cooling device.

Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

Abstract: A method that controls pressure within an immersion cooling tank having condensation fluid flowing through a condenser, includes: a controller receiving a signal that indicates a current level of vapor pressure within the tank; determining from the signal when the current level of vapor pressure exceeds or is below a first preset threshold pressure level; and in response to the current level of vapor pressure exceeding or being below the first preset threshold pressure level, signaling a flow control mechanism that modulates a flow rate of the condensation fluid through the condenser to increase or decrease the rate of flow from a current rate of flow. The controller receives the signal by a pressure sensor within the immersion cooling tank detecting the current vapor pressure, generating the signal and forwarding the signal to the controller. The pressure sensor can be a differential pressure transducer that measures a differential pressure internal to and outside of the immersion tank.

Abstract: A fluid heat exchange apparatus including a casing, and a heat-dissipating device is provided. The casing includes a chamber, an inlet, and an outlet. The chamber includes a first channel including a first entrance and a first exit and a second channel including a second entrance and a second exit. The cross-sectional area of the first channel decreases from the first entrance to the first exit and the cross-sectional area of the second channel decreases from the second entrance to the second exit. The heat-dissipating device is located between the first exit and the outlet. A first fluid flows from the inlet and flows through the first channel and the heat-dissipating device and then flows to the outlet. Part of the first fluid flowing through the heat-dissipating device absorbs heat and forms bubbles moving to the second channel and then forms a second fluid converging into the first channel.

Abstract: A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

Abstract: Cooling apparatuses and methods are provided facilitating transfer of heat from a working fluid to a coolant. The cooling apparatus includes a vapor condenser which includes a condenser housing with a condensing chamber accommodating the working fluid and coolant, which are in direct contact within the condensing chamber and are immiscible fluids. The condensing chamber includes a working fluid vapor layer and a working fluid liquid layer; and a working fluid vapor inlet facilitates flow of fluid vapor into the condensing chamber, and a working fluid vapor outlet facilitates egress of working fluid liquid from the condensing chamber. A coolant inlet structure facilitates ingress of coolant into the working fluid vapor layer of the condensing chamber in direct contact with the working fluid vapor to facilitate condensing the vapor into working fluid liquid, and the coolant outlet structure facilitates subsequent egress of coolant from the condensing chamber.

Abstract: In a method for cooling liquid, when a liquid containing a volatile component and a surfactant is supplied to an atmosphere having a pressure which is lower than or equal to the saturated vapor pressure of the volatile component so that at least a portion of the volatile component is vaporized, whereby the liquid is cooled, a gas other than the volatile component is introduced into the atmosphere having the pressure so that the gas contacts the liquid.

Abstract: A system for cooling items of equipment likely to give off energy, comprises: an enclosure comprising a membrane that is porous to water vapor and sealed to liquid water, said membrane separating the cavity into a first portion designed to contain a fluid consisting of water and vapor, a second portion designed to contain the vapor resulting from the vaporization of the water, a temperature sensor for measuring the temperature of the liquid-vapor fluid contained in the cavity, a device to discharge the vapor from the cavity into the environment creating a vacuum in this cavity and breaking the natural liquid/vapor balance of the cavity containing the liquid, thus causing a vaporization of a portion of the liquid, a means for controlling the flow rate of the vapor discharged to outside of the cavity, said control means being regulated on the signal delivered by the temperature sensor.

Abstract: An apparatus for cooling a heat-generating component is disclosed. The apparatus includes a cooling chamber containing a liquid metal. The cooling chamber has a heat-conducting wall thermally coupled to the heat-generating component. A plurality of extendable tubes making up an array of cooling pin fins is attached to the cooling chamber. Each of the extendable tubes has a port end that opens into the cooling chamber and a sealed end that projects away from the cooling chamber. Moreover, each of the extendable tubes has an extended position when filled with liquid metal from the cooling chamber and a retracted position when emptied of the liquid metal. A pump system is included for urging the liquid metal from the cooling chamber into the plurality of extendable tubes.

Abstract: A system includes a primary evaporator facilitating heat transfer by evaporating liquid to obtain vapor. The primary evaporator receives a liquid from a liquid line and outputs the vapor to a vapor line. The primary evaporator also outputs excess liquid received from the liquid line to an excess fluid line. A condensing system receives the vapor from the vapor line, and outputs the liquid and excess liquid to the liquid line. The excess liquid is obtained at least partially from a reservoir. A primary loop includes the condensing system, the primary evaporator, the liquid line, and the vapor line, and provides a heat transfer path. Similarly, a secondary loop includes the condensing system, the primary evaporator, the liquid line, the vapor line, and the excess fluid line. The secondary loop provides a venting path for removing undesired vapor within the liquid or excess liquid from the primary evaporator.

Abstract: The present invention relates generally to the field of cooling systems and/or methods for cooling a heated, fissioning, or exothermic solution. In one embodiment, the present invention relates to a cooling system, and method of utilizing same, for cooling a heated, fissioning, or exothermic solution that utilizes submerged cooling coils where the system of the present invention relies on a combination of multiple factors to achieve the desired effect. In one embodiment, the present invention relates to a cooling system, and method of utilizing same, for cooling a heated, fissioning, or exothermic solution that utilizes submerged cooling coils where the system of the present invention relies on the combination of: (i) cooling coil geometry; (ii) cooling coil location and design; and (iii) cooling coil operational pressure.

