Materials Of Manufacture Patents (Class 165/905)
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Patent number: 7069978Abstract: The present invention provides an apparatus including a magnesium alloy vessel that is substantially free of aluminum and zinc, but including magnesium in combination with a gettering metal. The magnesium alloy vessel has a hollow interior cavity containing a working fluid, with a stable, protective layer formed on the inside wall of the vessel so as to establish non-corrosive compatibility with the working fluid.Type: GrantFiled: August 19, 2003Date of Patent: July 4, 2006Assignee: Thermal Corp.Inventors: John H. Rosenfeld, G. Yale Eastman
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Patent number: 7056597Abstract: Disclosed is a brazing sheet product comprising a core metal sheet, on at least one side of the core sheet a clad layer of an aluminium brazing alloy comprising silicon in an amount in the range of 4 to 14% by weight, and further comprising on at least one outersurface of the clad layer a coated layer of iron-X alloy, wherein X is selected from one or more members of the group consisting of tin, zinc, manganese, and copper, and such that the clad layer and all layers exterior thereto form a metal filler for a brazing operation and having a composition with the proviso that the mol-ratio of Fe:X is in the range of 10:(0.3 to 6). The invention also relates to a method of manufacturing such a brazing product, and to a brazed assembly comprising at least one component made of this brazing product.Type: GrantFiled: December 11, 2003Date of Patent: June 6, 2006Assignee: Corus Aluminium Walzprodukte GmbHInventors: Adrianus Jacobus Wittebrood, Jacques Hubert Olga Joseph Wijenberg
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Patent number: 7036573Abstract: A thermal interface material made of a binder material and a fusible filler.Type: GrantFiled: February 8, 2002Date of Patent: May 2, 2006Assignee: Intel CorporationInventors: Paul A. Koning, Fay Hua, Carl L. Deppisch
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Patent number: 7018722Abstract: The present invention provides an aluminum alloy fin material for heat exchangers which has a thickness of 80 ?m (0.08 mm) or less and excels in joinability to a tube material and in intergranular corrosion resistance. The aluminum alloy fin material is an aluminum alloy bare fin material or a brazing fin material which has a thickness of 80 ?m or less and is incorporated into a heat exchanger made of an aluminum alloy manufactured by brazing through an Al—Si alloy filler metal. The structure of the core material before brazing is a fiber structure, and the crystal grain diameter of the structure after brazing is 50–250 ?m. The Si concentration in the Si dissolution area on the surface of the fin material and at the center of the thickness of the fin material after brazing is preferably 0.8% or more and 0.7% or less, respectively.Type: GrantFiled: June 23, 2003Date of Patent: March 28, 2006Assignees: Denso Corporation, Sumitomo Light Metal Industries, Ltd.Inventors: Taketoshi Toyama, Koji Hirao, Takashi Hatori, Yuji Hisatomi, Yasunaga Itoh, Yoshifusa Shoji
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Patent number: 7002795Abstract: A thermal management device includes a thermally conductive core, a thermally conductive frame positioned around the core, the frame defining at least one opening, and at least one thermally conductive insert disposed in the opening in the frame.Type: GrantFiled: June 26, 2003Date of Patent: February 21, 2006Assignee: Intel CorporationInventors: Mark A. Trautman, George Daskalakis
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Patent number: 6988531Abstract: A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area. As such, thermal stress on the die is reduced, and total heat from the die is more readily dissipated.Type: GrantFiled: January 11, 2002Date of Patent: January 24, 2006Assignee: Intel CorporationInventors: Gregory M. Chrysler, James G. Maveety
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Patent number: 6983789Abstract: A cooling system is provided with a heat exchanger that has a thermally conductive tube over-molded with a plurality of thermally conductive fins. To form the heat exchanger, a thermally conductive tube is provided. Insert molding, over molding or injection molding is utilized to incorporate thermally conductive fins with the thermally conductive tubes. The molding process may also simultaneously create any required features, such as mounting features and fittings for tubing to be connected to the heat exchanger.Type: GrantFiled: April 22, 2005Date of Patent: January 10, 2006Assignee: Intel CorporationInventors: Kurt A. Jenkins, John G. Olendorf, Peter Davison
