Heat Transmitter Patents (Class 165/185)
  • Patent number: 11637000
    Abstract: The present invention relates to a coating device comprising a vacuum coating chamber for conducting vacuum coating processes, said vacuum coating chamber comprising: —one or more cooled chamber walls 1 having an inner side 1 b and a cooled side 1 a, —protection shields being arranged in the interior of the chamber as one or more removable shielding plates 2, which cover at least part of the surface of the inner side 1 b of the one or more cooled chamber walls 1, wherein at least one removable shielding plate 2 is placed forming a gap 8 in relation to the surface of the inner side 1 b of the cooled chamber wall 1 that is covered by said removable shielding plate 2, wherein: —thermal conductive means 9 are arranged filling the gap 8 in an extension corresponding to at least a portion of the total surface of the inner side 1 b of the cooled chamber wall 1 that is covered by said removable shielding plate 2, wherein the thermal conductive means 9 enable conductive heat transfer between said removable shielding p
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: April 25, 2023
    Assignee: Oerlikon Surface Solutions AG, Pfäffikon
    Inventors: Siegfried Krassnitzer, Sebastien Guimond
  • Patent number: 11632875
    Abstract: A wireless device charger configured to produce an alternating magnetic field, thereby inducing an alternating electrical current within a capture coil of a personal electronic device proximate to the wireless device charger, said wireless device charger includes a source coil having a ferrite element configured to generate the alternating magnetic field, a housing formed of a thermally conductive material in thermal communication with the ferrite element, and an air movement device configured to produce an air flow across a surface of the housing flowing from an air inlet to an air outlet, thereby reducing a housing temperature. The surface of the housing defines a plurality of fins extending along the housing in a direction of the air flow. At least one fin in the plurality of fins has a non-symmetric surface, thereby creating turbulence in the air flow.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: April 18, 2023
    Assignee: APTIV TECHNOLOGIES LIMITED
    Inventors: Andrew F. Pinkos, John Mecca
  • Patent number: 11629919
    Abstract: The present invention relates to a method of manufacturing a cooling device using a heat pipe in which, using casting, the heat pipe is embedded inside a housing, and the method includes a filling step in which a predetermined support member is filled inside a pipe to prevent deformation of the pipe by a pressure of a melt being injected into a cavity of a mold that is closeable, a pipe seating step in which the pipe filled with the predetermined support member is seated in the cavity, a melt injecting step in which the melt is injected into the cavity to surround the pipe, a cooling and withdrawing step in which the injected melt is cooled and a molded product is withdrawn, an injecting step in which a working fluid is injected into the pipe through an injection end, and a finishing step in which, after the injecting step, the pipe is sealed.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: April 18, 2023
    Assignee: MH TECHNOLOGIES INC.
    Inventor: Jin-Ho Yoo
  • Patent number: 11624880
    Abstract: An optical transceiver having a locking assembly that prevents undesirable movement of the optical transceiver when engaged with another device is described. The locking assembly includes a slide with a projection, lift, and weighted stops. In a first configuration, the slide and weighted stops can sustain contact between a thermal interface material of the optical transceiver and the other device while locking the optical transceiver to prevent movement. In a second configuration mode, the locking assembly disengages the thermal interface material from the other device and unlocks the weighted stops to permit disconnection from the other device.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: April 11, 2023
    Assignee: Infinera Corporation
    Inventors: Franklin Wall, Jr., Paul Gavrilovic, Walter Shakespeare
  • Patent number: 11621212
    Abstract: In an apparatus for coupling integrated circuits to printed circuit boards, a backing plate with manufactured features on the top surface includes a module lid; a planar structure; a device seated in the planar structure, with the module lid in contact with the top surface of the device; and a backing plate that contains manufactured features on one side. The backing plate is in contact with the planar structure, and a plurality of fastening mechanisms couple together the lid, the device, the planar structure, and the backing plate.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: April 4, 2023
    Assignee: International Business Machines Corporation
    Inventors: Yuan Yao, Shurong Tian, Todd Edward Takken
  • Patent number: 11619151
    Abstract: An internal combustion engine having at least twelve cylinders, comprising a crankcase and an oil pan assembly attached to a bottom side of an engine casing, wherein the oil pan assembly is formed by at least one casted segment. The oil pan assembly is formed by at least two segments, wherein the at least two segments are casted parts and are arranged next to each other in a longitudinal direction of the engine.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: April 4, 2023
