Abstract: A water cooling module includes a flow-guiding main body and a pump set. The flow-guiding main body includes a first inlet, a first outlet and a flow-guiding passage set. The flow-guiding passage set includes a plurality of flow-guiding passages, and the first inlet and the first outlet are respectively communicable with one of the flow-guiding passages. The pump set includes a first pump having a first water inlet and a first water outlet, and a second pump having a second water inlet and a second water outlet. The first water inlet and the first water outlet are respectively communicable with one of the flow-guiding passages; the second water inlet and the second water outlet are also respectively communicable with one of the flow-guiding passages.

Abstract: A display system of a vehicle includes a display device disposed in the vehicle and operable to display heads up information for viewing by a driver of the vehicle. The display device includes a mirror, a display screen and a cooling device. The mirror is pivotally mounted at a base plate and is pivotable via a pin of a mounting arm of the mirror moving along a spiral groove of a gear element when the gear element is rotated. The pin is urged towards a side wall of the spiral groove to limit play of the mirror relative to the base plate.

Abstract: A heat exchanger and battery unit structure is provided for cooling battery units (or cells) where the thermally conductive nature of the battery forms a cooling path. The heat exchanger is in the form of a cooling element provided with an engaging device formed on or attached to an outer surface of the cooling plate for receiving a battery unit (or cell). The interconnection between the battery unit (or cell) and heat exchanger creates a mechanical interlock between the two components that results in improved heat transfer properties between the two components.

Abstract: Receptacle assembly includes a receptacle cage and a thermal-transfer module that is coupled to a thermal side of the receptacle cage. The thermal-transfer module has a base portion and a plurality of heat-transfer fins coupled to the base portion. The thermal-transfer module is configured to absorb thermal energy from a pluggable transceiver in the receptacle cage and transfer the thermal energy through the base portion and to the heat-transfer fins. The receptacle assembly also includes a retention clip configured to hold the thermal-transfer module to the receptacle cage. The retention clip includes a resilient beam that extends across the thermal-transfer module. The resilient beam directly engages at least some of the heat-transfer fins and applies a resilient force against the heat-transfer fins.

Abstract: An apparatus includes a top wall and a bottom wall. The top wall and the bottom wall define and enclose a first fin area; a second fin area; and a flex region joining the first fin area to the second fin area. The flex region is connected in fluid communication with the interior of the first fin area and the interior of the second fin area. The flex region is bent or twisted at a nonzero angle around at least one axis relative to the broadest surfaces of the first and second fin areas.

Abstract: An electronic control unit includes a substrate, a plurality of electronic components, and a heat sink. The plurality of electronic components are mounted on the substrate, and include an integrated circuit and a plurality of tall components. The plurality of tall components are taller than the integrated circuit. The heat sink includes a recess collectively accommodating the plurality of tall components, and is provided on a side on which the plurality of tall components are mounted on the substrate.

Abstract: CMC components having microchannels and methods for forming microchannels in CMC components are provided. For example, a method for forming microchannels in a CMC component comprises laying up a plurality of body plies for forming a body of the CMC component; laying up a microchannel ply on the plurality of body plies that has at least one void therein for forming at least one microchannel; laying up a cover ply on the microchannel ply to define an outer layer of the CMC component; and processing the laid up body plies, microchannel ply, and cover ply to form the CMC component. In another embodiment, the method comprises applying an additive matrix to the body plies to define at least one microchannel. In still other embodiments, the method comprises machining at least one microchannel in the plurality of body plies.

Abstract: A light weight component, the light weight component including: a metallic foam core formed into a desired configuration; an external metallic shell applied to an exterior surface of the metallic foam core after it has been formed into the desired configuration; an inlet opening and an outlet opening formed in the external metallic shell in order to provide a fluid path through the metallic foam core; and a thermoplastic material injected into the metallic foam core via the inlet opening.

