Abstract: A thermoelectric unit including thermoelectric modules, cold side fins, a heat sink, a hot side heat absorption element, and an electronic controller. The heat absorption element includes a metal heat transfer structure, phase change material (PCM) and heat exchange medium.

Abstract: Thermal distribution systems and methods are provided. A thermal distribution system can include a first surface having a perimeter and a second surface. At least a portion of the perimeter can be disposed proximate the second surface, forming a void between the first and second surfaces. The first surface can include a plurality of perforations. The second surface can include at least a portion of an electronic enclosure. A fluid mover having a first inlet can be adapted to draw a first inlet fluid from inside the void.

Abstract: An expansion apparatus suitable for an electronic apparatus is provided. The expansion apparatus includes a base, a supporter and an airflow guiding structure. The base has a first fan disposed therein. The supporter is pivoted to the base along a rotating axis and has a cooling channel. The cooling channel has a first port and a second port opposite to the first port. When the electronic apparatus is assembled to the supporter, the second port of the cooling channel faces to the electronic apparatus. The airflow guiding structure is disposed between the supporter and the base movably. When the supporter is pivoted relative to the base to an expanded state, an active airflow generated by the first fan is guided by the airflow guiding structure to pass through the base and the electronic apparatus. An electronic equipment including the expansion apparatus is also provided.

Abstract: A computer assembly includes a processor integrated circuit; a hard disk drive electrically connected to the processor integrated circuit and a power supply assembly, powering the processor integrated circuit and hard disk drive; a liquid-tight case, entirely containing and physically isolating and protecting the processor integrated circuit, hard disk drive and power supply assembly, the liquid-tight case defining fluid channels; electrical connectors to permit connection of the computer to outside devices; and a fan in the liquid-tight case, adapted to drive fluid through the fluid channel, thereby facilitating the movement of heat through the computer assembly.

Abstract: An automobile which includes a radiator fan control for heat pump HVAC which can selectively reverse fan direction based on ambient temperature and moisture to reduce ice buildup on a liquid-gas converter. The automobile may include a liquid-gas converter located within an engine bay, a radiator located adjacent the liquid-gas converter, a first fan located adjacent the radiator, a fuel cell and motor with the inverter located adjacent the first fan, the fuel cell supplying electricity to the motor with the inverter to drive the vehicle. The automobile can also include a temperature sensor located on an exterior surface of the automobile to sense an ambient temperature, a heater core connected to the liquid-gas converter and located between the engine bay and the passenger area, and a control unit connected to the first fan, the temperature sensor, and the heater core.

Abstract: A cooling system comprises an electronics module and a duct. The electronics module produces more heat at a first location than at a second location, and is rated to a safe operating temperature. The duct surrounds the electronics module, and has a shaped baffle with a constricted region near the first location and an open region near the second location. The expanded region has greater cross-sectional flow area than the constricted region. Airflow through the duct cools both the first location and the second location to within an efficiency margin below the safe operating temperature.

Abstract: An automobile which includes a radiator fan control for heat pump HVAC which can selectively reverse fan direction based on ambient temperature and moisture to reduce ice buildup on a liquid-gas converter. The automobile may include a liquid-gas converter located within an engine bay, a radiator located adjacent the liquid-gas converter, a first fan located adjacent the radiator, a fuel cell and motor with the inverter located adjacent the first fan, the fuel cell supplying electricity to the motor with the inverter to drive the vehicle. The automobile can also include a temperature sensor located on an exterior surface of the automobile to sense an ambient temperature, a heater core connected to the liquid-gas converter and located between the engine bay and the passenger area, and a control unit connected to the first fan, the temperature sensor, and the heater core.

Abstract: A first element and a second element are disposed in postures such that the length directions of the elements are parallel to each other. The first element is disposed in a posture such that a pair of opposing surfaces where a longitudinal flow passage is open is parallel to one main plate. The second element is disposed in a posture such that a pair of opposing surfaces where a longitudinal flow passage is open is parallel to the one main plate. A mixing flow passage formed as a result of the first element and the second element being disposed with a gap therebetween in a facing direction of side plates is provided between a transverse flow passage of the first element and a transverse flow passage of the second element.

