Abstract: A liquid cooling device for cooling at least one target component includes a base member configured to be in thermal contact with the at least one target component to be cooled by the liquid cooling device. The base member defines a plurality of pockets spaced apart from one another. A plurality of cover members are connected to the base member and are at least partially received in a corresponding pocket. Each cover member has a fluid inlet and outlet. The cover and base members define together a plurality of fluid conduits that are independent from one another. Each fluid conduit is defined between a cover member and the base member such that a number of the fluid conduits is equal to a number of the cover members. Each fluid conduit respectively receives and discharges fluid through the fluid inlet and the fluid outlet of the corresponding cover member.

Abstract: An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation.

Abstract: A power electronics unit, a vapor compression system incorporating the power electronics unit, and a method of cooling a power electronics unit are provided. The power electronics unit includes a semiconductor portion and an inductor portion. Approximately 80% of the heat generated by the power electronics unit may be derived from the semiconductor portion. Approximately 20% of the heat generated by the power electronics unit may be derived from the inductor portion. The semiconductor portion is cooled using at least one fan. The inductor portion is cooled using a working fluid (e.g., a refrigerant). The working fluid may be provided from upstream of the evaporator in the vapor compression system. Limiting the use working fluid to only cool the inductor portion of the power electronics unit may minimize the impact of the power electronics unit on the vapor compression system.

Abstract: A pushing action and a suction action are simultaneously performed on a working fluid passing through a heat transfer base, such that a heat exchange of cooling water can be efficiently performed, according to one embodiment of the present invention.

Abstract: Provided is a plasma processing apparatus capable of obtaining desired etch profiles and preventing the degradation of yield rates due to the adhesion of particles, and equipped with a processing chamber in which a sample is plasma-treated; a radio-frequency power source for supplying radio-frequency power used to generate plasma; a sample stage which is provided with electrodes for electrostatically adsorbing the sample and on which the sample is mounted; and a DC power supply for applying DC voltages to the electrodes, the apparatus being further equipped with a control apparatus for controlling the DC power supply so as to apply such DC voltages as to decrease the absolute value of the potential of the sample in the absence of the plasma.

Abstract: An information handling system has a docking station that is coupled to a host. The host includes a system fan and a host sensor that is configured to detect a physical location of the docking station and to measure an acoustic sound level of the system fan. The host further selects a mode of operation for the docking station. Based on the selected mode of operation, the detected physical location, and the measured acoustic sound level, the host dynamically adjusts operations of the docking station.

Abstract: An apparatus for conducting heat, including a substrate for receiving one or more electric components and a thermal substance circulation system. The substrate includes a first interface for receiving a first part of the thermal substance circulation system and a second interface for receiving a second part of the thermal substance circulation system such that the substrate is, when in use, in contact with the thermal substance of the circulation system between the first and the second interface. The substrate is heat conductive for transferring heat between the one or more electric components and the thermal substance of the circulation system.

Abstract: In accordance with one aspect of the present invention, a driver assist system for a vehicle includes a housing and a camera extending from the housing. A data processing circuit is mounted within the housing for processing and analyzing image data provided by the camera. A fluid filled heat sink transfers heat from the data processing circuit to the environment for cooling the data processing circuit.

Abstract: A liquid cooling device includes a water tank structure having parallel and separated first and second water tanks. The heat dissipation structure is installed between the first and second water tanks and the three are coupled to each other to form a curved cooling water passage. A mounting portion is formed in the gap between the heat dissipation structure and the first and second water tanks in the extension direction of the heat dissipation structure and the first and second water tanks. Both of the pumping structure and the endothermic structure are coupled to the first and second water tanks. The pumping structure and the endothermic structure are installed in at least one mounting portion and the pumping structure drives a working fluid to flow back and forth between the first water tank, the heat dissipation structure and the second water tank in the curved cooling water passage sequentially.

Abstract: A holder for connecting a rack manifold of an electronic rack and a room manifold of a data center room to provide liquid cooling to the electronic rack includes an L-shaped frame with a first arm having a first end and a second end, and a second arm extending from the second end of the first arm and substantially perpendicular to the first arm. The holder additionally includes a pivot point to be coupled to a pivot connector on a panel to pivotally move the L-shaped frame between a first position and a second position. The holder further includes a first blind-mate connector disposed on the L-shaped frame to be coupled to a second blind-mate connector at an engagement interface. The first blind-mate connector and the second blind-mate connector are coupled in response to the L-shaped frame moving to the second position in response to contact with the electronic rack.