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Patent number: 6976532Abstract: Ceramic materials are converted to materials with anisotropic thermal properties by forming the ceramics into composites with carbon nanotubes dispersed therein and uniaxially compressing the composites in a direction in which a lower thermal conductivity is desired.Type: GrantFiled: June 26, 2003Date of Patent: December 20, 2005Assignee: The Regents of the University of CaliforniaInventors: Guodong Zhan, Joshua D. Kuntz, Amiya K. Mukherjee
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Patent number: 6971438Abstract: A vehicle radiator device having a radiator with a first tank and a second tank coupled through a heat radiation core. The radiator is mounted onto an engine in a power unit supported by a vehicle body frame. The first and second tanks of the radiator are made of synthetic resin. The radiator is mounted onto the engine through a shroud for conducting cooling wind passing through the radiator. The shroud is made of elastic material for conducting cooling so that vibrations of the engine are absorbed by the elasticity of the shroud, thus preventing vibration of the radiator.Type: GrantFiled: December 21, 2001Date of Patent: December 6, 2005Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Kenji Oki, Shin Nabeya, Yoshiyuki Sekiya
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Patent number: 6959753Abstract: A heat sink which comprises an enclosure having a highly thermally conductive surface region and defining an enclosed cavity. A porous, highly thermally conductive material is disposed in the cavity, preferably homogeneously therein, and is thermally coupled to the thermally conductive surface. A phase change material changing from its initial phase, generally solid, to its final phase, generally liquid, responsive to the absorption of heat is disposed in the enclosed cavity and in the porous material. In accordance with a first embodiment, the highly thermally conductive surface region is preferably aluminum and the porous medium is a highly thermally conductive porous medium, preferably aluminum. In accordance with a second embodiment, the thermally conductive surface is composed of highly thermally conductive fibers disposed in a matrix and the porous material is a plurality of the thermally conductive fibers extending from the thermally conductive surface into the cavity.Type: GrantFiled: July 1, 1996Date of Patent: November 1, 2005Assignee: Raytheon CompanyInventors: Richard M. Weber, Kerrin A. Rummel
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Patent number: 6926070Abstract: A cooling system is provided with a heat exchanger that has a thermally conductive tube over-molded with a plurality of thermally conductive fins. To form the heat exchanger, a thermally conductive tube is provided. Insert molding, over molding or injection molding is utilized to incorporate thermally conductive fins with the thermally conductive tubes. The molding process may also simultaneously create any required features, such as mounting features and fittings for tubing to be connected to the heat exchanger.Type: GrantFiled: March 22, 2002Date of Patent: August 9, 2005Assignee: Intel CorporationInventors: Kurt A. Jenkins, John G. Oldendorf, Peter Davison
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Patent number: 6921584Abstract: The invention relates to a series of extra strong and durable aluminium alloy brazing sheets with enhanced corrosion resistance for brazed heat exchangers. The alloy sheets are based on recycled materials and are suitable for manufacturing of fins, welded tubes, headers and sideplates. The alloy sheets showed improved corrosion performance with respect to pitting corrosion, excellent high temperature sagging resistance and post braze strength, and a good brazeability. By optimising the material combination of fin, tube, header and sideplates it is possible to produce a heat exchanger with adequate corrosion performance in SWAAT.Type: GrantFiled: May 3, 2002Date of Patent: July 26, 2005Assignee: Norsk Hydro ASAInventors: Morten Syslak, Gro Stakkestad, Jon Dag Evensen, Xiao-Jun Jiang, Børge Bjørneklett
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Patent number: 6918438Abstract: A finned heat sink including a plurality of heat sink fins, wherein each of the plurality of heat sink fins includes a fin cover and a fin core, wherein the fin core is constructed of a conductive structural graphite-epoxy material and wherein the fin cover is constructed of a foil material and is disposed relative to the fin core so as to envelope the fin core and a heat sink base, wherein the heat sink base is disposed so as to be in thermal communication with the plurality of heat sink fins.Type: GrantFiled: June 4, 2002Date of Patent: July 19, 2005Assignee: International Business Machines CorporationInventors: Michael J. Ellsworth, Jr., Egidio Marotta, Prabjit Singh