Abstract: An outdoor unit for an air conditioning device includes an outdoor unit main body, a heat exchanger, a fan provided in an upper part of the outdoor unit main body, the fan blowing out the air taken in from a side surface of the outdoor unit main body upward, a ventilating member surrounding an outer circumference of the fan and forming a blow-out port, and an electric component unit accommodated in the outdoor unit main body and arranged in an opening portion between one side end portion and the other side end portion of the heat exchanger, wherein the electric component unit is provided so as to cross over a lower end of the ventilating member in the up and down direction, and on the upper side than the lower end of the ventilating member, the electric component unit is arranged on the horizontally outer side than the ventilating member.

Abstract: A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.

Abstract: A heat dissipation device includes a heat sink, a fan including a fixing member, and a positioning member. The heat sink includes a supporting portion and a number of fins. The supporting portion defines a positioning hole including an access hole and a locking hole communicating with the access hole. The positioning member includes a neck connected to a bottom of the fan, and a head connected to a bottom end of the neck and having a diameter greater than a diameter of the neck. When fixing the fan, the head extends through the access hole, the fan is slid to move the neck into the locking hole, and the fixing member is fixed to the heat sink.

Abstract: A first conduit is externally attached to one of two opposing sidewalls of electronic equipment and a second conduit is externally attached to the other of the opposing sidewalls. Each conduit has an open end, a closed end, and a side having a vent that is aligned with a vent in the sidewall of the electronic equipment to which that conduit is attached. The first conduit takes air in through its open end, channels the air in a direction substantially orthogonal to the direction of air flowing through the electronic equipment, and directs the air into the electronic equipment through its aligned vents. The second conduit receives air from the electronic equipment through its aligned vents, channels the air in a direction that is substantially orthogonal to the direction of air flowing through the electronic equipment, and exhausts the air through the open end of the second conduit.

Abstract: In an induction emission air conditioning apparatus installed in a ceiling, it is provided within a casing with a heat exchanger through which a feed air introduced from an outdoor side passes, a fan passing the feed air through the air conditioning heat exchanger, and a heating and cooling unit 1 for blowing a mixed air obtained by inducing and suctioning the air in the room inside by using the feed air passing through the heat exchanger so as to mix with the feed air, into the room inside in a laminar manner, and emitting the heat of the mixed air to the room inside, integrally.

Abstract: A system of computing assets arranges a plurality of backplanes to form a perimeter of a central region of a backplane structure. A plurality of computing assets are coupled to the backplanes and extend away from the central region of the backplane structure. A plurality of air intake openings are located along the perimeter of the backplane structure. An exhaust duct is coupled to an exhaust opening of the backplane structure and configured to direct air away from the backplane structure and is coupled to an air moving device. When the air moving device is operational, air flows across the computing assets through the air intake openings towards the central region of the backplane structure and into the exhaust duct, which directs the air away from the backplane structure.

Abstract: A computer system includes a rack-mountable server unit with a closed server housing. The server housing has a channel with a recessed channel wall in conductive thermal communication with a processor or other heat-generating component. An elongate conduit is received into the channel of the server housing in conductive thermal communication with an external surface of the server housing. The server is cooled by conductive fluid flow through the conduit, with no appreciable airflow through the server housing. The system may be operated in an optional burst cooling mode, wherein a volume of cooling fluid is trapped in the conduit for a period of time before being quickly released.