    Assignee: Liebherr-Components Colmar SAS
    Inventors: Hugues Winkelmuller, Richard Giaccardi
  • Patent number: 11604035
    Abstract: Embodiments of the present invention relate to a heat dissipation apparatus and relates to the field of heat dissipation technologies, so as to solve a problem that heat dissipation efficiency of heat dissipation fins of an existing heat dissipation apparatus is low. In embodiments of the present invention, the heat dissipation apparatus includes a base plate, where multiple main fins are disposed on the base plate, and multiple auxiliary fins are disposed on the main fins; a gap exists between the auxiliary fins and the base plate; and a blocking structure is disposed and fastened on the base plate and/or the main fins, and the blocking structure can make cooling airflow first flow along the auxiliary fins and then flow along gaps between adjacent main fins and flow out. The present invention is mainly used in the field of communication accessories.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: March 14, 2023
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Zaizhong Xia, Yun Tang, Wen Fang
  • Patent number: 11586259
    Abstract: A cooling system for a computing device includes an outer chassis of the computing device, a heat spreader, a heat bridge, and a heat dissipating structure. The outer chassis of the computing device is configured to support heat generating modules. The heat spreader is integrated into the outer chassis. The heat bridge couples the heat spreader to a corresponding heat generating module at a first location in the computing device. The heat dissipating structure is coupled to the heat spreader at a second location in the computing device. The second location is positioned in the computing device to experience higher airflow than the first location.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: February 21, 2023
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Vic Hong Chia, Joseph Francis Jacques, John Scott Scheeler
  • Patent number: 11589485
    Abstract: A shield case including a base portion made of a nonmetal material and having a mounting surface on which the electronic component is mounted, a cover portion made of a metal material and covering surroundings of the electronic component and a metal plate abutting with an outer surface of the base portion and having an end portion projecting outward from the base portion. A side-wall end portion of the cover member includes a first end abutting with the mounting surface of the base portion, and a second end extending in a thickness direction of the base portion and abutting with the end portion of the metal plate.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: February 21, 2023
    Assignee: NISSAN MOTOR CO., LTD.
    Inventor: Tsutomu Yamazaki
  • Patent number: 11581237
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a surface; a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the surface of the package substrate; and a cooling apparatus that may include a conductive base having a first surface and an opposing second surface, wherein the first surface of the conductive base is in thermal contact with the second surface of the die, and a plurality of conductive structures on the second surface of the conductive base, wherein an individual conductive structure of the plurality of conductive structures has a width between 10 microns and 100 microns.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: February 14, 2023
    Assignee: Intel Corporation
    Inventors: Joe F. Walczyk, Pooya Tadayon
  • Patent number: 11564329
    Abstract: A heat dissipation device includes a base having a first surface in contact with at least one heat source and an opposite second surface having a heat dissipation zone upward extended therefrom; an auxiliary heat dissipation zone horizontally extended from one of four lateral sides or directions of the heat dissipation zone; an air guiding section defined at the auxiliary heat dissipation zone; and at least one upward indented zone formed between the auxiliary heat dissipation zone and the side of the heat dissipation zone having the auxiliary heat dissipation zone sideward sidewardly extended from a higher portion thereof. With these arrangements, the heat dissipation device can guide air flow currents directly or indirectly to a plurality of heat sources located corresponding to the heat dissipation zone and the auxiliary heat dissipation zone at the same time to cool them.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: January 24, 2023
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Yen-Lin Chu
  • Patent number: 11551046
    Abstract: A flexible card may include a stacked dynamic magnetic stripe communications device having multiple layers, such as a magnetic emulator, a magnet, and a shield. A shield may form a non-flexible layer within the stack and may bend, but the shield may not be able to stretch or compress. Flexible layers may surround and adhere to the shield such that when the card is flexed, the flexible layers may stretch and compress with the movement of the shield.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: January 10, 2023
    Assignee: DYNAMICS INC.