Abstract: A counter-current cross-flow heat exchanger for heating a first gas and cooling a second gas, includes modules in fluid communication with one another, each module being positioned on a plane, the planes mutually overlapping. Conduits allow entry and exit of the first and second gases into and out of the exchanger. Each module has heat exchange plates, with heating and cooling faces. The plates are orthogonal to the module plane and parallel to define alternating heating and cooling spaces. The first gas crosses each heating space with a direction substantially parallel to the plane of each module and the second gas crosses each cooling space with a direction substantially orthogonal to the plane of each module. The cooling spaces between adjacent modules are in direct fluid communication. The heating spaces between adjacent modules are in fluid communication with one another by conduits/conveyors, creating a serpentine path.

Abstract: A connector housing includes a housing body having a socket adapted to receive an external electronic module inserted in an insertion direction and a shielding sheet having a first elastic sheet disposed on an inner side of the housing body, a second elastic sheet disposed on an outer side of the housing body, and a first bent portion connected between the first elastic sheet and the second elastic sheet and adapted to be clamped on an edge of the socket. The housing body has an outer wall with a mounting passageway. A free end of the first elastic sheet and/or the second elastic sheet has a pair of lap portions on a pair of sides parallel to the insertion direction. The free end of the first elastic sheet and/or the second elastic sheet is slidably engaged with the mounting passageway in the insertion direction.

Abstract: An apparatus includes a coldplate configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The coldplate includes (i) first and second outer layers having at least one first material and (ii) a third layer embedded in the outer layers and having at least one second material. The first and second materials have different coefficients of thermal expansion (CTEs). The third layer is embedded non-uniformly in the outer layers so that different zones of the coldplate have different local CTEs. The third layer may include openings extending through the second material(s), and projections of the first material(s) from at least one of the first and second outer layers may partially or completely fill the openings. The first and second outer layers may include aluminum or an aluminum alloy, and the third layer may include aluminum silicon carbide or thermal pyrolytic graphite.

Abstract: A heat sink comprising a heat exchange device having a large scale morphology over a scale range and a small scale texture over a scale range, wherein at least one of the large scale morphology and the small scale texture has a fractal-like self-similarity over a scale range. The large scale morphology and small scale texture may be independently defined and implemented, or be provided with a transitional range. The large scale morphology may be algorithmically optimized according to a set of geometrically constraints. The small scale texture may be optimized according to aerodynamic parameters and constraints. The heat sink may be dynamically varying, and/or operated in conjunction with a dynamically varying heat transfer medium supply.

Abstract: A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.

Abstract: Provided is an electronic device including a metal plate that is exposed on at least one of a plurality of side surfaces of the electronic device so as to absorb heat from a heat generating component that generates heat inside the electronic device and guide the heat to an outside of the electronic device. In addition, an outer surface of the metal plate exposed to the outside is formed further inside the electronic device than a first member and a second member.

Abstract: A solid thermal balancing composite material with lightweight is formed by a reinforced composite material pressured by a molding machine after going through a powder filling equipment. The reinforced composite material is a mixture of inorganic filler powders and polymer adhesives after granulation. The specific gravity of the solid thermal balancing composite material is no greater than 2.0. In addition, the present invention is adjustable in different shapes for various applications of heat dissipation.

Abstract: A device for cooling an electrical energy storage unit includes at least one tube exchanger and one plate exchanger, the tube exchanger and the plate exchanger being in fluid communication such as to form a circuit for circulation of a cooling fluid.

Abstract: A heat sink may include a base having a first surface in a first plane configured to contact a system on chip (SoC) located on a circuit board. The heat sink may include a plurality of heat transfer members connected to and extending from the base. The plurality of heat transfer members are configured to extend along a longitudinal length in a second plane having a first spacing from the first plane. The plurality of heat transfer members respectively include opposing internal walls that define a second spacing between the plurality of heat transfer members. The heat sink may include an enclosure surrounding the plurality of heat transfer members. The enclosure may include a base plate that contacts the base of the heat sink to form a cold-plate. The enclosure may partially surround the length of the heat transfer members, allowing airflow through the enclosure in a cross direction.

