Conductor Itself Is Flat Patents (Class 174/117FF)
  • Patent number: 5408050
    Abstract: Disclosed is a flat cable having a plurality of parallel-arranged flexible conductor wires and two pieces of insulating tape applied to the opposite center areas of the parallel arrangement of conductor wires leaving their opposite ends exposed, thereby permitting the exposed ends to be used as terminal contacts, each of said conductor wires having an intermediate length of reduced width for increasing the flexibility of the conductor wire. An elongated strip of electrically conductive, flexible metal foil is unrolled and fed to be punched to provide at one time, conductor wires of the same number and parallel arrangement as a flat cable to be made; two pieces of adhesive, insulating tape are applied to the center areas of the parallel conductor wire arrangement; and finally the opposite perforation edges are cut and removed.
    Type: Grant
    Filed: September 9, 1993
    Date of Patent: April 18, 1995
    Assignees: Honda Tsushin Kogyo Co., Ltd., Tohoku Honda Denshi Co., Ltd.
    Inventors: Kinji Kashio, Hikaru Mitani
  • Patent number: 5393933
    Abstract: Audio signal cable for interconnecting a power source and a load, e.g. a power amplifier and a loudspeaker, wherein the geometry of the conductors and the dielectric which separates them has been adapted to raise the capacitance and lower the inductance of the cable, therewith lowering its characteristic impedance to the same order as that of the load, typically 2-10 ohms. In a preferred embodiment this is done by providing a positive and a negative conductor each composed of a solid band of e.g. copper, substantially as wide as the cable which are sandwiched together with a thin interlayer of a dielectric material, e.g. polyester film.
    Type: Grant
    Filed: March 15, 1993
    Date of Patent: February 28, 1995
    Inventor: Ole S. Goertz
  • Patent number: 5391082
    Abstract: A probe for making electrical connections to the legs of an already mounted integrated circuit carries rows of tapered wedges. The wedges within a row are spaced apart by an amount that corresponds to the width of the IC's legs. For n-many legs on a side of the IC there are n+1 corresponding wedges, which then have n-many intervening spaces. As the positioned probe is pressed down the spaces between the wedges receive the legs of the IC, and wedges become wedged between the IC's legs. Each wedge has left and right conductive surfaces separated by an insulator. Each leg of the IC has a wedge to its left and a wedge to its right. Within the probe the right-hand conductive surface of the wedge to the left of a leg, and the left-hand conductive surface of the wedge to the right of that leg, are electrically connected together. Thus, the probe makes electrical contact to each leg in two places. The tapered wedges are of Ni- and Au-plated BeCu separated by acrylic adhesive and Kapton.
    Type: Grant
    Filed: October 26, 1993
    Date of Patent: February 21, 1995
    Inventor: Durwood Airhart
  • Patent number: 5389741
    Abstract: A flat cable which has a connection termination with interlayer peeling films interposed between conductors and insulating films at predetermined intervals along a length of the flat cable. When connecting the flat cable, by cutting the termination with the interlayer films, the insulating film ends and interlayer film ends positioned at the cut portion are folded back to form a folded back portion. This folded back portion is made to catch on to the protective insulator of the connection device, so as to prevent poor contact etc. by ensuring that no intolerable force acts on the connection portion of the conductors even if a tensile force is applied to the connection portion. Further, in the connection termination, connection terminals are inserted between the interlayer peeling films and connectors to connect to the conductors.
    Type: Grant
    Filed: May 14, 1993
    Date of Patent: February 14, 1995
    Assignee: The Furukawa Electric Company, Ltd.
    Inventor: Seiichi Ueno
  • Patent number: 5384431
    Abstract: The present invention is a joint assembly for allowing relative rotational movement of a camera relative to a stationary base structure. The assembly has a first flexible member which allows the camera to pan the surrounding are and a second flexible member which allows the camera to tilt. Each flexible member has a first surface facing a first direction and second surface facing a second opposite direction. One end each flexible member is folded over onto itself so that a portion of the second surface faces the first direction. The flexible members are constructed in an essentially radial shape to define a radial path. When an end of a flexible member moves along the arcuate path the member rolls over itself. That is, the portion of the flexible member that is rolled over, has its second surface facing the first direction instead of the second direction.
    Type: Grant
    Filed: May 11, 1993
    Date of Patent: January 24, 1995
    Assignee: Schaeffer Magnetics, Inc.
    Inventor: Alain Tusques
  • Patent number: 5384432
    Abstract: A tape lead wire includes a polymer resin film and conductor films. The conductor films are directly deposited on the surface of the polymer resin film without using any bonding layer. The total thickness of the tape lead wire can be made smaller than that of a conventional lead wire. The tape lead wire has a high flexibility, can be easily bent, can extremely reduce the bending spring rigidity and is suitable for a magnetic head having a reduced size and load, which is imposed by a head supporting device on the magnetic head, and lowered flying height and peripheral speed.