Abstract: Conditioning systems and methods for providing cooling to a heat load can include an evaporative cooler arranged in a scavenger plenum with a recovery coil downstream of the evaporative cooler. The conditioning systems can operate in various modes, including an adiabatic mode and an evaporative mode, and a blended mode between the adiabatic mode and the evaporative mode, depending on environmental conditions. The blended mode can be enabled by a fluid transmission and retention device fluidically connected to the inlet and outlet of the evaporative cooler, the recovery coil outlet, and the heat load. The fluid transmission and retention device can variably distribute the cooling fluid exiting the recovery coil and the cooling fluid exiting the evaporative cooler to one or both of the heat load and the evaporative cooler inlet. In an example, the fluid transmission and retention device includes a manifold. In another example, the fluid transmission and retention device includes one or more tanks.

Abstract: The invention relates to an assembly of two housings, a first housing comprising a first cooling circuit portion and a second housing comprising a second cooling circuit portion, said of this cooling circuit portions being configured to form a cooling circuit with a fluid, each housing comprising a flat face comprising an opening of a respective cooling circuit portion and defining an interface of said cooling circuit, said cooling circuit portions being configured to be fluidically connected by plane-plane contact between said flat faces, said openings being arranged substantially opposite each other.

Abstract: A turbocharger device includes a case having a turbine portion and a bearing portion connected to and extending from the turbine portion. The turbine portion defines a cavity that houses a turbine wheel and receives exhaust gas that rotates the turbine wheel. The bearing portion houses a shaft connected to the turbine wheel. The bearing portion has a radial thickness between an exterior surface and an interior surface. The interior surface defines a central channel. The bearing portion holds a bearing system that supports the shaft within the central channel. The bearing portion includes a lattice structure within the radial thickness. The lattice structure is a repeating three-dimensional array of frame segments connected to one another at junctions. The lattice structure engages a turbine back wall that is located between the turbine portion and the bearing portion. The lattice structure defines interstitial spaces between the frame segments.

Abstract: A power conversion device includes a cooling structure capable of cooling down, by a coolant that flows through a first flow channel formed by a first wall portion and a second wall portion facing with each other, a first electronic component and a second electronic component mounted on an external surface of the first wall portion. The first wall portion is formed in a stepwise shape, and includes a first mount portion on which the first electronic component is mounted, a second mount portion which has a different height from the first mount portion, and on which the second electronic component is mounted, and a first connection portion that is extended between the first mount portion and the second mount portion.

Abstract: The thermal containment system generally includes an enclosure, a vertical enclosure, a cable management system, integrated cooling unit, a plurality of quick connect couples for the cooling unit, a plurality of VFD fans, a plurality of recessed wheels, a plurality of wireless sensors and a quick lock system for securing the thermal containment system. The thermal containment system may be employed to control air flow in the data center, isolating hot air expelled by a plurality of computer systems therein and conditioning the hot air with integrated cooling units that may be connected to a closed loop geothermal cooling system. The wireless sensors may be employed to collect data for a data center infrastructure management (DCIM) system that may monitor and manage elements of the thermal containment system.

Abstract: A probing device includes a chuck configured to support a device under test (DUT); and a manipulator or probe card disposed above the chuck and including a plurality of probes protruding from the manipulator towards the chuck, wherein the chuck includes a roughened surface and vacuum suction holes for placement of wafer.

Abstract: A cooling system for a computer system comprises at least one unit such as a central processing unit (CPU) generating thermal energy and a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.

Abstract: A module including a cooling unit that cools a heat-generating component provided on a substrate; a connection pipe that is connected to the cooling unit; and a fixation portion that is provided at a position at which stress from the connection pipe to the cooling unit is reduced, and that fixes the connection pipe.

Abstract: A fast heat-sinking, current stabilization and pressure boosting device for condenser is disclosed, comprising a heat exchange module and an outer case. The heat exchange module is further divided into a high pressure area and a low pressure area, and an air in channel is installed in the high pressure area and a water out channel is installed in the low pressure area; also, the heat exchange module is provided with at least one channel, and the heat exchange module is assembled inside the outer case. As such, the pressure difference between the low pressure area and the high pressure area can drive the water in each of the inner channels to flow faster toward the low pressure area.