Abstract: Embodiments of a modular condenser unit are provided. The modular condenser unit may include a housing and a first condenser coil and a second condenser coil disposed within a volume of the housing. A fan may also be disposed in an end of the housing and adapted to draw air through at least one of the first condenser coil and the second condenser coil. In some embodiments, the first condenser coil and/or the second condenser coil may be micro-channel condenser coils.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: A chassis with distributed jet cooling is provided. The chassis includes one or more sidewalls defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly comprising a multi-orifice synthetic jet or a number of single orifice synthetic jets disposed on a side of a respective one of the array(s) of fins. The chassis further includes at least one attachment means for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls.

Abstract: A fluid pre-heating assembly includes a housing that may be positioned on a support surface. A tank is positioned within the housing so the tank may contain a fluid. A fan motor is coupled to the housing. A fan is operationally coupled to the fan motor so the fan may draw air over the tank.

Abstract: A heat management system may include a generally planar printed circuit board extending in a first plane, heat-generating electrical components mounted on a first side of the PCB, and an air baffle coupled to the PCB and configured to direct air flow across some of the components. The air baffle may include a generally planar air baffle body extending in a second plane parallel to and offset from the first plane of the PCB such that at least one of the components is located in an area between the air baffle body and the PCB, an opening in the generally planar body, and a generally planar wing coupled to the air baffle body at a first side of the opening and extending toward the PCB at an askew angle relative to the first plane of the air baffle body, the wing being configured to facilitate air flow through the opening.

Abstract: A heat dissipation module includes an encasing structure, a fan impeller mounted in the encasing structure, a heat dissipation piece, and a bearing. The fan impeller includes a mounting post and a plurality of fan blades surrounding the post. The heat dissipation piece is mounted in a base plate of the encasing structure and configured for directly contacting with a heat generating component. The bearing is mounted on the heat dissipation piece. The mounting post is pivotably mounted in the bearing. The fan impeller is capable of dissipating heat generated by the heat generating component when the mounting post is rotating in the bearing.

Abstract: A cooling system for an electronics chassis includes a plurality of centrifugal blowers arranged to motivate cooling air through the electronics chassis. The centrifugal blowers are arranged in one or more sets, each having blowers oriented with respective inlets in mutual facing relationship. The orientation, positioning, and alignment of the centrifugal blowers facilitates a compact arrangement of the plurality of blowers that achieves increased aerodynamic efficiencies to reduce noise output and energy consumption.

Abstract: A portable electronic device, which including a casing, a circuit board, a fan and a heat dissipating device, is disclosed. The circuit board is disposed in the casing and includes at least one electronic component thereon. The fan is disposed in the casing. The heat dissipating device is disposed in the casing and near the side of an air outlet of the fan. Gaps formed between the outer surfaces of the heat dissipating device and the inner surfaces of the casing as air flow channels. The portable electronic device isolates heat conducted to the casing of the portable electronic device via the gaps.

Abstract: An air duct mounted to a fan having an end board includes a top board which defines an opening, through which the fan is extended. Two opposite blocking members extend up from the top board at opposite first sides of the opening. Two opposite limiting members extend up from the top board at opposite second sides of the opening. Each blocking member includes a tab to block a top of the end board of the fan. Each limiting member includes a projection to abut a bottom of the end board of the fan.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow one or more fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves fanless servers installed on the server racks and introduces fan units to draw cooling air from the cold row encapsulation structure through the fanless servers on the racks.

Abstract: The invention relates to a system for coupling two adjacently placed heat exchangers (IL,IR), which is provided with a first coupling unit (11a) connected to the heat exchangers on a first side thereof, and a second coupling unit (11b) connected to the heat exchangers on a second side thereof. In each coupling unit an inlet duct (12) is herein formed for one of the heat exchangers connected thereto and an outlet duct (13) is formed for the other heat exchanger connected thereto. The inlet and outlet ducts can here intersect in each coupling unit. The coupling units can be identical and be arranged in the coupling system oriented in opposite directions.