Abstract: In an embodiment, a device includes: an integrated circuit die; a redistribution structure over a front-side surface of the integrated circuit die; a socket over the redistribution structure; a mechanical brace over the socket, the mechanical brace having an opening exposing the socket, edge regions of the socket overlapping edge regions of the mechanical brace at the opening; a first standoff screw disposed in the edge regions of the mechanical brace, the first standoff screw physically contacting the socket, the first standoff screw extending a first distance between the socket and the mechanical brace; and a bolt extending through the mechanical brace and the redistribution structure.

Abstract: An aluminum alloy fin material for a heat exchanger in the present invention comprises an aluminum alloy having a composition containing Mn: 1.2 to 2.0%, Cu: 0.05 to 0.20%, Si: 0.5 to 1.30%, Fe: 0.05 to 0.5%, and Zn: 1.0 to 3.0% by mass and a remainder comprising Al and an unavoidable impurity, further containing one or two or more of Ti: 0.01 to 0.20%, Cr: 0.01 to 0.20% and Mg: 0.01 to 0.20% by mass as desired, and, after heating in brazing, has a tensile strength of 140 MPa or more, a proof stress of 50 MPa or more, an electrical conductivity of 42% IACS or more, an average grain diameter of 150 ?m or more and less than 700 ?m, and a potential of ?800 mV or more and ?720 mV or less.

Abstract: A rotating electric machine includes a rotor, a stator, a housing, a plurality of control modules and a joining member. The stator includes a stator coil. The housing accommodates both the rotor and the stator therein. The control modules are capable of supplying multi-phase alternating current to the stator coil and rectifying multi-phase alternating current generated in the stator coil into direct current. The control modules include a first control module and a second control module that are arranged adjacent to each other. The first and second control modules are joined, by the joining member, to be in surface contact with each other.

Abstract: A pluggable module assembly includes a housing having a top wall, a bottom wall and sidewalls between the top wall and the bottom wall forming a cavity configured to hold an electrical component therein. The top wall has an opening above the cavity aligned with the electrical component receiving a thermal transfer device that is separate and discrete from the housing. The thermal transfer device transmits heat from the electrical component to fins separated by channels at an upper thermal interface. The upper thermal interface is exposed from above the housing for interfacing with an external heat sink for transferring heat from the thermal transfer device.

Abstract: An electronic device according to various embodiments of the present disclosure may include: a printed circuit board including one face; at least one electronic component mounted on the printed circuit board; and a conductive shield can structure attached to the one face of the printed circuit board while surrounding the at least one electronic component.

Abstract: A data storage device includes a heat source including a memory, and an enclosure within which the heat source is installed. The data storage device also includes a heat spreader within the enclosure and surrounding the heat source. The data storage device further includes a thermal interface material within the enclosure. The thermal interface material is coupled to the heat source and to the heat spreader, thereby providing a first low thermal resistance path between the heat source and the heat spreader. A phase change material is coupled to the thermal interface material such that the thermal interface material provides a second low thermal resistance path between the heat source and the phase change material.

Abstract: This disclosure relates to an external liquid cooling device including at least one radiator, at least one airflow generator, a water block and a mount head module. The at least one airflow generator and the water block are respectively disposed at two adjacent sides of the at least one radiator. The mount head module includes two connectors which are respectively connected to the at least one radiator and the water block via piping. The mount head module and the water block are respectively located at two opposite sides of the at least one radiator.

Abstract: A method for cooling power electronics circuits, in which a printed circuit board is produced according to a prescribed circuit board process and is populated with at least one power electronics components. Contact connecting at least one location on at least one metallic conductor track running on a surface of the printed circuit board that includes at least one metal element, which is both electrically conductive and heat-conductive and the physical height of which is designed to be at least as large as that of the at least one power electronics component. A cooling plate is placed in a planar manner onto the at least one power electronics component and/or the at least one metal element.

