Materials Of Manufacture Patents (Class 165/905)
  • Patent number: 7069978
    Abstract: The present invention provides an apparatus including a magnesium alloy vessel that is substantially free of aluminum and zinc, but including magnesium in combination with a gettering metal. The magnesium alloy vessel has a hollow interior cavity containing a working fluid, with a stable, protective layer formed on the inside wall of the vessel so as to establish non-corrosive compatibility with the working fluid.
    Type: Grant
    Filed: August 19, 2003
    Date of Patent: July 4, 2006
    Assignee: Thermal Corp.
    Inventors: John H. Rosenfeld, G. Yale Eastman
  • Patent number: 7056597
    Abstract: Disclosed is a brazing sheet product comprising a core metal sheet, on at least one side of the core sheet a clad layer of an aluminium brazing alloy comprising silicon in an amount in the range of 4 to 14% by weight, and further comprising on at least one outersurface of the clad layer a coated layer of iron-X alloy, wherein X is selected from one or more members of the group consisting of tin, zinc, manganese, and copper, and such that the clad layer and all layers exterior thereto form a metal filler for a brazing operation and having a composition with the proviso that the mol-ratio of Fe:X is in the range of 10:(0.3 to 6). The invention also relates to a method of manufacturing such a brazing product, and to a brazed assembly comprising at least one component made of this brazing product.
    Type: Grant
    Filed: December 11, 2003
    Date of Patent: June 6, 2006
    Assignee: Corus Aluminium Walzprodukte GmbH
    Inventors: Adrianus Jacobus Wittebrood, Jacques Hubert Olga Joseph Wijenberg
  • Patent number: 7036573
    Abstract: A thermal interface material made of a binder material and a fusible filler.
    Type: Grant
    Filed: February 8, 2002
    Date of Patent: May 2, 2006
    Assignee: Intel Corporation
    Inventors: Paul A. Koning, Fay Hua, Carl L. Deppisch
  • Patent number: 7018722
    Abstract: The present invention provides an aluminum alloy fin material for heat exchangers which has a thickness of 80 ?m (0.08 mm) or less and excels in joinability to a tube material and in intergranular corrosion resistance. The aluminum alloy fin material is an aluminum alloy bare fin material or a brazing fin material which has a thickness of 80 ?m or less and is incorporated into a heat exchanger made of an aluminum alloy manufactured by brazing through an Al—Si alloy filler metal. The structure of the core material before brazing is a fiber structure, and the crystal grain diameter of the structure after brazing is 50–250 ?m. The Si concentration in the Si dissolution area on the surface of the fin material and at the center of the thickness of the fin material after brazing is preferably 0.8% or more and 0.7% or less, respectively.
    Type: Grant
    Filed: June 23, 2003
    Date of Patent: March 28, 2006
    Assignees: Denso Corporation, Sumitomo Light Metal Industries, Ltd.
    Inventors: Taketoshi Toyama, Koji Hirao, Takashi Hatori, Yuji Hisatomi, Yasunaga Itoh, Yoshifusa Shoji
  • Patent number: 7002795
    Abstract: A thermal management device includes a thermally conductive core, a thermally conductive frame positioned around the core, the frame defining at least one opening, and at least one thermally conductive insert disposed in the opening in the frame.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: February 21, 2006
    Assignee: Intel Corporation
    Inventors: Mark A. Trautman, George Daskalakis
  • Patent number: 6988531
    Abstract: A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area. As such, thermal stress on the die is reduced, and total heat from the die is more readily dissipated.
    Type: Grant
    Filed: January 11, 2002
    Date of Patent: January 24, 2006
    Assignee: Intel Corporation
    Inventors: Gregory M. Chrysler, James G. Maveety
  • Patent number: 6983789
    Abstract: A cooling system is provided with a heat exchanger that has a thermally conductive tube over-molded with a plurality of thermally conductive fins. To form the heat exchanger, a thermally conductive tube is provided. Insert molding, over molding or injection molding is utilized to incorporate thermally conductive fins with the thermally conductive tubes. The molding process may also simultaneously create any required features, such as mounting features and fittings for tubing to be connected to the heat exchanger.