    Inventor: L. Casimir Mostowy, Jr.
  • Patent number: 11553621
    Abstract: A heat dissipation base includes a fixing plate and a metal heat conduction block. The fixing plate includes a plurality of heat pipe partitions and a plurality of heat pipe fixing openings, and the heat pipe fixing openings are formed between the heat pipe partitions. The metal heat conduction block is fixed to the fixing plate, and the fixing plate further includes a plurality of supporting portions to support shear surfaces at two ends of the heat conduction block.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: January 10, 2023
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Cheng-Ju Chang, Ming-Yuan Lo, Ching-An Liu
  • Patent number: 11553616
    Abstract: The present disclosure provides a module including a circuit board, a first component and a second component. The circuit board includes a first side and a second side opposite to each other and includes a first plane and second plane disposed on the first side. A first height difference is formed between the first plane and the second plane. The first component and the second component are disposed on the first plane and the second plane, respectively. The first component and the second component include a first contact surface and a second contact surface, respectively. The first contact surface and the second contact surface are coplanar with a first surface of the module. It benefits to reduce the design complexity of a heat-transfer component, and enhance the heat dissipation capability and the overall power density of the module simultaneously.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: January 10, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wenhua Li, Xueliang Chang, Yahong Xiong, Qinghua Su
  • Patent number: 11551988
    Abstract: An electronic component, or a precursor thereof, that comprises a curable organopolysiloxane composition or a cured product thereof is disclosed. The curable organopolysiloxane composition is generally curable through a hydrosilylation reaction and can be applied to at least one area by a microdroplet application device. The curable organopolysiloxane composition has a viscosity of no more than 2.0 Pa·s at a strain rate of 1,000 (1/s), and a viscosity at a strain rate of 0.1 (1/s) being a value no less than 50.0 times the viscosity at a strain rate of 1,000 (1/s). In particular, the area of application generally is a substantially circular area that fits within a frame no more than 1000 ?m in diameter, a linear area no more than 1000 ?m in line width, or a pattern configured from a combination of these areas.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: January 10, 2023
    Assignee: DOW TORAY CO., LTD.
    Inventor: Manabu Sutoh
  • Patent number: 11519646
    Abstract: Heat pump systems with a gas bypass tank and that operate in both heating and cooling modes are disclosed. The systems include a first splitting valve that can route liquid refrigerant to either the indoor coil or the outdoor coil, depending on whether the heat pump system is in heating or cooling mode. An expansion valve in the system can lower the pressure of liquid refrigerant leaving a condenser, thereby creating a two-phase fluid comprising liquid refrigerant and vaporized refrigerant. The gas bypass tank can separate liquid refrigerant from vaporized refrigerant. The liquid refrigerant can be supplied to the evaporator of the system, while the vaporized refrigerant can be bypassed to a compressor. The first splitting valve can include a first plurality of switching paths that route the separated liquid refrigerant to either the outdoor coil or the indoor coil.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: December 6, 2022
    Assignee: RHEEM MANUFACTURING COMPANY
    Inventor: Yang Zou
  • Patent number: 11523531
    Abstract: A spring lock includes a sinusoidal spring that has one or more crests and troughs formed along a length of the sinusoidal spring, the length extending along a sliding axis, the one or more crests and troughs forming a sinusoidal spring profile. The spring lock further includes a lock bar that has a track extending along the sliding axis, the track being configured to hold the sinusoidal spring and allow the sinusoidal spring to move along the sliding axis, the track further including one or more depressions and plateaus with the depressions and plateaus forming a lock bar profile, wherein the spring lock is locked when the sinusoidal spring profile and the lock bar profile are out-of-phase and the spring lock is unlocked when the sinusoidal spring profile and the lock bar profile are in-phase.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: December 6, 2022
    Inventors: Morgan E. Davidson, Mike S. Watson
  • Patent number: 11510336