Abstract: A motor drive converter includes a cold plate having a first side and a second side, the first side being opposite to the second side. The motor drive converter may further include at least one motor phase power electronics disposed on the first side of the cold plate, and a capacitor array disposed on the second side of the cold plate. The cold plate may include slots therethrough for a conductor to pass through the cold plate. The conductor may be configured to electrically coupling the capacitor array and the at least one motor phase power electronics.

Abstract: A cooling apparatus includes a cold plate including a lower surface to be in contact with a heat-radiating component, and a first coolant passage in which a coolant flows, a radiator including fins to perform cooling and pipes each defining a second coolant passage in communication with the first coolant passage, a pump to circulate the coolant, a first tank joined to one end of each of the pipes, and a second tank to join another end of each of the pipes to the pump. The radiator is provided on the cold plate, and the pump is adjacent to the second tank.

Abstract: A three-dimensional stacked integrated circuit includes a plurality of interposers between respective integrated circuits of the three-dimensional stacked integrated circuit and below a lowermost integrated circuit, wherein a plurality of movement paths of a coolant are respectively provided in the plurality of interposers, and the plurality of movement paths of the coolant provided in the plurality of interposers are connected to each other. Alternatively, the three-dimensional stacked integrated circuit is configured by immersion and the system thereof is simplified by the coolant interacting with the outside in grooves provided to the edges of the interposers. In this case, a path for allowing the coolant to flow in the layer direction is not necessary.

Abstract: A heat dissipation structure applied to an electronic device includes a circuit board assembly, a pipe, a refrigerant fluid, and a water pump. The circuit board assembly is provided with a receiving chamber therein, an inlet, and an outlet. Each of the inlet and the outlet communicates with the receiving chamber. The pipe and the receiving chamber together form a liquid channel. The refrigerant fluid is received in the liquid channel. The water pump communicates with the pipe and is configured to circulate the refrigerant fluid in the liquid channel to remove heat from the circuit board assembly.

Abstract: In a cooling system of an aircraft turbojet engine surrounded by a nacelle, a heat-transfer fluid is circulated that is less flammable than a lubricant (H) for the turbojet engine and liquid at temperatures between ?70° C. and +175° C., the heat-transfer fluid (C) being intended to circulate in a closed-circuit circulation duct including a first surface heat-exchanger between the heat-transfer fluid (C) and air (F), at the level of at least one of the outer fairing and the inner fairing of the nacelle, and a second surface heat-exchanger between the heat-transfer fluid (C) and the lubricant (H).

Abstract: This heat dissipation structure includes: a circuit board; an integrated circuit mounted thereon; a first thermal pad disposed on the surface of the integrated circuit; a heat sink having a first surface that applies pressure to the first thermal pad by sandwiching the first thermal pad together with the surface of the integrated circuit and a second surface facing the first surface; a second thermal pad disposed on the second surface; a heat dissipation casing having a surface that applies pressure to the second thermal pad by sandwiching the second thermal pad together with the second surface; and stud components for pulling up the heat sink from the heat dissipation casing side together with the circuit board such that the second thermal pad is sandwiched and pressurized between the heat dissipation casing and the heat sink.

Abstract: A switch of an inverter module is disposed in a coolant channel, is configured to be immersed in coolant in the coolant channel, and includes: a first terminal disposed on a first plane and configured to connect to a direct current (DC) reference potential; a second terminal disposed on a second plane and configured to connect to an alternating current (AC) reference potential; a gate, an emitter, and a collector; first cooling features that extend away from the first and second planes, that directly contact the first terminal, and that are configured to allow coolant flow therethrough; and second cooling features that extend away from the first cooling features, the first plane, and the second plane, that directly contact the second terminal, and that are configured to allow coolant flow therethrough.

Abstract: Filter systems, filters, and methods of managing filter systems are provided. The filter systems utilize large filters that are too large to be manually handled by service personnel. As such, the filter systems and methods utilize filter positioning units for handling the filters during maintenance intervals. Some systems include sensor for remotely monitoring the status of the filters and the information can be used to reverse pulse the filters as well as to indicate the end of the service life of the filters. The filters can be refurbished with new filter media.