Abstract: Thermal coupling with between an electrical component, such as a CPU, and a heatsink can be provided by a movable heatsink insert separate from the heatsink. This movable heatsink insert can be placed on the electrical component. The heatsink can be thermally coupled to that additional thermal conductor. The heatsink, which is attached to the printed circuit board, is not in direct contact with the electrical component, reducing the likelihood that the heatsink could cause bending of the printed circuit board by pressing down on the electrical component. Further, a spring coupled between the heatsink and the movable heatsink insert can provide further pressure relief such that the heatsink assembly can be attached to an electrical component without applying excessive force to the electrical component.

Abstract: A semiconductor die assembly in accordance with an embodiment of the present technology includes a first semiconductor die, a package substrate underlying the first semiconductor die, an interposer between the package substrate and the first semiconductor die, and a second semiconductor die between the package substrate and the interposer. The semiconductor die assembly further comprises a heat spreader including a cap thermally coupled to the first semiconductor die at a first elevation, and a pillar thermally coupled to the second semiconductor die at a second elevation different than the first elevation. The heat spreader is configured to transfer heat away from the first and second semiconductor dies via the cap and the pillar, respectively. The interposer extends around at least 75% of a perimeter of the pillar in a plane between the first and second elevations.

Abstract: An electronic display assembly is provided. The electronic display assembly comprises a backlight module, a transparent plate, a liquid crystal panel, an internal heat exchange path and an external heat dissipation path with ambient air flowing through. The liquid crystal panel is disposed between the transparent plate and the backlight module. The internal heat exchange path comprises a first pathway, a second pathway and a third pathway. The first pathway is arranged between the transparent plate and the liquid crystal panel. The second pathway is arranged between the liquid crystal panel and backlight module. The third pathway is located directly behind the backlight module. The external heat dissipation path carries heat conducted from air flowing through the third pathway.

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

Abstract: A cooling device of a heating element for an immersion type liquid cooling server, and a manufacturing method for the cooling device. The cooling device comprises: a metal substrate provided on the heating element and covering same. The metal substrate is adjacent to the surface of the heating element. The surface of the metal substrate distant to the heating element comprises a porous metal covering layer located above the heating element and covering same. The porous metal covering layer is exposed on the surface of the metal substrate remote from the heating element and has a thickness of less than 3 mm. By providing a metal substrate having a porous metal covering layer on the surface of a heating element, vaporization cores are improved, the boiling performance of the heating element is improved, and an efficient heat-dissipating effect on the surface of the heating element is achieved.

Abstract: A circuit board structure includes a circuit board, at least a through hole, and at least a heat dissipating structure. The circuit board has two opposite surfaces. A metal layer is disposed on each of the opposite surfaces of the circuit board. The through hole is disposed in the circuit board, and the through hole penetrates through the circuit board. The heat dissipating structure is disposed in the through hole. The heat dissipating structure includes a first metal block and a second metal block. The first metal block and the second metal block are joined together in the through hole and have an interface.

Abstract: Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.

Abstract: A semiconductor package includes a substrate having at least one semiconductor chip on a top surface of the substrate; a ground ring, on the top surface of the substrate, surrounding the at least one semiconductor chip; a metal-post reinforced glue wall disposed on the ground ring, surrounding the at least one semiconductor chip; a molding compound surrounding the at least one semiconductor chip, wherein a rear surface of the at least one semiconductor chip is flush with an upper surface of the molding compound; a conductive layer disposed on the molding compound and in direct contact with the rear surface of the semiconductor chip and the metal-post reinforced glue wall; a solder layer disposed on the conductive layer; and a heat sink disposed on the solder layer.