    Type: Grant
    Filed: May 28, 1993
    Date of Patent: January 24, 1995
    Assignee: TDK Corporation
    Inventors: Tetsuya Noro, Masahiko Itoh, Nobuya Ohyama, Hiroshi Kanai, Masaharu Ishizuka
  • Patent number: 5373108
    Abstract: A dual durometer ribbon generally consisting of a preform and cover, typically formed by an injection molding process. The preform has a low durometer midsection and a plurality of high durometer ends. The high durometer ends are attached to the low durometer midsection at narrow blend areas where the high durometer material blends with the low durometer material. A plurality of printed circuit termination boards rests within recesses located on the top surface of each of the high durometer ends. The recesses are of uniform depth and have an outer border of uniform thickness. The printed circuit termination boards typically have slotted through holes at a receptacle end of the printed circuit board and female connectors are located on one of the surfaces of the printed circuit boards. A plurality of conductors rest within groves contained on the low durometer midsection. The conductors are terminate at the through holes in the printed circuit termination board.
    Type: Grant
    Filed: September 8, 1993
    Date of Patent: December 13, 1994
    Inventor: Floyd Ysbrand
  • Patent number: 5373109
    Abstract: An electrical cable having a plurality of flat, flexible cable sections. Each section has flat, electrically conductive ground layers on at least the top and bottom surfaces thereof, and a plurality of flat, electrically conductive signal conductors between the ground layers. A plurality of dielectric layers separates the signal conductors from each other and from the ground layers. Each signal conductor includes an exposed surface extending a short distance from the end of the conductor along the length of each section. Adjacent cable sections are positioned relative to each other so that the exposed surfaces of corresponding signal conductors face each other. A plurality of connector assemblies is interposed between adjacent cable sections for electrically conducting the exposed surfaces of the corresponding signal conductors. Retaining means are provided for securing the ends of adjacent cable sections and connector assemblies in electrical contact with each other.
    Type: Grant
    Filed: December 23, 1992
    Date of Patent: December 13, 1994
    Assignee: International Business Machines Corporation
    Inventors: Straty N. Argyrakis, Richard W. Oldrey, Eugene E. Steele
  • Patent number: 5371324
    Abstract: A ribbon cable which is light weight, noncorrosive and exhibits excellent electrical conductivity properties. The cable includes a plurality of conductors, each composed of exfoliated graphite, which are arranged to extend parallel to each other and are sheathed with an electrical insulative material molded of a synthetic resin. In another embodiment, a conductor composed of exfoliated graphite and metallic conductors, each having an elongated rectangular cross-sectional shape, are arranged to extend parallel to each other. The conductors are sandwiched between opposing sheets of synthetic resin which are adhered to each other.
    Type: Grant
    Filed: November 24, 1992
    Date of Patent: December 6, 1994
    Assignee: Yazaki Corporation
    Inventors: Toshiaki Kanno, Hidenori Yamanashi, Tsuneyuki Horiike
  • Patent number: 5360943
    Abstract: An electrical connection structure includes electrodes formed on a device side, electrodes formed on a flexible film carrier having an electrode pattern connected to a drive circuit, and an anisotropic conductive film having metal particles or metal plated particles dispersed therein, interposed between the electrodes on the device side and the electrodes on the flexible film carrier, for electrically connecting the electrodes facing each other through thermocompression bonding. The electrodes on the flexible film carrier are exposed by removing the flexible film at an electrical connection area and the length of each exposed electrode is from 1.5 mm to 2.5 mm.
    Type: Grant
    Filed: September 30, 1992
    Date of Patent: November 1, 1994
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hideo Mori, Hiroshi Takabayashi, Masanori Takahashi
  • Patent number: 5360944
    Abstract: A high impedance cable includes a first layer of insulation surrounding a series of conductors to form a conventional ribbon cable and a second layer of insulation which conforms to the first layer of insulation and is retained in contact with the first layer of insulation in a manner which substantially excludes air from between the two layers of insulation but permits the second layer of insulation to be stripped from the ribbon cable for convention mass termination of the ribbon cable.
    Type: Grant
    Filed: December 8, 1992
    Date of Patent: November 1, 1994
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Denis D. Springer, Randall L. Alberg, Mark W. Breault
  • Patent number: 5342997
    Abstract: The insulating members, almost circular or oval in cross section with an outer diameter virtually equal to the thickness of the rectangular conductor, are arranged in such a manner as to be alternated with the rectangular conductors and are held between the two insulating tapes from both the upper and lower sides, with the adhesive layer filling the space between the two facing tapes. The insulating tapes with adhesive layers on the opposing inner sides are pressed against the conductors and the insulating members by the press-forming rollers to form a tape wire.