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Patent number: 6915841Abstract: A room air conditioner is provided which includes a compressor, a condenser coil, an evaporator coil, a wall positioned between the condenser coil and the evaporator coil, a chassis for supporting said compressor, condenser coil and wall, with the evaporator coil being secured to and supported by the wall, and at least a portion of the evaporator coil extending forwardly of a front edge of the chassis. The chassis is preferably formed of metal while the wall is preferably formed at least partially of plastic, in an upper and a lower mating piece. A plastic front panel may be positioned in front of the evaporator coil and secured to the wall. A series of air conditioners can be provided with a single sized chassis, but differing sized evaporator coils, to provide models with different cooling capacities utilizing a single sized chassis, with smaller cooling capacity air conditioners having a smaller size than larger capacity air conditioners of the series.Type: GrantFiled: May 23, 2002Date of Patent: July 12, 2005Assignee: WhirlPool CorporationInventors: Timothy J. Campbell, Jatin C. Khanpara
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Patent number: 6913075Abstract: A thermal interface includes nanofibrils. The nanofibrils may be attached to a flat base or membrane, or may be attached to the tip portions of larger diameter fibers. The nanofibrils have a diameter of less than about 1 micron, and may advantageously be formed from single walled and/or multi-walled nanotubes.Type: GrantFiled: June 13, 2000Date of Patent: July 5, 2005Assignee: Energy Science Laboratories, Inc.Inventors: Timothy R. Knowles, Christopher L. Seaman
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Patent number: 6911267Abstract: The present invention is directed to a brazing sheet comprising an aluminum 3xxx series core alloy wherein at least one side thereof is provided with an aluminum clad material comprising from 0.7-2.0% Mn and 0.7-3.0.0% Zn, wherein the clad is capable of being used as an Inner-liner of a heat exchange product. In one embodiment one side of the core alloy is provided a material that comprises from 0.7-2.0% Mn and 0.7-3.0% Zn and the other side of the core is provided with an aluminum alloy comprising at least 5.5% Si. Thee are further provided methods for preparing brazing sheets as described herein as well as methods for use of brazing sheet materials including as tube stock and as heat exchangers, as well as other applications.Type: GrantFiled: September 10, 2003Date of Patent: June 28, 2005Assignee: Pechiney Rolled ProductsInventors: H. Scott Goodrich, Scott L. Palmer, Gregory R. Johnson, Zayna M. Connor
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Patent number: 6904966Abstract: A flexible mesoscopic heat exchanger is provided by the invention. The heat exchanger of the invention includes uniform microchannels for fluid flow. Separate header and channel layers include microchannels for fluid flow and heat exchange. A layered structure with channels aligned in multiple orientations in the layers permits the use of a flexible material without channel sagging and provides uniform flows. In a preferred embodiment, layers are heat sealed, e.g., by a preferred lamination fabrication process.Type: GrantFiled: October 16, 2003Date of Patent: June 14, 2005Assignee: The Board of Trustees of the University of IllinoisInventors: Michael I. Philpott, Mark A. Shannon, John C. Selby
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Patent number: 6896977Abstract: A method of brazing an aluminum or aluminum alloy material, containing brazing an aluminum alloy brazing sheet that has an aluminum or aluminum alloy core material and, being clad on one or both surfaces, a filler alloy layer comprised of an Al—Si-based alloy and contains Mg incorporated at least in a constituent layer except the filler alloy layer, thereby to form a hollow structure whose one surface clad with the filler alloy is the inner surface, wherein the brazing is carried out in an inert gas atmosphere without applying any flux; and an aluminum alloy brazing sheet which satisfies the relationship: (X+Y)?a/60+0.5 and X>Y, wherein a (?m) represents the thickness of the filler alloy layer clad on the core material of the inner side of the hollow structure, and X and Y (mass %) represent the Mg contents of the core material and the brazing material, respectively.Type: GrantFiled: March 24, 2004Date of Patent: May 24, 2005Assignee: Furukawa-Sky Aluminum CORPInventors: Shinya Nishimura, Yutaka Yanagawa, Takeyoshi Doko, Yoshiharu Hasegawa, Haruhiko Miyachi, Kouji Hirao