    Type: Grant
    Filed: April 22, 2005
    Date of Patent: January 10, 2006
    Assignee: Intel Corporation
    Inventors: Kurt A. Jenkins, John G. Olendorf, Peter Davison
  • Patent number: 6976532
    Abstract: Ceramic materials are converted to materials with anisotropic thermal properties by forming the ceramics into composites with carbon nanotubes dispersed therein and uniaxially compressing the composites in a direction in which a lower thermal conductivity is desired.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: December 20, 2005
    Assignee: The Regents of the University of California
    Inventors: Guodong Zhan, Joshua D. Kuntz, Amiya K. Mukherjee
  • Patent number: 6971438
    Abstract: A vehicle radiator device having a radiator with a first tank and a second tank coupled through a heat radiation core. The radiator is mounted onto an engine in a power unit supported by a vehicle body frame. The first and second tanks of the radiator are made of synthetic resin. The radiator is mounted onto the engine through a shroud for conducting cooling wind passing through the radiator. The shroud is made of elastic material for conducting cooling so that vibrations of the engine are absorbed by the elasticity of the shroud, thus preventing vibration of the radiator.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: December 6, 2005
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Kenji Oki, Shin Nabeya, Yoshiyuki Sekiya
  • Patent number: 6959753
    Abstract: A heat sink which comprises an enclosure having a highly thermally conductive surface region and defining an enclosed cavity. A porous, highly thermally conductive material is disposed in the cavity, preferably homogeneously therein, and is thermally coupled to the thermally conductive surface. A phase change material changing from its initial phase, generally solid, to its final phase, generally liquid, responsive to the absorption of heat is disposed in the enclosed cavity and in the porous material. In accordance with a first embodiment, the highly thermally conductive surface region is preferably aluminum and the porous medium is a highly thermally conductive porous medium, preferably aluminum. In accordance with a second embodiment, the thermally conductive surface is composed of highly thermally conductive fibers disposed in a matrix and the porous material is a plurality of the thermally conductive fibers extending from the thermally conductive surface into the cavity.
    Type: Grant
    Filed: July 1, 1996
    Date of Patent: November 1, 2005
    Assignee: Raytheon Company
    Inventors: Richard M. Weber, Kerrin A. Rummel
  • Patent number: 6926070
    Abstract: A cooling system is provided with a heat exchanger that has a thermally conductive tube over-molded with a plurality of thermally conductive fins. To form the heat exchanger, a thermally conductive tube is provided. Insert molding, over molding or injection molding is utilized to incorporate thermally conductive fins with the thermally conductive tubes. The molding process may also simultaneously create any required features, such as mounting features and fittings for tubing to be connected to the heat exchanger.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: August 9, 2005
    Assignee: Intel Corporation
    Inventors: Kurt A. Jenkins, John G. Oldendorf, Peter Davison
  • Patent number: 6921584
    Abstract: The invention relates to a series of extra strong and durable aluminium alloy brazing sheets with enhanced corrosion resistance for brazed heat exchangers. The alloy sheets are based on recycled materials and are suitable for manufacturing of fins, welded tubes, headers and sideplates. The alloy sheets showed improved corrosion performance with respect to pitting corrosion, excellent high temperature sagging resistance and post braze strength, and a good brazeability. By optimising the material combination of fin, tube, header and sideplates it is possible to produce a heat exchanger with adequate corrosion performance in SWAAT.
    Type: Grant
    Filed: May 3, 2002
    Date of Patent: July 26, 2005
    Assignee: Norsk Hydro ASA
    Inventors: Morten Syslak, Gro Stakkestad, Jon Dag Evensen, Xiao-Jun Jiang, Børge Bjørneklett
  • Patent number: 6918438
    Abstract: A finned heat sink including a plurality of heat sink fins, wherein each of the plurality of heat sink fins includes a fin cover and a fin core, wherein the fin core is constructed of a conductive structural graphite-epoxy material and wherein the fin cover is constructed of a foil material and is disposed relative to the fin core so as to envelope the fin core and a heat sink base, wherein the heat sink base is disposed so as to be in thermal communication with the plurality of heat sink fins.