    Type: Grant
    Filed: January 6, 1993
    Date of Patent: August 30, 1994
    Assignee: Yazaki Corporation
    Inventors: Toshiaki Kanno, Akira Ikegaya, Tsuneyuki Horiike
  • Patent number: 5321310
    Abstract: A method for increasing electron flow and enhancing electrical conductivity in an electrical ribbon conductor by providing a plurality of parallel bridges spanning the ribbon conductor from one edge to the other, connecting them electrically, insulating the bridges from the surface of the ribbon conductor and from adjacent bridges, and generating or externally supplying a magnetic field along the direction perpendicular to the ribbon surface. Also disclosed is an electrical ribbon conductor apparatus which produces enhanced electrical conductivity, and has a two or three tiered structure with a plurality of parallel bridges spanning the ribbon conductor from one edge to the other, connecting the edges electrically, and insulated or spaced from the surface of the conductor and from adjacent bridges.
    Type: Grant
    Filed: November 13, 1991
    Date of Patent: June 14, 1994
    Inventor: Mikiso Mizuki
  • Patent number: 5319330
    Abstract: A device with laminated conductive patterns and dielectrics which can be selected without consideration of its bonding characteristics in regard of copper metal comprises a conductor means comprising a support frame with a window in which one or more etched conductors are arranged. The conductor means is located on one surface of a dielectric sheet or between two such sheets.
    Type: Grant
    Filed: June 12, 1992
    Date of Patent: June 7, 1994
    Assignee: Telefonaktiebolaget L M Ericsson
    Inventor: Karl-Erik Leeb
  • Patent number: 5304741
    Abstract: A ribbon connector for use in an audio system as a speaker cable. The ribbon connector comprises two sets of flat conductors encapsulated in fluorinated ethylene polypropylene. Each of the sets is spaced apart from one another by a median strip of insulation. The median strip has a width greater than the thickness of the insulation between adjacent conductors in a set. This allows the sets to be separated from one another when a terminal is placed on each set. The conductors of a set function as a single conductor in that when used they are joined to a single terminal. The ribbon connector has enhanced capacitance and inductance characteristics compared to round twisted wire conductors.
    Type: Grant
    Filed: August 10, 1992
    Date of Patent: April 19, 1994
    Assignee: Temp-Flex Cable, Inc.
    Inventor: Robert A. Proulx
  • Patent number: 5293140
    Abstract: A microstrip or stripline structure (10) is disclosed. A dielectric substrate (11) of ceramic includes an area (14) having a different electromagnetic characteristic. The differing dielectric characteristic can be provided by an area (14) in the substrate having a reduced thickness. A transmission line (13) is disposed on one side of the substrate and is partially disposed on the area of reduced thickness. An opposed conductor, such as a ground plane (12), is disposed on the opposite side of the substrate. For a microstrip (20), two such substrates are utilized.
    Type: Grant
    Filed: June 29, 1992
    Date of Patent: March 8, 1994
    Assignee: Motorola, Inc.
    Inventor: Robert J. Higgins
  • Patent number: 5281488
    Abstract: Foil strip conductor comprising a continuous tape of dielectric material placed adjacent to and facing an equally wide band of a conductive material like e.g. copper foil on one side, and another, wider, dielectric tape facing the conductor on its opposite side, the overlapping edges of the wider of the two tapes being folded around the edges of the conductor and the first mentioned dielectric tape at the same time, and in the process being bonded to the outside surface of the first mentioned tape.
    Type: Grant
    Filed: September 15, 1992
    Date of Patent: January 25, 1994
    Inventor: Peder U. Poulsen
  • Patent number: 5274195
    Abstract: A laminate comprising metal layers separated by an etchant barrier to control depth of etching of the laminate, the barrier being etchable by an etchant which is not an etchant for the layers. A cable incorporating such a laminate and having relatively flexible conductors integral with relatively rigid terminals. A method of making such a cable, using the laminate, by selectively etching the layers down to the barrier to form the conductors and terminals, stripping the barrier and laminating the conductor with an insulating material preferably extending over at least a portion of the terminals to reinforce the conductor terminal transition and a cable when made of such a method.
    Type: Grant
    Filed: June 2, 1992
    Date of Patent: December 28, 1993
    Assignee: Advanced Circuit Technology, Inc.
    Inventors: Davis W. Murphy, Dennis A. Bonnette, Thomas H. Stearns
  • Patent number: 5262590
    Abstract: An improved flexible circuit assembly arranged in stripline cable or microstrip configuration with shielding and also being designed with a predetermined characteristic impedance. The flexible printed circuits function as printed cables, and employ spacers on either side of the circuit traces so as to provide ground planes at a predetermined dimensional spacing from the traces comprising the circuit pattern. The arrangement of the present invention further comprises placing two or three individual conductor panels on a common substrate, so as to accommodate folding of the circuit panels, one over the other, to form a multi-layer sandwich. Elongated slots are formed along the fold lines so as to improve the integrity of the assembly, and to reduce buckling.