Abstract: A fan arrangement for a heat exchanger of a motor vehicle, a system for a motor vehicle, and a motor vehicle. A fan is arranged downstream of the heat exchanger in an air supply direction. The fan is arranged in a fan cowling which covers an air passage area of the heat exchanger and which is arranged spaced from the heat exchanger in an axial direction and coupled to the heat exchanger via a sealing part. A plurality of air passages having openings are arranged opposite each other in the sealing part. The dimensions of the air passage openings in a direction perpendicular to the air supply direction, in relation to the peripheral area of the sealing part, is at least a factor of 0.025 of the diameter of the fan, and the dimensions of the air passage openings in the direction of the air supply, is at least 0.0025 of the diameter of the fan.

Abstract: An airflow adjustment device is disclosed. The airflow adjustment device is used for a blade server provided for plugging in an interface card, and the interface card includes a bracket. The airflow adjustment device is installed in the blade server, and the airflow adjustment device includes a top cover, a plurality of sidewalls, a bracket plate, and at least one deflector. The bracket plate is used for sheltering the bracket, and air enters the blade server through the at least one deflector and at least one gap area formed by the bracket plate and at least one of the plurality of sidewalls whereby the flow resistance of the blade server is not affected by the type of the bracket.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includes an opening there through that is rectangular in shape. The equipment enclosure further comprises an exhaust air duct extending upward from the top panel of the enclosure. The exhaust air duct is rectangular in cross-section and is disposed in surrounding relation to, and in fluid communication with, the top panel opening. The exhaust air duct is adapted to segregate hot air being exhausted from the enclosure from cool air entering the enclosure, thereby improving thermal management of the enclosure.

Abstract: A cooling device for rack mount equipment comprises an extensible side duct, open on its inner and rear-facing sides which redirects warm exhaust air exiting vents in the side of a chassis towards the rear of an enclosure holding the chassis. An apparatus incorporating the cooling device may be installed in a rack with the extensible side duct in a retracted position. The extensible side duct may extend under the influence of air pressure, forming a plenum in fluid communication with the interior of a chassis on which it is mounted such that warm air exiting the chassis is collected in the plenum formed by the extensible side duct and directed out towards the rear of the chassis. Use of the apparatus permits conventional front-to-back cooling airflow patterns to be maintained even with chassis having side exhaust vents.

Abstract: A covering for use with an outdoor located unit defining an opening which exhibits a plurality of cold temperature sensitive components such as heat dissipating coils or cooling tower coils. A plurality of fasteners are secured to a face of the unit at locations proximate to at least one surrounding side of the opening. The fasteners secure to perimeter extending locations associated with an impermeable layer of material arranged over the opening in order to prevent air movement, ice, and snow through said opening in contact with the coils.

Abstract: A high-voltage apparatus includes a battery device, a high-voltage control device, a housing, and a cooling structure. The cooling structure includes a first cooling channel to cool the battery device, a second cooling channel to cool the high-voltage control device, a connection channel connecting the first cooling channel to the second cooling channel, and a ventilator. The connection channel has a first opening portion connected to the first cooling channel, a second opening portion connected to the second cooling channel, and an inner flow path to communicate the first opening portion to the second opening portion. A sectional area of the first opening portion and a sectional area of the second opening portion are each set to be smaller than a sectional area of the inner flow path.

Abstract: A fan module is detachably mounted in a chassis. The chassis includes a sidewall defining a locking slot. The fan module includes a bracket including a base plate defining a first through slot, a fan fixed to the base plate, a fan duct fixed to the base plate beside the fan, and a locking member. The fan duct includes a side plate defining a second through slot. The locking member is fixed to the fan duct. The locking member includes a locking portion extending through the second through slot of the fan duct and the first through slot of the bracket to lock into the locking slot of the chassis.

Abstract: A cooling system includes a first group of fans, a second group of fans, and an air conducting cover. The air conducting cover includes a first partition, a second partition, a third partition. The first partition is connected between the second partition and the third partition to define a first space, a second space and a third space. Wherein the first group of fans directs air flow to enter the first space and the second space, the second group of fans directs air flow to enter the third space.