Abstract: Provided are a flat plate pulsating heat pipe having flexibility and having an improved sealing ability so as not to leak a working fluid therein, and a manufacturing method thereof. The flat plate pulsating heat pipe includes a base part having an upper surface or a lower surface which is plasma-treated, wherein the base part has a plurality of channels formed therein and both end portions of each of the channels are bent and connected to each other to form a closed-loop type or a closed type; and a pair of surface films bonded to an upper portion and a lower portion of the base part and bonded to each other at an outer portion of the base part to seal the channels.

Abstract: A liquid cooling system is disclosed herein. The liquid cooling system contains one or more elements or components which provide for liquid cooling of heated or electronic environments, requiring heat dissipation. The liquid cooling system provides for creating a single looped assembly, which provides for a single-block system to cool all heat-producing components in an environment, which eliminates required fittings to complete the liquid cooling loop.

Abstract: In an electric power conversion apparatus, a semiconductor module-cooler unit includes a semiconductor module and a cooler that has cooling pipes stacked with the semiconductor module in a stacking direction. A flow path forming component includes an electronic component main body and has an in-component flow path formed therein. A case receives both the semiconductor module-cooler unit and the flow path forming component therein. A pressure-applying member is arranged in the case to apply pressure to the semiconductor module-cooler unit from a rear side toward a front side in the stacking direction. Moreover, the flow path forming component is fixed to the case. The pressure-applying member, the semiconductor module-cooler unit and the flow path forming component are arranged in alignment with each other in the stacking direction. An in-cooler flow path formed in the cooler and the in-component flow path are fluidically connected with each other in the stacking direction.

Abstract: A substantially planar heat exchanger for regulating the temperature of objects using a fluid coolant includes a bottom plate, a top plate, a fin insert sealed therebetween and a coolant inlet and outlet. The fin insert may include a plurality of substantially flattened omega-shaped or teardrop-shaped fins, which enhances the transfer of heat from the top and/or bottom plates into the fin insert. The omega-shaped fin inserts enhance the contact surface area between the plates and the insert to improve thermal migration therebetween. The fin insert may be constructed, for example, by forming convolutions in a sheet of metal, and compressing the convolutions laterally inwardly and vertically inwardly.

Abstract: The disclosure relates to a flow-rate adjustment component and a liquid cooling device. The flow-rate adjustment component is configured to be in contact with a plurality fins, and every two adjacent fins are spaced by a passageway. The flow-rate adjustment component includes a covering portion and at least one blocking portion. The covering portion has at least one through slot. The covering portion is in contact with the fins to cover the passageways. The through slot is connected to the passageways. The at least one blocking portion is to block one end of at least one of the passageways.

Abstract: An integrated circuit (IC) device package includes an IC device connected to an upper surface of the IC device carrier. Due to operation conditions or IC device package makeup, the IC device may warp. The warped IC device may include a convex upper surface. A conformable lid is connected to the IC device and includes an internal chamber and a deformable floor. The deformable floor is able to deform or bend along with the IC device. After deformation, the deformable floor may include a concave lower surface. A uniform bond line thickness of a thermal interface material that connects the IC device and the conformable lid is able to be achieved due to the deformable floor deforming or bending along with the IC device.

Abstract: A power control unit is disposed on a transaxle case and includes: a plurality of semiconductor devices; an electronic circuit board including a soldered portion for attaching the plurality of semiconductor devices; and a PCU case formed to house the plurality of semiconductor devices and the electronic circuit board. The PCU case includes a support member to which the plurality of semiconductor devices are attached, and an upper cover forming at least a part of an upper surface of the PCU case. The upper cover includes a first component and one or more second components having a lower rigidity than the first component. The electronic circuit board is attached to the first component. The soldered portion is arranged on a surface of the electronic circuit board on the upper cover side. At least one of the one or more second components is arranged to cover the soldered portion.

Abstract: Embodiments disclosed herein describe a manifold microchannel heat sink having a target surface, a microchannel structure and an insert disposed over the microchannel structure. The microchannel structure includes a plurality of fins extending in a normal direction from the target surface and defining a plurality of microchannels. The individual fins are shaped as rectangular plates and the individual microchannels comprise gaps between the individual fins. The plurality of fins are distributed on the target surface such that at least a thickness of the individual fins or a width of the gaps comprising the individual microchannels is varied along a plane of the target surface. The insert disposed over the microchannel structure has a plurality of inlet dividers and a plurality of outlet dividers. The individual inlet dividers define an inlet channel and the individual outlet dividers define an outlet channel.