    Type: Grant
    Filed: June 4, 2002
    Date of Patent: July 19, 2005
    Assignee: International Business Machines Corporation
    Inventors: Michael J. Ellsworth, Jr., Egidio Marotta, Prabjit Singh
  • Patent number: 6915841
    Abstract: A room air conditioner is provided which includes a compressor, a condenser coil, an evaporator coil, a wall positioned between the condenser coil and the evaporator coil, a chassis for supporting said compressor, condenser coil and wall, with the evaporator coil being secured to and supported by the wall, and at least a portion of the evaporator coil extending forwardly of a front edge of the chassis. The chassis is preferably formed of metal while the wall is preferably formed at least partially of plastic, in an upper and a lower mating piece. A plastic front panel may be positioned in front of the evaporator coil and secured to the wall. A series of air conditioners can be provided with a single sized chassis, but differing sized evaporator coils, to provide models with different cooling capacities utilizing a single sized chassis, with smaller cooling capacity air conditioners having a smaller size than larger capacity air conditioners of the series.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: July 12, 2005
    Assignee: WhirlPool Corporation
    Inventors: Timothy J. Campbell, Jatin C. Khanpara
  • Patent number: 6913075
    Abstract: A thermal interface includes nanofibrils. The nanofibrils may be attached to a flat base or membrane, or may be attached to the tip portions of larger diameter fibers. The nanofibrils have a diameter of less than about 1 micron, and may advantageously be formed from single walled and/or multi-walled nanotubes.
    Type: Grant
    Filed: June 13, 2000
    Date of Patent: July 5, 2005
    Assignee: Energy Science Laboratories, Inc.
    Inventors: Timothy R. Knowles, Christopher L. Seaman
  • Patent number: 6911267
    Abstract: The present invention is directed to a brazing sheet comprising an aluminum 3xxx series core alloy wherein at least one side thereof is provided with an aluminum clad material comprising from 0.7-2.0% Mn and 0.7-3.0.0% Zn, wherein the clad is capable of being used as an Inner-liner of a heat exchange product. In one embodiment one side of the core alloy is provided a material that comprises from 0.7-2.0% Mn and 0.7-3.0% Zn and the other side of the core is provided with an aluminum alloy comprising at least 5.5% Si. Thee are further provided methods for preparing brazing sheets as described herein as well as methods for use of brazing sheet materials including as tube stock and as heat exchangers, as well as other applications.
    Type: Grant
    Filed: September 10, 2003
    Date of Patent: June 28, 2005
    Assignee: Pechiney Rolled Products
    Inventors: H. Scott Goodrich, Scott L. Palmer, Gregory R. Johnson, Zayna M. Connor
  • Patent number: 6904966
    Abstract: A flexible mesoscopic heat exchanger is provided by the invention. The heat exchanger of the invention includes uniform microchannels for fluid flow. Separate header and channel layers include microchannels for fluid flow and heat exchange. A layered structure with channels aligned in multiple orientations in the layers permits the use of a flexible material without channel sagging and provides uniform flows. In a preferred embodiment, layers are heat sealed, e.g., by a preferred lamination fabrication process.
    Type: Grant
    Filed: October 16, 2003
    Date of Patent: June 14, 2005
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: Michael I. Philpott, Mark A. Shannon, John C. Selby
  • Patent number: 6896977
    Abstract: A method of brazing an aluminum or aluminum alloy material, containing brazing an aluminum alloy brazing sheet that has an aluminum or aluminum alloy core material and, being clad on one or both surfaces, a filler alloy layer comprised of an Al—Si-based alloy and contains Mg incorporated at least in a constituent layer except the filler alloy layer, thereby to form a hollow structure whose one surface clad with the filler alloy is the inner surface, wherein the brazing is carried out in an inert gas atmosphere without applying any flux; and an aluminum alloy brazing sheet which satisfies the relationship: (X+Y)?a/60+0.5 and X>Y, wherein a (?m) represents the thickness of the filler alloy layer clad on the core material of the inner side of the hollow structure, and X and Y (mass %) represent the Mg contents of the core material and the brazing material, respectively.