    Type: Grant
    Filed: April 27, 1992
    Date of Patent: November 16, 1993
    Assignee: Sheldahl, Inc.
    Inventor: Randell B. Lia
  • Patent number: 5250127
    Abstract: A method of manufacturing shielded flat cable comprising a plurality of tape form conductors, arranged in a horizontal plane, and in parallel fashion, and insulation cladding which covers the surfaces of the conductors and is unitary in structure, and using a cladding cable which is formed by the placing of a tear-away wire, comprising materials having a greater physical strength than the insulation cladding, between at least one of the plurality of the conductors and the insulation cladding covering this conductor, in which, in the exposure of a conductor which is overlaid by the tear-away wire, the tear-away wire, along with the area of the insulation cladding which overlays this tear-away wire, is pulled in an angled direction with respect to the surface, and after this a shield layer comprising conductive materials and having a tape form is laid on the surface of the cladding cable and the shield layer is brought into electrical contact with the exposed conductor.
    Type: Grant
    Filed: March 19, 1991
    Date of Patent: October 5, 1993
    Assignee: Fujikura Ltd.
    Inventor: Ryoichi Hara
  • Patent number: 5238006
    Abstract: A stimulation lead for electrically coupling an implantable pulse generator to an electrode in an apnea treatment system and method of making same. The lead employs a thin substrate of polyurethane or other highly flexible implantable material. Conductors are placed on the substrate by silk screening a conductive ink. The ends of the lead are electrically terminated using rivets which couple through the substrate. The substrate is folded to enclose the conductors, thereby insulating them and protecting them from bodily fluids. Suitable connectors may be attached to either end. The resulting lead is easily fabricated and is extremely thin and flexible.
    Type: Grant
    Filed: June 24, 1991
    Date of Patent: August 24, 1993
    Assignee: Medtronic, Inc.
    Inventor: H. Toby Markowitz
  • Patent number: 5235132
    Abstract: A double-layered flat electrical signal assembly comprising a shielded insulated flat cable on each side of a perforated separator material which may be conductive metal or non-metal. Controlled impedance signal transmission through high density insulation displacement connectors to PCB's.
    Type: Grant
    Filed: January 29, 1992
    Date of Patent: August 10, 1993
    Assignee: W. L. Gore & Associates, Inc.
    Inventors: James C. Ainsworth, Glen A. Milnes
  • Patent number: 5210378
    Abstract: A joint assembly for allowing relative rotational movement of two structures. The joint assembly has a flexible member with a first surface facing a first direction and second surface facing a second opposite direction. The flexible member is typically a flexible circuit board or an electrical wire cable, that extends from a first structure to a second structure. The structures are interconnected so that they can rotate relative to each other. The flexible member is constructed in an essentially radial shape that defines an arcuate path. One end of the flexible member is attached to the first structure and the other opposite end is connected to the second structure. When the second structure rotates relative to the first structure, the end of the flexible member attached to the second structure moves along the arcuate path. As the flexible member moves along the arcuate path the member rolls over itself.
    Type: Grant
    Filed: July 30, 1991
    Date of Patent: May 11, 1993
    Assignee: Schaeffer Magnetics, Inc.
    Inventor: Alain Tusques
  • Patent number: 5171938
    Abstract: A shield wire comprising: a conductor, an insulation layer provided around an outer periphery of the conductor; an electrically-conductive resin layer provided around an outer periphery of the insulation layer; a covering insulation layer formed around an outer periphery of the electrically-conductive resin layer; and shield device for shielding the shield cable from electromagnetic interference, the means formed to electrically contact the electrically-conductive resin layer.
    Type: Grant
    Filed: April 17, 1991
    Date of Patent: December 15, 1992
    Assignee: Yazaki Corporation
    Inventors: Makoto Katsumata, Akira Ikegaya, Hidenori Yamanashi, Hitoshi Ushijima
  • Patent number: 5158820
    Abstract: A signal carrying structure comprising a planar conductive member having a major surface, a dielectric layer having a substantially constant thickness, and a conductive track. A first major surface of the dielectric layer is in contact with the major surface of the planar conductive member, and the conductive track is in contact with a second major surface of the dielectric layer. The conductive track is spaced from the major surface of the planar conductive member by the dielectric layer. The dielectric layer has a plurality of apertures which extend between the first and second major surfaces thereof in the region between the conductive track and the planar conductive member. The proportion of dielectric material in the dielectric layer is less in this region than in the other regions of the dielectric layer. The structure is used for propagating microwave electromagnetic radiation, and is applicable to strip line, triplate and phased array antenna applications.