Abstract: A fluid distribution apparatus and a fluid distribution module with choke are provided. The fluid distribution apparatus includes a first fluid conveying pipe, a second fluid conveying pipe, multiple fluid manifolds located between the first fluid conveying pipe and the second fluid conveying pipe and connected with the first fluid conveying pipe and the second fluid conveying pipe, an inlet disposed on a side of the first fluid conveying pipe and between both ends of the first fluid conveying pipe; and an outlet disposed on a side of the second fluid conveying pipe and set corresponding to a position where the inlet is set. The fluid is supplied from the inlet to the first fluid conveying pipe, and the fluid is conveyed to the fluid manifolds along the first fluid conveying pipe, and flows into the second fluid conveying pipe through the fluid manifolds and flows out from the outlet.

Abstract: An electronic device includes a printed circuit board (PCB) that supports an integrated circuit (IC) chip. The device also includes a lid over the IC chip. A thermal interface material (TIM) is configured to transfer thermal energy from the IC chip to the lid. A heat spreader forms a cavity in communication with the lid. The heat spreader is at least partially filled with a liquid that is configured to change phases during operation of the IC chip.

Abstract: Embodiments described herein generally relate to an electronics assembly that includes a semiconductor device, a substrate layer, a first mesh layer and a second mesh layer. Jet channels that have a first inner diameter are disposed within the substrate layer. The first mesh layer includes a first plurality of pores that have a perimeter opening. The second mesh layer includes a second plurality of pores that have a second inner diameter. The jet channels, the first and the second plurality of pores are concentric to create a fluid path for a fluid to impinge a first device surface of the semiconductor device. The second inner diameter is smaller than the perimeter opening and the first inner diameter of the substrate layer such that a cooling fluid velocity increases when flowing from the substrate layer through the second mesh layer.

Abstract: Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.

Abstract: An electronics assembly includes a semiconductor device having a first device surface and at least one device conductive layer disposed directly thereon. A cooling structure coupled to the semiconductor device includes a manifold layer, a microchannel layer bonded to the manifold layer, at least one planar side cooling structure, and one or more cooling structure conductive layers. The manifold layer includes a fluid inlet and a fluid outlet and defines a first cooling structure surface. The microchannel layer comprises at least one microchannel fluidly coupled to the fluid inlet and the fluid outlet and defines a second cooling structure surface opposite from the first cooling structure surface. The planar side cooling structure surface is transverse to the first and the second cooling structure surfaces. The cooling structure conductive layers are disposed directly on the first cooling structure surface, the second cooling structure surface, and the planar side cooling structure surface.

Abstract: A complex vapor chamber structure includes a main body and at least one tubular body. The main body has a first chamber, a first opening and a second opening. A first capillary structure is disposed in the first chamber. A working fluid is filled in the first chamber. The first and second openings pass through one face of the main body to communicate with the first chamber. The tubular body has a first end, a second end and a passage. The first and second ends are respectively correspondingly inserted in the first and second openings, whereby the passage of the tubular body communicates with the first chamber via the first and second ends to form a loop for vapor-liquid circulation.

Abstract: A heat exchange apparatus, and method of forming the apparatus, are disclosed. The apparatus includes a thermally conductive substrate with a metal microlattice structure adhered to the thermally conductive substrate and in thermal communication with the thermally conductive substrate, the metal microlattice structure comprising a region containing an electroless metal. A method of making the apparatus includes forming a polymer lattice, applying the polymer lattice to a thermally conductive substrate, forming an electroless plated metal layer on the polymer lattice, forming an electroplated metal layer on the electroless metal layer, and forming a metal microlattice of the electroless metal layer and the electroplated metal layer.

Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.