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: May 24, 2005
    Assignee: Furukawa-Sky Aluminum CORP
    Inventors: Shinya Nishimura, Yutaka Yanagawa, Takeyoshi Doko, Yoshiharu Hasegawa, Haruhiko Miyachi, Kouji Hirao
  • Patent number: 6886629
    Abstract: The invention relates to a plate heat exchanger that consists of several pieces of sheet metal that are arranged parallel to one another, that are at least partially corrugated and that form a considerable number of heat-exchange passages. A header creates a flow connection among at least some of the heat-exchange passages. At least two parts (1, 2, 3) of the plate heat exchanger consist of metallic materials that cannot be welded to one another.
    Type: Grant
    Filed: May 9, 2001
    Date of Patent: May 3, 2005
    Assignee: Linde Akiengesellschaft
    Inventor: Jörg Dietrich
  • Patent number: 6874573
    Abstract: A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of nitrile rubber and carboxyl-terminated butadiene, carboxyl-terminated butadiene nitrile or a mixture thereof, and conductive filler particles.
    Type: Grant
    Filed: July 31, 2003
    Date of Patent: April 5, 2005
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Andrew Collins, Chih-Min Cheng
  • Patent number: 6873525
    Abstract: A liquid cooling system includes a pump for supplying a cooling liquid including water, a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the pump. Different parts of the liquid cooling system are provided with different corrosion resistance against the cooling liquid.
    Type: Grant
    Filed: February 18, 2004
    Date of Patent: March 29, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Rintaro Minamitani, Makoto Kitano, Noriyuki Ashiwake, Shigeo Ohashi, Yoshihiro Kondo, Takashi Naganawa, Yuji Yoshitomi, Tsuyoshi Nakagawa
  • Patent number: 6840307
    Abstract: Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least two fins and at least one porous reticulated foam block that fills the space between the fins.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: January 11, 2005
    Assignee: Delphi Technologies, Inc.
    Inventors: Gary Lynn Eesley, Donald T. Morelli, Mohinder Singh Bhatti
  • Patent number: 6841250
    Abstract: The present invention relates to a system for managing the heat from a heat source like an electronic component. More particularly, the present invention relates to a system effective for dissipating the heat generated by an electronic component using a thermal management system that includes a heat sink formed from a graphite article.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: January 11, 2005
    Assignee: Advanced Energy Technology Inc.
    Inventor: Jing-Wen Tzeng
  • Publication number: 20040244953
    Abstract: A compound type heat exchanger has an oil cooler unit and a condenser unit integrated with each other. Both of the units have a plurality of heat exchanging pipes and fins juxtaposed and alternately stacked into a lamination, in common. At both ends of the lamination in the longitudinal direction of the pipes, they are connected with header pipes. At a boundary between the units, the heat exchanger includes partition walls arranged in the header pipes and a pseudo heat exchanging passage member interposed in the lamination. Further, at least either one of two fins adjoining the pseudo heat exchanging passage member on the side of the oil cooler unit and also on the side of the condenser unit is joined to the pseudo heat exchanging passage member, while the other fins are joined to the pipes.
    Type: Application
    Filed: May 10, 2004
    Publication date: December 9, 2004
    Inventors: Naohisa Kamiyama, Toshiharu Watanabe
  • Publication number: 20040244959
    Abstract: A cooling fin structure is constructed by a thermally conductive sheet bent to form a heat radiation part and a welding part. The welding part is formed with a vacant region, which is defined by notches, openings or a slot, and the thermally conductive sheet is welded to a substrate through the welding part.
    Type: Application
    Filed: May 5, 2004
    Publication date: December 9, 2004
    Inventors: Chao-Nan Chien, Long-Song Shish, Wei-Fang Wu, Chin-Ming Chen
  • Publication number: 20040226699
    Abstract: A composition for reducing atmospheric oxidizing pollutants comprising a reducing agent comprising: at least one transition element and/or one or more compounds including at least one transition element wherein the standard electrode potential of the redox reaction including the transition element and an ionic species of the transition element or between the ionic species of the transition element present in the or each compound and a further ionic species of the transition element is less than +1.0 volt; a precious metal-free trap material capable of trapping at least one atmospheric reducing pollutant, whereby the at least one atmospheric oxidizing pollutant is reduced by a combination of the trap material and at least one trapped atmospheric reducing pollutant, which at least one trapped atmospheric reducing pollutant is consequently oxidized; or a manganese-based catalyst, preferably MnO2 or a derivative thereof including cryptomelane, and a water soluble binder.