Abstract: A geo-cooled photovoltaic power conversion apparatus including a cooling system having liquid-to-earth sub-grade heat exchanger, multiple cooling loops, and a coolant reservoir which provides thermal storage for the cooling system.

Abstract: A heat absorbing or dissipating device having a multi-pipe arrangement for flowing of thermal conductive fluids having a temperature difference. The thermal conductive fluids are reversely transported by a first fluid piping and second fluid piping in parallel or substantially parallel arrangements on a same end side of the heat dissipation or absorption receiving article or space. This configuration is configured to allow the heat transference, i.e., heat absorption or heat dissipation, between the thermal conductive fluid and the heat absorbing or dissipating device.

Abstract: An expansion and degassing container is in an expansion and degassing device for connecting to a circuit system for a circulating liquid. Because the amount of circulating liquid in the circuit system constantly changes during operation, liquid is withdrawn from the expansion and degassing container by way of a pressure holding pump, or supplied via a supply line, if needed. The supply line for supplying the refilling liquid is provided as a closed line, a system separator being arranged at the beginning region of the line and the end region thereof penetrating the container cover of the expansion and degassing container in a pressure-tight manner. The valve of the supply line is controlled according to the liquid level in the container. A pressure load cell, which additionally controls the valve according to the pressure, is present as a unit for decreasing an undesirable level of negative pressure.

Abstract: The invention relates to a device for transferring heat and a method of controlling such a device, the device comprising a stator chamber containing: a liquid; an input heat exchange surface; an output heat exchanger; and a rotor arranged to be rotated by vapour bubbles.

Abstract: A method and installation using liquid CO2 as a cryogenic fluid for transferring cold energy to products, wherein liquid CO2 is sent into a heat exchanger system including first and second heat exchangers connected in series. The liquid CO2 is supplied to the first heat exchanger where it evaporates. Gaseous CO2 from the first exchanger is supplied to the second heat exchanger. The atmosphere surrounding the products is blown across the heat exchangers to provide a cooled atmosphere with which to cool the products. The latent heat of vaporization of the liquid CO2 in the first heat exchanger and the sensible heat of the gaseous CO2 in the second heat exchanger satisfies the cooling requirement of the products. The first exchanger is kept at a pressure higher than the triple point pressure for CO2, whereas the second exchanger is held at atmospheric pressure or at a pressure between the triple point of the fluid and atmospheric pressure.

Abstract: One embodiment can include a heat exchange system for heat exchange with a heat source and a cold source. The system can include a circulation loop. The circulation loop can include a heat emission portion configured to exchange heat with the cold source and a heat absorption portion configured to exchange heat with the heat source, the heat absorption portion comprising a channel. The embodiment can include a liquid pump configured to circulate a liquid through the circulation loop, from an inlet of the channel to an outlet of the channel and a bubble injector coupled to the circulation loop proximal to the inlet of the channel and configured to flow a gas to form a plurality of gas bubbles in the channel, with each of the plurality of gas bubbles monodispersed across the channel, with segments of liquid separating successive gas bubbles of the plurality of gas bubbles.

Abstract: A waste heat recovery device includes a heat pipe in which a working fluid for transporting heat is enclosed, and a mode-switching valve for switching a heat recovery mode and a heat insulation mode. The heat pipe has a heating part for heating and evaporating the working fluid and a cooling part for cooling and condensing the evaporated working fluid. The heating part is made of a steel through which hydrogen gas permeates about at 500° C. and higher. In the heat recovery mode, the waste heat recovery device recovers heat of exhaust gas by using the heat pipe. Furthermore, in the heat insulation mode, a heat transport from the heating part to the cooling part is stopped.

Abstract: Provided herein is a vapor absorption system, adapted to receive a vapor comprising a vacuum pump having an operating liquid, where the vapor is received by an operating liquid and condensed therein to provide condensed liquid mixed with the operating liquid.

Abstract: The invention provides methods, apparatus and systems in which there is partial boiling of a liquid in a mini-channel or microchannel. The partial boiling removes heat from an exothermic process.

Abstract: In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.

Abstract: A refrigeration system includes a plurality of heat exchangers (E1, E2, E3) in cascade, each of said heat exchangers including: a flow (150) of cold-producing liquefied methane; a high-pressure flow (122) of a two-phase mixture of refrigerant fluids giving up in heat and including refrigerant fluids having a low normal boiling temperature; and a low-pressure flow (100) of a cold-producing two-phase mixture of said refrigerant fluids.

Abstract: A thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section. The condensate guide defines a vapour core in the evaporator and condenser sections and is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon.

Abstract: Exemplary embodiments relate to a system and method for monitoring functional operational reliability of a cooling system having at least one thermosyphon for transformers provided with at least one evaporator and with at least one condenser. The cooling system using a coolant which can be vaporized and a gaseous medium, as a heat carrier.