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Patent number: 6886629Abstract: The invention relates to a plate heat exchanger that consists of several pieces of sheet metal that are arranged parallel to one another, that are at least partially corrugated and that form a considerable number of heat-exchange passages. A header creates a flow connection among at least some of the heat-exchange passages. At least two parts (1, 2, 3) of the plate heat exchanger consist of metallic materials that cannot be welded to one another.Type: GrantFiled: May 9, 2001Date of Patent: May 3, 2005Assignee: Linde AkiengesellschaftInventor: Jörg Dietrich
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Patent number: 6874573Abstract: A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of nitrile rubber and carboxyl-terminated butadiene, carboxyl-terminated butadiene nitrile or a mixture thereof, and conductive filler particles.Type: GrantFiled: July 31, 2003Date of Patent: April 5, 2005Assignee: National Starch and Chemical Investment Holding CorporationInventors: Andrew Collins, Chih-Min Cheng
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Patent number: 6873525Abstract: A liquid cooling system includes a pump for supplying a cooling liquid including water, a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the pump. Different parts of the liquid cooling system are provided with different corrosion resistance against the cooling liquid.Type: GrantFiled: February 18, 2004Date of Patent: March 29, 2005Assignee: Hitachi, Ltd.Inventors: Rintaro Minamitani, Makoto Kitano, Noriyuki Ashiwake, Shigeo Ohashi, Yoshihiro Kondo, Takashi Naganawa, Yuji Yoshitomi, Tsuyoshi Nakagawa
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Patent number: 6840307Abstract: Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least two fins and at least one porous reticulated foam block that fills the space between the fins.Type: GrantFiled: March 13, 2001Date of Patent: January 11, 2005Assignee: Delphi Technologies, Inc.Inventors: Gary Lynn Eesley, Donald T. Morelli, Mohinder Singh Bhatti
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Patent number: 6841250Abstract: The present invention relates to a system for managing the heat from a heat source like an electronic component. More particularly, the present invention relates to a system effective for dissipating the heat generated by an electronic component using a thermal management system that includes a heat sink formed from a graphite article.Type: GrantFiled: September 27, 2002Date of Patent: January 11, 2005Assignee: Advanced Energy Technology Inc.Inventor: Jing-Wen Tzeng
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Publication number: 20040244953Abstract: A compound type heat exchanger has an oil cooler unit and a condenser unit integrated with each other. Both of the units have a plurality of heat exchanging pipes and fins juxtaposed and alternately stacked into a lamination, in common. At both ends of the lamination in the longitudinal direction of the pipes, they are connected with header pipes. At a boundary between the units, the heat exchanger includes partition walls arranged in the header pipes and a pseudo heat exchanging passage member interposed in the lamination. Further, at least either one of two fins adjoining the pseudo heat exchanging passage member on the side of the oil cooler unit and also on the side of the condenser unit is joined to the pseudo heat exchanging passage member, while the other fins are joined to the pipes.Type: ApplicationFiled: May 10, 2004Publication date: December 9, 2004Inventors: Naohisa Kamiyama, Toshiharu Watanabe
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Publication number: 20040244959Abstract: A cooling fin structure is constructed by a thermally conductive sheet bent to form a heat radiation part and a welding part. The welding part is formed with a vacant region, which is defined by notches, openings or a slot, and the thermally conductive sheet is welded to a substrate through the welding part.Type: ApplicationFiled: May 5, 2004Publication date: December 9, 2004Inventors: Chao-Nan Chien, Long-Song Shish, Wei-Fang Wu, Chin-Ming Chen
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Publication number: 20040226699Abstract: A composition for reducing atmospheric oxidizing pollutants comprising a reducing agent comprising: at least one transition element and/or one or more compounds including at least one transition element wherein the standard electrode potential of the redox reaction including the transition element and an ionic species of the transition element or between the ionic species of the transition element present in the or each compound and a further ionic species of the transition element is less than +1.0 volt; a precious metal-free trap material capable of trapping at least one atmospheric reducing pollutant, whereby the at least one atmospheric oxidizing pollutant is reduced by a combination of the trap material and at least one trapped atmospheric reducing pollutant, which at least one trapped atmospheric reducing pollutant is consequently oxidized; or a manganese-based catalyst, preferably MnO2 or a derivative thereof including cryptomelane, and a water soluble binder.Type: ApplicationFiled: June 28, 2004Publication date: November 18, 2004Inventor: Christopher Morgan