    Type: Grant
    Filed: May 31, 1990
    Date of Patent: October 27, 1992
    Assignee: The Marconi Company Limited
    Inventor: Antony J. Scammell
  • Patent number: 5155301
    Abstract: Electrical connection between electrode arrangements formed on first and second substrates is described. The first substrate is placed over the second substrate with a UV light curable adhesive between them. The UV light curable adhesive carries first and second particles dispersed therein. The first and second substrates are pressed against each other and exposed to UV light in order to harden the adhesive. The first particles are made from conductive particles and preferably resilient and function to form current paths between the electrodes of the first and second substrates. The second particles function to prevent the first particles from being destroyed by excess deformation.
    Type: Grant
    Filed: August 15, 1990
    Date of Patent: October 13, 1992
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Akira Mase
  • Patent number: 5147510
    Abstract: A flat multicore wire of the present invention has an end structure in which a group of round wires are disposed in a plane-like fashion in parallel with each other at predetermined intervals. In which coatings of the end portions of the group of round wires are uniformly peeled off so as to enable a group of exposed conductors so formed to act as contact portions, in which a connecting tape of a certain length is applied over the top surface of the coatings of the group of round wires along the proximal portions of the contact portions, and in which a securing tape is applied on the underside of the group of exposed conductors in such manner that the securing tape extends over a part of the coatings of the group of round wires.
    Type: Grant
    Filed: February 8, 1991
    Date of Patent: September 15, 1992
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Kazuo Iura, Yoshiaki Yamano, Kazuhito Saka
  • Patent number: 5136123
    Abstract: A multilayer circuit board is provided having an inner porous fluororesin layer containing electrical circuits, a ground conductor layer located adjacent the fluororesin layer on one side thereof and a power supply conductor layer located adjacent the fluororesin layer on the other side thereof, and a reinforcing, solid plastic dielectric layer adjacent each conductor layer and being external to the inner fluororesin layer. In an alternate embodiment, the multilayer circuit board may have a plurality of inner porous fluororesin layers, at least one fluororesin layer containing electrical circuits, and may have ground conductors and power supply conductors adjacent each fluororesin layer, and reinforcing, solid plastic dielectric layers on the outermost surfaces of the circuit board assembly. The ground and power supply conductor layers extend over the entire surfaces, respectively, of the inner fluororesin layers.
    Type: Grant
    Filed: March 23, 1988
    Date of Patent: August 4, 1992
    Assignee: Junkosha Co., Ltd.
    Inventors: Satoru Kobayashi, Masahiro Suzuki, Satoshi Tanaka, Tetsuya Hirose
  • Patent number: 5134252
    Abstract: Shielding portions are superposed on opposite sides of an elongated flexible circuit board on which signal wires are formed to provide a flexible shielded signal wire. The flexible shielded signal wire is especially adapted to transmit signals to and from a rotary head drum of a digital audio tape recorder.
    Type: Grant
    Filed: January 18, 1991
    Date of Patent: July 28, 1992
    Assignee: Sony Corporation
    Inventors: Takuji Himeno, Takashi Sato
  • Patent number: 5105055
    Abstract: A tunnel multiconnect system comprising a substrate of flexible dielectric material, a plurality of at least three first line conductors supported on the substrate to form a multiconductor pattern, a second conductor shaped to form a ground plane, a structure for mechanically positioning the second conductor in spaced relation to the multiconductor pattern to form a tunnel therebetween, and connectors located at each end of the first conductors for coupling the first conductors and the ground plane to respective multiport terminals of electrical subassemblies thereby forming a flexible high speed ribbon interconnect system.
    Type: Grant
    Filed: October 17, 1990
    Date of Patent: April 14, 1992
    Assignee: Digital Equipment Corporation
    Inventors: William C. Mooney, Joseph R, Santandreu, Kristopher Kshonze
  • Patent number: 5091610
    Abstract: An electrical cable assembly includes a plurality of electrical conductors supported within an insulative casing. The conductors are arranged in side-by-side transversely spaced position and the casing surrounds and electrically isolates each of the conductors. The casing includes a major planar surface permitting mass termination to a connector. One of the conductors includes a flat surface portion which faces an adjacent one of the side-by-side conductors and also includes a curved surface portion which faces the major planar surface.