Abstract: The present invention relates to a heat-sink base provided with heat-sink fin portions, it manufacturing method and a motor provided with the heat-sink base. The base is produced by pouring cast metal into a mold cavity to replace a pattern having a predetermined sublimation temperature. The base includes a preformed heat-sink member comprising a plurality of heat-sink fin portions and at least one anchor portion embedded at least partially in the pattern, and a base body comprising an enclosed base portion and a holder portion for receiving and holding the at least one anchor portion. By virtue of the invented method, the heat-sink member having an extremely thin thickness can be mounted on the base body and the overall surface area of the heat-sink base is increased considerably.

Abstract: A heat sink includes an extruded component, a cast component, and an interface layer. The extruded component includes a first aluminum material and is configured to be coupled to a solid state light source. The cast component includes a second aluminum material overmolded onto a portion of the extruded component to form the interface layer. The interface layer is formed of at least one of the first and the second aluminum materials and abuts against and couples the extruded component to the cast component.

Abstract: The invention relates to an electric motor having a stator and an electronics compartment which receives electric/electronic structural parts. Said electric motor is accommodated in an electronics housing and can be closed by a housing cover. In order to maintain leakage paths and/or air paths between the housing cover and the electric/electronic structural parts, the electric motor has an intermediate insulating part (1) which is made of an electrically insulating plastic and has a supporting part as hard component and at least one soft component as sealing part (14, 25). The soft component is connected cohesively and/or by positive engagement to the hard component. The intermediate insulating part (1) has at least one pressing element (33) by which at least one heat-generating structural part is pressed against a cooling surface. The intermediate insulating part (1) has a hood-shaped support which is made of a hard, electrically insulating plastic.

Abstract: A wireless communications device with a first housing including an LTE modem and a plurality of LTE antennas and a second housing including a battery system and network communications assembly, the first housing and second housing pivotally joined via a hinge assembly permitting movement of the device between a closed and one or more open positions.

Abstract: A system includes a coolant reservoir, a coolant pump, and a heat exchanger. The coolant reservoir is at least in part included in a data center rack and configured to hold a coolant. The coolant pump is configured to pump the coolant to a manifold configured to distribute the coolant to a plurality of different rack mounted devices. The heat exchanger is configured to cool the coolant via an ambient air of a data center.

Abstract: An apparatus for exchanging heat with a fluid includes a heat exchanger having first and second opposing surfaces and a plurality of flow passages permitting axial fluid flow between the surfaces. A manifold having an interface surface is in thermal contact with the first surface and includes a thermally conductive body for conducting heat in an axial direction between the interface surface and a heat transmitting surface. A plurality of feed passages extend through the thermally conductive body in a transverse direction, the passages having an inlet for receiving or discharging fluid. A plurality of distribution passages have ends in fluid communication with at least one of the feed passages and openings distributed over the interface surface. The distribution passages are configured to cause a change in fluid flow direction between a transversely directed flow in the feed passages and an axially directed flow at the openings.

Abstract: A cage assembly comprises a cage folded from a single flat plate and an electromagnetic shielding elastic sheet assembled onto a plurality of walls of an insertion port of the cage. The electromagnetic shielding elastic sheet is configured to be pre-assembled onto a front end of the flat plate before the flat plate is folded.

Abstract: Thermal thermally conductive interfaces are used in electronic devices for heat transfer between, for example, the mating heat transfer surfaces of a heat-generating, electronic component, such as an integrated circuit (IC) chip, and a thermal dissipation member, such as a heat sink or spreader, for the conductive cooling of the electronic component. The thermally conductive interface includes a heat spreading material formed of a flexible, lamellar graphite material having a plurality of coarse perforations therein; and a coating of a thermally-conductive phase change material joined to the surface of the graphite material.

Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.

Abstract: A miter saw includes a base assembly and a saw unit pivotably coupled to the base assembly. The saw unit includes a saw arm, a brushless motor supported by the saw arm, and power electronics positioned outside the motor for supplying power to the motor. The power electronics are coupled to a structural component of the miter saw to utilize the entire mass of the structural component as a heat sink to dissipate heat generated by the power electronics.