    Type: Application
    Filed: June 28, 2004
    Publication date: November 18, 2004
    Inventor: Christopher Morgan
  • Publication number: 20040226691
    Abstract: A heat dissipation device (10) includes a base (12) and a plurality of fins (14). Each fin includes a heat dissipating post (14) and a heat conducting tab (18). Each heat dissipating post is made by rolling up a metallic slice and thereby defines a through hole therein. Each heat conducting tab includes an engaging part (18a) attached on the base and a medial part (18b) extending from the corresponding heat dissipating post. The medial parts thermally connect the engaging parts and the heat dissipating posts, and mechanically separate the engaging parts from the heat dissipating posts; thereby the through holes are allowed to be exposed at opposite ends of the heat dissipating posts.
    Type: Application
    Filed: March 31, 2004
    Publication date: November 18, 2004
    Inventors: Hsieh Kun Lee, Cuijun Lu
  • Publication number: 20040226689
    Abstract: A heat sink arrangement for modular electronic and/or opto-electronic equipment is provided. The equipment module is inserted into an interface and a heat sink is pivotably arranged so as to be brought into contact with the inserted module. The equipment module may have an angled, or partially angled, so as to assist in bringing the module in contact with the heat sink.
    Type: Application
    Filed: March 24, 2004
    Publication date: November 18, 2004
    Inventors: Andrew Lee Thompson, Kim Leeson
  • Publication number: 20040226704
    Abstract: A plate heat exchanger, comprising a plurality of mutually facing plates that are hermetically coupled at at least one substantially peripheral portion and form at least two separate circuits for at least two fluids, each one of said plurality of plates having access ports that provide input ducts and output ducts for said at least two fluids, at least one portion of at least one face of at least one of said plurality of plates being uneven.
    Type: Application
    Filed: August 13, 2003
    Publication date: November 18, 2004
    Applicant: ONDA S.p.A.
    Inventors: Giuseppe Sella, Giovanni Antonio Longo, Roberto Sartori, Bruno Benetton, Giorgio Lunardi
  • Patent number: 6810999
    Abstract: A thin coating of a solution containing a low surface energy material is applied on the inner surface of tubing of a condenser or an evaporator of an air conditioning system. The solution is run through the tubing of the heat exchanger and drained. After drying, a monomolecular layer of the low surface energy material in solution remains on the inner surface of the tubing. A polymer with a lower surface energy and chemical and thermal resistance is employed, such as silane, fluorocarbons, polyetheretherketon (PEEK) and polysulfone. The thin coating of the lower surface energy material in solution prevents lubricating oil from the compressor which mixes with the refrigerant from wetting over the inner surface of the tubing, encouraging the formation of oil droplets. By preventing the build up of lubricating oil, heat transfer is improved.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: November 2, 2004
    Assignee: Carrier Corporation
    Inventor: James William Otter
  • Patent number: 6811720
    Abstract: A heat transfer medium is shown, having a very high heat transfer rate that is simple in structure, easy to make, environmentally sound, rapidly conducts heat, and preserves heat in a highly efficient manner. Also shown is a heat transfer surface and a heat transfer element utilizing the heat transfer medium.
    Type: Grant
    Filed: August 13, 2001
    Date of Patent: November 2, 2004
    Assignee: New Qu Energy Ltd.
    Inventor: YuZhi Qu
  • Patent number: 6808570
    Abstract: A fin and a tube for a high-temperature heat exchanger are made of a nickel-based alloy which contains 2.0 to 5.0% of Al and further contains, as required, at least one selected from the group consisting of 0.1 to 2.5% of Si, 0.8 to 4.0% of Cr, and 0.1 to 1.5% of Mn, the balance being Ni and unavoidable impurities.