    Abstract: An electronic device having heat dissipation function is proposed. The electronic device includes: a heating element (60) installed in a casing (C); a heat dissipation means (70) causing an ionic wind to flow into an inner space (S) of the casing (C); and a heat dissipation bridge (95). The heat dissipation bridge (95) exchanges heat with the ionic wind flowing in the inner space (S) by protruding in a direction of the heating element (60) and at least a portion of the heat dissipation bridge is connected to a heat sink and transfers heat received from the heating element (60) to the heat sink. Accordingly, two means of the heat dissipation means (70) and the heat dissipation bridge (95) simultaneously cool the heating element (60), so cooling efficiency is improved.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: November 22, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: MinWoo Jeong, Chun Hyuk Ryu, Jongkil Shin, BongJun Kim, Minjae Park
  • Patent number: 11506961
    Abstract: A heat dissipation module includes a base, a cover and a plurality of heat dissipation fins. The cover is disposed on the base and forms an accommodation space with the base. The plurality of heat dissipation fins is disposed in the accommodation space. The cover includes a top, at least one side wall, a first opening and a second opening. The first opening and the second opening are disposed on the top or the at least one side wall. The at least one side wall surrounds the top and is connected to the base. The distances between the plurality of heat dissipation fins and one of the at least one side wall in a first direction are different. A projection apparatus is also provided, which includes a light source module, a light valve, the aforementioned heat dissipation module and a projection lens.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: November 22, 2022
    Assignee: Coretronic Corporation
    Inventors: Shi-Wen Lin, Wei-Chi Liu, Tsung-Ching Lin
  • Patent number: 11497145
    Abstract: A server (10), a server rack (50) and a data centre (100, 150) are provided. The server (10) includes a housing (12) defining a gaseous flow passage. A plurality of active components (14) and a plurality of passive components (16) are provided in the housing (12). A plurality of liquid cooling devices (18) is attached to respective ones of the active components (14).
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: November 8, 2022
    Assignee: National University of Singapore
    Inventors: Poh Seng Lee, Yong Jie Chen, Matthew Lee Liong Law, Navin Raja Kuppusamy
  • Patent number: 11489216
    Abstract: A method for providing a battery arrangement for a motor vehicle, wherein a battery housing arrangement is provided, including a battery housing having at least one holding section for holding a battery module, a cooling device which provides at least part of a housing floor of the battery housing, and an underride guard which is disposed outside the battery housing at the cooling device such that a gap is created between the cooling device and the underride guard, and a viscous heat conducting element and a battery module are placed inside the holding section such that the heat conducting element is located between the underside of the battery module, which faces the cooling device, and the cooling device.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: November 1, 2022
    Assignee: AUDI AG
    Inventor: Martin Simon
  • Patent number: 11483942
    Abstract: Ruggedized avionics assemblies for use on kinetically launched space vehicles are disclosed. The avionic assemblies are able to maintain structural integrity and functionality under high acceleration forces generated during kinetic launch, including acceleration forces of >5,000 times Earth's gravity in a single direction of loading. The avionics assembly is ruggedized to withstand this level of acceleration force during launch via a plurality of constraining elements to constrain a plurality of printed circuit boards aligned in parallel to an acceleration vector. Further, a high specific strength and stiffness composition of the plurality of constraining elements aids in supporting the printed circuit boards and preventing them from bending and dislodging electronic components mounted to the printed circuit boards.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: October 25, 2022
    Assignee: SpinLaunch Inc.
    Inventors: Carl Lawhon, Maxim Clarke, Jonathan Yaney
  • Patent number: 11470748
    Abstract: A modular liquid cooling block is described for cooling high current devices deployed in power flow control systems. The liquid cooling blocks may have separate shower heads which may be configured for direct impingement, indirect impingement, or parallel flow cooling configurations. Voltage isolation of liquid cooling blocks from an enclosure of the power flow control system and from associated equipment enables serial or parallel connected power flow control units to inject substantial reactive power that may be configurable into a power transmission line. Associated power flow control systems are monitored for temperature, flow rate and pressure gradient. Redundant pumps and fan radiators contribute to reliable operation. Automatic shutdown and alarm may be provided.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: October 11, 2022
    Assignee: Smart Wires Inc.