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Publication number: 20040226691Abstract: A heat dissipation device (10) includes a base (12) and a plurality of fins (14). Each fin includes a heat dissipating post (14) and a heat conducting tab (18). Each heat dissipating post is made by rolling up a metallic slice and thereby defines a through hole therein. Each heat conducting tab includes an engaging part (18a) attached on the base and a medial part (18b) extending from the corresponding heat dissipating post. The medial parts thermally connect the engaging parts and the heat dissipating posts, and mechanically separate the engaging parts from the heat dissipating posts; thereby the through holes are allowed to be exposed at opposite ends of the heat dissipating posts.Type: ApplicationFiled: March 31, 2004Publication date: November 18, 2004Inventors: Hsieh Kun Lee, Cuijun Lu
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Publication number: 20040226689Abstract: A heat sink arrangement for modular electronic and/or opto-electronic equipment is provided. The equipment module is inserted into an interface and a heat sink is pivotably arranged so as to be brought into contact with the inserted module. The equipment module may have an angled, or partially angled, so as to assist in bringing the module in contact with the heat sink.Type: ApplicationFiled: March 24, 2004Publication date: November 18, 2004Inventors: Andrew Lee Thompson, Kim Leeson
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Publication number: 20040226704Abstract: A plate heat exchanger, comprising a plurality of mutually facing plates that are hermetically coupled at at least one substantially peripheral portion and form at least two separate circuits for at least two fluids, each one of said plurality of plates having access ports that provide input ducts and output ducts for said at least two fluids, at least one portion of at least one face of at least one of said plurality of plates being uneven.Type: ApplicationFiled: August 13, 2003Publication date: November 18, 2004Applicant: ONDA S.p.A.Inventors: Giuseppe Sella, Giovanni Antonio Longo, Roberto Sartori, Bruno Benetton, Giorgio Lunardi
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Patent number: 6810999Abstract: A thin coating of a solution containing a low surface energy material is applied on the inner surface of tubing of a condenser or an evaporator of an air conditioning system. The solution is run through the tubing of the heat exchanger and drained. After drying, a monomolecular layer of the low surface energy material in solution remains on the inner surface of the tubing. A polymer with a lower surface energy and chemical and thermal resistance is employed, such as silane, fluorocarbons, polyetheretherketon (PEEK) and polysulfone. The thin coating of the lower surface energy material in solution prevents lubricating oil from the compressor which mixes with the refrigerant from wetting over the inner surface of the tubing, encouraging the formation of oil droplets. By preventing the build up of lubricating oil, heat transfer is improved.Type: GrantFiled: August 7, 2001Date of Patent: November 2, 2004Assignee: Carrier CorporationInventor: James William Otter
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Patent number: 6811720Abstract: A heat transfer medium is shown, having a very high heat transfer rate that is simple in structure, easy to make, environmentally sound, rapidly conducts heat, and preserves heat in a highly efficient manner. Also shown is a heat transfer surface and a heat transfer element utilizing the heat transfer medium.Type: GrantFiled: August 13, 2001Date of Patent: November 2, 2004Assignee: New Qu Energy Ltd.Inventor: YuZhi Qu
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Patent number: 6808570Abstract: A fin and a tube for a high-temperature heat exchanger are made of a nickel-based alloy which contains 2.0 to 5.0% of Al and further contains, as required, at least one selected from the group consisting of 0.1 to 2.5% of Si, 0.8 to 4.0% of Cr, and 0.1 to 1.5% of Mn, the balance being Ni and unavoidable impurities.Type: GrantFiled: March 7, 2003Date of Patent: October 26, 2004Assignee: Mitsubishi Materials CorporationInventor: Akira Mitsuhashi