    Type: Grant
    Filed: March 7, 2003
    Date of Patent: October 26, 2004
    Assignee: Mitsubishi Materials Corporation
    Inventor: Akira Mitsuhashi
  • Publication number: 20040200597
    Abstract: A defroster for a heat exchanger includes a heat transfer plate on the heat exchanger; a thin film heater arranged on the heat transfer plate; and a power supply wire connected to the film heater for supplying power to the film heater. The defroster can be fabricated by forming a masking layer with a certain shape on an electrically resistant substrate; patterning a thin film heater on the substrate based on the shape of the masking layer; adhering the film heater to a heat transfer plate; and connecting a power supply to the film heater. Accordingly, it is possible to improve a defrosting performance of the heat exchanger and use an environment-friendly, alternative refrigerant with the relatively, low temperature defroster of the heat exchanger.
    Type: Application
    Filed: December 30, 2003
    Publication date: October 14, 2004
    Inventors: Nam-Soo Cho, Sung Jhee, Jang Seok Lee
  • Publication number: 20040194924
    Abstract: A heat sink is manufactured by forming a fin 2 for dissipating heat by separating a length of material from a substrate 1 while leaving the proximal end attached to the substrate 1. The fins are cut from the substrate by stamping process using the stamping single or progressive die tooling cutting the substrate 1 along dotted line 16. The heat sink is a unitary construction, with the fins 2 being integrally formed with the substrate 1.
    Type: Application
    Filed: December 24, 2003
    Publication date: October 7, 2004
    Inventor: Chee Tieng Wong
  • Publication number: 20040194948
    Abstract: A rear face inlet 25 and a foot inlet 28, and a rear face duct portion 26 and a foot duct portion 31 which are adapted to distribute air from the inlets, respectively, are disposed in alignment with each other in a transverse direction of a vehicle. As a result, a conventional overlapping portion where the rear face inlet and the foot inlet are made to overlap each other vertically somewhere along the length of each of the inlets in a transverse direction of the vehicle and a conventional overlapping portion where the rear face duct and the rear foot duct are disposed in such a manner as to overlap each other in a longitudinal direction of the vehicle somewhere along the length of a downwardly extending portion of each of the ducts can be eliminated, whereby the air conditioning unit can be constructed so as to be decreased in size vertically and longitudinally.
    Type: Application
    Filed: February 10, 2004
    Publication date: October 7, 2004
    Inventors: Kazuji Shibata, Yoshio Yoshida
  • Publication number: 20040194947
    Abstract: Both an air mixing door (9) for the cold air for adjusting a passage area of the cold air passage (6); and an air mixing door (10) for the hot air for adjusting a passage area of the hot air passage (7) are composed of a sliding door for adjusting the passage area when the air mixing door (9) for the cold air and the air mixing door (10) for the hot air are slid in a direction perpendicular to the flow of air in both the passages (6, 7), and while one of the air mixing door (9) for the cold air and the air mixing door (10) for the hot air is maintaining one of the passages (6, 7) in a fully opened state, an operating position of the other door is adjusted so that a passage area of the other passage is adjusted and a temperature of the air blowing out into a vehicle compartment is adjusted.
    Type: Application
    Filed: March 4, 2004
    Publication date: October 7, 2004
    Inventors: Koji Ito, Takahiro Tokunaga, Yoshihiko Okumura
  • Publication number: 20040194937
    Abstract: A method for adjusting temperature of a machining liquid, e.g., slurry, etching liquid, by passing the machining liquid through a heat exchanger. The heat exchanger, which adjusts the temperature of the machining liquid, includes a ceramic heat exchanging tube which is made by baking silicon carbide (SiC).
    Type: Application
    Filed: April 16, 2004
    Publication date: October 7, 2004
    Applicant: Fujikoshi Machinery Corp.
    Inventors: Yoshio Nakamura, Yoshio Otsuka
  • Patent number: 6799628
    Abstract: A heat exchanger includes a silicon nitride substrate. Electronic components may be surface mounted to the substrate. A fluid passageway in the heat exchanger allows a coolant to flow therethrough and carry away heat from the electronic components.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: October 5, 2004
    Assignee: Honeywell International Inc.