    Type: Grant
    Filed: September 19, 1990
    Date of Patent: February 25, 1992
    Assignee: Thomas & Betts Corporation
    Inventor: Richard F. Strauss
  • Patent number: 5083238
    Abstract: An electronic assembly comprising a plurality of printed circuit boards residing in a chassis and a removable high frequency, multi-conductor flexible cable, having a connector at each end, the structure of said cable being such that, if positioned in a single plane, it has a plurality of substantially rigid turns, the sum of the degrees of arc of such turns in one direction being equal to the sum of the degrees of arc of such turns in the opposite direction, such that the conductors have equal lengths throughout the cable, resulting in matched signal lengths throughout the cable.To provide optimum shielding, the cable is formed of a plurality of pairs of conductors, each pair is separated by a ground conductor, and the top and bottom of the cable are ground planes.
    Type: Grant
    Filed: February 4, 1991
    Date of Patent: January 21, 1992
    Assignee: Motorola, Inc.
    Inventor: Thomas W. Bousman
  • Patent number: 5073683
    Abstract: A previously fabricated flat flexible cable (10) includes tears and/or micro-fissures, micro-cuts or other defects or imperfections, depicted by jagged or wavy lines (16), in its edges (18). A multi-fiber tread (20), placed at the cable's edges, is enclosed within, between and/or atop one or more layers of adhesive film (22). A bond material (26) bonds the film layers to themselves at their ends (28), to the cable respectively at its sides (24), and to the thread. The bond material is also bonded to and within the micro-fissures, micro-cuts or other defects for repair thereof. The bond material also bonds thread (20) to portions of the cable adjacent to the tear to prevent further propagation of the tear into the cable.
    Type: Grant
    Filed: June 21, 1990
    Date of Patent: December 17, 1991
    Assignee: Hughes Aircraft Company
    Inventors: Edward A. Anderson, Ernesto S. Sandi, Mary K. White
  • Patent number: 5068632
    Abstract: A semi-rigid cable for the transmission of microwaves, such as those used for radar or for digital television. This cable has a symmetrical strip line with a dielectric having an almost rectangular section, with a width close to the thickness of the dielectric and external conductive strips with a width that is substantially greater than that of the central conductor. This symmetrical strip line is advantageously surrounded by an absorbent sheath. The entire unit is protected by an ordinary metallic shielding and by a standard external mechanical protective sheath.
    Type: Grant
    Filed: December 15, 1989
    Date of Patent: November 26, 1991
    Assignee: Thomson-CSF
    Inventor: Andre Champeau
  • Patent number: 5049215
    Abstract: A method of forming an electrical cable assembly includes providing a plurality of round electrical conductors. One of the conductors is flattened along a longitudinal surface portion. The conductors are arranged in side-by-side transversely spaced position with the flattened portion of the one conductor facing an adjacent conductor. An insulative casing is extruded about the conductors and includes a major planar surface permitting mass termination to a connector. The one conductor includes a curved surface portion which faces the major planar surface.
    Type: Grant
    Filed: September 19, 1990
    Date of Patent: September 17, 1991
    Assignee: Thomas & Betts Corporation
    Inventor: Richard F. Strauss
  • Patent number: 5041003
    Abstract: An electrical connector having first and second coacting engagable parts for mating a plurality of spaced electrical contacts in which the system includes predictable alignment, contact force and wiping features. The connector may use flexible circuit tape as the contact elements in which a plurality of modules may be utilized to be aligned separately to avoid cumulative alignment errors. The flexible circuit tape may be a TAB type tape which is configured to allow the end user with the capability to program the signal/ground ratio of the interconnect.
    Type: Grant
    Filed: July 27, 1990
    Date of Patent: August 20, 1991
    Assignee: Microelectronics and Computer Technology Corporation
    Inventors: Robert T. Smith, Chang-Hwa Chung, Yu C. Chang
  • Patent number: 5036379
    Abstract: A flexible beam lead tape having three layers having trace conductors, a dielectric and a ground plane. Vias extend through the dielectric layer at the first and second ends of the electrical conductors for providing versatile connections to either ends of the conductors. The ends of the conductors may be provided with electrical connections on either or both sides of the tape and may be connected by pressure contact or by bonding. The tape also includes means for aligning the tape with a substrate to which the tape will be interconnected.
    Type: Grant
    Filed: June 27, 1989
    Date of Patent: July 30, 1991
    Assignee: Microelectronics and Computer Technology Corporation
    Inventors: Robert T. Smith, Chang-Hwa Chung
  • Patent number: 5030794
    Abstract: The disclosed accessory RF shield has unitized conductive and insulating barrier sheets, sized to correspond lengthwise to the axial length of a ribbon cable to be shielded and widthwise between opposite side edges to completely encircle the ribbon cable and present overlapped inner and outer side edge layers adapted to be connected together for forming a field connection.
    Type: Grant
    Filed: February 14, 1990
    Date of Patent: July 9, 1991
    Assignee: RLP Tool Co.