    Inventors: Haroon Inam, Ali Farahani
  • Patent number: 11469154
    Abstract: An IGBT module with a heat dissipation structure having a specific layer thickness ratio includes a layer of IGBT chips, an upper bonding layer, a circuit layer, an insulating layer, and a heat dissipation layer. The insulating layer is disposed on the heat dissipation layer, the circuit layer is disposed on the insulating layer, the upper bonding layer is disposed on the circuit layer, and the layer of IGBT chips is disposed on the upper bonding layer. A thickness of the insulating layer is less than 0.2 mm, a thickness of the circuit layer is between 1.5 mm and 3 mm, and a thickness ratio of the circuit layer to the insulating layer is greater than or equal to 7.5:1.
    Type: Grant
    Filed: January 17, 2021
    Date of Patent: October 11, 2022
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Shih-Hsi Tai, Tze-Yang Yeh
  • Patent number: 11449111
    Abstract: A microprocessor loading mechanism, comprising a bolster plate surrounding an aperture, wherein the opening is to receive a microprocessor socket, one or more torsion bars coupled to the bolster plate, and a stud coupled to each of the one or more torsion bars, wherein each stud is to receive a nut to secure a microprocessor package to the microprocessor socket within the aperture and wherein each stud is secured to the bolster plate by each corresponding torsion bar.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: September 20, 2022
    Assignee: Intel Corporation
    Inventors: Eric W. Buddrius, Ralph V. Miele, Mohanraj Prabhugoud, David Shia, Jeffory L. Smalley
  • Patent number: 11439048
    Abstract: An electronic component housing that internally houses an electronic component includes a portion formed of a resin material and a portion formed of a metallic material. The portion formed of the resin material is a connection side portion opposed to a member as a connection partner of the electronic component housing, or an opposite portion opposed to the connection side portion. The electronic component housing further includes an electromagnetic shield member that covers an outer surface of the portion formed of the resin material.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: September 6, 2022
    Assignee: Nissan Motor Co., Ltd.
    Inventor: Kimihiro Ono
  • Patent number: 11432422
    Abstract: An electrical device including a skeleton-like frame structure and at least one electrical module is provided. The skeleton-like frame structure has a low rigidity, while the at least one electrical module provides an increased rigidity when mounted.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: August 30, 2022
    Assignee: ROHDE & SCHWARZ GMBH & CO. KG
    Inventors: Stefan Aman, Johannes Steffens
  • Patent number: 11414553
    Abstract: A fouling-proof structure is applicable to synthetic leather or fabric and it includes an alcohol-resistant layer; and a water-based fouling-proof layer disposed on the alcohol-resistant layer, wherein the alcohol-resistant layer is formed by curing an alcohol-resistant combination, and the alcohol-resistant combination comprises polyurethane resin, wherein the water-based fouling-proof layer is formed by curing a water-based fouling-proof combination, and the water-based fouling-proof combination comprises polyurethane resin, water, polymerized siloxanes, water-based PTFE and silicone oil.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: August 16, 2022
    Assignee: JANTEC CORP.
    Inventors: Ching-Hsiang Chang, Kuo-Hsing Yeh, Chun-Chieh Wang
  • Patent number: 11410909
    Abstract: A fluid channel for a power semiconductor module includes a die carrier configured to carry a plurality of semiconductor dies on a first side, a plurality of cooling elements arranged on a second side of the die carrier opposite the first side, and a channel wall arranged opposite the second side of the die carrier and forming a cavity. The cooling elements are arranged in the cavity. The cooling elements are attached to the die carrier at attachment points. A majority of the attachment points are positioned vertically in alignment with positions of the semiconductor dies.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: August 9, 2022
    Assignee: Infineon Technologies AG
    Inventors: Christian Schweikert, Alexander Kospach, Sebastian Paul Hans Moeller, Benedikt Rabl
  • Patent number: 11376649
    Abstract: The present invention discloses a method for preparing an evaporator for reducing water condensing capacity and an evaporator. The preparation method comprises steps of: step A: selecting fins; step B: stacking; step C: arranging tubes; and, step D: expanding tubes. In accordance with the present invention, the existing fins and devices can be used to produce an evaporator in which the distance between two adjacent fins satisfies the requirements of the freezing operation, ensuring the normal operation of an air conditioner when the refrigeration temperature is below 0° C.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: July 5, 2022
    Assignee: Wuyi University
    Inventor: Min Wu
  • Patent number: 11380946
    Abstract: A coolant includes a refrigerant, a porous plate-shaped heat insulator, and an enclosure in which the refrigerant and the heat insulator are enclosed in a sealed state, and the heat insulator has a thermal conductivity per unit area of 300 W/(K·m2) or less and a thickness equal to or greater than 0.5 mm and equal to or less than 10.0 mm.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: July 5, 2022
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., AUTONETWORKS TECHNOLOGIES, LTD.