    Inventors: Robert E. Masseth, Daniel E. Wilson, Michael Quan
  • Publication number: 20040182482
    Abstract: There is disclosed a DC cast alloy of composition (in wt %): Fe 0.8-1.5 Si 0.7-0.95 Mn 0.2-0.5 Zn 0.2-0.8 Mg up to 0.2 Cu up to 0.2 Ti<0.1 B<0.01 C<0.01. Unavoidable impurities up to 0.05 each, 0.15 total AI balance. Also disclosed is a method of DC casting the alloy to form an ingot.
    Type: Application
    Filed: March 9, 2004
    Publication date: September 23, 2004
    Inventors: Alan Gray, Andrew David Howells
  • Patent number: 6793844
    Abstract: The increase of temperature of heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing boric acid in an amount sufficient to effect the required heat absorption. Where the heat generating conditions are generated by a heat generator, separate and distinct from the heat sensitive device, the boric acid may be supported in a position between the heat sensitive device and the heat generator. Where the heat sensitive device is itself the heat generator, the boric acid is in contact with the heat sensitive device, either directly or indirectly.
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: September 21, 2004
    Inventor: Claude Q. C. Hayes
  • Patent number: 6787116
    Abstract: An overmolding insert includes a base having at least one opening in a first surface, the opening communicating with a second surface opposite the first surface, at least one hollow projection extending from the first surface, the hollow projection having a first opening communicating with the opening of the first surface and a second opening located at a terminal portion of the hollow projection, the insert further having two opposed side walls, each side wall being joined to the first surface, two opposed end walls being joined to an opposite end of the first surface and extending from one side wall to the other side wall. The side walls, the end walls, and the first surface define a partially closed space, with the terminal portion of the hollow projection extending beyond the partially closed space.
    Type: Grant
    Filed: May 1, 2002
    Date of Patent: September 7, 2004
    Assignee: Aquatherm Industries, Inc.
    Inventors: Charles G Williams, John F. Messerschmidt, J. David Sizelove
  • Patent number: 6780345
    Abstract: The increase of temperature of heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing a bicarbonate salt, such as lithium bicarbonate, sodium bicarbonate, potassium bicarbonate, magnesium bicarbonate, calcium bicarbonate, beryllium bicarbonate, aluminum bicarbonate, ammonium bicarbonate and mixtures thereof, in an amount sufficient to effect the required heat absorption. Where the heat generating conditions are generated by a heat generator, separate and distinct from the heat sensitive device, the bicarbonate salt may be supported in a position between the heat sensitive device and the heat generator.
    Type: Grant
    Filed: April 6, 2001
    Date of Patent: August 24, 2004
    Inventor: Claude Q. C. Hayes
  • Patent number: 6776226
    Abstract: A thermal interface member in a heat generating, electronic device is provided. The thermal interface member comprises either a single fluoroelastomer or a blend of fluoroelastomer components that are copolymers of hexafluoropropylene and vinylidene and consists of greater than 40% fluorine along the backbone, and one or more conductive fillers. The fluoroelastomer blend contains at least one component with a Mooney viscosity of 50 poise or less and at least one component with a Mooney viscosity of greater than 50 poise, while the single fluoroelastomer component may have a Mooney viscosity of either less than or greater than 50.
    Type: Grant
    Filed: March 12, 2003
    Date of Patent: August 17, 2004
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Chih-Min Cheng, Andrew Collins
  • Patent number: 6773623
    Abstract: The increase of temperature in heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing Aldehyde in an amount sufficient to effect the required heat absorption. Where the heat generating conditions are generated by a heat generator, separate and distinct from the heat sensitive device, the Aldehyde is supported in a position between the heat sensitive device and the heat generator. Where the heat sensitive device is itself the heat generator, the Aldehyde is contacted to the heat sensitive device either directly or indirectly.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: August 10, 2004
    Inventor: Claude Q. C. Hayes
  • Patent number: 6763881
    Abstract: An assembly comprising a heat generating electronic device and a heat sink is provided with an intermediate gradient region between them. This intermediate region comprises a material having a coefficient of thermal expansion substantially matching the coefficient of thermal expansion of the heat generating electronic device, and a thermal conductivity greater than the thermal conductivity of the electronic device but less than the thermal conductivity of the heat sink. Provision of this intermediate layer substantially reduces stress on the electronic device caused by thermal cycling.