Abstract: A semiconductor package system comprises a semiconductor package and a cap. The semiconductor package comprises a die pad, a chip mounted or arranged to a first main face of the die pad and an encapsulation body encapsulating the chip and the die pad. The cap covers at least partly an exposed second main face of the die pad. The cap comprises a cap body of an electrically insulating and thermally conductive material and a fastening system fastening the cap to the semiconductor package. The fastening system extends from the cap body towards the encapsulation body or along a side surface of the semiconductor package.

Abstract: A luminaire with a heat sink (1), which heat sink is formed by one integral piece of cold forged aluminum, comprising an essentially flat base portion (2), having a base surface with a center (2a) and an outer periphery (2b) and a set of heat dissipating fins (3, 4) extending from a first side of the base surface, in a direction normal to the base surface. The set includes at least one radial heat dissipating fin (3) having a cross section in a plane parallel to the base surface which cross section extends substantially in a radial direction from the center (2a) towards the outer periphery (2b), and at least one peripheral heat dissipating fin (4) having a cross section in a plane parallel to the base surface which cross section includes a portion extending in a direction parallel to the outer periphery (2b), wherein the peripheral heat dissipating fins (4) are arranged radially outside the radial heat dissipating fins (3).

Abstract: A locating unit with a base seat locating structure. The base seat locating structure includes a base seat and a locating unit. The base seat has a pair of locating holes each having a first locating hole section and a second locating hole section and a connection section connected therebetween. The second locating hole section has a locating recess. The locating unit has a main body having a first side and a second side and a through hole passing through the main body between the first and second sides. A first protruding key and a second protruding key protrude from the second side beside the through hole. The first and second protruding keys are displaceably assembled and connected with the locating holes. Free ends of the first and second protruding keys respectively have a first end section and a second end section connected and assembled with the locating recesses.

Abstract: A heat exchanger includes a pair of opposed, spaced apart heat exchanger plates defining a heat exchanger volume therebetween having an inlet and opposed outlet. A plurality of heat exchanger ribs are included within the heat exchanger volume. Each rib defines a rib body spanning the heat exchanger volume. Each rib body includes a plurality of slits therethrough to define a flow path through the heat exchanger ribs from the inlet to the outlet of the heat exchanger volume. The ribs and slits can be formed using ultrasonic additive manufacturing (UAM), for example.

Abstract: A pump driven liquid cooling device with tower fins is disclosed. The device includes a thermal interface component configured to be coupled to an electronic component to be cooled via the thermal interface component. The device further includes at least one coolant pipe coupled to the thermal interface component. The device includes a local heat exchanger coupled to the at least one coolant pipe and comprising a plurality of stacked horizontal fins. The device includes a local coolant pump configured to pump a liquid coolant through the at least one coolant pipe in a local closed loop.

Abstract: Various embodiments of the present disclosure provide a heat sink for a plug-in storage card and a plug-in storage card including the heat sink. The heat sink comprises a first part secured to a surface of the plug-in storage card and a second part coupled to the first part and being movable relative to the first part in a first direction, wherein the first direction is perpendicular to the surface of the plug-in storage card. In this way, when the second part and the first part have a larger overlap in the first direction, the heat sink has a smaller first height and when the second part and the first part have a smaller overlap in the first direction, the heat sink has a greater second height.

Abstract: A device and/or methodology are described that include a mechanism for separating erythrocytes from other constituents of blood and for purifying leukocytes from blood. The separation and purification aspects may be provided in separate components or within the same component. The separation aspect assists in separating erythrocytes (red blood cells) from other cells in blood, such as by aggregation of the red blood cells. A suitable aggregation device or device component uses chambers with at least one small dimension (e.g., a microfluidic chip) to control the interaction of the blood with a solution containing a high molecular weight polymer (e.g., dextran) to achieve separation.