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Publication number: 20040200597Abstract: A defroster for a heat exchanger includes a heat transfer plate on the heat exchanger; a thin film heater arranged on the heat transfer plate; and a power supply wire connected to the film heater for supplying power to the film heater. The defroster can be fabricated by forming a masking layer with a certain shape on an electrically resistant substrate; patterning a thin film heater on the substrate based on the shape of the masking layer; adhering the film heater to a heat transfer plate; and connecting a power supply to the film heater. Accordingly, it is possible to improve a defrosting performance of the heat exchanger and use an environment-friendly, alternative refrigerant with the relatively, low temperature defroster of the heat exchanger.Type: ApplicationFiled: December 30, 2003Publication date: October 14, 2004Inventors: Nam-Soo Cho, Sung Jhee, Jang Seok Lee
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Publication number: 20040194924Abstract: A heat sink is manufactured by forming a fin 2 for dissipating heat by separating a length of material from a substrate 1 while leaving the proximal end attached to the substrate 1. The fins are cut from the substrate by stamping process using the stamping single or progressive die tooling cutting the substrate 1 along dotted line 16. The heat sink is a unitary construction, with the fins 2 being integrally formed with the substrate 1.Type: ApplicationFiled: December 24, 2003Publication date: October 7, 2004Inventor: Chee Tieng Wong
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Publication number: 20040194948Abstract: A rear face inlet 25 and a foot inlet 28, and a rear face duct portion 26 and a foot duct portion 31 which are adapted to distribute air from the inlets, respectively, are disposed in alignment with each other in a transverse direction of a vehicle. As a result, a conventional overlapping portion where the rear face inlet and the foot inlet are made to overlap each other vertically somewhere along the length of each of the inlets in a transverse direction of the vehicle and a conventional overlapping portion where the rear face duct and the rear foot duct are disposed in such a manner as to overlap each other in a longitudinal direction of the vehicle somewhere along the length of a downwardly extending portion of each of the ducts can be eliminated, whereby the air conditioning unit can be constructed so as to be decreased in size vertically and longitudinally.Type: ApplicationFiled: February 10, 2004Publication date: October 7, 2004Inventors: Kazuji Shibata, Yoshio Yoshida
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Publication number: 20040194947Abstract: Both an air mixing door (9) for the cold air for adjusting a passage area of the cold air passage (6); and an air mixing door (10) for the hot air for adjusting a passage area of the hot air passage (7) are composed of a sliding door for adjusting the passage area when the air mixing door (9) for the cold air and the air mixing door (10) for the hot air are slid in a direction perpendicular to the flow of air in both the passages (6, 7), and while one of the air mixing door (9) for the cold air and the air mixing door (10) for the hot air is maintaining one of the passages (6, 7) in a fully opened state, an operating position of the other door is adjusted so that a passage area of the other passage is adjusted and a temperature of the air blowing out into a vehicle compartment is adjusted.Type: ApplicationFiled: March 4, 2004Publication date: October 7, 2004Inventors: Koji Ito, Takahiro Tokunaga, Yoshihiko Okumura
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Publication number: 20040194937Abstract: A method for adjusting temperature of a machining liquid, e.g., slurry, etching liquid, by passing the machining liquid through a heat exchanger. The heat exchanger, which adjusts the temperature of the machining liquid, includes a ceramic heat exchanging tube which is made by baking silicon carbide (SiC).Type: ApplicationFiled: April 16, 2004Publication date: October 7, 2004Applicant: Fujikoshi Machinery Corp.Inventors: Yoshio Nakamura, Yoshio Otsuka
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Patent number: 6799628Abstract: A heat exchanger includes a silicon nitride substrate. Electronic components may be surface mounted to the substrate. A fluid passageway in the heat exchanger allows a coolant to flow therethrough and carry away heat from the electronic components.Type: GrantFiled: July 20, 2000Date of Patent: October 5, 2004Assignee: Honeywell International Inc.Inventors: Robert E. Masseth, Daniel E. Wilson, Michael Quan
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Publication number: 20040182482Abstract: There is disclosed a DC cast alloy of composition (in wt %): Fe 0.8-1.5 Si 0.7-0.95 Mn 0.2-0.5 Zn 0.2-0.8 Mg up to 0.2 Cu up to 0.2 Ti<0.1 B<0.01 C<0.01. Unavoidable impurities up to 0.05 each, 0.15 total AI balance. Also disclosed is a method of DC casting the alloy to form an ingot.Type: ApplicationFiled: March 9, 2004Publication date: September 23, 2004Inventors: Alan Gray, Andrew David Howells