    Type: Grant
    Filed: February 18, 2000
    Date of Patent: July 20, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Guy R Wagner, Chandrakant Patel
  • Patent number: 6758263
    Abstract: A thermal management system provides a heat dissipating component using a high thermal conductivity insert. The heat dissipating component may be a spreader or heat sink, and includes a planar graphite member having high thermal conductivity along the plane of the member and having a relatively low thermal conductivity through the thickness of the member. A cavity is formed through the thickness of the member and the high conductivity insert is received in the cavity. The insert may be an isotropic high thermal conductivity material such as copper or an anisotropic material such as graphite oriented to have high conductivity in the direction of the thickness of the planar element.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: July 6, 2004
    Assignee: Advanced Energy Technology Inc.
    Inventors: Daniel W. Krassowski, Gary G. Chen
  • Publication number: 20040118554
    Abstract: Existing plate-type heat exchangers typically include plates that are constructed of metal or paper, which are only capable of transferring a limited amount of moisture, if any, from one side of the plate to the other side. The present invention is a plate-type heat exchanger wherein the plates are constructed of ionomer membranes, such as sulfonated or carboxylated polymer membranes, which are capable of transferring a significant amount of moisture from one side of the membrane to the other side. Incorporating such ionomer membranes into a plate-type heat exchanger provides the heat exchanger with the ability to transfer a large percentage of the available latent heat in one air stream to the other air streams. The ionomer membrane plates are, therefore, more efficient at transferring latent heat than plates constructed of metal or paper.
    Type: Application
    Filed: June 27, 2003
    Publication date: June 24, 2004
    Inventors: Gregory M. Dobbs, James D. Freihaut
  • Publication number: 20040112583
    Abstract: A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe.
    Type: Application
    Filed: October 29, 2003
    Publication date: June 17, 2004
    Inventors: Scott D. Garner, G. Yale Eastman
  • Publication number: 20040112571
    Abstract: A method and apparatus for cooling a hat source configured along a lane. The heat exchanger comprises an interface layer that perform thermal exchanger with the heat source and configured to pass fluid from a first side to a second side. The manifold layer comprises a first layer in contact with the heat source and has an appropriate thermal conductivity to pass heat to the interface layer. The manifold layer further comprises a second layer couple to the first layer and in contact with the second side of the interface layer. The first layer comprises a recess area having a heat conducting region in contact with the heat exchanging layer. The first layer includes at least one inlet and/or outlet port. The second layer includes at least one inlet and/or outlet port. At least one inlet and/or outlet port is positioned substantially parallel or perpendicular with respect to the plane.
    Type: Application
    Filed: October 30, 2003
    Publication date: June 17, 2004
    Applicant: Cooligy, Inc.
    Inventors: Thomas W. Kenny, Mark Munch, Peng Zhou, James Gill Shook, Girish Upadhya, Kenneth Goodson, Dave Corbin, Mark McMaster, James Lovette, James Hom
  • Publication number: 20040108098
    Abstract: A cellular reservoir flexible pressure vessel is formed as a series of closely packed tubes fitted into a pair of opposing end caps. The end caps have individual receptacles sized and shaped to receive the tube ends that are secured with adhesive or radio frequency welding. At least one end cap has a passageway for connection of the vessel. The flexible pressure vessel has a pressure relief device comprising a reduction in thickness of one end cap at a predetermined location. When subjected to overpressure it fails at the predetermined location. Other pressure relief devices include: a projecting member on the vessel surface, a weakened section of the passageway, a weakening or an absence of braiding material or hoop winding at a predetermined location on the vessel surface or along the passageway, a weakening or spreading of fibers in either the reinforcing panels or the flexible blankets covering the vessel.
    Type: Application
    Filed: August 8, 2003
    Publication date: June 10, 2004
    Inventor: Stan A. Sanders