Abstract: Exemplary embodiments are directed to a cooling apparatus for cooling a power electronic device, the apparatus including at least one panel that is adapted to be thermally connected to a heat source in order to receive heat from the heat source. The panel is also adapted to be thermally in contact with an air flow in order to transfer heat from the panel. The panel includes at least one hole between a first side of the panel and a second side of the panel. The hole is adapted to attenuate a vibrating air pressure generated by an acoustic noise source and carried by the air.

Abstract: An electronic device including a fan unit capable of setting an air blowing direction toward any of an interface plate side of a casing and a back plate side opposite to the interface plate; a power supply unit; a first housing portion capable of housing the power supply unit and provided within the casing to be close to the back plate; a second housing portion capable of housing the power supply unit and provided within the casing to be close to the interface plate; a detection portion that detects the air blowing direction of the fan unit and a position where the power supply unit is housed; and a warning portion that operates based on the detection portion to give a warning in a case where the air blowing direction of the fan unit is different from the side where the casing houses the power supply unit.

Abstract: An air condition system includes a casing, a first heat exchanger, a fan and a second heat exchanger. A host is held by the casing. The first heat exchanger is disposed inside the casing. Air flows into the casing, and is processed by the first heat exchanger. Then, the air processed by the heat exchange procedure flows forward the host. The fan exhausts the air passing through the host. The second heat exchanger disposed on the fan and inside the casing. The air exhausted by the fan is processed by the second heat exchanger, and flows out of the casing by wind force of the fan.

Abstract: Cooling airflow through an information handling system is redirected at positions of a motherboard having an unpopulated processing component towards positions of the motherboard having processing component. For example, a shroud shaped as a nozzle couples to a heat sink connector of the motherboard to cover an unpopulated CPU socket. The shroud has a nozzle-shaped channel with an inlet accepting cooling airflow and an outlet exhausting the cooling airflow towards a processing component. For instance, the inlet is proximate a cooling fan and the outlet directs the airflow from the cooling fan towards a heat sink associated with RAM populated on the motherboard.

Abstract: A computer system includes a computer case, a cover, and an air duct. The computer case includes a display, a housing connected to the display, a motherboard attached to the housing, and a fan module. The motherboard includes a heat generating component. An input opening and an output opening are defined in the cover. The output opening corresponds to the fan module. The air duct is mounted over the heat generating component. The air duct includes a top plate substantially parallel to the motherboard and a first side plate extending from the top plate. The first side plate is substantially perpendicular to the top plate. The first side plate defines a plurality of first airflow holes corresponding to the input opening. The top plate defines a plurality of through holes corresponding to the heat generating component.

Abstract: A system, configured to be disposed in a information technology equipment rack for providing ice thermal storage, includes a tank configured to hold water, a heat exchanger disposed in water in the tank and configured to convey a two-phase liquid and vapor refrigerant and to transfer heat between the water and the refrigerant, a first valve connected to a liquid and a vapor refrigerant line and configured to selectively connect the liquid refrigerant line to a first port and the vapor refrigerant line to a second port in a first mode and to connect the liquid refrigerant line to the second port and the vapor refrigerant line to the first port in a second mode, a thermostatic expansion valve connected to an inlet of the heat exchanger, and a liquid/vapor pump connected to an outlet of the heat exchanger and to the second port of the first valve.

Abstract: An enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket operatively coupled to the one or more walls of the outer casing and two or more synthetic jets operatively coupled to the bracket, where the two or more synthetic jets are arranged in a multi-dimensional array.

Abstract: In an electronic unit accommodated in a containing device so as to be adjacent to another electronic unit accommodated in the containing device, the electronic unit includes: a housing that is formed into a tub shape, that is provided with a plate comprising an air blowing hole, and that is closed by said another electronic unit when the electronic unit and the other electronic unit are accommodated in the containing device; and an interrupting portion that interrupts power supply to the electronic unit when said another electronic unit is detached from the containing device and the housing of the electronic unit is opened.