    Inventors: Koma Numata, Masatoshi Majima, Kazuki Okuno, Hiroki Hirai, Tetsuji Tanaka, Makoto Higashikozono, Junichi Ono
  • Patent number: 11370057
    Abstract: A friction welding machine for radiating fins is disclosed, which mainly uses a moving unit to drive a friction joint unit to approach the plurality of radiating fins, and a friction rod provided in the moving unit rotates at a high speed to penetrate the radiating fins. The radiating fins are then welded together through the heat generated by high-speed rotation friction to achieve the purpose of improving the welding quality of the radiating fins and reducing the cost.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: June 28, 2022
    Assignee: TIANLE INTERNATIONAL CO., LTD.
    Inventor: Li-Huang Hsu
  • Patent number: 11375607
    Abstract: The disclosed technology relates to a power supply circuit that utilizes a double-sided printed circuit board (PCB) that has a first surface and a second surface. The second surface is disposed opposite the first surface. Mounted on the first surface is a first power stage and a first inductor. Mounted on the second surface is a second power stage and a second inductor. The second power stage is disposed opposite the first power stage. The second inductor is disposed opposite the first inductor.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: June 28, 2022
    Assignee: APPLE INC.
    Inventors: Kejiu Zhang, Sunil M. Akre
  • Patent number: 11375639
    Abstract: A thermal management device includes a single contiguous component. The single contiguous component includes a first portion made of a first thermally conductive plastic, and a second portion extending away from the first portion. The second portion is made of a second thermally conductive plastic. The second thermally conductive plastic is different than the first thermally conductive plastic. The second portion has a greater hardness than the first portion.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: June 28, 2022
    Assignee: TCPOLY INC.
    Inventors: Thomas Lloyd Bougher, Matthew Kirby Smith
  • Patent number: 11369046
    Abstract: An electrical controller includes a housing, wherein the housing has cooling air openings on two different housing sides. A heat sink is arranged inside the housing, in particular so as to be protected against contact, and forms a cooling air channel, wherein the cooling air channel runs between the cooling air openings of the different housing sides. An electrically insulating holding element is designed to mechanically fix the heat sink inside the housing in a manner electrically insulated from the housing. A number of components to be cooled are provided, wherein the components are thermally conductively coupled to the heat sink and are held by the heat sink.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: June 21, 2022
    Assignee: Lenze Automation GmbH
    Inventors: Christof Schneggenburger, Bernhard Laeng, Alex Itten, Tobias Diefenbacher
  • Patent number: 11369047
    Abstract: A heat sink for use with a heat generating component such as an electronic power module comprises a first substrate having a serpentine slot, a second substrate secured to a first side of the first substrate to form a combined substrate, surfaces of the first and second substrates at least partially forming a serpentine passageway within the combined substrate for containing a fluid. The serpentine passageway has a non-circular cross-sectional shape.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: June 21, 2022
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Paul J. Grosskreuz, Jeffrey W. Dujmovic, Avijit Bhunia, Seongchul Jun
  • Patent number: 11355411
    Abstract: A heat sink including a heat sink body having a heat-absorbing surface that absorbs heat transferred from a heat-generating body, and a heat-dissipating surface that externally radiates the heat; a holding member that is held against the heat-absorbing surface; and a fixation portion that is provided on the heat sink body, that fixes the holding member so as to be incapable of coming loose from the heat sink body, and that suppresses displacement in a planar direction in which the heat-absorbing surface extends.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: June 7, 2022
    Assignee: NEC Platforms, Ltd.