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Patent number: 6793844Abstract: The increase of temperature of heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing boric acid in an amount sufficient to effect the required heat absorption. Where the heat generating conditions are generated by a heat generator, separate and distinct from the heat sensitive device, the boric acid may be supported in a position between the heat sensitive device and the heat generator. Where the heat sensitive device is itself the heat generator, the boric acid is in contact with the heat sensitive device, either directly or indirectly.Type: GrantFiled: February 20, 2001Date of Patent: September 21, 2004Inventor: Claude Q. C. Hayes
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Patent number: 6787116Abstract: An overmolding insert includes a base having at least one opening in a first surface, the opening communicating with a second surface opposite the first surface, at least one hollow projection extending from the first surface, the hollow projection having a first opening communicating with the opening of the first surface and a second opening located at a terminal portion of the hollow projection, the insert further having two opposed side walls, each side wall being joined to the first surface, two opposed end walls being joined to an opposite end of the first surface and extending from one side wall to the other side wall. The side walls, the end walls, and the first surface define a partially closed space, with the terminal portion of the hollow projection extending beyond the partially closed space.Type: GrantFiled: May 1, 2002Date of Patent: September 7, 2004Assignee: Aquatherm Industries, Inc.Inventors: Charles G Williams, John F. Messerschmidt, J. David Sizelove
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Patent number: 6780345Abstract: The increase of temperature of heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing a bicarbonate salt, such as lithium bicarbonate, sodium bicarbonate, potassium bicarbonate, magnesium bicarbonate, calcium bicarbonate, beryllium bicarbonate, aluminum bicarbonate, ammonium bicarbonate and mixtures thereof, in an amount sufficient to effect the required heat absorption. Where the heat generating conditions are generated by a heat generator, separate and distinct from the heat sensitive device, the bicarbonate salt may be supported in a position between the heat sensitive device and the heat generator.Type: GrantFiled: April 6, 2001Date of Patent: August 24, 2004Inventor: Claude Q. C. Hayes
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Patent number: 6776226Abstract: A thermal interface member in a heat generating, electronic device is provided. The thermal interface member comprises either a single fluoroelastomer or a blend of fluoroelastomer components that are copolymers of hexafluoropropylene and vinylidene and consists of greater than 40% fluorine along the backbone, and one or more conductive fillers. The fluoroelastomer blend contains at least one component with a Mooney viscosity of 50 poise or less and at least one component with a Mooney viscosity of greater than 50 poise, while the single fluoroelastomer component may have a Mooney viscosity of either less than or greater than 50.Type: GrantFiled: March 12, 2003Date of Patent: August 17, 2004Assignee: National Starch and Chemical Investment Holding CorporationInventors: Chih-Min Cheng, Andrew Collins
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Patent number: 6773623Abstract: The increase of temperature in heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing Aldehyde in an amount sufficient to effect the required heat absorption. Where the heat generating conditions are generated by a heat generator, separate and distinct from the heat sensitive device, the Aldehyde is supported in a position between the heat sensitive device and the heat generator. Where the heat sensitive device is itself the heat generator, the Aldehyde is contacted to the heat sensitive device either directly or indirectly.Type: GrantFiled: March 27, 2001Date of Patent: August 10, 2004Inventor: Claude Q. C. Hayes
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Patent number: 6763881Abstract: An assembly comprising a heat generating electronic device and a heat sink is provided with an intermediate gradient region between them. This intermediate region comprises a material having a coefficient of thermal expansion substantially matching the coefficient of thermal expansion of the heat generating electronic device, and a thermal conductivity greater than the thermal conductivity of the electronic device but less than the thermal conductivity of the heat sink. Provision of this intermediate layer substantially reduces stress on the electronic device caused by thermal cycling.Type: GrantFiled: February 18, 2000Date of Patent: July 20, 2004Assignee: Agilent Technologies, Inc.Inventors: Guy R Wagner, Chandrakant Patel