Abstract: An air cooled switching unit for a motor drive includes a forced air cooling chamber and a convective cooling chamber separate from the forced air cooling chamber. An exhaust port of the forced cooling chamber is configured to direct exhaust air across an outlet of the convective cooling chamber to induce an increased air flow through the convective cooling chamber thereby increasing the cooling capacity of the convective cooling chamber.

Abstract: According to one embodiment, a display device includes a housing, a circuit board device, a fan, a first wall portion, and a second wall portion. The housing includes an exhaust port. The circuit board device is housed in the housing and includes a circuit board having a first surface and a second surface, a first portion including the first surface, and a second portion including the second surface. The fan includes an ejection port and is housed in the housing at a position separated from the exhaust port to send cooling wind from the ejection port toward the first portion and the second portion. The first wall portion is located between the inner surface of the housing and the first portion, and constitutes a first ventilation path. The second wall portion is located between the inner surface of the housing and the second portion, and constitutes a second ventilation path.

Abstract: In an oil-cooled air compressor for controlling a temperature of a lubricant by changing a flow rate of a cooling medium supplied to a heat exchanger for the lubricant, for obtaining an energy saving effect by variable control of the flow rate of the cooling medium and preventing securely a condensed water from occurring in a compressor unit even when an exhaust duct is arranged inappropriately, a lubricant flow rate adjustor is arranged to measure a temperature of the lubricant and decreasing a flow rate of the lubricant supplied to the heat exchanger so that the lubricant temperature becomes T1 to satisfy T0>T1?TD when T0 is a control temperature of the lubricant and TD is a condensed water occurrence critical temperature at which a condensed water occurs in the compressor.

Abstract: An electronic device comprises a cooler comprises a plurality of first locking members, a backboard defining pluralities of first and second positioning holes, and a circuit board. The backboard is attached to the cooler through the first locking members engaged with the second positioning holes. A first mounting member and a second mounting member are adapted to receive the heat generating component. The first mounting member defines a plurality of locking holes. The first positioning holes are among the second positioning holes. The second mounting member receives the heat generating component, the circuit board is between the second mounting member and the backboard, the first mounting member is secured to the circuit board; when the first mounting member receives the heat generating component, the circuit board is between the first mounting member and the backboard, the first mounting member is secured to the backboard.

Abstract: A cooling system includes a fixing device and a fan. The fixing device includes a fixing rack and a latching rack. The fixing rack includes a first latching arm and two opposite supporting arms protruding from two ends of the first latching arm. The latching rack includes a second latching arm and two opposite adjusting arms protruding from two ends of the second latching arm. The adjusting arms can be adjustably fixed to the supporting arms at different positions to adjust a distance between the first latching arms and the second latching arm to releasably fix the fan between the first latching arm and the second latching arm.

Abstract: A user interface method for a terminal for a vehicle is provided. The terminal obtains position information to detect a point of a road. A road image of a driving direction is obtained, a lanes of the road represented on the obtained road image is recognized, and a point of a road and lane in which the vehicle having the terminal arranged therein is detected. A virtual road image regarding the recognized lanes is generated, and the generated virtual lanes are added to the road image of the driving direction of the vehicle, and displayed. Traffic information for each lane and surrounding information (i.e. lane closure, construction, accident, etc.) at the detected point of the relevant road are obtained, and the obtained information is displayed for each virtual lane.

Abstract: An electronic device includes a main body having an air inlet port and an air outlet port, an air channel having an air inlet port and an air outlet port and is arranged such that the air channel and the main body oppose each other, a boundary base disposed between the main body and the air channel, a heat sink mounted on the boundary base such that a fin thereof protrudes into the air channel, a power converter tightly mounted on an upper surface of a base of the heat sink so as to be positioned in the main body, cooling fans disposed near the air outlet port of the main body and the air outlet port of the air channel, and a first reactor disposed on a windward side of the heat sink in the air channel.