    Inventors: Mark S. Schell, Warren J. Persak
  • Patent number: 5025115
    Abstract: A flat electrical power-carrying pod for inclusion as a component in a ribbon cable comprising a multiplicity of parallel wires insulated as a unit by polytetrafluoroethylene and having on each side of the plane of wires a layer of hard cut-through resistant film not contacting the other hard polymer layer. Polyimide is the preferred hard polymer.
    Type: Grant
    Filed: May 22, 1990
    Date of Patent: June 18, 1991
    Assignee: W. L. Gore & Associates, Inc.
    Inventors: Emile G. Sayegh, James G. Vana, Jr., Wendall D. Willey
  • Patent number: 5003126
    Abstract: A shielded flat transmission cable for use in wiring electronic appliances having consistent low resistance and a high shielding effect. The cable comprises a plurality of insulated parallel conductors including a grounding conductor and signal transmitting conductors. The conductors and insulating layer are surrounded by a thin metal shielding material. An insulating film surrounds the outer surface of the shielding material. The shielding material is directly and metallically connected to the grounding conductor providing a good electrical contact between the shielding material and the grounding conductor. The connecting means employed can be a spot weld or any other equivalent means directly connecting said grounding conductor and said shielding material. In a first embodiment of the invention the insulation layer, shielding material, and insulating film are formed through lamination. In a second embodiment of the invention they are formed through winding.
    Type: Grant
    Filed: October 11, 1989
    Date of Patent: March 26, 1991
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yutaka Fujii, Taiji Oku, Haruo Saen
  • Patent number: 5003273
    Abstract: A multilayer printed circuit board has a plurality of planar layers formed with signal conductor lines and return lines grouped around the conductor lines to form pseudo-coaxial transmission lines. The return lines are grouped symmetrically around each signal line, e.g. two, four, or eight return lines at circumferential positions around each signal line. Ground and power planes may be formed with the multilayer structure for shielding and/or for powering electronic components mounted on the structure. The multilayer techniques can also be used to form a multilayer extender card which minimizes crosstalk and is reduced in cost and assembly time as compared to conventional extender boards.
    Type: Grant
    Filed: December 4, 1989
    Date of Patent: March 26, 1991
    Assignee: ITT Corporation
    Inventor: George A. Oppenberg
  • Patent number: 4991665
    Abstract: A flexible circuit conductor run for connecting circuit elements comprises a thin sheet which includes a plurality of pairs of generally parallel spaced-apart thin conductors.Each conductor in each pair of conductors includes alternating lengths of crossing portions and extending portions. Each length of conductor extending portions includes generally sidewardly-projecting tine portions.Such flexible circuit conductor run enables the characteristic impedance thereof at high power and operating frequencies to be substantially matched with the characteristic impedance of the circuit elements at such power and operating frequencies, to enable effective signal transfer and reduced signal loss between the circuit elements through the flexible circuit conductor run.
    Type: Grant
    Filed: December 5, 1988
    Date of Patent: February 12, 1991
    Assignee: Buss Systems Incorporated
    Inventor: Joseph A. Kueneman
  • Patent number: 4992059
    Abstract: The invention is a fine line electrical cable with two ends having a plurality of first conductor lines in a plane. The lines of the cable are embedded in an insulating laminate material, are closely spaced at one end to be compatible with the closely spaced contacts from IC chips and are fanned out along the length of the cable to the other end where the lines are spaced somewhat apart and compatible with conventional electrical connectors. Contact posts extent from each line end so that external connections may be made with the IC chips and the conventional connectors. At least one second conductor line may be embedded within the other side of the laminate material and appropriate contact posts extend from the line ends so that external connections may also be made at these locations. A method for fabricating the fine line elecrical cable is also disclosed.
    Type: Grant
    Filed: December 1, 1989
    Date of Patent: February 12, 1991
    Assignee: Westinghouse Electric Corp.
    Inventors: David R. King, David B. Harris
  • Patent number: 4952256
    Abstract: A method is described for making an electrical through connection between a first conduction line comprising a flat conductor to a second conduction line comprising a round conductor. The steps of such method comprise removing end portions of insulation layer from the flat conductor and the round conductor; placing a positioning ring about the exposed end of the round conductor; bonding the round conductor to the flat conductor; extending the bonded conductors with the positioning ring into an injection molding apparatus and axially fixing the round conductor by compressive engagment of the positioning ring by a plunger element; and injecting a plastic material into the injection molding apparatus to form an insulating seal longitudinally about the bonded conductors and the positioning ring.
    Type: Grant
    Filed: March 12, 1990
    Date of Patent: August 28, 1990
    Assignee: Kabelmetal Electro GmbH
    Inventors: Friedrich Schauer, Hans Berthold
  • Patent number: 4931598
    Abstract: The invention provides a sheet material adapted to make bonded electrical connection to an array of closely spaced conductive terminal pads. The material may be provided as a roll of an elongated flexible connector tape. The sheet material of the invention comprises a thin, flexible insulating substrate and a plurality of longitudinally-extending, regularly-spaced, metal conductive members. The sheet may also include an adhesive layer that may cover the conductive members or at least a portion of the conductive members may extend above the adhesive layer. The conductive members may be supported and held on the substrate or may be suspended in the adhesive, out of contact with the substrate.