    Inventor: Naoki Sakakibara
  • Patent number: 11355284
    Abstract: The invention relates to a cooling device for cooling a power component, the cooling device having a one-piece cooling housing with a base, a first end face, a second end face, a first lateral face, and a second lateral face, which define a receiving area for receiving the power component. The cooling device further includes an inlet for supplying a cooling medium, an outlet for discharging a cooling medium, a first cooling channel, a second cooling channel, a third cooling channel, and a fourth cooling channel. The first cooling channel is arranged on the first end face, the second cooling channel is arranged on the second end face, the third cooling channel is arranged on the first lateral face, the fourth cooling channel is arranged on the second lateral face, and the first and the second cooling channel are each fluidically connected to the third and fourth cooling channel.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: June 7, 2022
    Assignee: Robert Bosch GmbH
    Inventors: Wolfram Kienle, Alexandre Lehr
  • Patent number: 11348856
    Abstract: A memory sub-system can include multiple memory devices and a thermal cooling element. The thermal cooling element includes a bottom surface that is coupled to a top surface of each of the memory devices. Furthermore, the thermal cooling element further has a top surface that includes a protrusions that extend above the top surface of the thermal cooling element to dissipate heat that is generated from the memory devices.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: May 31, 2022
    Assignee: Micron Technology, Inc.
    Inventor: Rolf Thornton Munson
  • Patent number: 11343945
    Abstract: A combined liquid and air cooling system is provided over a printed circuit board (PCB) of an electronic device, where the PCB includes an integrated circuit package including an application specific integrated circuit (ASIC) die and a plurality of high bandwidth memory (HBM) modules located proximate the ASIC die, and the combined liquid and air cooling system includes a liquid cooling system located over the integrated circuit package and an air cooling system integrated with the liquid cooling system and a portion of the PCB. The system operates in a normal mode, where both liquid and air cooling systems provide cooling to components of the PCB, and a fail-safe mode, where the liquid cooling system is not operating (e.g., due to a detected condition) but the air cooling system operation is adjusted such that it provides sufficient cooling to PCB components which facilitates continuous operation of the electronic device.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: May 24, 2022
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: M. Baris Dogruoz, Joel Goergen
  • Patent number: 11343940
    Abstract: A cold plate that is configurable and for a datacenter liquid cooling system is disclosed. The cold plate includes a first section, a second section, and an intermediate layer, which is changeable and has first channels to enable flow of a coolant through the intermediate layer, and has second channels or at least one adapted second channel to concentrate the coolant or the flow of the coolant to at least one area within the configurable cold plate corresponding to at least a heat generating feature of an associated computing device.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: May 24, 2022
    Assignee: NVIDIA CORPORATION
    Inventor: Ali Heydari
  • Patent number: 11335964
    Abstract: A cold plate for a battery module comprising a plurality of cells that produces heat as charging and discharging is disclosed. The cold plate includes a plurality of first fins distributed in a first subarea of the cold plate; and a plurality of second fins distributed in a second subarea of the cold plate; wherein a second fin coverage of the plurality of second fins distributed in the second subarea is smaller than a first fin coverage of the plurality of first fins distributed in the first subarea when an amount of heat absorption of the second subarea from the plurality of cells is greater than an amount of heat absorption of the first subarea from the plurality of cells.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: May 17, 2022
    Assignee: National Chung-Shan Institute of Science and Technology
    Inventors: Fu-Min Fang, Kuo-Kuang Jen, Gwo-Huei You, Kuo-An Liang
  • Patent number: 11337299
    Abstract: An electronic assembly has a printed circuit board with first and second component sides. A cooling element on the first component side is cooled by forced convection produced by a convection unit. A majority of electronic components are arranged on the second component side. Non-current-conducting plated-through holes are used to transport thermal energy generated by an electronic component from the second component side to the first component side. The thermal energy can be transported away from the printed circuit board and dissipated by means of the forced convection. A corresponding method for dissipating heat from an electronic assembly is also disclosed.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: May 17, 2022
    Assignee: Siemens Aktiengesellschaft
    Inventors: Fabian Diepold, Alexander Kiesel, Benno Weis, Johannes Fürst