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Patent number: 6758263Abstract: A thermal management system provides a heat dissipating component using a high thermal conductivity insert. The heat dissipating component may be a spreader or heat sink, and includes a planar graphite member having high thermal conductivity along the plane of the member and having a relatively low thermal conductivity through the thickness of the member. A cavity is formed through the thickness of the member and the high conductivity insert is received in the cavity. The insert may be an isotropic high thermal conductivity material such as copper or an anisotropic material such as graphite oriented to have high conductivity in the direction of the thickness of the planar element.Type: GrantFiled: December 13, 2001Date of Patent: July 6, 2004Assignee: Advanced Energy Technology Inc.Inventors: Daniel W. Krassowski, Gary G. Chen
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Publication number: 20040118554Abstract: Existing plate-type heat exchangers typically include plates that are constructed of metal or paper, which are only capable of transferring a limited amount of moisture, if any, from one side of the plate to the other side. The present invention is a plate-type heat exchanger wherein the plates are constructed of ionomer membranes, such as sulfonated or carboxylated polymer membranes, which are capable of transferring a significant amount of moisture from one side of the membrane to the other side. Incorporating such ionomer membranes into a plate-type heat exchanger provides the heat exchanger with the ability to transfer a large percentage of the available latent heat in one air stream to the other air streams. The ionomer membrane plates are, therefore, more efficient at transferring latent heat than plates constructed of metal or paper.Type: ApplicationFiled: June 27, 2003Publication date: June 24, 2004Inventors: Gregory M. Dobbs, James D. Freihaut
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Publication number: 20040112583Abstract: A heat pipe assembly comprises a first heat pipe having a condenser and a working fluid. A reservoir communicates with the condenser of the first heat pipe and contains a non-condensable gas which variably permits access of the working fluid to the condenser of the first heat pipe, depending on a pressure of the working fluid. A second heat pipe has an evaporator. At least a portion of the evaporator of the second heat pipe is contained inside of the condenser of the first heat pipe.Type: ApplicationFiled: October 29, 2003Publication date: June 17, 2004Inventors: Scott D. Garner, G. Yale Eastman
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Publication number: 20040112571Abstract: A method and apparatus for cooling a hat source configured along a lane. The heat exchanger comprises an interface layer that perform thermal exchanger with the heat source and configured to pass fluid from a first side to a second side. The manifold layer comprises a first layer in contact with the heat source and has an appropriate thermal conductivity to pass heat to the interface layer. The manifold layer further comprises a second layer couple to the first layer and in contact with the second side of the interface layer. The first layer comprises a recess area having a heat conducting region in contact with the heat exchanging layer. The first layer includes at least one inlet and/or outlet port. The second layer includes at least one inlet and/or outlet port. At least one inlet and/or outlet port is positioned substantially parallel or perpendicular with respect to the plane.Type: ApplicationFiled: October 30, 2003Publication date: June 17, 2004Applicant: Cooligy, Inc.Inventors: Thomas W. Kenny, Mark Munch, Peng Zhou, James Gill Shook, Girish Upadhya, Kenneth Goodson, Dave Corbin, Mark McMaster, James Lovette, James Hom
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Publication number: 20040108098Abstract: A cellular reservoir flexible pressure vessel is formed as a series of closely packed tubes fitted into a pair of opposing end caps. The end caps have individual receptacles sized and shaped to receive the tube ends that are secured with adhesive or radio frequency welding. At least one end cap has a passageway for connection of the vessel. The flexible pressure vessel has a pressure relief device comprising a reduction in thickness of one end cap at a predetermined location. When subjected to overpressure it fails at the predetermined location. Other pressure relief devices include: a projecting member on the vessel surface, a weakened section of the passageway, a weakening or an absence of braiding material or hoop winding at a predetermined location on the vessel surface or along the passageway, a weakening or spreading of fibers in either the reinforcing panels or the flexible blankets covering the vessel.Type: ApplicationFiled: August 8, 2003Publication date: June 10, 2004Inventor: Stan A. Sanders