    Type: Grant
    Filed: December 30, 1988
    Date of Patent: June 5, 1990
    Assignee: 3M Company
    Inventors: Clyde D. Calhoun, David C. Koskenmaki
  • Patent number: 4926008
    Abstract: A high capacitance cable is described which avoids instantaneous voltage drops. The cable is very useful in connecting electrical components (e.g., connecting integrated circuit chips to power supplies). The cable includes: (a) a central continuous strip which is electrically insulating, (b) spaced-apart conductors carried on the upper surface of the strip, and (c) spaced-apart conductors carried on the lower surface of the strip. The cable can be surrounded by electrical insulation, and it preferably is a flexible cable.
    Type: Grant
    Filed: May 18, 1989
    Date of Patent: May 15, 1990
    Assignee: Hewlett-Packard Company
    Inventor: Robert W. Shreeve
  • Patent number: 4926007
    Abstract: A flexible shielded connector is made by depositing a cover shield layer onto a base shield layer so as to provide direct mechanical and electrical contact along the side edge seams of the two shield layers. A metallic base shield layer is applied to a flexible substrate and a base layer of insulating material is applied on top of an interior area of the base shield layer. Side edge areas of the base shield layer on each side of the interior area are left exposed. At least one conductor is applied over the base insulating layer and a cover layer of insulating material is applied over the conductor, also leaving the side edge areas of the top of the base shield layer on each side of the interior area exposed. A metallic cover shield layer is then deposited over the cover layer of insulating material and extends over the side edge areas of the top of the base shield layer so as to envelope the base and cover layers of insulating material and the conductor by the base and cover shield layers.
    Type: Grant
    Filed: March 3, 1989
    Date of Patent: May 15, 1990
    Assignee: W. H. Brady Co.
    Inventors: Brian E. Aufderheide, Gerald G. Hanauer
  • Patent number: 4923739
    Abstract: An electrical interconnection medium is made as a composite of electrically conducting, magnetic particles in a nonconductive matrix material. Particles are magnetically aligned into a network which extends in at least two dimensions as, e.g., in a sheet or layer medium. A layer medium may further include additional, larger conductive particles which may be magnetically aligned into columns extending the thickness of the medium; typically, in this case, the medium serves as an anisotropically conductive medium in the direction of the columns, with slight in-plane conductivity imparted by the network aiding the dissipation of electrostatic charge.
    Type: Grant
    Filed: July 30, 1987
    Date of Patent: May 8, 1990
    Assignee: American Telephone and Telegraph Company
    Inventors: Sungho Jin, William R. Lambert, Robert C. Moore, John J. Mottine, Jr., Richard C. Sherwood, Thomas H. Tiefel
  • Patent number: 4913662
    Abstract: A flat, flexible cable construction comprises two flat, flexible insulating strips each including a plurality of electrical conductors extending along one side of one strip and the opposite side of the other strip, which electrical conductors are exposed at their ends on the inner contacting faces of the two insulating strips. Each of the insulating strips is formed with a transversely-extending slit starting from the edge of the side not including its respective electrical conductors and terminating short of the side including its respective electrical conductors, whereby the two ends of the insulating strips may be transposed by inserting the non-slitted side of one into the slitted side of the other to thereby transpose the outer exposed ends of the electrical conductors from the inner contacting faces of the insulating strips to the outer non-contacting faces of the insulating strips for connection to an electrical connector.
    Type: Grant
    Filed: March 6, 1989
    Date of Patent: April 3, 1990
    Inventor: Nadin Noy
  • Patent number: 4891616
    Abstract: A differential-mode signal transmission system includes a circuitboard composed of at least one dielectric board substrate and a pair of spaced apart conductive parallel planar signal transmission lines disposed on one surface of the substrate and extending between a pair of edges thereof for providing pass-through transmission of differential-mode signals from one to the opposite edge of the substrate. Preferably, the circuitboard is composed of at least a pair of dielectric board substrates being disposed in face-to-face layered contact with one another and having at least one pair of the spaced apart conductive parallel planar signal transmission lines disposed between the layered substrates along the inner surfaces thereof. Ground planes are provided on the outer surfaces of the layered substrates for electrically shielding the parallel planar transmission line pair.
    Type: Grant
    Filed: June 1, 1988
    Date of Patent: January 2, 1990
    Assignee: Honeywell Inc.
    Inventors: Gerald W. Renken, Kimberly J. Gray, Michael W. Greenwood