Abstract: The present disclosure relates to a tube structure comprising an inner tube of metal and an outer tube of metal, wherein the inner tube extends in the outer tube, and wherein either the inner tube and the outer tube are mechanically tight fitted over the entire length of the inner tube, at least one space in a radial direction of the tube structure in the form of a groove extends at least in an outer surface of the inner tube or in an inner surface of the outer tube, and the at least one space extends in a longitudinal direction of the inner tube and over an entire longitudinal extension of the inner tube, or a spacer tube is located between the inner tube and the outer tube, the inner tube, the outer tube and the spacer tube are mechanically tight fitted over the entire length of the spacer tube, the spacer tube comprises at least one space in the form a slit extending in a radial direction of the tube structure from an outer surface of the inner tube to an inner surface of the outer tube, the at least one s

Abstract: According to one embodiment, an edge cooling system with an IT container having an edge device partially submerged within a liquid coolant. The device generates heat that is transferred into liquid coolant thereby causing the liquid coolant to vaporize into vapor. The system includes a condenser that condenses vapor into liquid coolant, a vapor buffer configured to buffer and provide vapor to the condenser, a liquid accumulator configured to accumulate condensed liquid coolant and provide liquid coolant to the IT container, a main liquid supply line that couples the condenser and IT container to the liquid accumulator, and a main vapor return line that couples the condenser and IT container to the vapor buffer to create a heat exchanging loop. The system design includes the liquid accumulator and vapor buffer, and functions multiple cooling modes including a supplemental cooling. Each of the components are fully enclosed within an edge container.

Abstract: A cooling apparatus that includes a base plate configured to dissipate heat and including a heat exchange unit, and a cover member coupled to the base plate and at least partially enclosing the heat exchange unit. The cover member and the base plate define a heat exchange chamber that includes the heat exchange unit. The cover member defines a first opening and a second opening, and at least one of the first and second openings are above the heat exchange unit. The cooling apparatus further includes a flow guidance plate disposed on the cover member and a housing disposed on the flow guidance plate.

Abstract: Provided are: ice which has excellent cooling capacity; a production method therefor; a method for producing a cooled article; and a refrigerant. Also provided are: ice in a non-separating state; and a production method therefor and ice which satisfies conditions (a) and (b) and is from a liquid that includes an aqueous solution comprising a solute. (a) The temperature of the ice after melting completely is less than 0° C. (b) The rate of change of the solute concentration in the aqueous solution generated from the ice in the melting process is 30% or lower. The refrigerant includes the ice. The refrigerant also includes water which comprises the same solute as the solute included in the ice, wherein the ratio of the concentration of the solute in the ice and the concentration of the solute in the water is preferably 75:25 to 20:80.

Abstract: Device for heat transfer between a first fluid and one second fluid includes a housing with first housing element, second housing element and heat transfer element. Housing is developed with a first connecting fitting and a second connecting fitting for each fluid. Heat transfer element is disposed in a volume completely enclosed in a housing and is developed for through-conduction of the first fluid. Housing is developed for conduction of the second fluid about the heat transfer element. Connecting fittings for second fluid are either disposed on the first housing element and the connecting fittings for the first fluid are disposed on the second housing element, wherein within the second housing at least one flow path for conducting the first fluid is implemented which extends between a connecting fitting and a collector region or the connecting fittings for the fluids are disposed on the first housing element.

Abstract: A loop heat pipe includes an evaporator configured to evaporate a liquid phase working fluid to generate vapor, the evaporator including first and second inner surfaces that face each other; a comb-like porous body including a plurality of comb teeth, the comb-like porous body being disposed inside the evaporator; a plurality of grooves disposed on one of the first inner surface and second inner surface so as to overlap the plurality of comb teeth; a vapor transport line configured to transport the vapor of the working fluid; a condenser configured to liquefy the vapor of the working fluid; and a liquid transport line configured to transport the liquified vapor as a liquid phase working fluid, wherein each of the liquid transport line and the vapor transport line connects the evaporator and the condenser, such that the vapor transport line and the liquid transport line form a loop-like flow passage.

Abstract: A semiconductor module is provided, where a coolant circulation portion of a cooling apparatus has a first coolant flow channel and a second coolant flow channel arranged so as to sandwich therebetween a fin region in which a cooling fin is provided, and each having two ends in a longitudinal direction, a casing portion of the cooling apparatus includes a first opening provided on an end side corresponding to a first end of the first coolant flow channel and a second opening provided on an end side corresponding to a second end of the second coolant flow channel, the second end and the first end are arranged on the same side of the casing portion, and the first coolant flow channel and the second coolant flow channel are each at least partly provided below the cooling fin.