  • Patent number: 11328975
    Abstract: A semiconductor device including a substrate, a semiconductor package, a plurality of pillars and a lid is provided. The semiconductor package is disposed on the substrate and includes at least one semiconductor die. The plurality of pillars are disposed on the semiconductor package. The lid is disposed on the substrate and covers the semiconductor package and the plurality of pillars. The lid includes an inflow channel and an outflow channel to allow a coolant to flow into and out of a space between the substrate, the semiconductor package, the plurality of pillars and the lid. An inner surface of the lid, which faces and overlaps the plurality of pillars along a stacking direction of the semiconductor package and the lid, is a flat surface.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: May 10, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin
  • Patent number: 11326837
    Abstract: A heat exchanger adapted to support a plurality of battery cells on the outer surface thereof is disclosed. The heat exchanger includes first and second plates disposed in opposed, facing relation to one another such that portions of the inner surface of the first and second plates are spaced apart from one another. A manifold region is enclosed between the first and second plates for receiving an incoming heat transfer fluid. A main fluid flow region is enclosed between the first and second plates and is configured for receiving heat transfer fluid discharged from the manifold region and transmitting the heat transfer fluid through the heat exchanger to an outlet port. At least one bypass port for establishing fluid communication between the manifold region and the main fluid flow region is disposed at a location within the manifold region that is upstream of the manifold region outlet end.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: May 10, 2022
    Assignee: Dana Canada Corporation
    Inventors: Farbod Vakilimoghaddam, Jiang Feng Yu
  • Patent number: 11320876
    Abstract: A portable information handling system housing has a handle to aid an end user in carrying of the system. A heat pipe loop passes through the handle and couples to a processing component heat sink to transfer excess thermal energy from within the housing to the handle for rejection to the ambient environment. Thermal wax disposed in the handle stores energy with a phase change from a solid to a liquid state. A color indicator disposed on the handle provides an end user with an indication of a temperature of the handle.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: May 3, 2022
    Assignee: Dell Products L.P.
    Inventors: Travis C. North, Jace W. Files, John Trevor Morrison
  • Patent number: 11317537
    Abstract: An electronic device includes a body having a receiving housing and an opening, a function module disposed in the receiving housing, a transmission module configured to transmit a signal between a first end of the transmission module and a second end of the transmission module, and a heat dissipation module disposed along the transmission module. The first end of the transmission module is located in the receiving housing, and the second end of the transmission module is located outside the receiving housing. The heat dissipation module is configured to transfer heat generated by the function module to the second end of the transmission module.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: April 26, 2022
    Assignee: LENOVO (BEIJING) CO., LTD.
    Inventor: Fuxing Ma
  • Patent number: 11316439
    Abstract: An inverter has at least three phases for supplying current to an electrical machine. The inverter also has a control unit and at least one power output stage connected to the control unit on an input side. The control unit is configured to generate pulse-width-modulated control signals for activating the power output stage. The inverter further has a heat sink and, for each phase, an intermediate circuit capacitor and a semiconductor switch half bridge. The heat sink has a flat thermal contact surface. The thermal contact surface is connected in a thermally conductive manner to the control unit and to the semiconductor switch half bridges. The heat sink has a recess for each of the intermediate circuit capacitors, and the intermediate circuit capacitors are each arranged in one of the recesses in the heat sink.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: April 26, 2022
    Assignee: Robert Bosch GmbH
    Inventors: Stephan Binhack, Jochen Kurfiss
  • Patent number: 11306980
    Abstract: A heat sink includes a bottom plate, a liquid barrier structure and a microstructure used for heat dissipation. The liquid barrier wall is arranged on the bottom plate. The liquid barrier wall is closed on the bottom plate to form a container. The microstructure for heat dissipation is arranged in the container and includes porous materials or 3D-structures with small sizes.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: April 19, 2022
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Kai-Yang Tung, Hung-Ju Chen
  • Patent number: 11310937
    Abstract: Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: April 19, 2022
    Assignee: Google LLC
    Inventors: Jeremy Rice, Jeffrey Scott Spaulding, Evan Fraisse